JPH04360595A - Ic module - Google Patents
Ic moduleInfo
- Publication number
- JPH04360595A JPH04360595A JP3136094A JP13609491A JPH04360595A JP H04360595 A JPH04360595 A JP H04360595A JP 3136094 A JP3136094 A JP 3136094A JP 13609491 A JP13609491 A JP 13609491A JP H04360595 A JPH04360595 A JP H04360595A
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- module
- board
- external lead
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、実装基板への外部リー
ドの取り付けを確実にしたＩＣモジュールに関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module in which external leads can be securely attached to a mounting board.
【０００２】0002
【従来の技術】図２はＩＣモジュールの外観を示す平面
図であり、図３は、第２図の側面図である。これらの図
で、１はＩＣで、実装基板２上にモジュール化されてい
る。図４は、図２および図３に点線で囲った外部リード
の装着部を示す拡大斜視図であり、図５は、図４のＸ−
Ｘ線による断面図である。図４，図５において、２は実
装基板であり、３はこの実装基板２に形成された平坦な
基板電極、４は外部リードで、この外部リード４のクラ
ンプ部５が前記基板電極３に半田付けされる。2. Description of the Related Art FIG. 2 is a plan view showing the external appearance of an IC module, and FIG. 3 is a side view of FIG. In these figures, 1 is an IC, which is modularized on a mounting board 2. FIG. 4 is an enlarged perspective view showing the attachment portion of the external lead surrounded by dotted lines in FIGS. 2 and 3, and FIG.
It is a sectional view taken by X-ray. 4 and 5, 2 is a mounting board, 3 is a flat board electrode formed on this mounting board 2, 4 is an external lead, and a clamp part 5 of this external lead 4 is soldered to the board electrode 3. will be attached.
【０００３】次に、単体のＩＣ１の実装が完了した実装
基板２に外部リード４を装着する工程について説明する
。まず、実装基板２を固定し、図６（ａ），（ｂ）に示
すように、外部リード４のクランプ部５を基板電極３に
圧入する。その後、クランプ部５と基板電極３の半田付
けを行う。Next, the process of attaching the external leads 4 to the mounting board 2 on which the single IC 1 has been mounted will be explained. First, the mounting board 2 is fixed, and the clamp part 5 of the external lead 4 is press-fitted into the board electrode 3, as shown in FIGS. 6(a) and 6(b). After that, the clamp part 5 and the substrate electrode 3 are soldered.
【０００４】0004
【発明が解決しようとする課題】従来のＩＣモジュール
は以上のように構成されているので、実装基板２の厚み
のバラツキや外部リード４のクランプ部５の寸法のバラ
ツキにより、外部リード４が確実に実装基板２上の基板
電極３に固定されず、半田付け前のハンドリングで位置
ずれしたり、はずれてしまったりするという問題点があ
った。[Problems to be Solved by the Invention] Since the conventional IC module is constructed as described above, it is difficult to securely connect the external leads 4 due to variations in the thickness of the mounting board 2 and variations in the dimensions of the clamp portions 5 of the external leads 4. Another problem was that it was not fixed to the board electrode 3 on the mounting board 2 and could be displaced or removed during handling before soldering.
【０００５】本発明は、上記のような問題点を解決する
ためになされたもので、外部リードのクランプ部が確実
に基板電極に装着されるようにしたＩＣモジュールを得
ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an IC module in which the clamp portion of the external lead can be reliably attached to the substrate electrode.
【０００６】[0006]
【課題を解決するための手段】本発明に係るＩＣモジュ
ールは、実装基板に形成された基板電極に外部リードの
クランプ部の一部が嵌合する嵌合部を設けたものである
。[Means for Solving the Problems] An IC module according to the present invention is provided with a fitting part into which a part of a clamp part of an external lead fits into a board electrode formed on a mounting board.
【０００７】[0007]
【作用】本発明における基板電極に形成した嵌合部は、
外部リードのクランプ部を圧入したとき、この嵌合部に
クランプ部の一部が嵌合し、外部リードの装着を確実、
かつ強固なものにする。[Operation] The fitting portion formed on the substrate electrode in the present invention is
When the clamp part of the external lead is press-fitted, a part of the clamp part fits into this fitting part, ensuring the attachment of the external lead.
and make it strong.
【０００８】[0008]
【実施例】以下、本発明の一実施例を図１について説明
する。図１において、図２〜図６と同一符号は同一構成
部分を示し、６は前記実装基板２上の基板電極３に形成
された前記外部リード４のクランプ部５が嵌合する嵌合
部で、例えば凹状のノッチである。[Embodiment] An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, the same reference numerals as in FIGS. 2 to 6 indicate the same components, and 6 is a fitting portion into which the clamp portion 5 of the external lead 4 formed on the board electrode 3 on the mounting board 2 is fitted. , for example a concave notch.
【０００９】このように、基板電極３に凹状のノッチ６
を形成し、この凹状のノッチ６に外部リード４のクラン
プ部５を圧入装着することにより、外部リード４は確実
、かつ強固に固定される。In this way, the concave notch 6 is formed in the substrate electrode 3.
By forming a notch 6 and press-fitting the clamp portion 5 of the external lead 4 into the concave notch 6, the external lead 4 is securely and firmly fixed.
【００１０】なお、上記実施例では、外部リード４のク
ラップ部５が嵌合する嵌合部として凹状のノッチ６を形
成したものについて説明したが、その形状や、外部リー
ド４のクランプ部５の形状は特に規定されるものでなく
、適宜なものを利用できることはいうまでもない。In the above embodiment, the concave notch 6 is formed as a fitting part into which the clamp part 5 of the external lead 4 is fitted, but the shape and shape of the notch 6 and the clamp part 5 of the external lead 4 are different. It goes without saying that the shape is not particularly limited and any suitable shape can be used.
【００１１】[0011]
【発明の効果】以上説明したように、本発明は、実装基
板に形成された基板電極に適宜な形状の嵌合部を形成し
たので、外部リードを圧入したとき、そのクランプ部が
前記嵌合部に嵌合し、実装基板と外部リードをの固定が
確実、かつ強固になり、品質，信頼性の高いＩＣモジュ
ールが得られる効果がある。As explained above, in the present invention, a fitting portion of an appropriate shape is formed on a substrate electrode formed on a mounting board, so that when an external lead is press-fitted, the clamp portion is attached to the fitting portion. This has the effect of ensuring that the mounting board and external leads are fixed securely and firmly, resulting in an IC module with high quality and reliability.
【図１】本発明の一実施例を示すＩＣモジュールの要部
断面図である。FIG. 1 is a sectional view of a main part of an IC module showing an embodiment of the present invention.
【図２】従来のＩＣモジュールの全体構成を示す平面図
である。FIG. 2 is a plan view showing the overall configuration of a conventional IC module.
【図３】図２の側面図である。FIG. 3 is a side view of FIG. 2;
【図４】図２の要部の拡大斜視図である。FIG. 4 is an enlarged perspective view of the main part of FIG. 2;
【図５】図４のＸ−Ｘ線による断面側面図である。FIG. 5 is a cross-sectional side view taken along line XX in FIG. 4;
【図６】従来の実装基板への外部リードの装着工程を示
す断面図である。FIG. 6 is a cross-sectional view showing a conventional process of attaching external leads to a mounting board.
１ ＩＣ ２ 実装基板 ３ 基板電極 ４ 外部リード ５ クランプ部 ６ 凹状のノッチ 1 IC 2 Mounting board 3 Substrate electrode 4 External lead 5 Clamp part 6 Concave notch
Claims (1)
実装基板上の基板電極に外部リードが装着されたＩＣモ
ジュールにおいて、前記外部リードを装着する実装基板
に形成された基板電極に前記外部リードのクランプ部が
嵌合する嵌合部を設けたことを特徴とするＩＣモジュー
ル。1. In an IC module in which a plurality of ICs are mounted on a mounting board, and external leads are attached to board electrodes on the mounting board, the board electrodes formed on the mounting board to which the external leads are mounted are provided. An IC module comprising a fitting part into which a clamp part of the external lead fits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3136094A JPH04360595A (en) | 1991-06-07 | 1991-06-07 | Ic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3136094A JPH04360595A (en) | 1991-06-07 | 1991-06-07 | Ic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04360595A true JPH04360595A (en) | 1992-12-14 |
Family
ID=15167125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3136094A Pending JPH04360595A (en) | 1991-06-07 | 1991-06-07 | Ic module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04360595A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6984885B1 (en) * | 2000-02-10 | 2006-01-10 | Renesas Technology Corp. | Semiconductor device having densely stacked semiconductor chips |
-
1991
- 1991-06-07 JP JP3136094A patent/JPH04360595A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6984885B1 (en) * | 2000-02-10 | 2006-01-10 | Renesas Technology Corp. | Semiconductor device having densely stacked semiconductor chips |
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