JPH04178263A - Flux coating device - Google Patents

Abstract

PURPOSE:To coat a prescribed position on a printed board with a necessary amount of flux by moving a coating member to a desired place on the printed board, or, bringing it into contact with the desired place on the printed board through an X-Y robot and its holding head. CONSTITUTION:First, the X-Y robot is driven, the coating member 17 is moved to a flux supply part 12a, the flux is supplied to its end part 18 and approached to a prescribed wiring pattern 6 of the printed board 5. Further, the holding head 21 is driven, a piston 22 of an electromagnetic solenoid 23 is withdrawn, the coating member 17 is lowered and one end part 18 of the coating member 17 is brought into contact with a prescribed position on the printed board 5. Then, the X-Y robot 14 is driven and the coating member 17 is moved after the shape of a wiring pattern 6 as one end part 18 of the coating member 17 is brought into contact with the printed board 5. The flux permeated in the coating member 17 is transferred in a shape nearly similar to the locus of one end part 18 of the coating member 17 and a necessary amount is applied along the wiring pattern.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention relates to a flux application process in which flux is applied to a printed circuit board in a process before soldering a multi-terminal electronic component to a printed circuit board, for example. Regarding equipment.

(Prior Art) For example, when a flat-packaged multi-terminal electronic component is soldered to a printed circuit board, flux may be applied to the printed circuit board in a step before the soldering process. This flux improves wetting of the solder and improves the bonding strength between the terminals of the multi-terminal electronic component and the wiring pattern of the printed circuit board.

The flux has been applied using, for example, a foaming method as shown in FIG. 4, or a stamping method as shown in FIGS. 5 and 6.

In the foaming method shown in FIG. 4, a flux 2 and a foaming member 3 are placed in a flux tank 1, and the foaming member 3 forms flux foam 4. Then, with the printed circuit board 5 or the wiring pattern 6 facing the flux tank 1, it moves as shown by arrow A and passes above the flux tank 1.

Then, the wiring pattern forming surface 7 of the printed circuit board 5 is brought into contact with the flux bubble 4, and the flux 2 is applied to substantially the entire wiring pattern forming surface 7 of the printed circuit board 5.

On the other hand, in the stamp method shown in FIGS. 5 and 6, a stamp head 8 as shown in FIG. 5 is used. The stamp head 8 has stamp parts 9 arranged so as to substantially match the arrangement of the wiring pattern 6 formed on the printed circuit board 5. Stamp head 8
After applying flux to the stamp portions 9 . Then, the stamp head 8 presses the stamp portion 9 against the wiring pattern 6 and applies flux in accordance with the arrangement of the wiring pattern 6.

(Problem to be Solved by the Invention) By the way, as shown in FIG. 4, flux is applied to almost the entire surface of the printed circuit board 5, and for example, the back side is left bare and exposed.
(onding) parts, etc., the IC that makes up the TAB parts may be damaged due to the flux remaining on the back side.
In addition, in the stamp method shown in FIGS. 5 and 6, it is possible to apply flux only to the necessary areas; There was a problem in that the amount of flux applied could not be controlled. In the stamp method, it is necessary to determine the shape and dimensions of the stamp portion 9 in advance in accordance with the wiring pattern 6.

Therefore, in order to apply the required amount of flux to the required portions, manual work was required.

SUMMARY OF THE INVENTION An object of the present invention is to provide a flux coating device that can apply a necessary amount of flux to a predetermined position on a printed circuit board without requiring any manual labor.

[Configuration of the Invention (Means and Effects for Solving the Problems) To achieve the above object, the present invention provides a printed circuit board holder for holding a printed circuit board, an application member for applying flux,
It includes an X-Y robot that moves the application member within the X-Y plane, and an application member holding head that moves the application member in a direction perpendicular to the X-Y plane and brings it into contact with a predetermined position on the printed circuit board. The purpose of this method is to apply the flux adhering to the application member to the printed circuit board.

By doing so, the present invention is able to apply the required amount of flux to a predetermined position on a printed circuit board without requiring any human labor.

(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 to 3. Components that are the same as those described in the prior art section are given the same numbers and their explanations will be omitted.

FIG. 1 shows an embodiment of the present invention, and the reference numeral 1 in the figure shows an embodiment of the present invention.
1 indicates a flux coating device.

This flux application device 11 has a rectangular flat base 1.
2, a rectangular printed circuit board 5 is mounted on the base 12, and a wiring pattern 6 formed on the printed circuit board 5 is mounted on the base 12.
It is placed facing upward. Furthermore, the flux coating device 11 holds the printed circuit board 5 on the base 12 by printed circuit board holders 13 (only two are shown) that are engaged with, for example, the four corners of the printed circuit board 5.

The flux application device 11 also includes a flux supply section 1 that stores, for example, paste-like flux on the base 12.
It has 2g.

Furthermore, the flux coating device 11 includes an X-Y robot 1.
4 is provided. This X-Y robot 14 includes an X-axis robot 15 disposed along one piece of the base 12;
The Y-axis robot 16 extends in a direction perpendicular to the longitudinal direction of the X-axis robot 15.

In addition, the X-Y robot 14 is operated by the X-axis robot 15.
Cotton swab 1 as an application member shown in FIGS. 2 and 3
7 (described later).

Then, the X-Y robot 14 moves the Y-axis robot 16 to the first position on the plate surface of the base 12 and along the X-axis robot 15.
It is moved linearly in the X direction shown by arrow C in the figure. moreover,
The X-Y robot 14 picks up the cotton swab 1 using the Y-axis robot 16.
7 is moved linearly in the Y direction indicated by the arrow in FIG.

The cotton swab 17 can be impregnated with flux at both ends 18 and 19 in its axial direction, and as shown in FIG. is fixed at one end of the The cotton swab 17 has its axial end portions 18 and 19 facing downward on the road.

Furthermore, the flux coating device 11 is provided with a cotton swab holding head (hereinafter referred to as a holding head) 21 as a coating member holding head. This holding head 21 is connected to the cotton swab holder 20 and a piston 22 that can be vertically protruded and retracted.
It is configured by an electromagnetic solenoid 23 having a.

The holding head 21 presses the other end of the cotton swab holder 20 downward by the piston 22 of the electromagnetic solenoid 23, and tilts the cotton swab holder 20 so that the side on which the cotton swab 17 is held is higher.

Next, the operation of the flux coating device 11 described above will be explained.

First, the X-axis robot 15 of the X-Y robot 14 and the
The axis robot 16 is driven, and the cotton swab 17 moves toward the flux supply section 12a. The cotton swab 17 is supplied with flux to one end 18 thereof, and the one end 18 is impregnated with the flux. The cotton swab 17 then moves toward the printed circuit board 5 and is brought close to a predetermined wiring pattern 6 on the printed circuit board 5.

Furthermore, the holding head 21 is driven, and the arrow E in FIG.
As shown in , the piston 22 of the electromagnetic solenoid 2B is retracted to rotationally displace the cotton swab holder 20. Then, the holding head 21 moves the cotton swab 1 in the Z direction indicated by arrow F in FIG.
7 and bring one end 18 of the cotton swab 17 into contact with a predetermined position on the printed circuit board 5.

Then, the X-Y robot 14 is driven, and while keeping one end 18 of the cotton swab 17 in contact with the printed circuit board 5, the wiring 71' turn 6 is also aligned to the shape as shown by arrows a-d in FIG. Moving. Then, the flux soaked into the cotton swab 17 is transferred into a shape that substantially matches the locus of one end 18 of the cotton swab 17, and is applied along the wiring pattern 6.

That is, in such a flux coating device 11, the X-Y robot 14 and the holding head 21,
The cotton swab 17 can be moved to a desired location on the printed circuit board 5 and brought into contact with the desired location on the printed circuit board 5 .

Therefore, the required amount of flux can be applied to a predetermined position or a predetermined range of the printed circuit board 5 without requiring any manual labor.

Further, corrosion caused by excess flux can be prevented from occurring in the IC chip mounted on the printed circuit board 5.

[Effects of the Invention] As explained above, the present invention includes a printed circuit board holder that holds a printed circuit board, an application member to which flux is applied, and an X-Y system that moves this application member within the X-Y plane.
It is equipped with a robot and a coating member holding head that moves the coating member in a direction perpendicular to the X-Y plane and contacts a predetermined position on the printed circuit board, and applies the flux attached to the coating member to the printed circuit board. be.

Therefore, the present invention has the advantage that a necessary amount of flux can be applied to a predetermined position on a printed circuit board without requiring any manual labor.

[Brief explanation of the drawing]

Figures 1 to 3 show one embodiment of the present invention.
The figure is a perspective view schematically showing the flux device, FIG. 2 is an explanatory diagram showing the principle of the flux device, FIG. 3 is an explanatory diagram showing the principle of the holding head, and FIGS. 4 to 6 are schematic diagrams of conventional examples. Figure 4 is an explanatory diagram of the foamed flux method.
FIG. 5 is a plan view of a stamp head used in the stamp method, and FIG. 6 is an explanatory diagram of the stamp head method. 5... Printed circuit board, 11... Flux coating device, 13... Printed circuit board holder, 14... X-Y robot, 17... Cotton swab (application member), 21... Cotton swab holding head ( application member holding head). Applicant's agent Patent attorney Takehiko Suzue Figure 1

Claims (1)

[Claims] A printed circuit board holder that holds a printed circuit board, an application member that applies flux, an X-Y robot that moves this application member within an X-Y plane, and an X-Y robot that moves the application member perpendicularly to the X-Y plane. What is claimed is: 1. A flux coating device comprising: a coating member holding head that is moved in a direction and brought into contact with a predetermined position of the printed circuit board, and coats the flux adhered to the coating member onto the printed circuit board.