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JPH0452002B2 - - Google Patents

Info

Publication number
JPH0452002B2
JPH0452002B2 JP61036769A JP3676986A JPH0452002B2 JP H0452002 B2 JPH0452002 B2 JP H0452002B2 JP 61036769 A JP61036769 A JP 61036769A JP 3676986 A JP3676986 A JP 3676986A JP H0452002 B2 JPH0452002 B2 JP H0452002B2
Authority
JP
Japan
Prior art keywords
recess
line
stripline
line electrodes
bonding agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61036769A
Other languages
Japanese (ja)
Other versions
JPS62194702A (en
Inventor
Toshio Nishikawa
Jun Hatsutori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP61036769A priority Critical patent/JPS62194702A/en
Publication of JPS62194702A publication Critical patent/JPS62194702A/en
Publication of JPH0452002B2 publication Critical patent/JPH0452002B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations

Landscapes

  • Waveguides (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、例えばマイクロ波用の伝送線路、
フイルタ、あるいはそれらを用いたMIC(マイク
ロ波集積回路)等に用いられる、いわゆるトリプ
レート型のストリツプラインに関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to, for example, microwave transmission lines,
This article relates to so-called triplate strip lines used in filters or MICs (microwave integrated circuits) using them.

〔従来の技術〕[Conventional technology]

第5図は、従来のストリツプラインの一例を部
分的に示す断面図である。このストリツプライン
はいわゆるトリプレート型であり、一方の主面に
アース電極4a,4bが、他方の主面に1または
複数のライン電極6a,6bがそれぞれ形成され
た2枚の誘電体基板2a,2bを、それぞれのラ
イン電極6a,6b同士が対向かつ導通するよう
に重ね合わせて成る。
FIG. 5 is a sectional view partially showing an example of a conventional stripline. This stripline is of a so-called triplate type, and consists of two dielectric substrates 2a, each having ground electrodes 4a, 4b formed on one main surface and one or more line electrodes 6a, 6b formed on the other main surface. , 2b are stacked one on top of the other so that the respective line electrodes 6a and 6b face each other and are electrically conductive.

具体的には、誘電体基板2a,2b同士は、例
えばガラスグレーズ等の無機系の接着剤10で接
着しており、ライン電極6a,6b同士は導電性
接合剤8を用いて、例えば銀ペーストを焼付けた
り、ソルダークリームを等を用いて半田付けした
りして、導電接合(導通状態で貼り合わせ)して
いる。
Specifically, the dielectric substrates 2a and 2b are bonded together using an inorganic adhesive 10 such as glass glaze, and the line electrodes 6a and 6b are bonded together using a conductive bonding agent 8, such as silver paste. Conductive bonding (bonding in a conductive state) is done by baking or soldering using solder cream or the like.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところが上記のようなストリツプラインにおい
ては、導電性接合剤8の付与量や付与位置をかな
り厳しくコントロールしないと、上下の誘電体基
板2a,2b、ライン電極6a,6bの貼り合わ
せ後において、導電性接合剤8がライン電極6
a,6b部分からはみ出して電極面積が変化した
り、導電性接合剤8のついていない部分ができる
等し、しかもその状態が個々のストリツプライン
においてばらつくため、当該ストリツプラインの
特性がばらつき易く、そのため量産した場合の良
品率が低下する等、量産上問題があつた。
However, in the above-mentioned stripline, unless the amount and position of the conductive bonding agent 8 applied are very strictly controlled, the conductivity will be lost after the upper and lower dielectric substrates 2a, 2b and line electrodes 6a, 6b are bonded together. The bonding agent 8 is the line electrode 6
The electrode area may change by protruding from the a and 6b portions, or there may be a portion where the conductive bonding agent 8 is not attached, and the condition may vary among individual striplines, so the characteristics of the stripline may vary easily. Therefore, there were problems in mass production, such as a decrease in the quality of products when mass-produced.

また、ライン電極6a,6b間に導電性接合剤
8を挟んでいるため、両誘電体基板2a,2b間
のギヤツプAが大きく、しかもそれがばらつき易
いため、この点からも特性がばらつき易くなつて
いた。
Furthermore, since the conductive bonding agent 8 is sandwiched between the line electrodes 6a and 6b, the gap A between both dielectric substrates 2a and 2b is large, and it tends to vary, so the characteristics tend to vary from this point as well. was.

そこでこの発明は、特性が安定していて量産性
の高いストリツプラインを提供することを目的と
する。
Therefore, an object of the present invention is to provide a stripline that has stable characteristics and is highly mass-producible.

〔問題点を解決するための手段〕[Means for solving problems]

この発明のストリツプラインは、一方の主面に
アース電極および他方の主面にライン電極がそれ
ぞれ形成された2枚の誘電体基板を、それぞれの
ライン電極同士が対向かつ導通するように重ね合
わせて成るストリツプラインにおいて、相対向す
るライン電極の内の少なくとも一方のライン電極
部分に凹みを設け、当該凹み内に導電性接合剤を
入れて当該凹みの部分で相対向するライン電極同
士を導電接合していることを特徴とする。
The stripline of this invention consists of two dielectric substrates each having a ground electrode formed on one main surface and a line electrode formed on the other main surface, which are stacked so that the line electrodes face each other and are electrically conductive. In the strip line, a recess is provided in at least one of the opposing line electrodes, and a conductive bonding agent is placed in the recess to connect the opposing line electrodes to each other in the recess. It is characterized by being joined.

〔作用〕[Effect]

相対向するライン電極同士の導電接合を凹みの
部分において行つており、当該凹みには電極接合
時における導電性接合剤のいわゆる逃げのスペー
スがあるため、導電性接合剤の付与量や付与位置
が多少ばらついていたとしても、電極接合後の導
電性接合剤のはみ出し等は殆ど無くなり、その結
果ストリツプラインの特性のばらつきは小さく抑
えられる。
Conductive bonding between line electrodes that face each other is performed in the recessed area, and the recess has a so-called escape space for the conductive bonding agent when bonding the electrodes, so the amount and position of the conductive bonding agent may vary. Even if there is some variation, there is almost no protrusion of the conductive bonding agent after electrode bonding, and as a result, variations in the characteristics of the stripline can be suppressed to a small level.

〔実施例〕〔Example〕

第1図および第2図は、それぞれ、この発明の
実施例に係るストリツプラインを部分的に示す断
面図である。第5図と同等部分には同一符号を付
してその説明を省略する。
1 and 2 are respectively partially sectional views showing a stripline according to an embodiment of the present invention. Components equivalent to those in FIG. 5 are designated by the same reference numerals and their explanations will be omitted.

第1図の実施例においては、相対向するライン
電極16a,16bの内の一方、この例ではライ
ン電極16bの部分に凹み18を設けている。第
2図の実施例においては、ライン電極16a側に
も同様の凹み18を設けている。
In the embodiment shown in FIG. 1, a recess 18 is provided in one of the opposing line electrodes 16a and 16b, in this example the line electrode 16b. In the embodiment shown in FIG. 2, a similar recess 18 is also provided on the line electrode 16a side.

当該凹み18の形状等は特定のものに限定され
るものではなく、種々のものが採り得る。例えば
ライン電極16b側を例に説明すれば、第3図に
示すように、凹み18をライン電極16bの長手
方向に走る細長い溝状のものとしても良く、ある
いは第4図に示すように、ライン電極16bの長
手方向の所々に部分的な凹み18を幾つか設ける
ようにしても良い。ライン電極16a側について
も同様である。
The shape of the recess 18 is not limited to a specific shape, and various shapes can be adopted. For example, taking the line electrode 16b side as an example, as shown in FIG. 3, the recess 18 may be in the form of a long and narrow groove running in the longitudinal direction of the line electrode 16b, or as shown in FIG. Several partial recesses 18 may be provided at various locations along the length of the electrode 16b. The same applies to the line electrode 16a side.

そして両方の誘電体基板2a,2bを貼り合わ
せるに際しては、凹み18内に銀ペーストやソル
ダークリーム等の導電性接合剤8を入れてライン
電極16a,16b同士を当該凹み18の部分の
みで導電接合するようにしている。
When bonding both dielectric substrates 2a and 2b together, a conductive bonding agent 8 such as silver paste or solder cream is placed in the recess 18 to electrically bond the line electrodes 16a and 16b to each other only in the recess 18. I try to do that.

従つて上記のようなストリツプラインにおいて
は、凹み18の部分に、導電性接合剤8である例
えば銀ペーストの焼付けやソルダークリームの融
解時におけるそれらのいわゆる逃げのスペースが
あるため、導電性接合剤8の付与量や付与位置が
多少ばらついていたとしても、電極接合後の導電
性接合剤8の従来のような電極からのはみ出しや
導電性接合剤8のついていない部分の発生等が殆
ど無くなる。その結果、当該ストリツプラインの
特性のばらつきは小さく抑えられ、量産の場合の
良品率が向上する。即ち量産性が高くなる。
Therefore, in the above stripline, there is a so-called escape space in the recess 18 when the conductive bonding agent 8, for example, silver paste, is baked or solder cream is melted. Even if there is some variation in the amount and position of the adhesive 8 applied, the protrusion of the conductive adhesive 8 from the electrode after electrode bonding and the occurrence of areas where the conductive adhesive 8 is not attached, as in the conventional case, are almost eliminated. . As a result, variations in the characteristics of the stripline are suppressed to a small extent, and the yield rate in mass production is improved. In other words, mass productivity is improved.

また、従来のようにライン電極16a,16b
間に導電性接合剤8を挟んでいないため、両誘電
体基板2a,2b間のギヤツプBが小さくなると
共に、貼り合わせ後の当該ギヤツプBの大きさ
は、ライン電極16a,16bの厚みでほぼ規定
されるためばらつきが小さく、この点からも特性
の安定したストリツプラインが得られる。
In addition, as in the conventional line electrodes 16a, 16b,
Since the conductive adhesive 8 is not sandwiched between the two dielectric substrates 2a and 2b, the gap B between the two dielectric substrates 2a and 2b becomes small, and the size of the gap B after bonding is approximately equal to the thickness of the line electrodes 16a and 16b. Since the characteristics are defined, variations are small, and from this point of view as well, a stripline with stable characteristics can be obtained.

ちなみに、凹み18が第4図のような場合には
両ライン電極16a,16b同士の接合個所は部
分的に点在したものとなるけれども、その位置が
従来のようにばらつくことはないので、この場合
も第3図の場合と同様に特性の安定したストリツ
プラインが得られる。
Incidentally, when the recess 18 is as shown in FIG. 4, the joining points between the line electrodes 16a and 16b will be partially scattered, but the positions will not vary as in the conventional case, so this In this case, as in the case of FIG. 3, a stripline with stable characteristics can be obtained.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、特性が安定し
ていて量産性の高いストリツプラインが得られ
る。またその結果、当該ストリツプラインのコス
ト低減を図ることも可能となる。
As described above, according to the present invention, a stripline with stable characteristics and high productivity can be obtained. As a result, it is also possible to reduce the cost of the stripline.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は、それぞれ、この発明の
実施例に係るストリツプラインを部分的に示す断
面図である。第3図および第4図は、それぞれ、
一方の誘電体基板の例を部分的に示す斜視図であ
る。第5図は、従来のストリツプラインの一例を
部分的に示す断面図である。 2a,2b……誘電体基板、4a,4b……ア
ース電極、8……導電性接合剤、16a,16b
……ライン電極、18……凹み。
1 and 2 are respectively partially sectional views showing a stripline according to an embodiment of the present invention. Figures 3 and 4 are, respectively,
FIG. 2 is a perspective view partially showing an example of one dielectric substrate. FIG. 5 is a sectional view partially showing an example of a conventional stripline. 2a, 2b...dielectric substrate, 4a, 4b...earth electrode, 8...conductive bonding agent, 16a, 16b
... Line electrode, 18 ... recess.

Claims (1)

【特許請求の範囲】[Claims] 1 一方の主面にアース電極および他方の主面に
ライン電極がそれぞれ形成された2枚の誘電体基
板を、それぞれのライン電極同士が対向かつ導通
するように重ね合わせて成るストリツプラインに
おいて、相対向するライン電極の内の少なくとも
一方のライン電極部分に凹みを設け、当該凹み内
に導電性接合剤を入れて当該凹みの部分で相対向
するライン電極同士を導電接合していることを特
徴とするストリツプライン。
1. In a strip line formed by overlapping two dielectric substrates each having a ground electrode formed on one main surface and a line electrode formed on the other main surface so that the respective line electrodes face each other and are electrically conductive, A recess is provided in at least one of the opposing line electrodes, a conductive bonding agent is placed in the recess, and the opposing line electrodes are conductively bonded to each other in the recess. Strip line.
JP61036769A 1986-02-21 1986-02-21 Strip line Granted JPS62194702A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61036769A JPS62194702A (en) 1986-02-21 1986-02-21 Strip line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61036769A JPS62194702A (en) 1986-02-21 1986-02-21 Strip line

Publications (2)

Publication Number Publication Date
JPS62194702A JPS62194702A (en) 1987-08-27
JPH0452002B2 true JPH0452002B2 (en) 1992-08-20

Family

ID=12478967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61036769A Granted JPS62194702A (en) 1986-02-21 1986-02-21 Strip line

Country Status (1)

Country Link
JP (1) JPS62194702A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365208A (en) * 1991-04-08 1994-11-15 Ngk Spark Plug Co., Ltd. Microwave stripline filter formed from a pair of dielectric substrates
JP2936443B2 (en) * 1992-04-30 1999-08-23 日本特殊陶業株式会社 Dielectric filter
FI90808C (en) * 1992-05-08 1994-03-25 Lk Products Oy The resonator structure

Also Published As

Publication number Publication date
JPS62194702A (en) 1987-08-27

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