JPH04148542A - Handler apparatus - Google Patents

Abstract

PURPOSE:To facilitate joint of a handier apparatus and a test stage by keeping a measurement socket fitted tight into the socket gauge of the handier apparatus and by arranging a first test board provided with the measurement socket onto the test stage via a joint member equipped with up/down moving conductive pins to join it in an electric face contact with a second test board. CONSTITUTION:A DUT board 5 serving as the first test board provided with an IC socket 4 for setting a test IC is fitted tight into a socket gauge 3, and the IC socket 4 into the opening 2 of the socket gauge 3. On the other hand, the DUT board 5 is provided with a performance board 7 to connect the test IC electrically to a tester apparatus on the performance board 7 serving as the second board. A flock ring 8 so provided with a plurality of up/down moving conductive pins 10 including springs in both faces and in a face to contact the performance board 7. In face contact of the DUT board 5 and the performance board 7, these pogo pins 10 arranged corresponding to both faces are electrically connected.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Field of Application) The present invention relates to a handler device for setting an integrated circuit to be tested in a test state, and in particular to a handler device with improved connectivity with a test stage. Regarding.

(Prior Art) Conventionally, when testing an integrated circuit using a handler device, it is necessary to connect a test stage (test head box) electrically connected to the test device to the handler device.

Specifically, an IC socket provided on a first test board (DUT board) fixedly disposed on the test stage via a second test board (performance board) is installed on the handler device side. The handler device and the inspection stage were joined together by fitting a socket gauge for regulating the IC socket.

In such a joint structure, the socket gauge provided on the handler device side is connected to the socket gauge provided on the inspection stage side.
In order to regulate the C socket, it was formed to match the dimensions of the corresponding IC socket, and the IC socket was closely fitted.

(Problems to be Solved by the Invention) As explained above, in the conventional joint structure between the handler device and the inspection stage, there is no dimensional margin between the IC socket and the socket gauge, so stress is applied to both. It takes a lot of time and skill to closely fit the two together without causing any cracks, and a lot of time is spent joining the handler device body and the inspection stage.

Furthermore, if the integrated circuit under test is set in the IC socket while the IC socket is forcibly fitted into the socket gauge and stress is generated on both, the envelope of the integrated circuit under test may be damaged and There was also a risk of damage to the device itself.

Furthermore, in the above-mentioned state, the stress generated in the IC socket may affect the first and second test boards, leading to poor bonding.

Therefore, the present invention has been made in view of the above, and its purpose is to shorten the joining time by using a container to join the handler device and the inspection stage, and to reduce the joining time. By reducing the stress of
It is an object of the present invention to provide a handler device that can prevent poor bonding and damage to the device and the integrated circuit to be tested.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method in which a first test board equipped with a measurement socket into which an integrated circuit to be tested is set is tightly fitted into a socket gauge of a controller device. The first inspection board and the second inspection board, which are fixedly arranged on the inspection stage, have a plurality of conductive pins protruding from both sides that move up and down. The pin is connected to the first through a connecting member fixedly disposed on the inspection board.
The gist is that the test board is electrically connected to the test board and the second test board so as to be in surface contact with each other.

(Function) In the above configuration, the present invention has the first inspection board fixedly disposed on the handler device, so that the measurement socket of the first inspection board is tightly fitted in advance to the socket gauge of the handler device, By connecting the first inspection board to the v1!2 inspection board via a joining member, the handler device is connected to the inspection stage.

(Example) Hereinafter, the present invention will be explained in detail using the drawings.

FIG. 1 is a diagram showing a joint structure between a handler device and a test stage according to an embodiment of the present invention.

In FIG. 1, a handler device 1 is provided with a socket gauge 3 in which an opening 2 into which an IC socket is tightly fitted is formed. The socket gauge 3 has a DUT board 5 which is a first test board on which an IC socket 4 in which an integrated circuit to be tested is set is arranged, and the IC socket 4 is tightly fitted into the opening 2 of the socket gauge 3. It is fixed by the fixing jig 6 in such a manner as to be fixed.

On the other hand, the performance port 7, which is fixed to the test stage side and serves as a second test board, has a joint for joining the DUT board 5 and the performance port 7 to electrically connect the integrated circuit under test to the tester device. A member (hereinafter referred to as a "flock ring") 8 is attached by a fixing jig 9.

The flock ring 8 has a plurality of conductive pins (hereinafter referred to as "pogo pins") 10 that contain springs and move up and down on both sides, that is, the surface that contacts the CUT board 5 and the surface that contacts the performance port 7. It is arranged. This pogo pin 1o has a contact surface with the DUT board 5 and the performance port 7 having a predetermined area, and makes surface contact with the CUT board 5 and the performance port 7. In addition, this boco pin 10 is in a state where pins arranged corresponding to both sides are electrically connected, and when the DUT board 5 and the performance port 7 are joined via the flock ring 8, the DUT The board 5 and performance port 7 are electrically connected.

In such a configuration, as shown in FIG.
The board 5 is fixedly disposed on the socket gauge 3, the flock ring 8 is fixedly disposed on the performance port 7, and the flock ring 8 is fixedly disposed on the test stage 11.

In this state, the test stage 11 is raised to join the test stage 11 connected to the handler device 1 and the tester device (not shown).

Specifically, the test stage 11 is raised and the guide pin 12 provided on the upper surface of the flock ring 8 is connected to the DUT.
The board 5 is inserted into a guide hole 13 provided in correspondence with the guide pin 12. At this time, the guide pin 12 and the guide hole 13 are aligned with each other because the guide pin 12 and the guide hole 13 have a large margin for alignment compared to the dimensional margin between the conventional socket gauge and the IC socket. can be easily inserted into the guide hole 13.

This makes joining the handler device and the tester device much easier than in the past, making it possible to significantly shorten the setting time.

In this way, the DUT board 5 is connected through the flock ring 8.
When connecting the DUT board 5 and the performance port 7, the DUT board 5 fixed to the handler device 1 and the test stage 11
The plane direction (X
-Y direction) can be absorbed by the pogo pins 10 as long as it is within the area of the contact surfaces of the pogo pins 10 provided on both sides of the flock ring 8.

This allows DUT board 5 and performance board 7 to
Even if there is some deviation in the plane direction, the pogo pins 10 can reliably join the two.

In addition, the vertical misalignment between the DUT board 5 and the performance port 7, that is, the non-parallelism between the two boards,
If the pogo pin 10 is within the vertical movement range, the pogo pin 10
can be absorbed by. This allows D.U.
Even if there is some vertical deviation between the T-board 5 and the performance board 7, they can be reliably joined by the pogo pins 10.

Therefore, poor connection between the handler device and the tester device is significantly reduced compared to the conventional method, and test efficiency can be improved.

In addition, since the DUT board 5 and the performance board 7 are bonded via the flock ring 8, the flock ring 8 absorbs and alleviates the stress generated during bonding, preventing damage to the equipment and inspection board, etc. It becomes possible to suppress bonding defects.

It should be noted that the socket gauge 3, DUT board 5, flock ring 8, and performance port 7 are replaced and arranged in accordance with the integrated circuit to be tested.

〔Effect of the invention〕

As explained above, according to the present invention, the measurement socket is closely fitted in advance to the socket gauge of the handler device, and the first inspection board provided with the measurement socket is equipped with a conductive pin that is movable up and down. Since the joint is electrically surface-contacted with the second test board disposed on the test stage via the joint member, the test stage connected to the tester device and the handler device can be joined easily and easily. This makes it possible to perform the bonding reliably and shorten the bonding time. Furthermore, the stress applied to the handler device and the test board during bonding is alleviated, making it possible to prevent bonding failures and damage to the device and the integrated circuit to be tested.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a configuration when a handler device according to an embodiment of the present invention is joined to an inspection stage, and FIG.
It is a figure which shows the state of joining a handler apparatus and an inspection stage by the structure shown in a figure. 1... Handler device 3... Socket gauge 4... IC socket 5... DUT board 7... Performance port 10...・Pogo pin 11... Inspection stage 12... Guide pin 13... Guide hole

Claims (1)

[Claims] A first test board provided with a measurement socket into which an integrated circuit to be tested is set is closely fitted and fixed to a socket gauge of a handler device, and fixedly arranged to the first test board and the test stage. The second inspection board is connected to the first inspection board via a joining member having a plurality of vertically movable conductive pins protruding from both sides and fixedly disposed on the second inspection board. A handler device, characterized in that it is electrically connected to the second inspection board so as to be in surface contact with the second inspection board.