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JPH0444171U - - Google Patents

Info

Publication number
JPH0444171U
JPH0444171U JP8677290U JP8677290U JPH0444171U JP H0444171 U JPH0444171 U JP H0444171U JP 8677290 U JP8677290 U JP 8677290U JP 8677290 U JP8677290 U JP 8677290U JP H0444171 U JPH0444171 U JP H0444171U
Authority
JP
Japan
Prior art keywords
lead
narrow
semiconductor device
wide
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8677290U
Other languages
Japanese (ja)
Other versions
JP2512626Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990086772U priority Critical patent/JP2512626Y2/en
Publication of JPH0444171U publication Critical patent/JPH0444171U/ja
Application granted granted Critical
Publication of JP2512626Y2 publication Critical patent/JP2512626Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案を適用した樹脂封止形発光ダイ
オードの断面図、第２図は平面図、第３図は従来
の樹脂封止形発光ダイオードの断面図、第４図及
び第５図は樹脂封止形発光ダイオードの実装方法
を示す工程図である。 １１……発光ダイオードチツプ（半導体素子）
、１２……第１のリード、１３……第２のリード
、１４……リード細線、１５……光透過性樹脂封
止体、１６，２１……第１の幅狭部、１７，２２
……第１の幅広部、１８，２３……第２の幅狭部
、１９，２４……第２の幅広部、２０……素子搭
載部、２５……リード接続部。 Fig. 1 is a sectional view of a resin-sealed light emitting diode to which the present invention is applied, Fig. 2 is a plan view, Fig. 3 is a sectional view of a conventional resin-sealed light-emitting diode, and Figs. 4 and 5 are FIG. 3 is a process diagram showing a method for mounting a resin-sealed light emitting diode. 11... Light emitting diode chip (semiconductor element)
, 12...First lead, 13...Second lead, 14...Lead thin wire, 15...Light-transparent resin sealing body, 16, 21...First narrow portion, 17, 22
...First wide part, 18, 23... Second narrow part, 19, 24... Second wide part, 20... Element mounting part, 25... Lead connection part.

Claims (1)

【実用新案登録請求の範囲】 (1) 半導体素子と、該半導体素子に電気的に接
続された第１及び第２のリードと、前記半導体素
子を封止する光透過性樹脂封止体とを具備し、前
記半導体素子の一方の主面に形成された電極は前
記第１のリードの素子搭載部に固着され、前記半
導体素子の他方の主面に形成された電極はリード
細線を介して前記第２のリードのリード接続部に
電気的に接続された樹脂封止形光半導体装置にお
いて、 前記第１のリードはその一方の端部側から第１
の幅狭部、第１の幅広部、第２の幅狭部、第２の
幅広部及び前記素子搭載部を順番に有し、前記第
２のリードはその一方の端部側から第１の幅狭部
、第１の幅広部、第２の幅狭部、第２の幅広部及
び前記リード接続部を順番に有し、前記光透過性
樹脂封止体の底面は前記第１及び第２のリードの
前記第１の幅広部の前記第１の幅狭部側の端部と
前記第２の幅狭部側の端部との間に位置する平面
を構成することを特徴とする樹脂封止形光半導体
装置。 (2) 前記第１のリードの前記第２の幅狭部の中
心軸は前記第１のリードの前記第１の幅狭部の中
心軸を延長した位置よりも前記第２のリード側又
は前記第２のリードから離間する側に偏位してお
り、前記第２のリードの前記第２の幅狭部の中心
軸は前記第２のリードの前記第１の幅狭部の中心
軸を延長とした位置よりも前記第１のリード側又
は前記第１のリードから離間する側に偏位してい
る請求項(1)に記載の樹脂封止形光半導体装置。[Claims for Utility Model Registration] (1) A semiconductor device, first and second leads electrically connected to the semiconductor device, and a light-transmissive resin encapsulant for sealing the semiconductor device. The electrode formed on one main surface of the semiconductor element is fixed to the element mounting part of the first lead, and the electrode formed on the other main surface of the semiconductor element is fixed to the element mounting part of the first lead through a thin lead wire. In a resin-sealed optical semiconductor device electrically connected to a lead connection portion of a second lead, the first lead is connected to the first lead from one end side of the first lead.
The second lead has a narrow part, a first wide part, a second narrow part, a second wide part, and the element mounting part in this order, and the second lead has a narrow part, a first wide part, a second narrow part, a second wide part, and the element mounting part. The light-transmissive resin sealing body has a narrow portion, a first wide portion, a second narrow portion, a second wide portion, and the lead connection portion in this order, and a bottom surface of the light-transmissive resin encapsulant is connected to the first and second narrow portions. A resin seal comprising a plane located between an end of the first wide part of the lead on the first narrow part side and an end part of the second narrow part of the lead. Fixed optical semiconductor device. (2) The central axis of the second narrow portion of the first lead is closer to the second lead than the central axis of the first narrow portion of the first lead, or the second narrow portion of the second lead extends from the first narrow portion of the second lead; 2. The resin-sealed optical semiconductor device according to claim 1, wherein the resin-sealed optical semiconductor device is deviated toward the first lead or a side away from the first lead.
JP1990086772U 1990-08-21 1990-08-21 Resin-sealed optical semiconductor device Expired - Fee Related JP2512626Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (en) 1990-08-21 1990-08-21 Resin-sealed optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990086772U JP2512626Y2 (en) 1990-08-21 1990-08-21 Resin-sealed optical semiconductor device

Publications (2)

Publication Number Publication Date
JPH0444171U true JPH0444171U (en) 1992-04-15
JP2512626Y2 JP2512626Y2 (en) 1996-10-02

Family

ID=31818609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990086772U Expired - Fee Related JP2512626Y2 (en) 1990-08-21 1990-08-21 Resin-sealed optical semiconductor device

Country Status (1)

Country Link
JP (1) JP2512626Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003158302A (en) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd Light emitting diode
WO2003049207A1 (en) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Light-emitting diode, led light, and light apparatus
JP2007019153A (en) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd Optical link device
JP2011249433A (en) * 2010-05-25 2011-12-08 Nichia Chem Ind Ltd Light-emitting device and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174871U (en) * 1980-05-26 1981-12-23
JPH0247070U (en) * 1988-09-28 1990-03-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56174871U (en) * 1980-05-26 1981-12-23
JPH0247070U (en) * 1988-09-28 1990-03-30

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003049207A1 (en) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Light-emitting diode, led light, and light apparatus
JP2003158302A (en) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd Light emitting diode
JP2007019153A (en) * 2005-07-06 2007-01-25 Citizen Electronics Co Ltd Optical link device
JP2011249433A (en) * 2010-05-25 2011-12-08 Nichia Chem Ind Ltd Light-emitting device and method for manufacturing the same

Also Published As

Publication number Publication date
JP2512626Y2 (en) 1996-10-02

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