JPH04299595A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To realize a hybrid integrated circuit device whose packaging density is higher than that of the conventional device. CONSTITUTION:Surface mounting devices 1 are packaged between two retaining boards 2, so as to be in parallel with each other and vertical to the two boards 2. A package having gull wing type leads, a leadless chip carrier, etc., are applied to the surface mounting device 1. The package occupied area on the retaining board 2 is 1/4-1/3 as compared with the conventional single-sided board mounting, and 1/2-2/3 as compared with the doubled-sided board mounting.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device equipped with a surface-mounted device.

0002

2. Description of the Related Art FIG. 4 shows a cross-sectional structure of a hybrid integrated circuit device in which a conventional surface mount device 1 such as an SOP is mounted on a support substrate 2a such as a printed circuit board. This surface mount device 1 is mounted on both sides of a support substrate 2.

0003

SUMMARY OF THE INVENTION This conventional hybrid integrated circuit device has a problem in that high packaging density cannot be achieved. A large number of surface mount devices 1 are mounted on a support substrate 2.
, the support substrate 2 needs to be mounted on both sides and occupy at least 1/2 of the total area of the mounted packages, and as hybrid integrated circuit devices become large-scale and the number of mounted packages increases as seen today. The area occupied by the package on the support substrate increases accordingly.

SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit device that solves these problems, reduces the area occupied by surface-mounted devices, and improves the packaging density.

[0005]

A hybrid integrated circuit device according to the present invention is characterized in that a plurality of surface mount devices are mounted parallel to each other and perpendicularly between two supporting substrates.

[0006] In the present invention, the surface mount device can also be a leadless chip carrier.

[0007]

Embodiment FIG. 1(a) is a side view showing a first embodiment of the present invention. A plurality of surface mount devices 1 are mounted parallel to each other and perpendicularly to two support substrates 2. The gull wing type leads of each surface mount device 1 are connected to the supporting substrate 2.
The surface mount devices are connected to each other by wiring on the supporting substrate 2 arranged on at least both sides (in four directions in some cases).

Furthermore, as shown in FIG. 1(b), it is also possible to attach a clip terminal 3 to the end of the support substrate 2 of this hybrid integrated circuit device and insert it onto another substrate 2b for mounting. .

FIG. 2 is a sectional side view of a second embodiment of the present invention, in which a leadless chip carrier 12 is used as the surface mount device 1.

A typical leadless chip carrier is shown in FIG.
It is shown as a perspective view of (a), (b) and its AA' cross-sectional view. A sealing resin 7 is applied on the substrate 5 having the end surface through-hole electrodes 4 on the inner side defined by the resin frame 6. Moreover, the IC chip 8 mounted on the substrate 5 is
The bonding wire 9 is connected to the end surface through-hole electrode 4 via the wiring 10, and the end surface through-hole electrode 4 is also connected to the back surface electrode 11. A leadless chip carrier 12 is mounted on the support substrate 2, and the leadless chip carrier 12 is connected to the support substrate 2 by, for example, solder via the end surface through-hole electrode 4.

[0011]

[Effects of the Invention] As explained above, in the present invention, since the surface mount devices are mounted parallel to each other and perpendicular to the support substrate, the area occupied by the surface mount devices on the support substrate can be reduced and the mounting density can be improved. effective. In a normal package, the thickness of the package is approximately 1/4 to 1/3 compared to the package size, so it is 1/4 to 1/3 compared to conventional single-sided mounting, and 1/3 compared to conventional double-sided mounting. The area occupied on the support substrate can be reduced to about 2/2 to 2/3.

Furthermore, compared to the first embodiment, in the case of the second embodiment, since the leadless chip carrier 12 is surface mounted on the support substrate 1, the surface on which the leadless chip carrier is mounted is opposite to the surface on which the leadless chip carrier is mounted. Wiring can also be done on the surface of the supporting substrate on the side, increasing the degree of freedom in designing the supporting substrate and enabling even higher density wiring.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are a side sectional view showing a first embodiment of the present invention and a side view of an application example thereof.

FIG. 2 is a side sectional view of a second embodiment of the invention.

FIGS. 3(a) and 3(b) are a perspective view and a sectional view taken along line AA' of a typical leadless chip carrier.

FIG. 4 is a side sectional view showing a conventional example.

[Explanation of symbols]

1　　　　Surface mount device 2 Support board 3 Clip terminal 4 End surface through-hole electrode 5　　　　　Substrate 6 Resin frame 7 Sealing resin 8 IC chip 9 Bonding wire 10 Wiring 11　　　　Back electrode

Claims (2)

[Claims] 1. A hybrid integrated circuit device characterized in that a plurality of surface mount devices are mounted parallel to each other and perpendicularly between two supporting substrates. 2. The hybrid integrated circuit device of claim 1, wherein the surface mount device is a leadless chip carrier.