JPH11354914A - Method for mounting electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a method for mounting electronic components, capable of mechanizing and restricting a reduction in mounting density of a printed board. SOLUTION: In a method of mounting electronic components to a printed board, it contains a flux adhering step (a) of adhering a flux 3 to a terminal 2 of an IC 1, solder particles adhering steps (b, c) for adhering solder particles 5 to the terminal 2 to which the flux 3 is adhered, part mounting steps (c, d) for mounting the terminal 2 to which the solder particles 5 are adhered to a part mounting position of a printed board 7, and a heating step (d) for heating the terminal 2 of the IC 1 mounted to the printed board 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for mounting an electronic component on a printed circuit board.

[0002]

2. Description of the Related Art In order to mount an electronic component on a printed circuit board, it is necessary to fix the electronic component to a predetermined portion of the printed circuit board and connect a terminal of the electronic component to a predetermined conductive pattern. The main methods of mounting electronic components include the dip method in which the pattern surface of the printed circuit board is immersed in a molten solder bath, or the application of cream solder to the soldered part in advance by printing or the like, and then mounting the electronic components Then, the printed circuit board is heated to melt and fix the cream solder.

[0003] However, some electronic components are vulnerable to heat, and the above-mentioned dip method or reflow method may not be used. When using such electronic components, there is a method in which a heat-sensitive component is mounted on one side of a double-sided board, and a heat-resistant component is mounted on the back side and soldered in a method suitable for each. Since the board is expensive, if it is possible to mount on one side in terms of area, a method of mounting heat-resistant components and then manually soldering heat-sensitive components by hand or by robotic soldering is used. Often.

[0004]

As shown in FIG. 8, such hand soldering and soldering by a robot are performed as shown in FIG.
The wire solder 60 and the soldering iron 61 are brought into contact with the terminals 2 of the electronic component mounted on the printed circuit board 7, and the wiring pattern of the terminals 2 and the printed circuit board 7 (not shown) is melted with solder.
Is to be connected.

However, when mounting a multi-pin electronic component having a large number of terminals 2, for example, an integrated circuit 1, there is a problem in that the operation takes time. In soldering, it is necessary to position the wire solder 60 and the soldering iron 61 around the electronic component. In addition, the supply mechanism of the wire solder 60 and the soldering iron 61 (particularly the supply mechanism of the thread solder 60) ) Is a relatively large device, so that a relatively large area around the electronic component becomes a mounting prohibited area where components cannot be mounted, and there is a problem that the component mounting density on the printed circuit board 7 is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to realize a method for mounting electronic components which can be mechanized and can suppress a decrease in the mounting density of a printed circuit board.

[0007]

Means for Solving the Problems and Their Effects To solve the above problems, an electronic component mounting method according to the present invention (1)
Is a method of mounting electronic components on a printed circuit board,
A flux attaching step of attaching a flux to a terminal of the electronic component, a solder grain attaching step of attaching a solder grain to the terminal to which the flux is attached, and a component mounting position of the printed board on the solder grain attached terminal. And a heating step of heating terminals of the electronic component mounted on the printed circuit board.

According to the electronic component mounting method (1), when the electronic component is mounted on a printed circuit board, the solder particles adhere to the terminals of the electronic component. Electronic components can be mounted only by local heating with a soldering iron, etc., and even multi-terminal electronic components can be mounted once or in a small number of steps, and there is no need to use a solder supply mechanism after mounting the electronic components. The forbidden area can be reduced, and a decrease in component mounting density on the printed circuit board can be suppressed.

An electronic component mounting method according to the present invention (2)
Is characterized in that in the electronic component mounting method (1), the solder particle attaching step is a step of attaching terminals of the electronic component to the solder particles in a container.

According to the electronic component mounting method (2), when the terminals of the electronic component are attached to the solder particles in the container, the solder particles adhere to the terminals due to the adhesive force of the flux attached to the terminals. I do.

An electronic component mounting method according to the present invention (3)
Is characterized in that, in the electronic component mounting method (1), the solder particle attaching step is a step of sprinkling the solder particles on terminals of the electronic component.

According to the electronic component mounting method (2), when the solder particles are sprinkled on the terminals of the electronic component, the solder particles adhere to the terminals due to the adhesive force of the flux adhering to the terminals.

The electronic component mounting method (4) according to the present invention is a method of mounting an electronic component on a printed circuit board, the method comprising: applying a flux to the printed circuit board; and applying a flux to the printed circuit board. A solder attaching step of attaching a rectangular parallelepiped solder particle to the electronic component connection pattern portion, a component mounting step of mounting the electronic component such that a terminal of the electronic component is mounted on the rectangular parallelepiped solder particle, and the printing And heating a terminal of the electronic component mounted on the substrate.

According to the electronic component mounting method (4), when the electronic component is mounted on the printed board, solder particles are interposed between the terminals of the electronic component and the printed board. Therefore, it is possible to mount the electronic component only by locally heating the terminal portion with a laser or a soldering iron, etc., and it is possible to mount a multi-terminal electronic component once or in a small number of steps. Since there is no need to use a supply mechanism, the mounting prohibited area can be reduced, and a decrease in the component mounting density of the printed circuit board can be suppressed.

The electronic component mounting method (5) according to the present invention is a method for mounting an electronic component on a printed circuit board, the method comprising: forming a solder mounting pattern connected to the electronic component connecting pattern on the printed circuit board;
A flux applying step of applying a flux to the printed board, a solder attaching step of attaching solder particles onto a solder mounting pattern of the printed board to which the flux is applied, and a terminal of the electronic component on the electronic component connection pattern. And a heating step of heating the solder particles on the solder mounting pattern.

According to the electronic component mounting method (5), when the electronic component is mounted on the printed board, the solder mounting pattern adjacent to the connection pattern of the printed board on which the terminals of the electronic component are mounted is provided. Since the solder particles are adhered on the top, only by locally heating the solder particles with a laser, a soldering iron, or the like, the solder particles are melted and the terminals and the connection pattern are connected, and the mounting of the electronic component is completed. Done. Therefore, even a multi-terminal electronic component can be mounted once or in a small number of steps, and since there is no need to use a solder supply mechanism after mounting the electronic component, the mounting prohibited area can be reduced, and a decrease in the component mounting density of the printed circuit board is suppressed. be able to.

The electronic component mounting method (6) according to the present invention is a method for mounting an electronic component on a printed circuit board, wherein the electronic component connecting pattern portion on the printed circuit board has a through-hole pattern connected to the electronic component connecting pattern. Forming a through hole pattern, applying an adhesive to an electronic component mounting position of the printed board, and applying the electronic component so that the terminal of the electronic component is mounted on the electronic component connection pattern. The method includes a component mounting step of mounting, and a dip step of immersing a surface of the printed circuit board opposite to a mounting surface of the electronic component in molten solder.

According to the electronic component mounting method (6), when the electronic component is mounted on the printed board, the electronic component is melted from the surface opposite to the mounting surface of the electronic component through the through hole in the dip step. The solder reaches the terminals of the electronic component, and the terminals are connected to the connection patterns by the solder, so that the electronic component is mounted. Therefore, even a multi-terminal electronic component can be mounted once or in a small number of steps, and since there is no mounting work on this electronic component from the mounting surface side of the electronic component, the mounting prohibited area can be reduced and the component mounting density of the printed circuit board can be reduced. Can be suppressed.

Further, the electronic component mounting method (7) according to the present invention is a method of mounting an electronic component on a printed circuit board, wherein the paste immersing step includes immersing a nozzle of a transfer machine in a conductive paste. A step of applying the conductive paste by pressing the nozzle with the conductive paste onto the electronic component connection pattern of the printed circuit board; and applying the electronic component so that the terminal of the electronic component is mounted on the conductive paste. And a curing step of curing the conductive paste.

According to the electronic component mounting method (7), when the electronic component is mounted on the printed board, the conductive paste is interposed between the terminal of the electronic component and the printed board. Therefore, the terminal (conductive paste) portion can be mounted on the electronic component only by hardening the conductive paste by locally heating or applying pressure with a laser or a soldering iron, or by irradiating ultraviolet rays. Also, even a multi-terminal electronic component can be mounted once or in a small number of steps, and since there is no need to use a solder supply mechanism after mounting the electronic component, the mounting prohibited area can be reduced, and a decrease in the component mounting density of the printed circuit board is suppressed. be able to.

The electronic component mounting method (8) according to the present invention is a method of mounting an electronic component on a printed circuit board, wherein the anisotropic conductive sheet having conductivity in a direction perpendicular to the surface is provided on the printed circuit board. A sheet attaching step of attaching to a component mounting surface, an adhesive applying step of applying an adhesive to an electronic component mounting portion of the printed board, and a terminal of the electronic component positioned on an electronic component connection pattern on the printed board. Mounting the electronic component on the anisotropic conductive sheet.

According to the electronic component mounting method (8), when the electronic component is mounted on the printed circuit board, the terminals of the electronic component are connected to the electronic component connection pattern under the anisotropic conductive sheet. Is electrically connected to the terminal. Therefore, even a multi-terminal electronic component can be mounted once or in a small number of steps, and since there is no need to use a solder supply mechanism after mounting the electronic component, the mounting prohibited area can be reduced, and the component mounting density of the printed circuit board can be reduced. Can be suppressed.

[0023]

Next, an embodiment of the present invention will be described. FIG. 1 is a process explanatory view showing an electronic component mounting method according to the first embodiment of the present invention. The electronic component mounting method according to the first embodiment is a step performed after mounting another electronic component by a dip or reflow method.

In the first step, as shown in FIG. 1A, an integrated circuit (IC) 1 having a plurality of terminals 2 arranged at equal intervals on both sides of a package is suction-held by a vacuum suction nozzle 4.
The terminal 2 is immersed in a flux tank containing the flux 3 to adhere the flux 3 to the terminal 2. In the second step, as shown in FIGS. 2B and 2C, the terminal 2 to which the flux 3 is attached is attached to the solder ball 5 (solder particles) in the container. Then, the solder balls 5 adhere to the terminals 2 due to the adhesive force of the flux 3. Note that the solder ball 5 is a spherical solder particle, and the appropriate size varies depending on the size of the terminal 2 and the like, but is suitably about 100 to 500 μm. In the third step, as shown in FIG.
At a predetermined location (mounting position of IC1). Then I
C1 is temporarily fixed to the printed circuit board 7 by the adhesive force of the flux 3. Then, in the fourth step, the vicinity of the terminal 2 is heated while the IC 1 is temporarily fixed. Then solder ball 5
Is melted, and the terminal 2 and the wiring pattern 6 of the printed board 7 are connected. Note that the heating near the terminal 2 is desirably a local heating method using a laser, a soldering iron, or the like.

As described above, according to the first embodiment, when mounting the IC 1 on the printed circuit board 7 after mounting another electronic component, supply of the solder after mounting the IC 1 on the printed circuit board 7 is performed. Therefore, the mounting prohibited area around the IC 1 mounting location can be reduced even when mounting is performed by a mounting machine. Next, a second embodiment of the present invention will be described. FIG. 2 is a process explanatory view showing an electronic component mounting method according to a second embodiment of the present invention. still,
The same components as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. The electronic component mounting method according to the second embodiment is a process performed after mounting another electronic component by a dip or reflow method.

In the first step, as shown in FIG. 1A, an integrated circuit (IC) 1 having a plurality of terminals 2 arranged at equal intervals on both sides of a package is suction-held by a vacuum suction nozzle 4.
The terminal 2 is immersed in a flux tank containing the flux 3 to adhere the flux 3 to the terminal 2. In the second step, as shown in FIG. 2B, a solder ball 5 (solder particles) is sprinkled on the terminal 2 to which the flux 3 has adhered (the solder ball 5 is spun down from the container to the terminal, or is ejected from a nozzle or the like). . Then, the solder balls 5 adhere to the terminals 2 due to the adhesive force of the flux 3 (FIG. 3C). Note that the solder ball 5 is a spherical solder particle, and the appropriate size varies depending on the size of the terminal 2 and the like, but is suitably about 100 to 500 μm. In the third step, as shown in FIG. 4D, the IC 1 is placed at a predetermined position on the printed circuit board 7 (the mounting position of the IC 1). Then, the IC 1 is temporarily fixed to the printed circuit board 7 by the adhesive force of the flux 3. Then, in the fourth step, the vicinity of the terminal 2 is heated while the IC 1 is temporarily fixed. Then, the solder balls 5 are melted and the terminals 2 are connected to the wiring patterns 6 on the printed circuit board 7. Terminal 2
For the heating in the vicinity, a local heating method using a laser, a soldering iron, or the like is desirable.

As described above, according to the second embodiment, when the IC 1 is mounted on the printed circuit board 7 after mounting another electronic component, the supply of the solder after the mounting of the IC 1 on the printed circuit board 7 is performed. Therefore, the mounting prohibited area around the IC 1 mounting location can be reduced even when mounting is performed by a mounting machine. Next, a third embodiment of the present invention will be described. FIG. 3 is a process explanatory view showing an electronic component mounting method according to a third embodiment of the present invention. still,
The same components as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. The electronic component mounting method according to the third embodiment is a step performed after mounting another electronic component by a dip or reflow method.

In the first step, as shown in FIG. 3A, the terminals 2 of the IC 1 on the electronic component mounting surface of the printed circuit board 7 are formed.
Flux 8 is applied to the vicinity of the connection portion with. In the second step, as shown in FIG.
Is sucked and held by the vacuum suction nozzle 10 and placed on a wiring pattern connected to the terminal 2 of the IC 1 on the printed circuit board 7. In the third step, as shown in FIG.
Is sucked and held by the vacuum suction nozzle 4, and the IC1 is soldered at a predetermined position (the mounting position of the IC1) on the printed circuit board 7.
Place on top. Then, in the fourth step, the vicinity of the terminal 2 is heated. Then, the solder particles 9 are melted to connect the terminal 2 to the wiring pattern of the printed board 7 (the flux 8 evaporates by heat). In addition, the heating near the terminal 2 is desirably a local heating method using a laser, a soldering iron, or the like.

As described above, according to the third embodiment, when the IC 1 is mounted on the printed circuit board 7 after mounting another electronic component, the supply of solder after the mounting of the IC 1 on the printed circuit board 7 is performed. Therefore, the mounting prohibited area around the IC 1 mounting location can be reduced even when mounting is performed by a mounting machine. Next, a fourth embodiment of the present invention will be described. FIG. 4 is a process explanatory view showing an electronic component mounting method according to a fourth embodiment of the present invention. still,
The same components as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

In the first step, as shown in FIG. 5A, a connection land 15 for connecting to the terminal 19 of the IC in the wiring pattern of the printed circuit board 7 is replaced with a connection pattern 16 for connecting the terminal 19 as in the prior art. The connection pattern 16 is connected to a new solder mounting pattern 17 on which the solder balls 20 are placed, and is formed together with other wiring patterns by a normal wiring pattern forming method using plating or the like.
Then, another electronic component is mounted by a dip or reflow method. In the second step, a flux 18 is applied to the vicinity of the connection land 15 on the electronic component mounting surface of the printed circuit board 7 as shown in FIG. In the third step, as shown in FIG. 4C, the solder balls 20 are mounted on the solder mounting pattern 17 by a vacuum suction nozzle (not shown) or the like. In the fourth step, the IC is sucked and gripped by a vacuum suction nozzle (not shown) or the like, and the IC is mounted on a predetermined portion of the printed circuit board (terminal 19 of the IC is on connection pattern 16). Heat. Then solder balls 20
Is melted and spreads along the connection land 15, and the terminal 19 and the connection pattern 16 are connected (the flux 18 evaporates by heat). Note that a local heating method using a laser, a soldering iron, or the like is desirable for heating the vicinity of the terminal 19.

As described above, according to the fourth embodiment, when the IC is mounted on the printed circuit board 7 after mounting another electronic component, the solder is supplied after the IC is mounted on the printed circuit board 7. Therefore, the mounting prohibited area around the IC mounting location can be reduced even when mounting is performed by a mounting machine. Next, a fifth embodiment of the present invention will be described. FIG. 5 is a process explanatory view showing an electronic component mounting method according to a fifth embodiment of the present invention. Note that the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the first step, as shown in FIG. 5A, a through-hole 25 whose surface is formed of a conductive layer such as copper foil is formed on a connection terminal 29 connected to the terminal 2 of the IC in the wiring pattern of the printed circuit board 7. To form Then, another electronic component is mounted by a dip or reflow method. Thereafter, in the second step, as shown in FIG.
(1) An appropriate amount of adhesive 26 is applied to the mounting portion, and a flux (not shown) is applied to the wiring pattern surface of the printed circuit board 7 if necessary, and the IC 1 is sucked by a vacuum suction nozzle (not shown) or the like. The IC 1 is mounted on the IC 1 mounting portion by grasping, and other electronic components (components to be soldered by the dip method, not shown) are also mounted on predetermined portions of the printed circuit board 7 by a component mounting machine or the like. In the third step, as shown in FIG. 3B, the back surface of the printed circuit board 7 on the IC 1 mounting surface is immersed in a molten solder bath and soldering is performed by a dip method. Then, the molten solder 28 rises to the terminal 2 portion through the through hole 25, and the terminal 2 is soldered 27 to the connection terminal 29 and the through hole 25.

As described above, according to the fifth embodiment, when the IC 1 is mounted on the printed circuit board 7 after other electronic components are mounted, after the IC 1 is mounted on the printed circuit board 7,
Since it is not necessary to supply the solder to the mounting surface side, the mounting prohibited area around the IC 1 mounting location can be reduced even when mounting using a mounting machine is performed. In addition, it can be soldered together with other electronic components by the dip method, thereby reducing the cost. Since the back surface of the mounting surface of the IC 1 on the printed circuit board 7 is immersed in the molten solder 28, much heat is not transmitted to the IC 1 and the heat Can be prevented from being destroyed.

Next, a sixth embodiment of the present invention will be described. FIG. 6 is an explanatory process diagram showing an electronic component mounting method according to a sixth embodiment of the present invention. Note that the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. The electronic component mounting method according to the sixth embodiment is a process performed after mounting another electronic component by a dip or reflow method.

In the first step, as shown in FIG. 3A, a moving mechanism including a motor, a hydraulic / vacuum cylinder (not shown), and a nozzle 32 (a structure in which a proper amount of cream solder adheres to the tip, for example, The transfer machine 31 is driven to transfer the nozzle 32 into the cream solder 30 of the cream solder tank 33, and the tip of the nozzle 32 Apply an appropriate amount of cream solder to In addition, each nozzle 3
2 is arranged in accordance with the interval between the terminals 2 of the IC 1. The cream solder 30 is formed of a mixture of solder fine particles and a cured resin that is cured by heat, ultraviolet light, or the like, and is applied to the terminal 2 and the wiring pattern.
The terminal 2 and the wiring pattern are cured by being heated, irradiated with ultraviolet rays, or the like, and connected and fixed. In the second step, the transfer machine 31 is driven as shown in FIG.
The nozzle 32 is brought into contact with the connection portion of the electronic component mounting surface of the printed circuit board 7 with the terminal 2 of the IC 1 to transfer the cream solder 30. In the third step, as shown in FIG. 5C, the IC 1 is gripped by the suction nozzle 4 and placed at a predetermined position on the printed circuit board 7 (the mounting position of the IC 1). Then IC
1 is a printed circuit board 7 due to the adhesive force of the cream solder 30.
Will be temporarily stopped. Then, in the fourth step, a hardening process such as heating or irradiation of ultraviolet rays is performed on the vicinity of the terminal 2 in the temporarily fixed state of the IC 1. Then, the cream solder 30 is cured, and the terminal 2 and the wiring pattern are connected and fixed.

As described above, according to the sixth embodiment, when the IC 1 is mounted on the printed circuit board 7 after mounting another electronic component, the solder is supplied after the IC 1 is mounted on the printed circuit board 7. Therefore, the mounting prohibited area around the IC 1 mounting location can be reduced even when mounting is performed by a mounting machine. Next, a seventh embodiment of the present invention will be described. FIG. 7 is a process explanatory view showing an electronic component mounting method according to a seventh embodiment of the present invention. still,
The same components as those in the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. The electronic component mounting method according to the seventh embodiment is a process performed after mounting another electronic component by a dip or reflow method.

In the first step, as shown in FIG. 5A, the anisotropic conductive sheet 52 is held by a moving mechanism including a motor, a hydraulic / vacuum cylinder (not shown) and the like. Using an anisotropic conductive sheet sticking device (not shown) including a gripping mechanism (not shown), the anisotropic conductive sheet 52 is placed near the connection portion of the connection pattern 51 on the electronic component mounting surface of the printed circuit board 7. Attach. In the second step,
As shown in FIG. 2B, the IC 1 is gripped by the suction nozzle 4 and is mounted on a predetermined portion of the printed circuit board 7 (the mounting position of the IC 1). Then, in a third step, a pressure / heat treatment is performed on the terminal 2. Then, the anisotropic conductive sheet 52 plastically deforms while maintaining conductivity in the direction perpendicular to the surface thereof,
The terminal 2 and the connection pattern 51 are connected and fixed. FIG. 3C is a diagram showing this state. The anisotropic conductive sheet 52 is obtained by adding conductive fine particles (conductive filler 56) such as metal or carbon to a resin 53 such as rubber which is plastically deformed by pressurization and heat treatment. Is applied between the terminal 2 and the connection pattern 51, the conductive fillers 56 in the anisotropic conductive sheet 52 are in contact with each other.
Undergo plastic deformation. Therefore, only between the terminal 2 and the connection pattern 51 in the compressed state, that is, the anisotropic conductive sheet 5
2, only in the direction perpendicular to the surface becomes conductive.

As described above, according to the seventh embodiment, when the IC 1 is mounted on the printed circuit board 7 after other electronic components are mounted, the solder is supplied after the IC 1 is mounted on the printed circuit board 7. Therefore, the mounting prohibited area around the IC 1 mounting location can be reduced even when mounting is performed by a mounting machine.

[Brief description of the drawings]

FIGS. 1A to 1D are process explanatory views showing an electronic component mounting method according to a first embodiment of the present invention.

FIGS. 2A to 2D are process explanatory views showing an electronic component mounting method according to a second embodiment of the present invention.

FIGS. 3A to 3D are process explanatory views showing an electronic component mounting method according to a third embodiment of the present invention.

FIGS. 4A to 4D are process explanatory views showing an electronic component mounting method according to a fourth embodiment of the present invention.

FIGS. 5A to 5D are process explanatory diagrams showing an electronic component mounting method according to a fifth embodiment of the present invention.

FIGS. 6A to 6D are process explanatory views showing an electronic component mounting method according to a sixth embodiment of the present invention.

FIGS. 7A to 7D are process explanatory views showing an electronic component mounting method according to a seventh embodiment of the present invention.

FIG. 8 is a process explanatory view showing a conventional electronic component mounting method.

[Description of Signs] 1 ... IC (Electronic Component) 2 ... Terminal 3,6 ... Flux 4 ... Suction Nozzle 5 ... Solder Ball (Solder Grain) 7 ... Printed Circuit Board 8. ..Wiring pattern 9: rectangular parallelepiped solder particles 17: solder mounting pattern 25: through hole 30: conductive paste 52: anisotropic conductive sheet

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Norihiro Inoue 2-28-1, Goshodori, Hyogo-ku, Kobe City, Hyogo Prefecture Inside Fujitsu Ten Limited (72) Inventor Sugiyama Taka 1-chome, Goshodori, Hyogo-ku, Kobe City No. 28 in Fujitsu Ten Limited

Claims (8)

[Claims] 1. A method of mounting an electronic component on a printed circuit board, comprising: a flux attaching step of attaching a flux to a terminal of the electronic component; and a solder grain attaching step of attaching a solder grain to the terminal to which the flux is attached. An electronic device comprising: a component mounting step of mounting a terminal to which the solder particles are attached at a component mounting position on the printed board; and a heating step of heating a terminal of the electronic component mounted on the printed board. Component mounting method. 2. The electronic component mounting method according to claim 1, wherein the solder particle attaching step is a step of attaching terminals of the electronic component to the solder particles in a container. 3. The electronic component mounting method according to claim 1, wherein the solder particle attaching step is a step of sprinkling the solder particles on terminals of the electronic component. 4. A method for mounting an electronic component on a printed circuit board, comprising: a flux applying step of applying a flux to the printed circuit board; and a rectangular parallelepiped solder particle on an electronic component connecting pattern portion of the printed circuit board to which the flux is applied. Solder mounting step of mounting the electronic component, mounting the electronic component so that the terminal of the electronic component is mounted on the rectangular parallelepiped solder particles, and heating the terminal of the electronic component mounted on the printed circuit board An electronic component mounting method, comprising: a heating step. 5. A method of mounting an electronic component on a printed board, comprising: a pattern forming step of forming a solder mounting pattern connected to the electronic component connection pattern of the printed board; and a flux applying step of applying a flux to the printed board. A solder attaching step of attaching solder particles onto the solder mounting pattern of the printed circuit board to which the flux is applied; and a component mounting step of mounting the electronic component such that terminals of the electronic component are mounted on the electronic component connection pattern. And a heating step of heating the solder particles on the solder mounting pattern. 6. A method of mounting an electronic component on a printed circuit board, wherein a through-hole pattern forming step of forming a through-hole pattern connected to the electronic component connection pattern on an electronic component connection pattern portion of the printed circuit board; An adhesive application step of applying an adhesive to the electronic component mounting position, a component mounting step of mounting the electronic component such that a terminal of the electronic component is mounted on the electronic component connection pattern, and A dipping step of immersing a surface opposite to the component mounting surface in molten solder. 7. A method for mounting an electronic component on a printed circuit board, comprising: a paste dipping step of dipping a nozzle of a transfer machine in a conductive paste; A conductive paste applying step of pressing the conductive paste onto an electronic component connection pattern, a component mounting step of mounting the electronic component such that terminals of the electronic component are mounted on the conductive paste, and curing the conductive paste And a curing step of causing the electronic component to be mounted. 8. A method of mounting an electronic component on a printed circuit board, comprising: a sheet attaching step of attaching an anisotropic conductive sheet having conductivity in a direction perpendicular to a surface to a component mounting surface of the printed circuit board; An adhesive application step of applying an adhesive to the electronic component mounting portion, and mounting the electronic component on the anisotropic conductive sheet so that the terminals of the electronic component are located on the electronic component connection pattern on the printed circuit board. And an electronic component mounting method.