JPH0416040B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a ceramic multilayer wiring board and a method for manufacturing the same, and in particular to a ceramic multilayer wiring board and a method for manufacturing the same.
The present invention relates to a ceramic multilayer wiring board suitable for mounting ICs and LSIs, and a method for manufacturing the same.

[Conventional technology]

2. Description of the Related Art In recent years, as electronic technology has progressed, electronic devices have been made to have higher densities and faster calculation functions. As a result, ceramic multilayer wiring boards, in which wiring circuits are formed in multiple layers, are being used for the purpose of increasing the density of wiring boards.

The ceramic multilayer wiring board is manufactured by a thick film multilayer method, a green sheet lamination method, and a method in which a conductive circuit pattern is formed on a ceramic substrate as described in Japanese Patent Application Laid-open No. 133597/1983. A "multilayer wiring circuit board" is known, in which a plurality of circuit boards obtained by forming the circuit board are laminated and bonded via an electrically insulating and thermally conductive adhesive layer.

[Problem that the invention seeks to solve]

However, since the multilayer wiring board manufactured by the thick film multilayer method has unevenness due to the thickness of the applied wiring circuit, it is difficult to print a thick film when the number of laminated layers is too large. 3-4
It is not suitable for high density because it has a limit of up to layers. Furthermore, it is difficult to control firing shrinkage of ceramic multilayer wiring boards manufactured by the green sheet lamination method, resulting in poor dimensions and low yields. The ceramic multilayer wiring board described in JP-A-55-133597 requires the production of a mold for punching out green sheets for each board, or the need to drill holes in the ceramic board using a carbon dioxide laser. Therefore, not only does it have the disadvantage of extremely high costs, but it is also described that the adhesive layer that covers the through-hole part is used to make a hole using a laser, but such a method It is difficult to remove the adhesive reliably, and the connection between the conductor in the through hole, which is the most important part of a multilayer wiring board, and the inner layer circuit on each board is likely to become defective, resulting in a lack of reliability.

[Means for solving problems]

An object of the present invention is to provide a ceramic multilayer wiring board and a method for manufacturing the same that solve the problems of the conventional ceramic multilayer wiring board and method for manufacturing the same. The above object can be achieved by providing a ceramic multilayer wiring board and a method for manufacturing the same.

As a result of various studies to solve the above-mentioned problems, the inventor of the present invention has discovered that the present inventor has a plurality of holes arranged with a regularity of predetermined pitch intervals, and that a hole is selected from among the plurality of holes. at least 1
A multilayer board in which a plurality of ceramic substrates each having a hole filled with an electrically insulating material are laminated with an adhesive so that the positions of the holes correspond to each other, and A ceramic multilayer wiring board comprising through holes formed so as to penetrate at least one part of the holes selected from among the holes filled with an insulating material, and a conductor circuit formed on each ceramic substrate. The present invention was completed based on the idea that the above-mentioned problems could be solved all at once by the manufacturing method.

The present invention will be explained in detail below.

Each ceramic substrate constituting the multilayer wiring board of the present invention has a plurality of holes arranged with a regularity of predetermined pitch intervals, and at least one selected from the plurality of holes A ceramic substrate is used in which the holes in the section are filled with an electrically insulating material.

On the other hand, conventional ceramic substrates with through-holes are manufactured by punching holes only in the desired locations using a special mold at the green sheet stage and then firing them. Not only is it necessary to create a special mold for each board and use this mold to punch out the holes, but it is also necessary to adjust the dimensions of the mold and the arrangement of the holes as appropriate depending on the state of shrinkage of the green sheet during firing. There were times when it was necessary to make design changes.

By the way, recently, wiring circuits on such wiring boards are often designed using computers, and as a result, there is a strong tendency for through-hole positions and wiring patterns to be designed with a certain regularity. . Therefore, in response to this regular wiring design, among the holes of the ceramic substrate, which has a plurality of holes arranged regularly at predetermined pitch intervals, are not used as through holes for the wiring circuit. By using the ceramic substrate of the present invention in which the holes are filled with an electrically insulating material, it is no longer necessary to manufacture a special mold for each board with a different wiring circuit, and a standardized general-purpose mold can be used. Moreover, since the ceramic substrate of the present invention has a plurality of holes regularly arranged at a predetermined pitch interval, it can be kept as an inventory item in the fired state. The ceramic multilayer wiring board according to the present invention can be manufactured in an extremely short delivery time and at low cost, and the inventory management of molds and fired boards can be greatly improved. Since a plurality of holes are provided, the firing shrinkage becomes uniform and high dimensional accuracy can be obtained.

The ceramic substrate of the present invention preferably has an electrical resistance (volume resistivity) of 10 ⁸ Ω-cm or more. The reason is that if the electrical resistance is lower than 10 ⁸ Ω-cm, insulation treatment is required to ensure the electrical insulation of the through holes, which makes the process complicated and makes it difficult to increase density. It is from.

The material of the ceramic substrate of the present invention is alumina,
Beryllium, mullite, low-temperature fired ceramics (based on alumina, etc., with low melting point components added,
It is preferable to use at least one selected from the group consisting of crystallized glass and crystalline ceramic (ceramics that can be sintered at low temperatures), dielectric ceramics such as barium titanate, aluminum nitride, silicon carbide, etc. However, alumina, low-temperature fired ceramics, and aluminum nitride can be advantageously used because they have a good balance of properties, can be fired in green sheets, and are excellent in workability and mass production.

The plurality of holes arranged in the ceramic substrate of the present invention need to have a regularity of a predetermined pitch interval in order to form a through hole, and more specifically, it is necessary to have a regularity of a predetermined pitch interval. It is preferable that the holes be arranged on a line parallel to the hole and having a predetermined pitch interval.For example, the arrangement can be as shown in A to F in FIG. 1 or a combination thereof, and the size of the hole can be changed as appropriate.
In particular, if most of the holes are arranged in a square lattice pattern as shown in Figure 1A or in a houndstooth lattice pattern as shown in Figure 1C, wiring design is easy and the versatility is excellent. . The pitch spacing of the square grid is 2.54 mm, which is the pitch spacing of electronic component leads.
(100mil) or 1.27mm (50mil) is preferable.

In the case of the plurality of ceramic substrates constituting the multilayer wiring board of the present invention, the arrangement of the holes that are drilled through the multilayer board among the holes provided therein must be the same, and It is preferable that the arrangement of other holes is also the same.

In each ceramic substrate constituting the multilayer wiring board of the present invention, at least one selected from the plurality of holes is filled with an electrically insulating material. Among the plurality of holes arranged in the ceramic substrate, the holes in which inner via holes and blind through holes are formed may not be filled with an electrically insulating material, but the holes may not be filled with an electrically insulating material so as to at least penetrate the laminated multilayer board. The holes drilled in are filled with an electrically insulating material.

The electrically insulating material can be suitably used as long as it has excellent insulation properties, thermal properties, and ability to fill through holes, and in particular, heat-resistant resins, mixtures of heat-resistant resins and fillers, glass, etc. It is preferable to use any one selected from
Examples of the heat-resistant resin include epoxy resin,
Heat-resistant epoxy resins, epoxy-modified polyimide resins, polyimide resins, phenolic resins, triazine resins, etc. Also, as fillers, powders such as alumina, beryllia, silica, glass, silicon nitride, boron nitride, aluminum nitride, silicon carbide, etc. are advantageous. It is advantageous to use a commercially available dielectric paste as the glass.

The multilayer wiring board used in the ceramic multilayer wiring board of the present invention is a multilayer board in which a plurality of the ceramic substrates are laminated with an adhesive so that the positions of the holes in which they are disposed correspond to each other. The reason why multiple ceramic substrates are stacked so that the positions of the holes correspond to each other is that through-holes penetrating the multilayer board can be easily drilled using, for example, an NC multi-axis drilling machine. This is because the hole can be opened by

The adhesive can be suitably used as long as it is a material with excellent electrical insulation, thermal properties, adhesive properties, etc.
In particular, it is preferable to use a heat-resistant resin as a main component. As the heat-resistant resin, for example, epoxy resin, heat-resistant epoxy resin, epoxy-modified polyimide resin, polyimide resin, phenol resin, triazine resin, etc. can be advantageously used, and inorganic filler made of powder of silica, alumina, glass, etc. Glass fibers can be incorporated into the heat-resistant resin.

The ceramic multilayer wiring board of the present invention includes through-holes formed to penetrate through at least a portion of the holes selected from the holes filled with the electrically insulating material of the multilayer board, and each ceramic multilayer wiring board. A conductor circuit is formed on a substrate. The reason for this is that by drilling the hole through the hole filled with the electrically insulating material, the conductor circuit in the inner layer can be reliably exposed on the inner wall surface of the through hole. This is because a multilayer wiring board can be obtained in which the reliability of connection with conductor circuits on each board is extremely high.

As a method for forming a conductor circuit on the ceramic substrate, various methods commonly used for printed wiring boards or hybrid IC wiring boards can be adopted, such as plating method, metal foil bonding method, resin method, etc. A system conductor paste method, a vapor deposition method, a thick film conductor paste method, and a combination thereof can be used. Thick-film conductors commonly used in conventional ceramic wiring boards have high sheet resistance, large high-frequency transmission loss, and low fine line properties, making it difficult to increase density, and furthermore, there are problems such as the need to be careful about migration. In contrast, the plating method can be used particularly advantageously because it can solve the problems associated with the thick film conductor. The plating method may be a tenting method, a panel pattern mixing method, a full additive method, or a semi-additive method, and a multi-wire method may also be used as a method for forming a conductive circuit.

Next, a method of manufacturing a ceramic multilayer wiring board according to the present invention will be explained with reference to FIGS. 2 and 3.

2A to 2E show a process of manufacturing a ceramic substrate in which a plurality of holes are arranged with a regularity of a predetermined pitch; at least one selected from the plurality of holes; a step of filling the hole with an electrically insulating material; a step of forming a conductor circuit on the ceramic substrate; one or more of the ceramic substrates on which the conductor circuit has been formed is used as an inner layer plate, and the ceramic substrate is filled with the electrically insulating material. A process of laminating ceramic substrates as both outer layers using an adhesive so that the positions of the holes corresponding to each other; A method for manufacturing a ceramic multilayer wiring board manufactured through the steps of: forming a hole through at least one of the holes; and forming a conductor circuit on the through hole and both outer layer substrates. It is a process explanatory diagram.

FIG. 2A is a cross-sectional view of a ceramic substrate 1 in which a plurality of holes 2, 2 are arranged with a regularity of predetermined pitch intervals, and there are various methods for manufacturing this ceramic substrate. For example, a method of punching holes in a green sheet with a mold and then firing it, a method of pressing powder using a mold with a mechanism for forming holes and firing it, and a method of drilling holes in a powder press body with a drill. A method in which the ceramic plate is fired later or a method in which holes are formed in a pre-fired ceramic plate using a CO ₂ laser, ultrasonic processing, a diamond drill, etc. can be applied. Among these, the method of punching holes in the green sheet with a mold and then firing it is the most practical because it is excellent in mass production.

FIG. 2B shows that at least one of the holes 2 selected from the plurality of holes 2 is connected to an electrically insulating material 3.
1 is a cross-sectional view of a ceramic substrate filled with Methods for filling predetermined holes with this electrically insulating material include, for example, using a mask such as a screen, metal mask, or photosensitive dry film, and press-fitting the electrically insulating material only into the predetermined holes with a squeegee or the like, or using a pin. There is a method of filling electrically insulating material only into predetermined holes using an automatic hole filling machine or direct writing for thick films.Also, when filling all holes with electrically insulating material, the method described above can be used. In addition, for example, it is also possible to directly press-fill with a squeegee without using a mask, or use a roller-type hole filling machine. Note that holes that are not filled with electrically insulating material can be used, for example, to form inner via holes or blind through holes, or as holes for inserting alignment guide pins, and can be filled after filling with electrically insulating material. It is also possible to drill at least some of the holes selected from the holes, for example by drilling, and use these drilled holes for the purpose described above.

If the electrical insulating material filled in the holes 2 is a heat-resistant resin or a mixture of a heat-resistant resin and a filler, it is heated and hardened at a temperature of approximately 100 to 300°C, and in the case of glass, it is heated to a temperature of 500°C or higher. It is melted and solidified. It is preferable that the excess electrically insulating material protruding from the holes of the ceramic substrate 1 be removed by polishing to make the surface of the ceramic substrate smooth.

FIG. 2C is a sectional view of the ceramic substrate on which the conductor circuit 4 is formed. Among the methods mentioned above for forming conductor circuits on a ceramic substrate, there are three methods: electroless plating and then etching, bonding copper foil and then etching, and direct electroless plating to form conductor circuits. Since the sheet resistance is low and a fine pattern can be easily obtained, this method is particularly advantageous as a method for forming conductor circuits of the ceramic multilayer wiring board of the present invention. The electroless plating includes electroless copper plating, electroless nickel plating,
Examples include electroless tin plating and electroless gold plating, and they may be combined, or electroless plating may be followed by electroplating.

When applying electroless plating, in order to improve the adhesion between the electroless plating and the ceramic substrate,
For example, it is preferable to directly roughen the surface of the ceramic substrate physically or chemically, or to roughen the surface by providing an adhesive layer for electroless plating. In particular, according to the present invention, after applying a mixture of heat-resistant resin and silica fine powder to a substrate, the silica fine powder is exposed and dissolved and removed with hydrofluoric acid to roughen the adhesive layer, or the heat-resistant resin and fine silica powder are coated on the substrate in advance. Forming an adhesive layer made of hardened heat-resistant resin fine powder and roughening the surface of the adhesive layer by dissolving and removing the fine powder with chromic acid improves the adhesion with electroless plating. This is preferable because reliability can be improved. In order to improve the adhesion between the ceramic substrate and the adhesive layer for electroless plating, the surface of the substrate can be chemically or physically roughened or treated with a coupling agent.

In the present invention, it is also possible to form, for example, a printed resistor, a plated resistor, or a thick film capacitor on the ceramic substrate on which the conductive circuit is formed.

In FIG. 2D, the ceramic substrate on which the semiconductor circuit is formed is used as an inner layer plate, and the ceramic substrate shown in FIG. 2B is used as both outer layer plates. 5 is a sectional view of a multilayer board laminated using No. 5. As a method for making the positions of the holes arranged in the ceramic substrate correspond to each other, there are a method using the end face of the ceramic substrate, a method using a guide pin, and the like.

As the adhesive 5, an adhesive sheet made of semi-cured heat-resistant resin, a prepreg made of glass cloth impregnated with heat-resistant resin, etc. may be used, or a liquid adhesive may be used to bond the ceramic substrates to each other. It can be applied to any surface. In this way, adhesives mainly made of heat-resistant resin are used,
It is preferable to heat and press the plate using a lamination press to form a multilayer board. Note that it is advantageous to roughen the surface of the conductive circuit in advance by, for example, blackening treatment, to improve adhesiveness of the ceramic substrate on which the conductive circuit is formed, before laminating the ceramic substrate.

FIG. 2E shows a method in which at least one hole selected from among the holes filled with the electrically insulating material of the laminated multilayer board is opened so as to pass through the hole, and then the through hole is opened. 6 is a sectional view of a ceramic multilayer wiring board in which conductor circuits 7 are formed on both outer layer substrates. As for the method of drilling a through hole that penetrates the hole filled with the electrically insulating material, the method of drilling the hole using an NC multi-axis drilling machine has good hole shape and positional accuracy, and is also excellent in productivity. It is advantageous because In addition, as a method for forming conductor circuits on the through holes and both outer layer substrates, the methods described above can be used, but among them, the plating method is used to form conductor circuits on the inner layer circuits and the outer layer circuits. It can be used particularly advantageously since it provides a reliable connection.

3A to 3E show a process of manufacturing a ceramic substrate in which a plurality of holes are arranged with a regularity of a predetermined pitch; at least one selected from the plurality of holes; a step of filling the holes with an electrically insulating material; a step of forming a conductor circuit on the ceramic substrate; a step of laminating using an adhesive; a step of opening holes so as to penetrate at least some of the holes selected from among the holes filled with the electrically insulating material of the laminated multilayer board; FIG. 2 is a process explanatory diagram of a method for manufacturing a ceramic multilayer wiring board manufactured through the step of forming a conductor circuit in a hole.

Figure 3A shows a plurality of holes 2, 2 similar to Figure 2A.
FIG. 1 is a cross-sectional view of a ceramic substrate 1 in which ceramics are arranged with a regularity of a predetermined pitch interval.

Similar to FIG. 2B, FIG. 3B shows at least one hole 2 selected from the plurality of holes.
is filled with electrical insulating material 3 and solidified, and then the substrate 1
1 is a sectional view of a ceramic substrate 1 whose surface has been polished and smoothed.

FIG. 3C is a sectional view of the ceramic substrate 1 on which the conductive circuit 4 is formed on the ceramic substrate, similar to FIG. 2C. Usually, a conductor circuit 4 is formed on both sides or one side of a substrate used as an inner layer board, and a conductor circuit 4 is formed on one side of a substrate used as an outer layer board.

FIG. 3D is a cross-sectional view of a multilayer board in which a plurality of ceramic substrates on which the conductor circuits are formed are laminated using an adhesive 5 so that the positions of the holes correspond to each other.

FIG. 3E shows that after opening at least one hole selected from among the holes filled with the electrically insulating material of the laminated multilayer board,
FIG. 3 is a sectional view of a ceramic multilayer wiring board in which a conductive circuit is formed in the through hole 6. FIG.

The ceramic multilayer wiring boards shown in FIG. 2E and FIG. A ceramic multilayer wiring board with conductor circuits formed in multiple layers can be manufactured.

Next, the present invention will be explained with reference to examples.

Example 1 A ceramic multilayer wiring board was manufactured through the following steps (1) to (6).

(1) A green sheet made of α-alumina fine powder as the main raw material is punched with holes using a standardized general-purpose mold, and then fired to form a lattice with a pitch of 2.54 mm as shown in Figure 1A. A 96% alumina ceramic substrate (external dimensions 50.8 x 50.8 mm, thickness 0.635 mm) with 1.2 mmφ holes arranged in a shape was fabricated.

(2) Heat-resistant epoxy resin (manufactured by Mitsui Petrochemical Industries, Ltd.)
TA-1850) An electrical insulating material made by uniformly dispersing 300 parts by weight of α-alumina fine powder with a particle size of 1 to 5 μm treated with silane coupling in 100 parts by weight of solid content is printed onto a ceramic substrate using a screen printing machine using a metal mask. Fill all pores of and heat to 180℃
After heat curing for 20 minutes, excess electrical insulating material protruding from the holes was removed by polishing to smooth the surface of the ceramic substrate as shown in FIG. 2B.

(3) Based on 100 parts by weight of the solid content of the heat-resistant epoxy resin, the particle size of the silane coupling treatment is 1 to 1.
An electroless plating adhesive uniformly mixed with 80 parts by weight of 3 μm fine silica powder was applied using a roll coater to the surface of a ceramic substrate treated with silane coupling, and then heated and cured at 180°C for 1 hour to form a thick layer. An adhesive layer for electroless plating with a thickness of approximately 8 μm was formed, and the surface of the adhesive layer was lightly polished and then immersed in a 25% aqueous solution of hydrofluoric acid for 2 minutes to roughen the surface of the adhesive layer. A palladium catalyst (SHIPLEY) is applied to the surface of this ceramic substrate.
The panel was plated with a plating thickness of 18 μm by immersing it in an electroless copper plating solution for thickening, and then using a photosensitive drum film (manufactured by E. 1015) as an etching resist, a part of the copper plating film was etched with a cupric chloride etching solution to form an inner layer conductor circuit.

(4) The ceramic substrate made through step (3) and with a blackened copper plating surface is used as the inner layer, and a prepreg (manufactured by Risho Kogyo, 80 μm thick), which is made by impregnating glass cloth with heat-resistant epoxy resin, is used as the inner layer. Then, the ceramic substrates made through step (2) are stacked together as both outer layer plates, and the holes are placed in correspondence with each other by using the end faces of each substrate as a reference. A multilayer plate as shown in FIG. 2D was obtained by heat-pressing for 60 minutes at 170° C. and a pressure of 20 kg/cm ² .

(5) After forming an adhesive layer for electroless plating on both surfaces of the multilayer board in the same manner as in step (2), predetermined holes of the holes filled with the electrically insulating material of the multilayer board are filled. , NC multi-axis drilling machine (Excellon
A through hole was formed by drilling a hole through the multilayer board using a 0.8 mmφ drill using a Mark V Driller (manufactured by Automation).

(6) A process is applied to the multilayer board in which the through holes are formed.
Thickness is increased by electroless copper plating in the same manner as (3).
After plating the panel with a thickness of 18 μm, etching was performed using a tenting method using a photosensitive dry film to form the through holes and conductor circuits on both outer layer substrates to obtain a ceramic multilayer wiring board as shown in Figure 2E. .

The ceramic multilayer wiring board manufactured as described above was subjected to a temperature cycle test (MIL-STD-
As a result of examining the connection reliability of the multilayer circuit using 202E107D Cond B), no failures were observed even after 200 cycles, indicating high reliability.

Example 2 The steps (1) to (3) of this example are similar to the steps (1) to (3) of Example 1, but the ceramic multilayer is formed through the steps (4) to (6) shown below. I made a wiring board.

(4) Using three ceramic substrates made through step (3) of Example 1, a ceramic substrate with conductive circuits formed on both sides and blackened copper plating surfaces was used as an inner layer plate, and the prepreg was Then, the ceramic substrates with conductor circuits formed on one side were stacked together as both outer layer plates, and heated and pressed under the above conditions using a lamination press while matching the positions of the respective holes, as shown in FIG. 3D. It was made into a multilayer board like this.

(5) Use the multi-axis drilling machine to drill a predetermined hole of the multilayer board filled with the electrically insulating material so as to penetrate the multilayer board with a 0.8 mmφ drill. A hole was formed.

(6) Additive photosensitive dry film (EIDupont
Using Riston T-168 (manufactured by Co., Ltd.) as a plating resist, the holes penetrated by electroless copper plating were plated with a through-hole of about 18 μm in thickness to form a ceramic multilayer wiring board as shown in Figure 3D. Manufactured.

The ceramic multilayer wiring board manufactured as described above had the same high connection reliability as the multilayer wiring board manufactured in Example 1.

〔Effect of the invention〕

As described above, the ceramic multilayer wiring board of the present invention eliminates the need to manufacture a dedicated mold for each board with a different wiring circuit, unlike conventional ceramic multilayer wiring boards, and uses a standardized general-purpose mold. Moreover, since the ceramic multilayer substrate of the present invention has a plurality of holes regularly arranged at a predetermined pitch interval, it can be kept as an inventory item in the fired state. Ceramic multilayer wiring boards can be manufactured in an extremely short lead time and at low cost, and inventory management of molds and fired substrates can also be greatly improved.

Furthermore, the ceramic multilayer wiring board of the present invention can form a multilayer circuit with high connection reliability, which is the most important aspect of a multilayer wiring board, as described above. Multilayer wiring boards with high density conductor circuits can be manufactured with high yield.

Due to these advantages, the ceramic multilayer wiring board of the present invention can be used as a high-density hybrid IC wiring board, a wiring board for surface mounting LSI or ceramic packages, a wiring board for large computers, and a hybrid IC development prototype wiring board with a short delivery time. It is suitable for applications such as, and is extremely useful industrially.

[Brief explanation of drawings]

FIGS. 1A to 1F are plan views showing several examples of the arrangement of holes provided in the ceramic substrate of the present invention, and FIGS. It is a sectional view explaining a manufacturing process. 1... Ceramic substrate, 2... Hole, 3... Electrical insulating material, 4, 7... Conductor circuit, 5... Adhesive,
6...Through hole.

Claims (1)

[Scope of Claims] 1. It has a plurality of holes arranged with regularity of predetermined pitch intervals, and at least one selected from the plurality of holes is made of an electrically insulating material. A multilayer board in which a plurality of ceramic substrates filled with the electrically insulating material are laminated with adhesive so that the positions of the holes in each board correspond to each other, and the holes in the multilayer board are filled with the electrically insulating material. A ceramic multilayer wiring board comprising through holes formed to penetrate at least one part of the holes selected from among them, and a conductor circuit formed on each ceramic substrate. 2 The electric resistance of the ceramic substrate is 10 ⁸ Ω-cm
The multilayer wiring board according to claim 1, which is the above. 3. The material of the ceramic substrate is at least one selected from alumina, beryllia, mullite, low-temperature fired ceramic, aluminum nitride, and silicon carbide.
Multilayer wiring board as described in section. 4. The multilayer wiring board according to claim 1, wherein most of the holes among the plurality of holes are arranged in a grid pattern. 5. Claims 1 to 4, wherein the electrically insulating material is any one material selected from heat-resistant resin, a mixture of heat-resistant resin and filler, and glass.
The multilayer wiring board according to any one of paragraphs. 6. The multilayer wiring board according to any one of claims 1 to 5, wherein the adhesive is mainly made of a heat-resistant resin. 7 Claims 1 to 6, wherein the conductor circuit is a circuit formed mainly by a plating method.
The multilayer wiring board according to any one of paragraphs. 8. A method for manufacturing a ceramic multilayer wiring board manufactured through the steps (a) to (f) below. (b) A step of manufacturing a ceramic substrate in which a plurality of holes are arranged with regularity at a predetermined pitch interval; (b) A step of forming at least one hole selected from the plurality of holes. a step of filling with an electrically insulating material; (c) a step of forming a conductor circuit on the ceramic substrate; (d) using one or more of the ceramic substrates produced through the step (c) as an inner layer plate; A step of laminating the ceramic substrates produced through the above step (B) as both outer layer boards using an adhesive so that the positions of the respective holes correspond; (E) the laminated multilayer board; (f) forming a conductive circuit on the penetrated hole and both outer layer substrates; The process of doing. 9. A method for manufacturing a ceramic multilayer wiring board manufactured through the following steps (a) to (f). (b) A step of manufacturing a ceramic substrate in which a plurality of holes are arranged with regularity at a predetermined pitch interval; (b) A step of forming at least one hole selected from the plurality of holes. a step of filling with an electrically insulating material; (c) a step of forming a conductor circuit on the ceramic substrate; (d) a step of positioning a plurality of ceramic substrates on which the conductor circuits are formed, respectively, in holes in which they are disposed; (e) At least one hole selected from among the holes filled with the electrically insulating material of the laminated multilayer board.
(f) forming a conductor circuit in the through hole;