JPH0434957A - Hybrid module - Google Patents

Abstract

PURPOSE:To prevent the separation of the connecting part of a lead frame and the main body of a hybrid circuit by providing a protruding strip which is engaged with the bent part of the lead frame at the inner surface of a cap body corresponding to the position of the bent part of the lead frame. CONSTITUTION:Electronic parts 2 such as IC elements are mounted on a circuit board 1 in a main body 3 of a hybrid circuit. The hybrid-circuit main body 3 is arranged on a heat sink 4 comprising metal such as aluminum. A tubular body 5 made of a resin is uprightly provided so as to surround the hybrid-circuit main body 3 on the heat sink 4. A lead frame 6 is arranged so as to penetrate the wall of the tubular body 5. One end of the lead frame is guided to the outside of the tubular body 5. A part of the lead frame 6 which is housed in the tubular body 5 is bent 6a in an L shape twice at the intermediate part. The tip is overlapped on the connecting terminal of the hybrid-circuit main body 3 on the circuit board 1 and the tip is connected. When the device is sealed with a cap body 7', the tip part of a protruding strip 8 comes into contact with the bent part 6a of the lead frame 6. The tip part is engaged with a vertical part 6b of the lead frame 6, and the movement and the dislocation of the lead frame 6 are prevented.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a hybrid module, and particularly relates to extension and retraction of a lead frame electrically connected to a sealed/internally installed hybrid circuit body. The present invention relates to a hybrid module having a structure that prevents defects caused by.

(Prior Art) As is well known, so-called hybrid modules, which have a compact electronic circuit configuration, are widely used in various electronic devices. This type of hybrid module is generally configured as follows. That is, as shown in cross section in FIG.
A hybrid circuit main body 3 on which necessary electronic components 2 such as C elements are mounted, a base plate 4 like a heat dissipation fin on which this hybrid circuit main body 3 is disposed on the whole surface, and a hybrid circuit main body 3 on this base plate 4. A cylindrical envelope body 5, for example, a resin cylindrical body, is provided upright so as to surround the cylindrical body 5, and the cylindrical body 5 is provided through the wall of the cylindrical body 5, and one end thereof is connected to the hybrid circuit body 3. It consists of a lead frame 6 electrically connected to terminals by soldering or welding, and a lid 7 made of, for example, resin, which seals the upper end opening of the cylindrical body 5 and houses the hybrid circuit body 3 therein. Hybrid modules are in practical use.

In the hybrid module 7 to 7 having such a structure, the lead frame 6 within the envelope exhibits sufficient cushioning properties (shock mitigation properties) against vibrations and temperature changes. It is bent, for example, into an L-shape within the envelope body (cylindrical body) 5 so that stress is not applied to the solder and the like at the connection part with the variable temperature circuit body 3.

(Problem to be Solved by the Invention) However, in the 71 hybrid module having such a structure, during transportation or use after assembly, the lead frame 6 located inside the envelope body (cylindrical body) 5 may extend or retract in the direction in which the lead frame 6 and the hybrid circuit main body 3 (circuit board 1) are connected.

Furthermore, in assembling the hybrid module,
First, after connecting the hybrid circuit main body 3 and the lead frame 6, when the lid body 7 is adhesively integrated with the envelope main body 5 and sealed, the L-shaped bent part of the lead frame 6 may be misaligned. However, there is a problem in that wire breakage or short circuits are likely to occur.

The present invention was made in order to solve such problems, and its purpose is to provide a hybrid module in which positional displacement such as extension or retraction of the leading end portion of the lead frame located in the envelope is properly prevented. do.

[Configuration of the Invention (Means for Solving the Problems) The present invention provides an outer enclosure in which one end opening of a cylindrical envelope body is sealed by a base plate and the other end opening is sealed by a lid body. a hybrid circuit main body housed in the envelope; The hybrid module is characterized in that a protrusion is provided on the periphery of the lid body to reach the bent part of the lead frame and lock the bent part of the lead frame perpendicularly to the extending direction. do.

(Function) In the hybrid module according to the present invention, a protrusion that engages with the lead frame bent portion is provided on the circumferential surface of the lid body corresponding to the position of the lead frame bent portion. Therefore, the lead frame located inside the envelope is
Misalignment such as extending in the distal direction is easily prevented by the locking action of the protrusion. Therefore, the risk of defects such as disconnection of the connection between the lead frame and the hybrid circuit main body is completely eliminated, and the hybrid module functions as a highly reliable hybrid module.

(Example) The present invention will be described in detail below with reference to FIGS. 1 and 2.

FIG. 1 is a sectional view showing an example of the configuration of a hybrid module according to the present invention.

In FIG. 1, numeral 3 indicates a hybrid circuit body in which electronic components 2 such as IC elements are mounted on a circuit board 1, and this hybrid circuit body 3 is arranged on a heat sink 4 made of metal such as aluminum. has been done. That is, an opening at one end of a cylindrical envelope body, for example, a resin cylindrical body 5 is sealed, and the hybrid circuit body 3 is placed on a heat dissipation plate 4 forming the envelope via an adhesive layer. are arranged integrally. Further, a resin cylindrical body (envelope body) 5 erected on the heat sink 4 so as to surround the hybrid circuit body 3 has a lead penetrating through the wall of the cylindrical body 5. A frame 6 is provided, and one end of the lead frame 6 is led out to the outside of the cylindrical body 5.

The portion of the lead frame 6 housed in the cylindrical body (envelope body) 5 is bent 6a in the middle in a double-sided shape, and the tip is placed on the circuit board 1 of the hybrid circuit body 3. It is superimposed on the formed connection terminal and electrically connected by a method such as soldering or welding.

Furthermore, the other end (upper) opening of the cylindrical body (envelope main body) 5 is sealed with a lid 7' made of resin, for example. That is, as shown in a plan view of the back surface of the lid 7 in FIG. 2, in the lid 7', the surface of the lead frame 6 is located at a position corresponding to the bent portion 6a of the lead frame 6 to be installed. A protrusion 8 having a height sufficient to reach the lead frame 6 is disposed perpendicularly to the direction in which the lead frame 6 extends and can be pressed into contact with the lead frame 6. In other words, when the lid 7' is sealed, the tips (peaks) of the protrusions 8 come into contact (contact) with the bent portion 6a of the lead frame 6 installed inside, and the lead frame The lid body lid body 7' is configured so as to be engaged with the vertical portion 6b of the lead frame 6 to prevent movement or displacement of the lead frame 6 within the envelope.

In the hybrid module configured as described above, the lead frame 6 located inside the envelope body (cylindrical body) 5 moves in the direction in which it approaches the hybrid circuit body 3, which is the direction in which it extends, due to vibrations, thermal changes, etc. Even if an attempt is made to extend or extend the lead frame 6, the vertical portion of the lead frame 6 is locked to a protrusion 8 protruding from the inner surface (back surface) of the lid 7', so that the lead frame 6 cannot be extended any further. Therefore, a connection failure such as disconnection does not occur at the connection between the lead frame 6 and the hybrid circuit main body 3, and reliability is high.

Additionally, the protrusion 8 prevents the lead frame 6 from attempting to pull into the envelope body (cylindrical body) 5, so it can be reliably attached to other equipment. .

[Effects of the Invention] As explained above, according to the hybrid module according to the present invention, the stretching or positional shift of the lead frame housed in the envelope is prevented from colliding with the protrusion provided on the inner surface of the lid body. It is inhibited by being connected and locked. therefore,
No extra stress is applied to the connection between the lead frame housed in the envelope and the hybrid circuit main body, resulting in high connection reliability.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an example of the configuration of a hybrid module according to the present invention, FIG. 2 is a plan view showing the back structure of the lid body used in the configuration of the hybrid module shown in FIG. 1, and FIG. 3 is a conventional FIG. 2 is a cross-sectional view showing the configuration of a hybrid module. 1...Circuit board 2...Electronic components 3...Hybrid circuit body 4...Base plate (radiating fin) 5...
Cylindrical envelope body 6...Lead frame 6a...Lead frame bent portion 6b...
・Lead frame vertical portion 7...Lid body 8...Protrusion Applicant: Toshiba Corporation

Claims (1)

[Scope of Claims] An envelope having an opening at one end of a cylindrical envelope body sealed by a base plate and an opening at the other end sealed by a lid;
a hybrid circuit main body housed in the envelope; and a lead frame that penetrates the side wall of the envelope, is bent in an L-shape within the envelope, and has a tip electrically connected to the hybrid circuit main body. A hybrid module comprising: a protrusion that reaches the bent portion of the lead frame and locks the bent portion of the lead frame perpendicularly to the extending direction on the circumferential surface of the lid body.