JPH04167506A - Electronic part - Google Patents

Abstract

PURPOSE:To contrive improvement in circuit characteristics by a method wherein at least part of circuit elements are formed in such a manner that at least one of conductors is connected to the connection conductors which pass through the inside of a sintered body in the longitudinal direction; the connection conductors are led out to one surface of the sintered body in longitudinal direction, to be electrically connected to the conductive pattern provided on one surface of the sintered body. CONSTITUTION:Connection conductors 41 and 42 are buried in such a manner that at least a part of conductors 201 to 211 is connected and that the connection conductors pass through the inside of a sintered body in longitudinal direction, and the conductor patterns 51 and 52, with which the connection conductors 41 and 42 are connected, are provided on the surface 1A and 1B of the sintered body 1. Accordingly, the interterminal distributed capacitance, which has been a trouble in the past when a terminal electrode is provided on the side edge of the sintered body 1, can be almost prevented. Moreover, both sides 1A and 1B of the sintered body 1 have wider area when compared with the side edge face, and as the degree of freedom of selection of the number and shape of the conductive patterns 51 and 52 is increased, the distance between the connecting conductors 41 and 42 is decreased, and lead inductance is reduced. As a result, circuit characteristics can be improved.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an electronic component in which a plurality of conductors are embedded inside a sintered body to form a plurality of circuit elements inside the sintered body.
At least a part of the circuit element is led out to at least one vertical surface of the sintered body by a connecting conductor passing vertically inside the sintered body, and is electrically connected to a conductor pattern provided on one surface, thereby connecting terminal electrodes. In addition to preventing the occurrence of distributed capacitance,
The wiring pattern length is reduced and excellent circuit characteristics can be obtained.

<Prior art> A multilayer capacitor, a multilayer inductor, a multilayer LC composite component, or a hybrid integrated circuit component in which an integrated circuit component or a resistor is incorporated into each of these components is installed inside a sintered body made of an electric or magnetic material. , an electronic component in which a plurality of conductors constituting a circuit element are embedded has been proposed. Fig. 13 is a cross-sectional view schematically showing the structure of this type of electronic component, and Fig. 14 is a plan view thereof.
01 to 211 are conductors constituting circuit elements such as capacitors and inductors, and 301 to 320 are terminal electrodes.

For the sintered body 1, dielectric ceramic is used when forming a capacitor, and when forming an inductor such as a coil or transformer, a magnetic sintered body such as ferrite is used.

The pattern and number of the conductors 201-211 are selected according to the required capacitor network or inductor, and are connected to the terminal electrodes 301-320 according to the circuit configuration.

The terminal electrodes 301 to 320 are formed on the side end surface of the sintered body 1 at a predetermined interval d1.

<Problems to be Solved by the Invention> As described above, this type of conventional electronic component has a structure in which the terminal electrodes 301 to 320 are provided only on the side end surfaces of the sintered body 1, and therefore has the following problems. was there.

(a) As the number and types of circuit elements embedded inside the sintered body 1 increase, the number of conductors 201 to 211 increases, and the number of terminal electrodes 301 to 320 increases, the more the terminal electrodes 301 to 32
0 becomes narrower, and the distributed capacitance C0 between the terminal electrodes 301 to 320 increases. An increase in distributed capacitance C0 deteriorates circuit characteristics.

(b) In order to avoid an increase in distributed capacitance, terminal electrodes 301 to
If the interval d1 of 320 is increased, the required number of terminal electrodes 3
01 to 320 cannot be examined by formation, resulting in a shortage of terminal electrodes.

(c) Since the positions of the terminal electrodes 301 to 320 are fixed to the side end surfaces of the sintered body 1, depending on the positions of the conductors 201 to 211, the wiring pattern length becomes longer, leading to an increase in lead inductance and resulting circuit characteristics. leading to deterioration.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned conventional problems and to provide an electronic component in which the distributed capacitance between terminal electrodes can be ignored in commercial terms, the wiring pattern length is short, and the circuit characteristics are excellent. It is.

Means for Solving the Problems> In order to solve the above-mentioned problems, the present invention provides an electronic component in which a plurality of conductors are embedded inside a sintered body and a plurality of circuit elements are formed by the conductors. At least a portion of the circuit element is connected to a connecting conductor in which at least one of the conductors passes vertically inside the sintered body, and the connecting conductor is connected to at least one surface of the sintered body in the vertical direction. The conductor pattern is drawn out and electrically connected to the conductor pattern provided on the one surface of the sintered body.

At least a part of the circuit element is connected to a connecting conductor whose conductor passes vertically inside the sintered body, and the connecting conductor is led out to at least one surface of the sintered body in the vertical direction. Since the conductor pattern provided on one surface of the sintered body is electrically conductive, distributed capacitance between the terminal electrodes, which is a problem when the terminal electrodes are provided on the side end faces of the sintered body, is hardly generated.

Moreover, one surface side of the sintered body has a larger area than the side end surface, and the degree of freedom in selecting the number, shape, etc. of the conductor patterns that conduct the connecting conductors is increased. Therefore, by selecting a conductor pattern, it is possible to shorten the distance between the conductor and the connecting conductor, reduce lead inductance, and improve circuit characteristics.

Furthermore, since one surface side of the sintered body has a larger area than the side end surface, it is possible to easily secure the required number of conductor patterns for conducting the connecting conductors.

<Example> In FIG. 1, a collection of cross-sectional views schematically showing the structure of an electronic component according to the present invention, the same reference numerals as in FIG. 13 indicate the same components. 41.42 is a connection conductor, and 51.52 is a conductor pattern. Connection conductor 41.
42 is buried so as to pass vertically inside the sintered body 1 so as to connect at least a portion of the conductors 201 to 211. In the illustration, the connection conductor 41 is sintered to form a circuit element. It is connected to conductors 201 to 206 buried inside the compact 1, and is connected to a conductor pattern 51 formed on the surface IA of the sintered compact 1. The connecting conductor 42 is connected to the conductors 207 to 211 inside the sintered body 1 and
It is connected to a conductor pattern 52 formed on the back surface IB of the.

Conductor pattern 51.52 connecting connection conductor 41.42
are provided on both sides IA and IB of the sintered body 1, so
Distributed capacitance between the terminal electrodes, which was a problem when the terminal electrodes were provided on the side end surfaces of the sintered body, hardly occurs.

In addition, since both sides IA and IB of the sintered body 1 have a larger area than the side end faces, the degree of freedom in selecting the number and shape of the conductor patterns 51 and 52 is increased, so by selecting the conductor patterns 51 and 52, Shorten the distance between the connecting conductors 41 and 42,
Lead inductance can be reduced to improve circuit characteristics.

Furthermore, since the surfaces of both surfaces IA and IB of the sintered body 1 have a larger area than the side end surfaces, the required number of conductor patterns 51 and 52 can be easily secured.

Figure 2 is an enlarged sectional view of the connection conductor 41 and 42, and Figure 3
The figure also shows a perspective view of the connecting conductor 41,42.

Typically, this type of electronic component is constructed as a laminated component. Since the connection conductors 41 and 42 are formed by sequentially laminating each layer in the lamination process, they are formed in a zigzag pattern in the vertical direction that corresponds to the lamination direction of the sintered body 1. Connecting conductor 41.4
2, as shown in FIGS. 2 and 3, is constructed by connecting connecting conductor pieces 411 and 421 formed for each layer in a zigzag manner in the stacking direction.

FIG. 4 is a sectional view showing another embodiment of the connecting conductor 41, 42, and FIG. 5 is a perspective view thereof. The connecting conductors 41 and 42 shown in this embodiment have a planar area S1, s,=w,XW determined by the conductor horizontal dimension Wl and the conductor vertical dimension W2.

, the conductor area is sufficiently smaller than the plane area 51. The conductor area is determined by the conductor width d, d2, the conductor lateral dimension W1, and the conductor vertical dimension W2. The connecting conductor piece 411.421 has a ring shape with a hole 412.422 in the center.

In addition to the ring shape, modifications such as providing a cut in a part of the ring-shaped conductor portion, providing a shorting piece between two opposing pieces, or forming an H-shaped pattern are possible.

y7% Connection conductor 41.42 with the structure shown in Figures 4 and 5
In comparison with FIGS. 2 and 3, the amount of connected conductors per unit volume of the sintered body 1 is significantly reduced. For this reason,
The occurrence of cracks and a decrease in mechanical strength due to the difference in firing shrinkage between the sintered body and the connecting conductor are prevented.

The connecting conductors 41 and 42 are formed using high-precision pattern forming technology mainly based on screen printing process and photolithography.
It can be formed using a film forming technique such as sputtering or vapor deposition. 6(a), (b) to FIG. 10(a), (b) are diagrams showing steps in forming the connecting conductors 41, 42 by a screen printing process. First, Figure 6(a), (
As shown in b), a connecting conductor piece 411 is placed on the surface of the conductor layer 200 printed on the sheet-like sinterable paste 101.
．． Print 421. The sinterable paste 101 is formed by screen printing a ceramic paste or a magnetic paste, and the conductor layer 200 and the connecting conductor piece 411
．． 421 is formed by screen printing a conductive paste. The conductor layer 200 becomes conductors 201 to 211 that constitute circuit elements.

Next, as shown in FIGS. 7(a) and 7(b), sinterable paste 102 is applied so as to cover approximately half of the right side (in the figure) of the connecting conductor pieces 411 and 421. Connection conductor piece 4
11. Around the left half of 421 is sinterable paste 102
leaving a window area 6 uncoated.

Next, as shown in FIGS. 8(a) and 8(b), the connection conductor piece 411 which is not covered with the sinterable paste 102.
Connecting conductor pieces 411 and 42 so as to overlap half of 421
Print 1.

Next, as shown in FIGS. 9(a) and 9(b), sinterable paste 103 is applied so as to cover the left half (in the figure) of the connecting conductor pieces 411 and 421.

Next, as shown in the lto diagrams (a) and (b), a connecting conductor piece 411 that is not covered with the sinterable paste 103.
Connecting conductor pieces 411 and 42 so as to overlap half of 421
Print 1.

The above figures 7(a), (b) to 10(a), (b)
By repeating the process a predetermined number of times, an electronic component having connection conductors 41 and 42 having the structure shown in FIGS. 1 to 3 is obtained. Electronic components having connection conductors shown in FIGS. 4 and 5 can also be manufactured by the same process.

The present invention relates to a multilayer capacitor, a multilayer inductor, a multilayer LC
It can be widely used in composite parts or hybrid integrated circuit parts in which integrated circuit parts or resistors are incorporated into each of these parts. FIGS. 11 and 12 show an example of application to a hybrid integrated circuit component. In the figure, 7 is an integrated circuit component. The integrated circuit component 7 is mounted on the surface IA of the sintered body 1, and its lead terminals 71-74 are connected to the conductor patterns 51-54. Each of the conductor patterns 51 to 54 is connected to one end of a connecting conductor 41 to 44 that is electrically connected to a conductor buried inside the sintered body. Four circuit elements serving as capacitors 01 to C4 are buried inside the sintered body 1. In the capacitors C1 to C4, conductors serving as capacitor electrodes are conductively connected to conductor patterns 51 to 54 via connection conductors 41 to 44, respectively. Further, a portion of the conductor serving as the capacitor electrode is also connected to terminal electrodes 301 to 305 formed on the side end surface of the sintered body 1, respectively. Since each interval between the terminal electrodes 301 to 305 is larger than in the conventional case, the problem of distributed capacitance between the electrode terminals can be substantially ignored.

<Effects of the Invention> As described above, the present invention provides an electronic component in which a plurality of conductors are embedded inside a sintered body and a plurality of circuit elements are formed by the conductors, in which at least some of the circuit elements are , at least one of the conductors is connected to a connecting conductor passing vertically inside the sintered body, and the connecting conductor is led out to at least one surface of the sintered body in the vertical direction, and the connecting conductor is connected to one surface of the sintered body in the vertical direction. Since the provided conductor pattern is electrically conductive, the distributed capacitance between the terminal electrodes can be substantially ignored, the wiring pattern length is short, and an electronic component having excellent circuit characteristics can be provided.

[Brief explanation of the drawing]

FIG. 1 is a sectional view schematically showing the structure of an electronic component according to the present invention, and FIG. 2 is an enlarged sectional view of a connecting conductor. J3
The figure is also a perspective view of the connecting conductor, ′! Figure J4 is a sectional view showing another embodiment of the connection conductor, Figure 5 is a perspective view thereof,
! 6(a), (b) to FIG. 10(a), (b) are diagrams showing the steps of forming the connecting conductor by a screen printing process, and FIG. 6(a) to FIG. ) is a plan view, Figure 6(b)~'! J10 figure (b) is! Figure 6 (a)
〜(As As ) in FIG. 10(a) 〜(As
611 is a plan sectional view of the hybrid integrated circuit component included in the electronic component according to the present invention,
FIG. 12 is a partial front sectional view, FIG. 13 is a sectional view schematically showing the structure of a conventional electronic component, and FIG. 14 is a plan view thereof. 1...Sintered body 201-211...Conductor 41.4
2... Connection conductor 411.421... Connection conductor piece Fig. 1 Fig. 3 Fig. 4 Fig. 5 Fig. 9 (a) Fig. 9 (b) Fig. 10 (a) Fig. 10 (b ) Figure 11 Figure 12

Claims (4)

[Claims] (1) An electronic component in which a plurality of conductors are embedded inside a sintered body and a plurality of circuit elements are formed by the conductors, wherein at least a part of the circuit element is formed by at least one of the conductors formed by the sintered body. The connecting conductor is connected to a connecting conductor passing vertically inside the body, and the connecting conductor is led out to at least one surface of the sintered body in the vertical direction and is connected to a conductor pattern provided on the one surface of the sintered body. An electronic component characterized by being electrically conductive. (2) The sintered body is a laminate stacked in the vertical direction, and the connection conductor is configured by connecting connection conductor pieces formed for each layer in the stacking direction. The electronic component according to claim 1. (3) The electronic component according to claim 1 or 2, wherein the circuit element includes at least one of a capacitor and an inductor. (4) Claims 1 and 2, wherein the sintered body has a resistor or an integrated circuit component mounted on the one surface.
or the electronic component described in 3.