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JPH04129287A - Enameled substrate with screwed part - Google Patents

Enameled substrate with screwed part

Info

Publication number
JPH04129287A
JPH04129287A JP24862790A JP24862790A JPH04129287A JP H04129287 A JPH04129287 A JP H04129287A JP 24862790 A JP24862790 A JP 24862790A JP 24862790 A JP24862790 A JP 24862790A JP H04129287 A JPH04129287 A JP H04129287A
Authority
JP
Japan
Prior art keywords
enamel
substrate
enameled
groove
screwed part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24862790A
Other languages
Japanese (ja)
Inventor
Hitoshi Okuyama
奥山 等
Kiyoshi Yajima
矢島 喜代志
Takao Suzuki
孝雄 鈴木
Masanori Itou
政律 伊藤
Kenichi Uruga
謙一 宇留賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP24862790A priority Critical patent/JPH04129287A/en
Publication of JPH04129287A publication Critical patent/JPH04129287A/en
Pending legal-status Critical Current

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  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To avoid an accident such as cut of a circuit by providing a screwed part having a groove having no enameled layer for isolating from each other between a conductor circuit region of an enameled substrate and the screwed part of the substrate. CONSTITUTION:Threaded holes 4 are formed at both ends of an enameled substrate 1. A groove 6 is so formed by cutting an enameled layer of the part by sand-blasting as to isolate the conductor circuit region 2 of the substrate 1 and a screwed part 7. Thus, a crack 8 in the enamel due to screw clamping does not affect the circuit part and safety and the circuit part is assured.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はネジ止め部を有するホウロウ基板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an enameled substrate having a screwed portion.

更に詳しくは、ネジ止め部をネジ締めしても、回路に影
響しないホウロウ基板に関する。
More specifically, the present invention relates to an enamel board that does not affect the circuit even if the screw-fastening portion is tightened.

〔従来の技術〕[Conventional technology]

従来は、メタルコアにネジ止め用の孔を穿った場合にも
、全体について施釉してホウロウを付け、この基板に導
体回路を形成することが行われていた。
Conventionally, even when a hole for screwing is bored in a metal core, the entire board is glazed and enameled, and a conductive circuit is formed on this board.

このネジ止め用の孔を有するホウロウ基板を筐体等に、
その孔を利用してネジ止めする場合、強くネジを締める
とホウロウにクラックが入り、このクラックが伝播して
近接している回路を切断してしまうという問題があった
Place this enamel board with holes for screws into the casing, etc.
When using these holes to fasten with screws, there was a problem in that if the screws were tightened too strongly, cracks would form in the enamel, and these cracks would propagate and cut off adjacent circuits.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

本発明の目的はネジ止め部を有するホウロウ基板におい
て、基板を他の支持体にネジ止めする場合に、ネジを締
めて、その周辺にホウロウ層のクラックを生じても、導
体回路に影響を及ぼさないホウロウ基板を提供すること
である。
An object of the present invention is to provide an enameled board with a screw-fastening part, so that when the board is screwed to another support, even if cracks occur in the enamel layer around the screws when the screws are tightened, the conductor circuit will not be affected. Our goal is to provide a non-enamel substrate.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、ホウロウ基板の導体回路領域と、ホウロウ基
板のネジ止め部分との間に相互を隔離するホウロウ層の
ない溝を有するネジ止め部を有するホウロウ基板で゛あ
る。
The present invention is an enameled substrate having a screw fixing portion having a groove without an enameled layer separating the conductor circuit region of the enameled substrate and the screw fixing portion of the enameled substrate from each other.

ホウロウ層のない溝を形成させる方法としては、ネジ止
め用孔を取り囲んだ周囲又は導体回路領域とネジ止め用
孔部分との境界線に1關幅前後の溝を設定し、この部分
のホウロウ層をサンドブラスト等の手段又は機械的切削
手段によりホウロウ層を削り落とすか、又は前処理済み
のメタルコアの溝形成予定部分にNiペーストを印刷す
るか又は部分Niメツキを施すかして、ホウロウフリッ
トを電着、焼成すると、Ni層を形成した部分には、ホ
ウロウが付かないので、ホウロウ層のない溝を形成する
ことができる。
A method of forming a groove without an enamel layer is to set a groove about one inch wide around the screw hole or on the boundary line between the conductor circuit area and the screw hole, and then remove the enamel layer in this area. The enamel frit is electrocuted by scraping off the enamel layer by means such as sandblasting or mechanical cutting, or by printing Ni paste on the pretreated metal core where the grooves are to be formed, or by applying partial Ni plating. When deposited and fired, no enamel is attached to the portion where the Ni layer is formed, so it is possible to form a groove without an enamel layer.

このように構成することによって、ネジ止め部分で強く
締めて孔の周囲にホウロウ層のクラックを生じても、そ
のクラックの伝播がホウロウ層のない溝の部分でくいと
められ、導体回路領域には及ばないため、回路の切断な
どの事故を回避することができる。
With this configuration, even if a crack occurs in the enamel layer around the hole due to strong tightening at the screwed part, the propagation of the crack will be stopped in the groove part where there is no enamel layer, and the conductor circuit area will be prevented from propagating. Therefore, accidents such as circuit breakage can be avoided.

〔実施例〕〔Example〕

以下に実施例によって、本発明を更に具体的に説明する
が、本発明は、この実施例によって同等限定されるもの
ではない。
EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to the same extent by these Examples.

図面について説明する。第1図は導体回路領域とネジ止
め部分との間にホウロウ層のない隔離溝を設けたホウロ
ウ基板をベース支持体にネジ止めした断面立面図を示す
The drawings will be explained. FIG. 1 shows a cross-sectional elevation view of an enameled substrate with an isolation groove without an enameled layer between the conductor circuit area and the screwed part, screwed to a base support.

第2図は、該隔離溝を設けたホウロウ基板の一部の平面
図である。
FIG. 2 is a plan view of a portion of the enamel substrate provided with the isolation groove.

1はホウロウ基板、2は導体回路領域、3は導体回路、
4はネジ止め用孔、5はネジ、6は隔離溝、7は基板の
ネジ止め部分、8はネジ締め時に発生したクラック、9
はホウロウ基板を取り付けるベース支持体である。
1 is an enamel substrate, 2 is a conductor circuit area, 3 is a conductor circuit,
4 is a hole for screw fixing, 5 is a screw, 6 is an isolation groove, 7 is a screw fixing part of the board, 8 is a crack that occurs when tightening a screw, 9
is the base support to which the enamel substrate is attached.

〔実施例1〕 35■l×67鰭X0.8m+*tのホウロウ基板の両
端部にM3ネジ孔2個を設けである。このホウロウ基板
の導体回路領域とネジ止め部分とを隔離するように、1
mI幅×35關長さの溝2本を、この部分のホウロウ層
をサンドブラストで削りおとして形成した。
[Example 1] Two M3 screw holes were provided at both ends of an enamel substrate measuring 35 μl×67 fins×0.8 m+*t. 1 so as to isolate the conductive circuit area of this enamel board from the screwed part.
Two grooves each having a width of mI and a length of 35 mm were formed by sandblasting the enamel layer in this area.

このM3ネジを6kg−(7)のトルクで締付けたとこ
ろ、ワッシャーの下、ネジ止め部分のホウロウ層にクラ
ックが発生した。
When this M3 screw was tightened with a torque of 6 kg-(7), a crack occurred in the enamel layer of the screwed part under the washer.

しかし、このクラックも溝部でくいとめられ、中央の回
路部にはクラックは発生しなかった。
However, this crack was also stopped by the groove, and no crack occurred in the central circuit section.

〔実施例2〕 前処理済のコア鉄板にネジ止め用孔を穿ち、この孔と回
路領域を隔離するように溝部を予定し、この溝が必要な
所に部分Niメツキを施し、その後ホウロウフリットを
電着し、焼成した。Niメツキ上にはホウロウが付かな
いため、ホウロウ層のない溝部を形成することができた
。実施例1と同様にM3ネジを6kg−■のトルクにて
締付けたところ、ワッシャーの下、ネジ止め部分のホウ
ロウ層にはり→ツクが発生したが、中央の回路部にはク
ラックの発生はなかった。
[Example 2] Holes for screw fixing were drilled in a pretreated core iron plate, a groove was planned to separate the hole from the circuit area, Ni plating was applied partially where the groove was needed, and then enamel frit was applied. was electrodeposited and fired. Since no enamel was formed on the Ni plating, it was possible to form a groove without an enamel layer. When the M3 screws were tightened to a torque of 6 kg-■ in the same manner as in Example 1, a crack appeared in the enamel layer under the washer where the screws were fixed, but no cracks occurred in the central circuit section. Ta.

〔発明の効果〕〔Effect of the invention〕

本発明のホウロウ基板は導体回路部とネジ止め部分とを
隔てる溝が有るので、ネジ締めによるホウロウのクラッ
クが回路部に影響することがなく、回路部の安全を確保
できる。
Since the enamel board of the present invention has a groove separating the conductor circuit part and the screwed part, cracks in the enamel caused by screw tightening do not affect the circuit part, and the safety of the circuit part can be ensured.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は隔離溝を設けたホウロウ基板の断面立面図であ
る。 第2図は第1図の平面図である。 1・・・ホウロウ基板、2・・・導体回路領域、3・・
・導体回路、4・・・ネジ止め用孔、5・・・ネジ、6
・・・隔離溝、7・・・ネジ止め部分、8・・・クラッ
ク。
FIG. 1 is a cross-sectional elevational view of an enamel substrate provided with isolation grooves. FIG. 2 is a plan view of FIG. 1. 1... Enamel board, 2... Conductor circuit area, 3...
・Conductor circuit, 4... Screw fixing hole, 5... Screw, 6
...Isolation groove, 7...Screwed part, 8...Crack.

Claims (1)

【特許請求の範囲】[Claims] ホウロウ基板の導体回路領域とホウロウ基板のネジ止め
部分との間に相互を隔離するホウロウ層のない溝を有す
るネジ止め部を有するホウロウ基板。
An enamel substrate having a screw fixing part having a groove without an enamel layer separating the conductive circuit area of the enamel substrate and the screw fixing part of the enamel substrate from each other.
JP24862790A 1990-09-20 1990-09-20 Enameled substrate with screwed part Pending JPH04129287A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24862790A JPH04129287A (en) 1990-09-20 1990-09-20 Enameled substrate with screwed part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24862790A JPH04129287A (en) 1990-09-20 1990-09-20 Enameled substrate with screwed part

Publications (1)

Publication Number Publication Date
JPH04129287A true JPH04129287A (en) 1992-04-30

Family

ID=17180929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24862790A Pending JPH04129287A (en) 1990-09-20 1990-09-20 Enameled substrate with screwed part

Country Status (1)

Country Link
JP (1) JPH04129287A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366027A (en) * 1991-07-19 1994-11-22 Poly Circuits, Inc. Circuit board having a bonded metal support
WO2006132222A1 (en) 2005-06-07 2006-12-14 Fujikura Ltd. Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
JP2010034346A (en) * 2008-07-30 2010-02-12 Sanyo Electric Co Ltd Circuit device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366027A (en) * 1991-07-19 1994-11-22 Poly Circuits, Inc. Circuit board having a bonded metal support
US5432303A (en) * 1991-07-19 1995-07-11 Poly Circuits, Inc. Conductive adhesive for use in a circuit board
WO2006132222A1 (en) 2005-06-07 2006-12-14 Fujikura Ltd. Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
JP2010034346A (en) * 2008-07-30 2010-02-12 Sanyo Electric Co Ltd Circuit device

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