JPH04160200A - Production of electric contact material - Google Patents
Production of electric contact materialInfo
- Publication number
- JPH04160200A JPH04160200A JP2286622A JP28662290A JPH04160200A JP H04160200 A JPH04160200 A JP H04160200A JP 2286622 A JP2286622 A JP 2286622A JP 28662290 A JP28662290 A JP 28662290A JP H04160200 A JPH04160200 A JP H04160200A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- layer
- contact
- tin
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000004332 silver Substances 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000012298 atmosphere Substances 0.000 claims abstract description 5
- 238000005096 rolling process Methods 0.000 claims abstract description 5
- 238000009792 diffusion process Methods 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 5
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910001316 Ag alloy Inorganic materials 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Metal Extraction Processes (AREA)
- Electroplating Methods And Accessories (AREA)
- Contacts (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は電気接点材料の製造方法に関し、更に詳しくは
、摺動特性や電気接続性に優れている電気接点材料を製
造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing an electrical contact material, and more particularly, to a method for manufacturing an electrical contact material that has excellent sliding properties and electrical connectivity.
(従来の技術)
各種金属線条の表面を銀または銀合金で被覆して成る材
料は、その基材である金属線条が具備する特性に加えて
、銀または銀合金が備えている耐食性、半田付は性、電
気接続性などの特性も発現するので、従来から各種の用
途に用いられている。(Prior Art) Materials made by coating the surface of various metal wires with silver or silver alloys have not only the characteristics of the metal wires that are the base material, but also the corrosion resistance of silver or silver alloys. Soldering also exhibits properties such as stability and electrical connectivity, so it has been used for various purposes.
例えば、銅合金条の表面を厚み0.5〜20μmの銀層
で被覆して成る材料は、銅合金の優れた機械的特性の外
に、銀が有する優れた耐食性、半田付は性、電気接続性
等も同時に発現する経済的な高性能導体として知られて
おり、電気・電子機器分野における接触部品やリードの
材料として広く用いられている。For example, a material made by coating the surface of a copper alloy strip with a silver layer with a thickness of 0.5 to 20 μm has the excellent mechanical properties of copper alloy, as well as the excellent corrosion resistance, solderability, and electrical properties of silver. It is known as an economical, high-performance conductor that also exhibits connectivity, etc., and is widely used as a material for contact parts and leads in the electrical and electronic equipment fields.
ところで、これら材料のうち、例えばスイッチは固定接
点と可動接点を組合わせて構成されているが、これら両
接点の材料には、いずれも、上記した銀または銀合金で
基材を被覆した材料が通常用いられている。By the way, among these materials, for example, a switch is constructed by combining a fixed contact and a movable contact, but both of these contacts are made of a material whose base material is coated with the above-mentioned silver or silver alloy. Usually used.
(発明が解決しようとする課題)
しかしながら、上記した接点材料から成るスイッチは、
接点間における接触回数が増加するにつれて、スイッチ
作動力の低下や、接点間の接触抵抗の増加などによって
スイッチ機能が低下しはじめる。そして、結局は、スイ
ッチ寿命が短(なる。(Problem to be solved by the invention) However, the switch made of the above-mentioned contact material,
As the number of contacts between the contacts increases, the switch function begins to deteriorate due to a decrease in switch actuation force and an increase in contact resistance between the contacts. In the end, the life of the switch becomes short.
このような現象は、両接点の接触面における銀または銀
合金の凝着摩耗に起因する。すなわち、両接点の接触に
基づく凝着の進行によってスイッチの作動力は低下し、
また、接触面の銀層または銀合金層が剥離して基材が露
出することにより、接触抵抗の増加が引き起こされるか
らである。This phenomenon is caused by adhesive wear of the silver or silver alloy at the contact surfaces of both contacts. In other words, the operating force of the switch decreases due to the progress of adhesion due to contact between both contacts.
Furthermore, the contact resistance increases when the silver layer or silver alloy layer on the contact surface peels off and the base material is exposed.
このような両接点間の凝着摩耗を防止するための方法と
しては、Au−Ag、 Pd−Ag、 AgPd −
Agのような異種金属で接点の表面を構成することが知
られている。As a method for preventing such adhesive wear between both contacts, Au-Ag, Pd-Ag, AgPd-
It is known to construct the surface of the contact with a dissimilar metal such as Ag.
しかしながら、そのような方法は、上記したような高価
格の貴金属を使用するため、接点材料のコストは大幅に
アップしてしまい、その接点の用途は極めて狭い範囲に
限定されざるを得なくなる。However, since such a method uses the above-mentioned expensive precious metals, the cost of the contact material increases significantly, and the applications of the contact must be limited to an extremely narrow range.
一方、電気接点材料には安定した電気接続性が要求され
る。そして、この電気接続性を安定にするために、接点
材料としては、接触の初期においてもまた時間の経過後
にあっても両接点間における接触抵抗が小さく抑制され
ること、接触面における摺動性が良好であって摩耗損傷
が少ないこと、更には耐食性が優れていることなどの特
性が必要とされる。On the other hand, electrical contact materials are required to have stable electrical connectivity. In order to stabilize this electrical connectivity, the contact material must be able to suppress the contact resistance between the two contacts to a low level both at the initial stage of contact and after the passage of time, and to have sliding properties on the contact surface. Characteristics such as good corrosion resistance, low wear and tear, and excellent corrosion resistance are required.
本発明は、上記した問題を解決し、接点間の凝着摩耗を
起すことがなく、しかも安定した電気接続性を実現する
ことができる電気接点材料を安価に製造する方法の提供
を目的とする。The present invention aims to solve the above-mentioned problems and provide a method for inexpensively manufacturing an electrical contact material that does not cause adhesive wear between contacts and can realize stable electrical connectivity. .
(課題を解決するための手段)
上記した目的を達成するために、本発明においては、銀
層で被覆された接点基材の前記銀層の表面にすすのめっ
き層を形成したのち、非酸化性雰囲気中で加熱して前記
銀層および前記すずめつき層間に拡散処理を施し、つい
で、引抜き加工または圧延加工を行なうことを特徴とす
る電気接点材料の製造方法が提供される。(Means for Solving the Problems) In order to achieve the above object, in the present invention, a soot plating layer is formed on the surface of the silver layer of a contact base material coated with a silver layer, and then a non-oxidized Provided is a method for producing an electrical contact material, which comprises heating in a neutral atmosphere to perform a diffusion treatment between the silver layer and the tinned layer, and then performing drawing or rolling.
まず、本発明方法が適用される接点基材の材料としては
、例えば、銅や各種の銅合金;鋼材、アルミニウム材の
ような材料の表面を銅または銅合金で被覆して成る複合
材料、または、ニッケルや鉄、もしくはこれらの合金;
などをあげることができる。First, the contact base material to which the method of the present invention is applied includes, for example, copper and various copper alloys; composite materials formed by coating the surface of materials such as steel and aluminum with copper or copper alloy; , nickel or iron, or their alloys;
etc. can be given.
接点基材の形状は、格別限定されるものではなく、例え
ば線材、条材、棒材、管材などをあげることができる。The shape of the contact base material is not particularly limited, and may be, for example, a wire, a strip, a bar, a tube, or the like.
この基材の表面は銀層で被覆される。銀層の形成方法と
しては、例えば、常用の電気めっき法やクラッド法であ
ればよい。また、銀層の厚みは、それが薄すぎると、わ
ずかな摩耗によっても基材が露出して接触抵抗が増大す
るので、通常は、0.5μm以上にすることが好ましい
。より好ましくは1〜10μmである。The surface of this substrate is coated with a silver layer. The silver layer may be formed by, for example, a commonly used electroplating method or a cladding method. Furthermore, if the thickness of the silver layer is too thin, the base material will be exposed even by slight wear and the contact resistance will increase, so it is usually preferable that the thickness of the silver layer be 0.5 μm or more. More preferably, it is 1 to 10 μm.
本発明においては、この銀層の上に、まず、すずのめっ
き層が例えば電気めっき法で形成される。In the present invention, a tin plating layer is first formed on the silver layer by, for example, electroplating.
このめっき層の厚みが薄すぎると、後述する拡散処理時
におけるAg−3n合金の生成量が少なくなって、凝着
摩耗の抑制効果が減退するので、その厚みは0.01μ
m以上であることが好ましい。If the thickness of this plating layer is too thin, the amount of Ag-3n alloy produced during the diffusion treatment described below will decrease, reducing the adhesive wear suppressing effect, so the thickness should be 0.01 μm.
It is preferable that it is more than m.
また、上記Ag−8n合金におけるSn量が1〜10重
量%となるように、Snの厚みおよび熱処理条件を選定
することが好ましい。Further, it is preferable to select the thickness of Sn and the heat treatment conditions so that the amount of Sn in the Ag-8n alloy is 1 to 10% by weight.
このようにしてすずのめっき層が形成されている材料は
、つぎに、非酸化性雰囲気中で加熱されこの処理を施す
ことにより、銀層の表面部分または銀層の全てとすずめ
つき層との間で拡散反応が起り、凝着摩耗の抑制効果を
発揮するAg−8nの合金が生成する。The material on which the tin plating layer is formed in this way is then heated in a non-oxidizing atmosphere and subjected to this treatment, thereby creating a gap between the surface part of the silver layer or all of the silver layer and the tin plating layer. A diffusion reaction takes place, producing an Ag-8n alloy that exhibits the effect of suppressing adhesive wear.
このときの非酸化性雰囲気としては、例えば、窒素、ア
ルゴン、水素などであればよい。また、加熱温度は、上
記合金を生成するために、概ね300℃以上であればよ
いが、その上限は、銀の融点以下にする。更に、処理時
間は、加熱温度によって変化させればよいが、概ね10
秒以上である。The non-oxidizing atmosphere at this time may be, for example, nitrogen, argon, hydrogen, or the like. Further, the heating temperature may be approximately 300° C. or higher in order to produce the above-mentioned alloy, but the upper limit thereof is set to be lower than the melting point of silver. Furthermore, the treatment time may be changed depending on the heating temperature, but it is approximately 10
More than seconds.
最外層がAg−5n合金になっているこの材料に、つぎ
に、引抜き加工(材料が線材、棒材、管材の場合)また
は圧延加工(材料が条材の場合)を施す。This material, whose outermost layer is made of Ag-5n alloy, is then subjected to drawing processing (if the material is a wire, bar, or tube) or rolling processing (if the material is a strip).
この加工処理によって、合金化した銀は加工硬化する。Through this processing, the alloyed silver is work hardened.
その結果、得られた材料の耐摩耗性が一層向上する。As a result, the wear resistance of the obtained material is further improved.
このときの加工率が低すぎると、上記加工硬化による耐
摩耗性の向上はあまり顕著に発現しないので、加工率は
3%以上にすることが好ましい。If the processing rate at this time is too low, the improvement in wear resistance due to work hardening will not be noticeable, so the processing rate is preferably 3% or more.
(発明の実施例)
実施例1〜9.比較例1〜3
厚み0.3mm、幅30mm、長さ100mmの黄銅板
に、アルカリ脱脂−水洗一酸洗一水洗の表面清浄化処理
を施し、その表面に銀のストライクめっきを施したのち
、電気めっき法により第1表で示した厚みの銀層、すず
めつき層を順次形成した。(Embodiments of the invention) Examples 1 to 9. Comparative Examples 1 to 3 A brass plate with a thickness of 0.3 mm, a width of 30 mm, and a length of 100 mm was subjected to a surface cleaning treatment of alkaline degreasing, water washing, pickling, and water washing, and silver strike plating was applied to the surface. A silver layer and a tinned layer having the thickness shown in Table 1 were successively formed by electroplating.
ついで、水洗したのち乾燥し、黄銅板を窒素雰囲気炉内
において第1表に示した条件下で拡散処理を行ない、更
に、第1表で示した加工率で圧延加工を行なった。Then, after washing with water and drying, the brass plate was subjected to a diffusion treatment in a nitrogen atmosphere furnace under the conditions shown in Table 1, and further subjected to rolling processing at the processing rate shown in Table 1.
得られた材料につき、下記の仕様で動摩擦係数と微動摩
耗接触抵抗を測定した。The coefficient of dynamic friction and micro-abrasion contact resistance of the obtained material were measured according to the following specifications.
動摩擦係数:ヘッド頭部半径5mnの銀棒、荷重Log
、摺動距離10mn、摺動回
数500回。Dynamic friction coefficient: Silver bar with head radius 5mm, load Log
, sliding distance 10mm, number of sliding 500 times.
微動摩耗接触抵抗:ヘッド頭部半径5mmの銀棒、荷重
50g、通電電流IA、摺動
距離0.1−1摺動回数20万回。Micro-movement abrasion contact resistance: Silver bar with head radius 5 mm, load 50 g, current IA, sliding distance 0.1-1, number of sliding 200,000 times.
以上の結果を一括して第1表に示した。The above results are collectively shown in Table 1.
(以下余白)
(発明の効果)
以上の説明で明らかなように、本発明方法で製造した材
料は、銀の凝着摩耗が抑制されていて、またその電気接
続性も良好かつ安定している。(The following is a blank space) (Effects of the invention) As is clear from the above explanation, the adhesive wear of silver is suppressed in the material produced by the method of the present invention, and its electrical connectivity is also good and stable. .
したがって、本発明方法は、高価な貴金属を使用するこ
となく優れた特性の電気接点材料を製造する方法として
、その工業的価値は極めて大である。Therefore, the method of the present invention has extremely great industrial value as a method for producing electrical contact materials with excellent characteristics without using expensive precious metals.
Claims (1)
っき層を形成したのち、非酸化性雰囲気中で加熱して前
記銀層および前記すずめっき層間に拡散処理を施し、つ
いで、引抜き加工または圧延加工を行なうことを特徴と
する電気接点材料の製造方法。After forming a tin plating layer on the surface of the silver layer of the contact base material coated with a silver layer, heating in a non-oxidizing atmosphere to perform a diffusion treatment between the silver layer and the tin plating layer, and then drawing. A method for producing an electrical contact material, which comprises processing or rolling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2286622A JPH04160200A (en) | 1990-10-24 | 1990-10-24 | Production of electric contact material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2286622A JPH04160200A (en) | 1990-10-24 | 1990-10-24 | Production of electric contact material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04160200A true JPH04160200A (en) | 1992-06-03 |
Family
ID=17706796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2286622A Pending JPH04160200A (en) | 1990-10-24 | 1990-10-24 | Production of electric contact material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04160200A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004030907A1 (en) * | 2002-10-02 | 2004-04-15 | Fcm Co., Ltd. | Laminate comprising silver layer and, formed thereon, layer for stabilizing the same |
JP2009263699A (en) * | 2008-04-23 | 2009-11-12 | Toyota Motor Corp | METHOD OF MANUFACTURING PLATED BASE MATERIAL HAVING Sn PLATED LAYER |
JP2010146925A (en) * | 2008-12-19 | 2010-07-01 | Furukawa Electric Co Ltd:The | Contactor material for electric motor and method of manufacturing the same |
JP2011017062A (en) * | 2009-07-10 | 2011-01-27 | Toyota Motor Corp | METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL |
WO2013042572A1 (en) * | 2011-09-20 | 2013-03-28 | Jx日鉱日石金属株式会社 | Metal material for electronic components and method for producing same |
US9580783B2 (en) | 2011-10-04 | 2017-02-28 | Jx Nippon Mining & Metals Corporation | Electronic component metal material and method for manufacturing the same |
US9728878B2 (en) | 2012-02-03 | 2017-08-08 | Jx Nippon Mining & Metals Corporation | Press-fit terminal and electronic component using the same |
RU2659509C1 (en) * | 2014-05-19 | 2018-07-02 | Ниссин Стил Ко., Лтд. | Connecting component material |
US10530084B2 (en) | 2012-06-27 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
US10594066B2 (en) | 2012-06-27 | 2020-03-17 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
-
1990
- 1990-10-24 JP JP2286622A patent/JPH04160200A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004030907A1 (en) * | 2002-10-02 | 2004-04-15 | Fcm Co., Ltd. | Laminate comprising silver layer and, formed thereon, layer for stabilizing the same |
JP2009263699A (en) * | 2008-04-23 | 2009-11-12 | Toyota Motor Corp | METHOD OF MANUFACTURING PLATED BASE MATERIAL HAVING Sn PLATED LAYER |
JP2010146925A (en) * | 2008-12-19 | 2010-07-01 | Furukawa Electric Co Ltd:The | Contactor material for electric motor and method of manufacturing the same |
JP2011017062A (en) * | 2009-07-10 | 2011-01-27 | Toyota Motor Corp | METHOD OF MANUFACTURING PLATED MATERIAL HAVING PLATED LAYER OF Sn OR Sn ALLOY, AND THE PLATED MATERIAL |
AU2012310742B2 (en) * | 2011-09-20 | 2015-05-14 | Jx Nippon Mining & Metals Corporation | Metal material for electronic components and method for producing same |
JP2013079439A (en) * | 2011-09-20 | 2013-05-02 | Jx Nippon Mining & Metals Corp | Metallic material for electronic component and method for producing the same |
WO2013042572A1 (en) * | 2011-09-20 | 2013-03-28 | Jx日鉱日石金属株式会社 | Metal material for electronic components and method for producing same |
US9576693B2 (en) | 2011-09-20 | 2017-02-21 | Jx Nippon Mining & Metals Corporation | Metal material for electronic component and method for manufacturing the same |
US9580783B2 (en) | 2011-10-04 | 2017-02-28 | Jx Nippon Mining & Metals Corporation | Electronic component metal material and method for manufacturing the same |
US9728878B2 (en) | 2012-02-03 | 2017-08-08 | Jx Nippon Mining & Metals Corporation | Press-fit terminal and electronic component using the same |
US10530084B2 (en) | 2012-06-27 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
US10594066B2 (en) | 2012-06-27 | 2020-03-17 | Jx Nippon Mining & Metals Corporation | Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same |
RU2659509C1 (en) * | 2014-05-19 | 2018-07-02 | Ниссин Стил Ко., Лтд. | Connecting component material |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2002317295A (en) | REFLOW TREATED Sn ALLOY PLATING MATERIAL AND FIT TYPE CONNECTING TERMINAL USING THE SAME | |
KR101058763B1 (en) | Whisker-Resistant Cu-Kn Alloy Heat Resistant Sn-Plated Strip | |
JPH04160200A (en) | Production of electric contact material | |
JPH11222659A (en) | Process for producing metal composite strip | |
JP2915623B2 (en) | Electrical contact material and its manufacturing method | |
JP2959872B2 (en) | Electrical contact material and its manufacturing method | |
JPH04160199A (en) | Production of electric contact material | |
JP3175381B2 (en) | Electrical contact material and its manufacturing method | |
JP2012049041A (en) | Silver coating material for movable contact component and method for manufacturing the same | |
JP3734961B2 (en) | Contact material and manufacturing method thereof | |
JP2009215632A (en) | Metallic material for electric contact component | |
JP2012140678A (en) | Plated member for preventing occurrence of whisker in bending part, electric electronic component using the same, method for producing plated member, and method for preventing occurrence of whisker in plated member | |
US5069979A (en) | Plated copper alloy material | |
JP5226032B2 (en) | Cu-Zn alloy heat resistant Sn plating strip with reduced whisker | |
JP2000030558A (en) | Electric contact material and its manufacture | |
JPH0520949A (en) | Electric contact point material and manufacture thereof | |
JPH0547252A (en) | Electric contact material and its manufacture | |
JPH08283963A (en) | Heat-resistant silver-coated composite and its production | |
JPS6372895A (en) | Production of parts for electronic and electrical equipment | |
JP2647656B2 (en) | Method of manufacturing contacts | |
JPH0365630B2 (en) | ||
JPH04356375A (en) | Electrode for spot welding | |
JPS5949651B2 (en) | Heat-resistant electrical conductor for wiring | |
JPH10177821A (en) | Electrical contact and its manufacturing method | |
JPH04329224A (en) | Electric contact material and manufacture thereof |