JPH04214714A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

PURPOSE:To obtain an epoxy resin composition, good in fluidity and mechanical strength, having low stress and hygroscopicity and a high glass transition temperature and excellent in crack resistance and moldability and a semiconductor device, sealed with a cured product of the aforementioned composition and having high reliability. CONSTITUTION:An epoxy resin composition is obtained by blending (A) an epoxy resin having >=2 epoxy groups in one molecule with (B) a phenolic resin, (C) a silicone-based flexibilizer which is a copolymer prepared by carrying out addition reaction of alkenyl groups of an alkenyl group-containing epoxy resin or phenolic resin with groups identicalSiH in an organopolysiloxane expressed by the formula [R is lower alkyl, etc.; a is 0.01-0.1; b is 1.8-2.2; (n) is 20-400, etc.], (D) a curing accelerator [e.g. 1,8-diazabicyclo[5.4.0]undecene-7] and (E) an inorganic filler (e.g. silicas). In the aforementioned composition, however, a compound having >=1 (substituted) naphthalene rings is contained in at least either of the components (A) and (B).

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention has good fluidity, good mechanical strength such as bending strength and flexural modulus, low expansion coefficient, high glass transition temperature, and crack resistance. The present invention relates to an epoxy resin composition that provides a cured product with excellent moldability and low moisture absorption, and a semiconductor device sealed with the cured product of this epoxy resin composition.

0002

[Prior Art] Currently, resin-encapsulated diodes, transistors, ICs, LSIs, and VLSIs are the mainstream in the semiconductor industry. The blended epoxy resin composition generally has superior moldability, adhesion, electrical properties, mechanical properties, moisture resistance, etc. compared to other thermosetting resins, so semiconductor devices can be encapsulated with the epoxy resin composition. Many things are being done. Recently, the degree of integration of these semiconductor devices has been increasing, and the chip size has also been increasing accordingly.

On the other hand, the external dimensions of packages are becoming smaller and thinner due to the demand for smaller and lighter electronic devices. Furthermore, in the method of attaching semiconductor components to a circuit board, surface mounting of semiconductor components has become common due to the increased density of components on the board and the thinner boards.

0004

[Problems to be Solved by the Invention] However, when surface mounting a semiconductor device onto a circuit board, the general method is to immerse the entire semiconductor device in a solder bath or to pass it through a high temperature zone where the solder melts. At that time, there were problems in that the thermal shock caused cracks in the sealing resin layer and peeling at the interface between the lead frame or chip and the sealing resin. Such cracks and peeling become more noticeable if the encapsulating resin layer of the semiconductor device absorbs moisture before the thermal shock during surface mounting, but in the actual work process, the encapsulating resin layer absorbs moisture. This is unavoidable, and as a result, the reliability of the semiconductor device sealed with epoxy resin after mounting may be greatly impaired.

Therefore, it has been desired to develop a high quality epoxy resin composition for encapsulating a semiconductor device that can provide a highly reliable semiconductor device after surface mounting on a circuit board.

[0006] The present invention was made in view of the above circumstances.
It has good fluidity, good mechanical strength such as bending strength and flexural modulus, low expansion coefficient, high glass transition temperature, excellent crack resistance and moldability, and low moisture absorption. An object of the present invention is to provide an epoxy resin composition that provides a cured product of the present invention, and a semiconductor device sealed with the cured product of this epoxy resin composition that has high reliability even after thermal shock during surface mounting.

[0007]

[Means and effects for solving the problem] As a result of extensive studies to achieve the above object, the present inventors have found (1) an epoxy resin having at least two or more epoxy groups in one molecule, (2) a phenol By causing an addition reaction between the alkenyl group of the resin, (3) a silicone-based flexibility imparting agent, preferably an alkenyl group-containing epoxy resin or phenol resin, and the ≡SiH group of the organopolysiloxane represented by the following general formula (1). The obtained copolymer, (4) a curing accelerator, and (5) an inorganic filler are blended, and the above-mentioned (1)
An epoxy resin composition containing a compound having at least one substituted or unsubstituted naphthalene ring in one molecule in at least one of the epoxy resin component () and the phenol resin component (2) has good fluidity. At the same time, it has been found that a cured product with excellent low stress properties can be obtained, which has characteristics such as a low expansion coefficient and a decrease in elastic modulus in a temperature range equal to or higher than the glass transition temperature.

[0008]

[Case 2]

Moreover, the epoxy resin compositions obtained by conventional methods of lowering the elastic modulus have drawbacks such as a low glass transition temperature and insufficient resin strength.
The above-mentioned epoxy resin composition has a low modulus of elasticity, no drop in glass transition temperature, low moisture absorption, and is crack resistant because the silicone flexibility imparting agent is microdispersed in the curable epoxy resin. The inventors have discovered that this method provides a cured product that has excellent properties not available with conventional epoxy resin compositions, such as dramatically improved properties and excellent moldability with little deformation of the aluminum electrode. In addition, semiconductor devices sealed with such a cured product have high reliability even after thermal shock during surface mounting.
It has been discovered that it can be used to encapsulate any type of semiconductor device, such as molded or flat-packed type, and has extremely excellent properties as a encapsulating material for surface-mounted semiconductor devices in particular. I arrived at the eggplant.

Therefore, the present invention provides (1) an epoxy resin having at least two epoxy groups in one molecule, (2) a phenolic resin, (3) a silicone flexibility imparting agent, (4) a curing accelerator, and (5) a curing accelerator. The epoxy resin of component (1) and (
2) An epoxy resin composition characterized by containing a compound having at least one substituted or unsubstituted naphthalene ring in one molecule in at least one of the phenolic resins as the component; An epoxy resin composition containing a copolymer obtained by addition-reacting an alkenyl group-containing epoxy resin or phenol resin with the ≡SiH group of an organopolysiloxane represented by the following general formula (1) as a flexibility imparting agent, and A semiconductor device sealed with a cured product of these epoxy resin compositions is provided.

[0011]

[Chemical formula 3]

[0012] The present invention will be described in more detail below.The epoxy resin composition of the present invention contains an epoxy resin, a phenol resin, a silicone flexibility imparting agent, a curing accelerator, and an inorganic filler as described above. It becomes.

[0013] Here, as the epoxy resin which is the first essential component, epoxy resins having two or more epoxy groups in one molecule are preferably used, such as bisphenol A type epoxy resins, phenol novolac type epoxy resins,
Glycidyl ether type epoxy resins such as allylphenol novolac type epoxy resins, triphenolalkane type epoxy resins and their polymers, naphthalene type epoxy resins, biphenyl type epoxy resins, dicyclopentadiene type epoxy resins, phenol aralkyl type epoxy resins, glycidyl esters One or more types of epoxy resins such as type epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, and halogenated epoxy resins can be used.

In this case, in the present invention, it is preferable that a part or all of the epoxy resin as the first essential component is an epoxy resin having at least one substituted or unsubstituted naphthalene ring in one molecule; By using an epoxy resin containing a naphthalene ring, it is possible to obtain an epoxy resin composition that has a small expansion coefficient and provides a cured product with low hygroscopicity.

[0015] Specifically, as such an epoxy resin having a naphthalene ring, compounds having the following structure can be mentioned.

[0016]

[C4]

Next, the second essential component phenolic resin is:
It acts as a curing agent for epoxy resins, such as novolac type phenol resin, resol type phenol resin, naphthalene type phenol resin, phenol aralkyl resin, triphenol alkane type resin, and polymers of these. Particularly, it is preferable that part or all of the second essential component is a phenol resin having at least one substituted or unsubstituted naphthalene ring in one molecule. By blending a phenolic resin with a naphthalene ring as a curing agent, it has a small expansion coefficient, a high glass transition temperature, a low elastic modulus in the temperature range above the glass transition temperature, and has low moisture absorption. An epoxy resin composition that gives a cured product of obtain.

[0018] As the phenol resin having such a naphthalene ring, compounds having the following structure can be specifically exemplified.

[0019]

[C5]

In addition to the above-mentioned phenolic resin, the composition of the present invention also contains other curing agents such as amine-based curing agents such as diaminodiphenylmethane, diaminodiphenylsulfone, and metaphenylene diamine, phthalic anhydride, and anhydrous Acid anhydride curing agents such as pyromellitic acid and benzophenonetetracarboxylic anhydride may also be used in combination within the range that does not impede the effects of the present invention.

[0021]The epoxy resin composition of the present invention contains the above-mentioned epoxy resin and phenol resin as essential components, but in this case, one molecule of at least one of the above-mentioned epoxy resin and phenol resin. It is necessary to contain a compound having at least one substituted or unsubstituted naphthalene ring.

The content of naphthalene rings in the epoxy resin as the first essential component and the phenol resin as the curing agent is preferably in the range of 5 to 80% by weight, particularly 10 to 60% by weight. If the content of naphthalene rings is less than 10% by weight, the cured product will not have low moisture absorption, and the effect of low elastic modulus in the temperature range above the glass transition temperature will not be noticeable.
Cracking resistance during thermal shock after moisture absorption may not be sufficiently improved. Furthermore, if the naphthalene ring content exceeds 80% by weight, it may be disadvantageous in terms of dispersibility or moldability during production.

Examples of the silicone flexibility imparting agent as the third essential component of the present invention include silicone oil made of organopolysiloxane, modified silicone oil made of terminally functional organopolysiloxane, silicone elastomer powder, silicone gel, silicone Commonly used resins such as modified epoxy resins and silicone-modified phenol resins can be used, but in particular, alkenyl group-containing epoxy resins or alkenyl groups of phenol resins and organopolysiloxanes represented by the following general formula (1) ≡ It is preferable to blend a copolymer obtained by addition reaction with SiH groups.

[0024]

[C6]

Here, the alkenyl group-containing epoxy resin and phenol resin are specifically represented by the following formulas (2) to (
The compound 5) is exemplified.

[0026]

embedded image (However, in the above formulas (2) to (5), p and q usually represent positive numbers expressed as 1≦p≦10, 1≦q≦3.)

[0027] These alkenyl group-containing epoxy resins and phenol resins can be obtained by, for example, epoxidizing an alkenyl group-containing phenol resin with epichlorohydrin,
It can be obtained by a conventionally known method such as partially reacting an epoxy resin with 2-allylphenol or the like.

On the other hand, in the organopolysiloxane represented by the above formula (1), at least one ≡
Any material having SiH may be used, but hydrogen methyl polysiloxane at both ends, hydrogen methyl phenyl polysiloxane at both ends, and hydrogen methyl/(2-trimethoxysilylethyl) polysiloxane at both ends are particularly preferred. Specifically, the following compounds (6) to (10) may be mentioned.

[0029]

[Chemical formula 8]

The degree of polymerization of the organopolysiloxane represented by the above formula (1) is preferably in the range of 20 to 400, particularly 30 to 200; when n is less than 20, sufficient flexibility is often imparted. In some cases, it may not be possible to obtain a glass transition point, and if n exceeds 400, it is extremely difficult to obtain a copolymer due to synthesis technology, and even if a copolymer is obtained, it is difficult to disperse easily. There may be cases where it is not possible to do so. Generally, when the silicone content is the same, organopolysiloxanes can give good results in crack resistance and high Tg as n increases, but on the other hand, dispersibility and adhesion with elements decrease. Tend. In order to improve the adhesion with the dispersive element, it is effective and desirable to introduce the following group into the side chain, for example as shown in the above formula (10).

[0031]

[Chemical formula 9]

The copolymer blended into the epoxy resin composition of the present invention is composed of the above-mentioned alkenyl group-containing epoxy resin or phenol resin, an organopolysiloxane having a ≡SiH group of formula (1), and a conventionally known addition catalyst, such as a chlorination catalyst. It can be obtained by carrying out a heating reaction in the presence of a platinum-based catalyst such as platinic acid. This reaction is an addition reaction between the alkenyl group of the epoxy resin or phenol resin and the ≡SiH group of the organopolysiloxane, and the reaction formula is as follows.

≡SiH+CH2=CH → ≡Si-CH2-C
H2-Furthermore, the copolymer has a high glass transition point, is not compatible with the epoxy resin (curable epoxy resin) in the epoxy resin composition, and has a fine sea-island structure.
It is desirable to obtain an epoxy resin composition with a low expansion coefficient and excellent crack resistance, and for this purpose, the solubility parameter of the copolymer is set to 7.3 to 8.5, particularly 7.6.
It is preferable to set it as 8.2. In order to obtain a copolymer with the above solubility parameter, if the ≡SiH equivalent of the organopolysiloxane is A, and the molecular weight of the alkenyl group-containing epoxy resin or phenolic resin is B, then 0.7<A
It is preferable to carry out the reaction in the range of /B<7.0.

The blending amount of the above-mentioned copolymer is preferably from 1 to 100 parts, particularly from 2 to 60 parts; if it is less than 1 part, the glass transition temperature of the epoxy resin composition is improved, the crack resistance is improved, and aluminum The effect of inhibiting wire movement may be insufficient, and if the amount exceeds 100 parts by weight, the mechanical strength of the epoxy resin composition may decrease.

In addition, in the present invention, the amount of epoxy groups (x moles) and the amount of phenolic hydroxyl groups (y
It is preferable that the ratio x/y is in the range of 0.5 to 1.5, especially 0.9 to 1.1; if x/y is outside the above range, hardenability and low stress properties may be at a disadvantage. Therefore, it is desirable that the first to third components are blended within this range.

Next, examples of the curing accelerator as the fourth essential component to be added to the composition of the present invention include 1,8-diazabicyclo(5.4.0)undecene-7,N,N-dimethylbenzylamine, etc. Examples include tertiary amine compounds such as tertiary amine compounds, imidazole compounds such as 2-phenylimidazole and 2-ethyl-4-methylimidazole, and phosphorus compounds such as triphenylphosphine, but in particular 1,8-diazabicyclo (5.4. 0) Undecene-7 and triphenylphosphine in a weight ratio of 0:1 to 1:1, especially 0.01:1
It is preferred to use co-catalysts mixed in a ratio of ~0.5:1. When the mixing ratio of 1,8-diazabicyclo(5.4.0)undecene-7 is outside the above range, the glass transition temperature of the resulting cured product may become low.

The amount of the curing catalyst added is not particularly limited, but when using the above-mentioned combined catalyst, the amount is 0.2 to 100 parts per 100 parts of the total amount of the epoxy resin as the first component and the phenol resin as the second component. It is desirable to use 2 parts, especially 0.4 to 1.2 parts.

Furthermore, as the inorganic filler to be used in the composition of the present invention, those normally added to epoxy resin compositions can be used, such as silicas such as fused silica and crystalline silica, alumina, talc, and mica. , silicon nitride,
Examples include boron nitride and calcium carbonate, but it is particularly preferable to use silica and alumina either alone or in combination.

The amount of the inorganic filler blended is not particularly limited, but it is 100 to 1000 parts, especially 200 parts to 100 parts of the first to third components (epoxy resin, phenol resin, and silicone flexibility imparting agent). It is preferable to set it as the range of 700 parts.

[0040] In addition to the above-mentioned essential components, the composition of the present invention may further contain various additives as other optional components, if necessary. Optional ingredients include waxes such as carnauba wax, mold release agents such as fatty acids such as stearic acid and metal salts thereof, carbon black,
Pigments such as cobalt blue and red iron, antimony oxide,
Flame retardants such as halogen compounds, surface treatment agents (γ-glycidoxypropyltrimethoxysilane, etc.), coupling agents such as epoxysilane, vinylsilane, boron compounds, alkyl titanates, anti-aging agents, and other additives. 1
A species or two or more species can be blended. Incidentally, the amount of these additives to be blended can be a normal amount within a range that does not impede the effects of the present invention.

In producing the epoxy resin composition of the present invention, predetermined amounts of the above-mentioned components are uniformly stirred and mixed,
It can be obtained by kneading, cooling, and pulverizing using a kneader, roll, extruder, etc. that has been heated to 70 to 95°C in advance. Here, there is no restriction on the order of blending the components.

The epoxy resin composition of the present invention thus obtained can be effectively used for sealing semiconductor devices such as SOP type, SOJ type, PLCC type, flat pack type, etc.
In this case, molding can be carried out by employing conventional molding methods such as transfer molding, injection molding, and casting. In addition, it is desirable that the molding temperature of the epoxy resin composition of the present invention is 150 to 180°C, and the post-curing is carried out at 150 to 180°C for 2 to 16 hours.

[0043]

[Examples] The present invention will be specifically explained below with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. In addition, in the following examples, all parts are parts by weight. Furthermore, prior to explaining the Examples and Comparative Examples, a production example of the copolymer used in the present invention will be shown as a reference example.

[Reference Example 1] A phenol novolak resin modified with allyl glycidyl ether (phenol equivalent: 125, allyl equivalent: 1100
), 170 g of methyl isobutyl ketone, 330 g of toluene, and 0.07 g of a 2-ethylhexanol-modified chloroplatinic acid solution with a platinum concentration of 2% were added, azeotropic dehydration was performed for 1 hour, and the following formula (11) was added at reflux temperature. 133 g of organopolysiloxane represented by was added dropwise over a dropping time of 30 minutes. Furthermore, after reacting by stirring at the same temperature for 4 hours, the obtained contents were washed with water and the solvent was distilled off under reduced pressure. A reaction product (copolymer I) was obtained which had a weight loss.

[0045]

[Chemical formula 10]

[Reference Example 2] Using the same four-necked flask as in Reference Example 1, 200 g of a phenol novolak resin (phenol equivalent: 125, allyl equivalent: 1100) with a softening point of 100° C. modified with allyl glycidyl ether was placed in it. , chloromethyloxirane 800g, cetyltrimethylammonium bromide 0
．． 6 g of each were added, heated, and stirred and mixed at a temperature of 110° C. for 3 hours. This was cooled to a temperature of 70°C, and
After reducing the pressure to mmHg, 128 g of a 50% aqueous solution of sodium hydroxide was added dropwise over 3 hours while performing azeotropic dehydration. The resulting contents were distilled off under reduced pressure to remove the solvent, and then 300 g of methyl isobutyl ketone and 300 g of acetone were added.
After dissolving in a mixed solvent of g, the resin was washed with water, and the solvent was distilled off under reduced pressure to obtain an allyl group-containing epoxy resin (allyl equivalent: 1590, epoxy equivalent: 190). When this epoxy resin and the organopolysiloxane of formula (11) were reacted in the same manner as in Reference Example 1, the reaction product shown in Table 1 (copolymer II, epoxy equivalent weight 276) was obtained.
was gotten.

[Reference Example 3] 150 g of epoxidized cresol novolac resin (epoxy equivalent: 200) with a softening point of 70° C. was placed in a 1 liter four-necked flask equipped with a reflux condenser, thermometer, stirrer and dropping funnel. 1,4-dioxane 15
0 g, and 150 g of n-butanol were added thereto, and while stirring at a temperature of 83°C, 50 g of α,ω-di(methylaminopropyl)dimethylpolysiloxane represented by the following formula (12) was added dropwise over a 2 hour drop time. The reaction was continued at the same temperature for 6 hours with stirring. Thereafter, the solvent was distilled off from the obtained contents to obtain the reaction products shown in Table 1 (copolymer III, epoxy equivalent: 240).

[0048]

[Chemical formula 11]

[0049]

[Table 1]

[Reference Example 4] 100 g of methylvinylpolysiloxane with a viscosity of 200 cs, consisting of 96 mol% of dimethylsiloxane units whose molecular chain ends are capped with dimethylvinylsilyl groups and 4 mol% of methylvinylsiloxane units, was added to the molecular chain. 95 mol% of methylhydrogensiloxane units and 5 mol% of dimethylsiloxane units with both ends capped with trimethylsilyl groups
10 g of methylhydrogenpolysiloxane having a viscosity of 28 cs was added to prepare an organosiloxane composition having a molar ratio of ≡SiH/Si=CH2 of 2.0.

Next, 3 parts of polyoxyethylene octylphenyl ether having an HLB of 13.5 and 587 g of water were added to this organosiloxane composition and mixed uniformly with a homogenizer, followed by a Gaulin homogenizer at a pressure of 300 kg/cm2. An emulsion was prepared by homogenization. The maximum particle size of this emulsion particle is 10 μm.
The volume average particle size was 1.0 μm.

Next, 0.06 g of chloroplatinic acid-olefin complex salt as platinum was added to 0.5 g of the obtained emulsion and mixed, and the emulsion particles were left to react at 25° C. for 20 hours. The volume average particle diameter was 1.0 μm. Furthermore, when this emulsion particle was passed through a spray dryer with an inlet temperature of 150°C and an outlet temperature of 80°C, a particle size of 15μ was released from the chamber.
9.05g of spherical silicone elastomer powder less than m
(yield 83%) was obtained.

[Examples 1 to 12, Comparative Examples 1 to 9] Table 2,
The components shown in 3 and the components shown below are uniformly melt-mixed using two heated rolls, cooled and pulverized to obtain an epoxy resin composition (
Examples 1 to 12 and Comparative Examples 1 to 9) were obtained.

The following tests were conducted on the obtained epoxy resin composition. The results are also listed in Tables 2 and 3. Ingredients Inorganic filler Quartz powder (I) Specific surface area 1.2m2/g, average particle size 30μ
m fused spherical silica (coarse particles of 75 μm or more, 0.1% or less)
300 parts Quartz powder (II) Specific surface area 2.5 m2/g, average particle size 6 μm
of fused crushed silica (0 coarse particles larger than 75 μm)
．． 1% or less)
200 copies
Quartz powder (III) Specific surface area 10m2/g, average particle size 1.0μ
M fused spherical silica 50 parts Mold release agent Carnauba wax

1.5 parts Silane coupling agent 3-glycidoxypropyltrimethoxysilane 1.5 parts
(KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.) Colorant Kaborn Black

1.5 parts Flame retardant antimony trioxide

1.5 parts Test method (1) Spiral flow The molding conditions were 175° C. and 70 kg/cm 2 . (2) Mechanical strength (bending strength and bending modulus) JIS-
A bending rod of 10 x 4 x 100 mm was molded under the conditions of 175° C., 70 kg/cm 2 and molding time of 2 minutes in accordance with K6911, and was post-cured at 180° C. for 4 hours, and measurements were taken at room temperature. (3) Glass transition temperature, coefficient of linear expansion (4) Low coefficient of expansion Using a test piece of 5 x 5 x 15 mm, the value was measured when the temperature was raised at a rate of 5°C per minute using a dilatometer. (5) Solder cracking after moisture absorption 4x silicone chips with a size of 2x4x0.4mm
It was adhered to a 12 x 1.8 mm package, and an epoxy resin composition was molded thereon at 175 x 2 minutes, followed by post-curing at 180°C for 4 hours. After this was left in an atmosphere of 85° C./85% RH for 48 hours, it was immersed in a solder bath at a temperature of 240° C. for 10 seconds, and the number/total number of package cracks was measured. (n=20) Note that the state in which internal cracks occurred is as shown in the drawings, and cracks 4 were observed to occur within the sealing resin 3 that sealed the silicone chip 1 and the frame 2. (6) A moisture-resistant 4M DRAM chip is glued to a 20PIN SOJ frame, and an epoxy resin composition is molded onto it at 175°C.
It was molded in 2 minutes and post-cured at 180°C for 4 hours. Next, after leaving it in a 121°C/100% RH atmosphere for 24 hours to absorb moisture, it was immersed in a 260°C solder bath for 10 seconds, and then left in a 121°C/100% RH atmosphere for 300 hours. /Total number was measured. (n=40)
(7) Heat cycle resistance 4x1 silicon chips with a size of 2x4x0.4mm
It was glued onto a 2x1.8mm SO package, and an epoxy resin composition was molded onto it at 175°C for 2 minutes.
Post-cure was performed at 0°C for 4 hours. To this -196℃,
A heat cycle of 1 minute to 260°C for 30 seconds was repeated, and the number of package cracks/total number after 100 cycles was measured. (8) A disc with a diameter of 50 mm x 2 mm was molded under the conditions of water absorption rate of 175°C, 70 kg/cm2, and molding time of 2 minutes, post-cured at 180°C for 4 hours, and then left in 121°C/100% PCT for 24 hours. Then, the water absorption rate was measured.

[0055]

[Table 2]

[0056]

[Table 3]

The epoxy resins and phenol resins shown in Tables 2 and 3 are as follows.

[0058]

[Chemical formula 12]

From the results shown in Tables 2 and 3, the epoxy resin composition of the present invention not only has good fluidity, but also has good mechanical strength such as bending strength and flexural modulus, and has a low expansion coefficient and high It has a glass transition temperature, has excellent crack resistance, has a small amount of deformation of the aluminum electrode, and has excellent formability.
It was confirmed that this gave a cured product with low hygroscopicity.

[0060]

Effects of the Invention As explained above, the epoxy resin composition of the present invention has good fluidity and good mechanical strength such as bending strength and bending modulus due to the combination of the above-mentioned components. A cured product that has low stress and excellent crack resistance due to its low expansion coefficient, low elastic modulus, high glass transition temperature, low moisture absorption, and excellent moldability. Therefore, a semiconductor device sealed with a cured product of the epoxy resin composition of the present invention has high reliability even after thermal shock after surface mounting.

[Brief explanation of the drawing]

FIG. 1 is a state diagram showing internal cracks generated in a silicone chip resin sealed with an epoxy resin composition.

[Explanation of symbols]

1 Silicone chip 2 Frame 3 Sealing resin 4 Crack

Claims (3)

[Claims] Claim 1: (1) an epoxy resin having at least two epoxy groups in one molecule, (2) a phenolic resin, (3) a silicone flexibility imparting agent, (4) a curing accelerator, (5) an inorganic filler, and an epoxy resin as the component (1) and (
2) An epoxy resin composition characterized in that at least one of the component phenolic resins contains a compound having at least one substituted or unsubstituted naphthalene ring in one molecule. [Claim 2] A silicone-based flexibility imparting agent obtained by an addition reaction between an alkenyl group of an alkenyl group-containing epoxy resin or a phenol resin and a ≡SiH group of an organopolysiloxane represented by the following general formula (1). The epoxy resin composition according to claim 1, which contains a copolymer. [Chemical formula 1] 3. A semiconductor device sealed with a cured product of the epoxy resin composition according to claim 1 or 2.