JPH036094A - Inductor and composite component containing conductor and manufacture thereof - Google Patents

Abstract

PURPOSE:To shield the outside of a shielding electrode layer without influence of frequency characteristic of a using environment and to prevent deterioration of Q of an inductor, etc., by providing a sheet layer between an inductor body and the electrode layer, shielding the outside of the layer with a protective layer, and grounding the electrode layer through a ground terminal film. CONSTITUTION:A pair of sheet layers 4, 6, a pair of shielding electrode layers 3, 7 provided at both sides of the layers 4, 6, an inductor body 5, a pair of protective layers 2, 8 made of magnetic material or insulator provided at both sides of the layers 4, 6 and 3, 7, and a ground terminal film 13 connected to the layers 3, 7 and exposed with an exterior are provided. Thus, the layers 4, 6 are interposed between the body 5 and the layers 3, 7, which are shielded with the protective layers, and grounded through the film 13. Thus, it can be shielded without influence of the frequency characteristic of a using environment to prevent deterioration of Q of the inductor.

Description

Detailed Description of the Invention The present invention relates to an inductor and an inductor in which electrode films are patterned on both sides of a layered magnetic material having dielectric properties, and the outside of the layer is shielded. The present invention relates to composite parts including inductors, such as bandpass filters, and methods of manufacturing them.

For example, as a band pass filter, Fig. 20 (front view), Fig. 21 (bottom view), Fig. 22 (rear view)
There is one that is configured as shown below. This involves forming two symmetrical U-shaped conductive patterns 221, 222, 223, and 224 on the front surface 220a and back surface 220b of a substrate 220 made of a dielectric material obtained by firing, respectively.
Grounding terminal 22 on conductive patterns 221 and 222 of 0a
5.225, and the conductive pattern 2゜2 on the back side 220b
3. Lead terminal 226.22 for external extraction on 2.24
After soldering 6, the protruding parts of the lead terminal 225 and the grounding terminal 226 are immersed in an insulating resin bath to form a resin film (not shown), and the outside of this is coated with a magnetic material, for example. It is surrounded and shielded by a shield case (not shown) consisting of.

This shield is provided to prevent deviations in frequency characteristics from occurring if a conductor such as metal is present nearby.

Further, inductors and other composite parts including inductors are similarly shielded.

However, in the above-mentioned shield structure,
Since the magnetic permeability μ of the shielding case made of a magnetic material changes depending on the frequency characteristics, the magnetic permeability μ deteriorates in the high frequency region, and a sufficient shielding effect cannot be obtained.

Furthermore, when manufactured as described above, various manufacturing steps were required, such as baking the substrate, forming a conductive pattern, soldering the terminals, immersing it in resin, and covering it with a shield case. Therefore, in order to manufacture with fewer steps, in recent years it has been desired to manufacture by forming an integral structure with an electrode layer for shielding inside and firing it, but in reality, it is difficult to manufacture it by firing it. However, there was a problem in that Q deterioration occurred in the bandpass filter body, inductor body, etc. inside the shield electrode layer, making it impossible to implement.

The present invention has been made in view of the above circumstances, and provides an inductor and an inductor that can be shielded without being affected by the frequency characteristics of the usage environment, and that have a structure that does not cause Q deterioration in the inductor, etc. inside the shield. The purpose of the present invention is to provide composite parts including: and methods for manufacturing them.

An inductor according to the present invention for the present invention has an inductor main body configured such that coil pattern electrodes formed on both sides of a magnetic layer are electrically connected through a through hole formed in the magnetic layer. a pair of sheet layers made of a magnetic material or an insulator provided on both sides of the inductor body; a pair of shield electrode layers provided on both sides of the inductor body and the pair of sheet layers; A pair of protective layers made of a magnetic material or an insulator are provided on both sides of the main body, a pair of sheet layers, and a pair of shield electrode layers, and are connected to the pair of shield electrode layers and exposed to the outside. and a ground terminal membrane.

In addition, a composite component including an inductor has a composite component body formed by forming electrodes including a coil pattern on both sides of a magnetic layer, and a sheet layer on both sides of the composite component body, as in the case of an inductor.

The structure includes a shield electrode layer, a protective layer, and a ground terminal film.

A bandpass filter is suitable for such a structure.

Further, for the inductor having the above structure, an inductor body is formed in which coil pattern electrodes formed on both sides of the magnetic layer are electrically connected through a through hole formed in the magnetic layer. A protective layer made of a magnetic material or an insulating material, a shield electrode layer, a sheet layer made of a magnetic material or an insulating material 2 The inductor body, a sheet layer made of a magnetic material or an insulating material, a shield electrode layer, and a magnetic material or insulating material a step of forming a laminate by laminating protective layers consisting of the laminate in this order, a step of connecting with the two shield electrode layers and exposing to the outside to form a ground terminal film, and a state of the laminate as it is. Alternatively, the laminate can be manufactured by firing the laminate with the ground terminal film formed thereon.

Furthermore, for composite parts including inductors, there is a process of manufacturing a composite part main body formed by forming electrodes including coil patterns on both sides with a magnetic layer sandwiched therebetween, a protective layer made of a magnetic material or an insulator, and a shield electrode layer. , a laminate formed by laminating in this order a sheet layer made of a magnetic material or an insulating material, the composite component body, a sheet layer made of a magnetic material or an insulating material, a shield electrode layer, and a protective layer made of a magnetic material or an insulating material. a step of forming a ground terminal film by connecting it to the two shield electrode layers and exposing it to the outside, and firing the laminate as it is or with the ground terminal film formed on the laminate. It can be manufactured by performing the following steps.

In the inductor of the present invention, a sheet layer made of a magnetic material or an insulating material is interposed between the inductor main body and the shield electrode layer. Deterioration of the Q of the inductor body caused by firing can be prevented. Furthermore, since the outside of the shield electrode layer is covered with a protective layer and is grounded via the ground terminal film, it does not depend on the frequency of the usage environment. This also applies to composite parts including inductors and bandpass filters.

Furthermore, in the case of manufacturing an inductor, a composite part including an inductor, and a bandpass filter by the method of the present invention, it is easy to manufacture by stacking each layer in a laminated state and then performing integral firing.

Fig. 1 is an external perspective view showing an inductor according to the present invention;
FIG. 2 is a bottom view thereof, and FIG. 3 is a sectional view taken along the line ■--■ in FIG. 1. As shown in the figure, this inductor is made up of multiple layers laminated and has a rectangular parallelepiped shape as a whole, and the bottom layer 2 and the top layer 8 are made of magnetic or insulating sheets with a thickness of 20 to 50 μm. It is a protective layer with a shape. 3 and 7 on the inside are shield electrode layers made of, for example, sinus or silver, and 4 and 6 are made of a magnetic material or an insulator with a thickness of 1 to 1.
．． It is a sheet layer with a thickness of 5 mm, and 5 in the center is a sheet-like magnetic material layer 51, 52 having a thickness of 20 to 50 μm and made of a magnetic material with a high dielectric constant, such as spinel ferrite.
, 53, 54, 55, and 56, and an electrode film made of a conductive material is patterned between them.

Further, in the figure, 11 is an input terminal, 12 is an output terminal, and 13 is a ground terminal. In addition, the protective layer 2.8 and the sheet layer 4,
Any magnetic material may be used for the magnetic material 6, regardless of its dielectric constant.

As shown in FIG. 4, the inductor main body 5 includes five magnetic layers 51. . . , 55, C-shaped electrode film patterns 51a, . This electrode film pattern 51a
The input terminal piece A provided on one end side (left side in the figure) of the electrode film pattern 51a formed on the uppermost magnetic layer 51 is sequentially shifted in the left-right direction, and the magnetic layer 52. ...,
The pie hole 52b, which is provided through the hole 55,...
55b is filled with a conductive material (not shown) to connect the ends of the upper and lower electrode film patterns 51a, etc., and the input terminal piece A to the output terminal piece B provided on the magnetic layer 55 are integrally connected. It is made with a spiral coil.

Note that 57 is a bonding electrode for reliably connecting the filled conductive material and the lower electrode film pattern to be connected. Further, the input terminal piece A and the output terminal B are exposed on the end face of the magnetic layer 51 and the like, and are connected to the input terminal 11 and the output terminal 12 formed at the left and right ends of the inductor. Although the electrode film pattern 51a and the like are formed in a C-shape, they are not limited to this and may be formed in a U-shape or the like.

The shield electrode layers 3.7 provided on both the upper and lower sides of the inductor main body 5 described above are connected to the ground terminal piece 3a ( 7a) and is connected to the ground terminal 13 via this ground terminal piece 3a (7a).

Next, a method for manufacturing an inductor having such a structure will be described. First, six magnetic layers 51. . . 56 are prepared, and predetermined electrode film patterns 51a, etc. are formed thereon, and holes 52b, etc. are formed in the piezoelectric layer.

Bonding electrode 57. An input terminal piece A and an output terminal piece B are formed, a conductive material is filled in the inside of the vial 52b, etc., and six magnetic layers 51 etc. are stacked.

As shown in FIG. 3, a sheet layer 4.6, shield electrode layers 3 and 7, and protection N2.8 are sequentially laminated on both sides of the inductor main body 5 thus produced.

Thereafter, an input terminal 11 and an output terminal 12 are respectively formed on the side surface portions where the input terminal piece A and the output terminal piece B, which have been previously formed so as to be exposed on the side surface of the inductor, are present, and the shield electrode layer 3.7 is A ground terminal 13 is formed from the exposed side portion to the bottom edge. This results in
The input terminal 11 is connected to the input terminal piece A, the output terminal 12 is connected to the output terminal piece B, and the ground terminal 13 is connected to the portion exposed on the side surface of the shield electrode layer 3.7.

Then, the product in this state is charged into a firing furnace maintained at a predetermined temperature and fired. Then, an inductor having the above structure is manufactured. As shown in FIG. 5, the shield electrode layers 3 and 7 are formed to be slightly smaller in size than the protective layers 2, etc. located above and below the shield electrode layers 3 and 7, and a large number of shield electrode layers ( In this example, there are 4 through holes 3
It is preferable to form a layer b (or 7b) in order to improve the adhesion between the upper and lower layers. This through hole has a small cross section so that it does not interfere with the shield.

In the inductor manufactured in this way, each layer is laminated to form a laminate and this is fired to form the inductor, so the number of different manufacturing techniques can be reduced, which makes it easy to manufacture the inductor. Furthermore, since the human/output terminal and the ground terminal are exposed to the outside, it can be surface mounted on a circuit board, etc.

Furthermore, since the sheet layer 4.6 made of a magnetic material or an insulator is provided between the inductor body 5 and the shield electrode layers 3 and 7, the inductor body 5 can be It is possible to prevent the Q from deteriorating. In addition, a protective layer 2.8 is formed on the outside of the shield electrode layer 3.7, and the shield electrode layer 3.7 is grounded via the ground terminal 13, so even if a conductor such as a metal approaches the inductor, the frequency There is no deviation in characteristics.

Next, a case will be described in which the present invention is applied to a bandpass filter. FIG. 6 is an external perspective view showing the bandpass filter according to the present invention, FIG. 7 is a cross-sectional view (front view) taken along the line ■-■ in FIG. 6, and FIG. 8 is taken along the line ■-■ in FIG. 7. It is a sectional view (plan view). This bandpass filter is
As shown in FIG. 7, it has a rectangular parallelepiped shape in which a plurality of layers are laminated, and from the bottom layer, a sheet-like protective layer 21 made of a magnetic material or an insulating material and having a thickness of 20 to 50 am, such as copper or silver. A shield electrode layer 22 consisting of a magnetic material or an insulating material having a thickness of 1 to 1.5M, a back electrode film 24 and 34 consisting of a conductive material such as copper, and a material having a dielectric constant of, for example, spinel ferrite. A sheet-like magnetic layer 25 made of a highly magnetic material and having a thickness of 20 to 50 μm, a surface electrode film 26.36 made of a conductive material such as copper, and a thickness of 1 to 1.5 mm made of a magnetic material or an insulator. A sheet layer 27, a shield electrode layer 28, and a sheet-like protective layer 29 made of a magnetic material or an insulator and having a thickness of 20 to 50 μm are provided. The above protective layer 21.29 and sheet layer 23.27
Any magnetic material may be used regardless of the dielectric constant.

The front electrode film 26 (solid line) and the back electrode film 24 (broken line) located on the left side of FIG. 8 are two capacitor electrode patterns 61a, 62a, 41a, 42a connected by one coil pattern 63a, 43a. It has a U-shaped pattern when viewed from above.

The capacitor electrode patterns 61a, 41a, and 62
a and 42a face each other on both the front and back sides of the magnetic layer 25, and form capacitors C1 and C whose capacities are determined by the dielectric constant and thickness of the magnetic layer 25, and the opposing area of the capacitor electrodes.
2 is formed.

On the other hand, the coil patterns 63a and 43a are connected to the magnetic layer 2, respectively.
Two capacitor electrode patterns 6 on each front and back side of 5
It is formed to connect 1a and 62a, and 41a and 42a. Each coil pattern 63a, 43a forms a coil in terms of high frequency, so its inductance is Ll,
If L2, the surface electrode film 26. The back electrode film 24 and the magnetic layer 25 therebetween are, as shown in FIG. 9, an equivalent circuit in which a second capacitor C2 is connected in parallel to an LC circuit in which coils Ll and L2 are connected in series on both sides of a first capacitor CI. A hail resonator Q1 is configured. Note that this equivalent circuit is the same for the conventional product shown in FIG.

Further, both the back electrode film 24 and the front electrode film 26 have tongues 24a and 26a that reach one side of the bandpass filter, and the exposed portions of the tongues 24a and 26a are connected to the lower side surface portions. Terminal electrode films 32 for input made of a conductive material such as silver formed in an upper letter shape on the bottom portions following this.
．． It is electrically connected to a terminal electrode film 30 for grounding (see FIG. 6). The terminal electrode films 32 and 30 are formed so as to be electrically insulated from each other and from other layers.

On the other hand, the front electrode film 36 (solid line) and the back electrode film 34 (broken vA) located on the right side of FIG. 8 are two capacitor electrode patterns 61b, 62b, 4lb.

42b are connected by one coil pattern 63b, 43b, and has a U-shaped pattern shape in plan view that is symmetrical with respect to the case of the front electrode film 26 and the back electrode film 24. The capacitor electrode patterns 61b and 41b and 62b and 42b face each other on both sides of the magnetic layer 250, and form capacitors C3 and C4 whose capacities are determined by the dielectric constant and thickness of the magnetic layer 25 and the facing area of the capacitor electrodes. is formed. On the other hand, the coil patterns 63b and 43b are formed to connect the two capacitor electrode patterns 61ti and 62b, and 41b and 42b on each of the front and back surfaces of the magnetic layer 25, respectively. Each coil pattern 63b
, 43b form a coil in terms of high frequency, so if its inductance is L3°L4, then the surface electrode film 36. The back electrode film 34 and the magnetic layer 25 therebetween are arranged on both sides of the first capacitor C3 as shown in FIG. A resonator Q2 is formed by an equivalent circuit in which a second capacitor C4 is connected in parallel to an LC circuit in which L4 is connected in series.
Configure.

Furthermore, both the back electrode film 34 and the front electrode film 36 have tongues 34a and 36a that reach one side of the bandpass filter, and the exposed portions of the tongues 34a and 36a are connected to the lower side surface portions. Terminal electrode films 33 for output made of a conductive material such as silver formed in an upper letter shape on the bottom portion following this.
．． It is electrically connected to a terminal electrode film 31 for grounding (see FIG. 6). The terminal electrode films 33 and 31 are formed so as to be electrically insulated from each other and from other layers.

As shown in FIG. 8, the resonators Q1 and Q2 having the above-mentioned equivalent circuit have two coil patterns 63a,
Since the coil patterns 63b are close to each other with the distance d, the two coil patterns 63a and 63b are magnetically coupled, and the 10th
A bandpass filter with an equivalent circuit as shown in the figure is constructed. In the figure, M indicates two coil patterns 63a and 63b.
Mutual inductance L30 and L31, which determine the degree of magnetic coupling of fs"f, are the inductances of the grounding terminal electrode films 30 and 31. Note that the two resonators Q1
．． Since Q2 uses the magnetic layer 25, not only magnetic coupling but also capacitive coupling is performed.

In the figure, C3 schematically indicates the coupling capacity.

Parts of each of the shield electrode layers 22 and 28 on both sides of the bandpass filter main body having such a structure are exposed on the sides of the bandpass filter, and these exposed portions (not shown) are shown in FIG. As such, it is connected to the ground terminal film 43 formed on the entire side surface on the back side of the bandpass filter and in the vicinity thereof.

A method for manufacturing a bandpass filter having such a structure will be described next. First, a protective layer 21, a sheet layer 23, 27, and a magnetic layer 25 are prepared, and a part of the protective layer 21 is screen-printed or coated with a paste made of a conductive material such as copper on the surface of the protective layer 21. The shield electrode layer 22 is formed so as to be exposed on the end face of the sheet layer 23, and the tongue pieces 24a, 34a are formed on the surface of the sheet layer 23 in the same manner, and two U-shaped back electrodes are formed symmetrically. membrane 24
．． 34, and on the surface of the magnetic layer 25, in the same manner, two U-shaped surface electrode films 26 and 36 having the tongues 26a and 36a and symmetrically formed on the left and right sides are formed. Similarly, a shield electrode layer 28 is formed on the surface of the sheet layer 27 by exposing a part to the end face of the sheet layer 27, and these are stacked together with a protective layer 29 and then pressed together to form a laminate. In the laminate, the tongue piece 2
A paste made of a conductive material such as copper or silver is printed on the exposed portions of 4a, 34a, 26a, and 36a, the side surfaces below these, and the bottom surface following this to form the terminal electrode film 30.
, 31, 32, 33, and a ground terminal film 43 made of a conductive material such as copper or silver is formed on the side surface where a part of the shield electrode layer 22, 28 is exposed. Bake for 2 hours.

In the band-pass filter manufactured in this way, the layers are laminated to form a laminate, which is then fired to form a laminate, so the number of different manufacturing techniques can be reduced, and this allows the band-pass filter to be manufactured by It can be easily manufactured, and since the terminal electrode film 30 and the like and the ground terminal film 43 are provided to be exposed to the outside, it can be surface mounted on a circuit board or the like. Furthermore, since the sheet layer 23.27 made of a magnetic material or an insulator is provided between the bandpass filter main body and the shield electrode layer 22.28, even if the sheet layer 23.27 is formed into an integral structure and is fired, the bandpass filter will pass. It is possible to prevent the Q of the filter body from deteriorating. Also,
The iii layer 21.2 is kept on the outside of the shield electrode N22.28.
9 is formed and the shield electrode layers 22 and 28 are grounded via the ground terminal film 43, so even if a conductor such as a metal approaches the bandpass filter, there will be no shift in frequency characteristics.

In addition, the shield electrode 22.28, the back electrode film 24.34
The positions where the surface electrode films 26 and 36 are formed are not limited to those described above, and for example, the positions where the surface electrode films 26 and 36 are formed are not limited to those described above.
2 may be formed not on the surface of the protective layer 21 but on the back surface of the sheet layer 23.

Further, crimping is not an essential requirement of the present invention. Furthermore, the front electrode film 26.36, the back electrode film 2434, and the shield electrode! Each of the five stones except 22.28 may be constructed from a single sheet material, or may be constructed by stacking two or more sheet materials made of the same material.

Shield electrodes N2B and 22 are disposed through sheet layers 27 and 23, respectively, at the upper and lower positions of the bandpass filter main body, that is, at the directional positions that are easily affected by external magnetic fields and external conductors. Therefore, the bandpass filter main body is effectively shielded by this shield electrode layer 28.22, and by changing the thickness of both or one of the sheets ji 27.23, that is, the thickness of one sheet material can be changed. change or sheet layer 27
．． It is possible to adjust the frequency characteristics of the bandpass filter by increasing or decreasing the number of the plurality of sheet materials that constitute the bandpass filter 23. For example, the seat, Ii! The case where the frequency characteristics are adjusted by changing the thickness of the 27 side will be explained below.

First, if the center frequency is higher than the desired value, the sheet N27 is made thicker. As a result, the bandpass filter main body is separated from the shield electrode layer 2, so that the center frequency is lowered. As a result, the frequency characteristic can be adjusted from curve 1 to curve 3 as shown in FIG. 11 (frequency characteristic curve).

Conversely, if the center frequency is lower than the desired value, the sheet layer 27 is made thinner. This causes, contrary to the above case,
Since the shield electrode layer approaches the bandpass filter body, curve 1 changes to curve 2, and the center frequency becomes higher.

Moreover, the above-mentioned sheets [27 and 23 can each have a uniform thickness, so that the shield electrode layer 28'
, 22 and the front and back electrode films 26, 36, 24, 34 can be made parallel, and the spacing can be made constant, for example, 1 mm or more. Thereby, deterioration of the electrical characteristics of the shielded bandpass filter can be suppressed.

In addition, in the above embodiment, the front electrode films 26, 36 and the back electrode film 2
4.34 and the shield electrode layer 22.28 are formed by printing or coating, but the present invention is not limited to this. Alternatively, one or more of the front electrode films 26, 36, the back electrodes M24, 34, and the shield electrode layer 22, 28 may be made of conductive material. It is also possible to prepare sheet materials made of the material and to overlap each sheet material in combination with printing or coating.

Further, it is optional whether the protective layers 21 and 29, the sheet layers 23 and 27, and the magnetic layer 25 are each formed by one sheet material or by laminating a plurality of sheet materials. You can choose.

FIG. 12 is an external perspective view showing a bandpass filter having another configuration according to the present invention, and FIG. 13 is a bottom view thereof, and FIG.
FIG. 4 is a sectional view taken along the line XIV-X■ in FIG. 12. This band-pass filter has the same number of laminated layers, materials, etc. as described above, but has shield electrode layers 22 and 28 partially exposed on the side surface of the band-pass filter.
It is connected to the ground terminal film 93 formed on the left side surface of the bandpass filter, and as shown in FIG. (The same parts as in FIG. 7 are given the same reference numerals.)

Of the latter electrode films, the front electrode film 80a and the back electrode film 80b located on the left side in FIG. Coil pattern 8 formed on both sides
2a and 82b are connected, and these coil patterns 82a
, 82b are connected via a conductive material 25b filled in a through hole 25a formed in the magnetic layer 25.

The capacitor electrode patterns 81a and 81b are opposed to each other on both sides of the magnetic layer 25.
A capacitor C1l is formed with a capacitance determined by the dielectric constant, thickness, and opposing area of the capacitor electrodes.

On the other hand, a single coil pattern in which two coil patterns 82a and 82b are connected is formed by connecting two capacitor electrode patterns 81a and 81b on the front and back sides of the magnetic layer 250.

Since the two coil patterns 82a and 82b form a coil in terms of high frequency, their inductances Lll and L
12, the front electrode film 80a, the back electrode film 80b, and the magnetic layer 25 therebetween constitute a resonator.

Further, the front electrode film 80a and the back electrode film 80b each have tongue pieces 84a and 84b that reach one side of the bandpass filter.
has. The exposed portion of one tongue piece 84a is an input terminal electrode film 9 made of a conductive material such as silver, formed in a 5-shape on the side surface portion below and the bottom portion following this.
0, and the exposed portion of the other tongue piece 84b is a ground terminal film made of a conductive material such as silver formed in a 5-shape on the side surface portion below this and the bottom surface portion following this. It is electrically connected to 91. The terminal electrode film 9
0 and the ground terminal film 91 are formed so as to be electrically insulated from each other and from other layers.

On the other hand, the front electrode film 70a and the back electrode film 70b located on the right side of FIG.
Coil patterns 72a and 72b formed on both sides of the magnetic layer 25 are connected to each other, and these coil patterns 72a and 72b are connected to the conductive material 2 filled in the through hole 25a' formed in the magnetic layer 25.
5b'. The capacitor electrode patterns 71a and 71b face each other on both sides of the magnetic layer 25, forming a capacitor C12 having a capacitance determined by the dielectric constant and thickness of the magnetic layer 25, and the facing area of the capacitor electrodes.

The two coil patterns 72a and 72b connected into one are formed by connecting the two capacitor electrode patterns 71a and 71b on each of the front and back surfaces of the magnetic layer 25.

Since the two coil patterns 72a and 72b form a coil in terms of high frequency, the inductance L13. L
14, the front electrode film 70a, the back electrode film 70b, and the magnetic layer 25 therebetween constitute a resonator.

Further, the front electrode film 70a and the back electrode film 70b each have tongue pieces 74a and 74b that reach one side of the bandpass filter.
has. The exposed portion of one tongue piece 74a is an output terminal electrode film 9 made of a conductive material such as silver, which is formed in a 5-shape on the side surface portion below this and the bottom portion following this.
The exposed portion of the other tongue piece 74b is electrically connected to the ground terminal film 91, which is shared with the left side. The terminal electrode films 92 are formed to be electrically insulated from each other and from other layers.

As shown in the equivalent circuit of FIG. 16, the bandpass filter having such a structure has a structure in which resonators formed on the left and right sides of the magnetic layer 25 are magnetically coupled by a mutual inductance M as before. , this frequency characteristic is as shown in FIG.

In the bandpass filter manufactured in this way, as before, the layers are laminated to form a laminate and this is fired to form a laminate, so the number of different manufacturing techniques can be reduced, which makes it possible to reduce the number of different manufacturing techniques. The pass filter can be easily manufactured, and since the terminal electrode film for human/output and the ground terminal film are exposed to the outside, it can be surface mounted on a circuit board or the like. Furthermore, since the sheet JW23.27 made of a magnetic or insulating material is provided between the bandpass filter main body and the shield electrode layer 22.28, even if the sheet JW23.27 is formed into an integral structure and then fired, the bandpass filter still remains intact. It is possible to prevent the Q of the main body from deteriorating. In addition, a protective layer 1 is provided on the outside of the shield electrode layer 22.28.
2129 is formed and the shield electrode layers 22.28 are grounded via the ground terminal film 93, so even if a conductor such as a metal approaches the bandpass filter, there will be no shift in frequency characteristics.

In the case of the above-mentioned inductor, shield electrode layers are formed on both sides of the magnetic layer located in the center, thereby shielding the inside, but the present invention is not limited to this. In addition to this shield electrode layer 3.7, a shield electrode film 3' (indicated by a broken line) may also be formed on the side surfaces (two sides) of the inductor where the input terminal 11 and output terminal 12 are not formed. good. This has the advantage that shielding can be made more reliable. The same effect can be obtained even if this is applied to a composite component including an inductor such as the above-mentioned bandpass filter.

Further, as explained using FIG. 5 in the above-mentioned inductor, a large number of through holes are provided in the shield electrode layer. b)
As shown in the figure, one shield electrode layer 3 (7) may be divided into two or four parts, and these parts may be separated and sandwiched between upper and lower layers, for example, the protective layer 2. This means that a band pass filter, etc. It is also preferable to apply it to

Furthermore, according to the present invention, there are the following advantages in an inductor and a composite part including the inductor.

Taking the above inductor as an example, the protection FJ
2, 8 and sheet layer 4.6, even if a magnetic material with a small magnetic permeability μ is used to sufficiently extend the usable band to the high frequency range, the shielding effect cannot be improved due to the presence of the shield electrode layers 3, 7. It is possible to extend the usable band to the high frequency side while maintaining it.

As described in detail above, in the case of the present invention, a laminate is formed by laminating each layer, and this is formed by firing.
The number of different manufacturing techniques can be reduced, which makes it possible to easily manufacture inductors and composite parts including inductors.Also, by laminating shield electrode films on both sides of the inductor body and composite part body, the main body can be easily manufactured. At the same time, the shield electrode film is grounded via the ground terminal film, so even if a conductor such as metal approaches, there will be no deviation in frequency characteristics. Since a sheet layer is provided between the electrode layer and the shield electrode layer, deterioration of the Q of the main body can be prevented, and the frequency characteristics can be adjusted by changing the thickness of the sheet layer. ,
It has excellent effects.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view showing an inductor according to the present invention;
FIG. 2 is a bottom view thereof, FIG. 3 is a cross-sectional view taken along the line ■-■ in FIG. 1, FIG. 4 is an exploded perspective view showing the inductor body inside the inductor according to the present invention, and FIG. FIG. 6 is an external perspective view showing a bandpass filter according to the present invention,
Figure 7 is a sectional view taken along the line ■-■ in Figure 6, and Figure 8 is a cross-sectional view of the
9 is an equivalent circuit diagram of the resonator part of the band-pass filter, FIG. 10 is an equivalent circuit diagram of the main body of the band-pass filter, and FIG. 11 is the equivalent circuit diagram of the band-pass filter body. A graph showing a frequency characteristic curve of a band-pass filter, FIG. 12 is an external perspective view showing a band-pass filter with another configuration according to the present invention, FIG. 13 is a bottom view thereof, and FIG. 14 is a longitudinal sectional view thereof. Fig. 15 is a plan view showing the circuit of the main body of the band pass filter, Fig. 16 is an equivalent circuit diagram of the main body of the band pass filter, Fig. 17 is a graph showing the frequency characteristics of the band pass filter, and Fig. 18 is a diagram of the main body of the band pass filter. FIG. 19 is a perspective view of another shield electrode film suitable for use in the present invention; FIG. 20 is a front view of a conventional product; FIG. 21 is a perspective view of another inductor to which the invention is applied; is its bottom view, and FIG. 22 is its rear view. 2, 8. 21. 29...protective layer, 3. 7.
2228...shield electrode layer, 4,6,23.27.
... Sheet layer, 24.34 ... Back electrode film, 25,51
．． ．． 52.53, 54, 55.56... magnetic layer, 2
636... Surface electrode film, 13,43.93... Earth terminal film.

Claims (5)

[Claims] (1) An inductor body having a configuration in which coil pattern electrodes formed on both sides of the magnetic layer are electrically connected through through holes drilled in the magnetic layer; A pair of sheet layers made of a magnetic material or an insulator, a pair of shield electrode layers provided on both sides of the inductor body and the pair of sheet layers, and an inductor body, a pair of sheet layers, and a pair of shields. A pair of protective layers made of a magnetic material or an insulating material are provided on both sides of the electrode layer, and a ground terminal film is connected to the pair of shield electrode layers and exposed to the outside. Inductor. (2) A composite component body formed by forming electrodes including coil patterns on both sides with a magnetic layer in between, and a pair of sheet layers made of magnetic or insulating material provided on both sides of the composite component body. , a pair of shield electrode layers provided on both sides of the composite component body and the pair of sheet layers, and a magnetic material provided on both sides of the composite component body, the pair of sheet layers, and the pair of shield electrode layers, or 1. A composite component including an inductor, comprising: a pair of protective layers made of an insulator; and an earth terminal film connected to the pair of shield electrode layers and exposed to the outside. (3) The composite component including an inductor according to claim 2, wherein the composite component body is a bandpass filter body. (4) In a method for manufacturing an inductor, an inductor body is formed in which coil pattern electrodes formed on both sides of a magnetic layer are electrically connected through a through hole drilled in the magnetic layer. A protective layer made of a magnetic material or an insulating material, a shield electrode layer, a sheet layer made of a magnetic material or an insulating material, the inductor body, a sheet layer made of a magnetic material or an insulating material, a shield electrode layer, and a magnetic material or insulating material. a step of forming a laminate by laminating protective layers consisting of a laminate in this order; a step of connecting with the two shield electrode layers and exposing to the outside to form a ground terminal film; and a state of the laminate as it is. or firing the laminate with a ground terminal film formed thereon. (5) A method for manufacturing a composite component including an inductor, including a step of manufacturing a composite component body by forming an electrode film including a coil pattern on both sides with a magnetic layer sandwiched therebetween, and a protection made of a magnetic material or an insulator. layer, a shield electrode layer, a sheet layer made of a magnetic material or an insulator, the composite component body, a sheet layer made of a magnetic material or an insulator, a shield electrode layer, and a protective layer made of a magnetic material or an insulator are laminated in this order. a step of forming a laminate consisting of a laminate; a step of forming a ground terminal film by connecting it to the two shield electrode layers and exposing it to the outside; 1. A method for manufacturing a composite component including an inductor, the method comprising: firing the formed composite component.