JPH04101841A - release film - Google Patents
release filmInfo
- Publication number
- JPH04101841A JPH04101841A JP22068390A JP22068390A JPH04101841A JP H04101841 A JPH04101841 A JP H04101841A JP 22068390 A JP22068390 A JP 22068390A JP 22068390 A JP22068390 A JP 22068390A JP H04101841 A JPH04101841 A JP H04101841A
- Authority
- JP
- Japan
- Prior art keywords
- film
- methyl
- pentene
- poly
- paper sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 31
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 230000003746 surface roughness Effects 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- -1 silicone oil Chemical compound 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011269 tar Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
発明の技術分野
本発明は、離型フィルムに関し、さらに詳しくは、多局
プリント回路基板の外装板などを形成する際に用いられ
る離型フィルムに関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a mold release film, and more particularly to a mold release film used in forming an exterior plate of a multi-channel printed circuit board.
発明の技術的背景
近年、電子機器の小型・多機能化が要望され、これに伴
い、多層プリント回路基板を電子機器に実装することに
より、電子機器の小型化が図られている。TECHNICAL BACKGROUND OF THE INVENTION In recent years, there has been a demand for electronic devices to be smaller and more multifunctional, and in accordance with this demand, electronic devices are being made smaller by mounting multilayer printed circuit boards on them.
この多層プリント回路基板は、たとえば第５図に示すよ
うに、２枚の外装板１１．１１の間にエポキシ硬化層１
２およびプリント回路１３が交互に積層された構造とな
っている。This multilayer printed circuit board has an epoxy hardened layer 1 between two outer panels 11 and 11, as shown in FIG.
2 and printed circuits 13 are alternately stacked.
上記の外装板１１は、通常、銅箔１１ａと、この銅箔１
１ａ上に設けられた樹脂層１１ｂとからなり、この樹脂
層１１ｂは、銅箔１１ａ上に外装板樹脂層形成用プリプ
レグ（フェノール樹脂、エポキシ樹脂あるいはポリエス
テル樹脂などのベース樹脂にガラス繊維などを配合した
シート状接着材）を積層し、これを硬化することにより
製造されている。The above-mentioned exterior plate 11 usually includes a copper foil 11a and a copper foil 1.
This resin layer 11b consists of a prepreg for forming an exterior plate resin layer (a base resin such as phenol resin, epoxy resin, or polyester resin mixed with glass fiber, etc.) on the copper foil 11a. It is manufactured by laminating sheets of adhesive material and curing them.
そして、多層プリント回路基板は、上記のような外装板
１１の樹脂層１１ｂと、エポキシプリプレグ２０と、プ
リント回路１３と、エポキシプリプレグ２０とを、第６
図に示すように積層し、この積層体を２枚の治具２１で
挟み、クツション材２２をプレス熱板２３とそれぞれの
治具２１の間に入れて２枚のプレス熱板２３で加熱しな
がら加圧してエポキシプリプレグ２０を硬化させて一体
化し、次いで得られた積層体に穴を開け、このスルーホ
ール部分にめっきを行なうなどした後に表面をエツチン
グすることによって製造されている。Then, the multilayer printed circuit board includes the resin layer 11b of the exterior board 11 as described above, the epoxy prepreg 20, the printed circuit 13, and the epoxy prepreg 20.
Laminated as shown in the figure, this laminate is sandwiched between two jigs 21, and the cushion material 22 is placed between the press hot plate 23 and each jig 21 and heated by the two press hot plates 23. It is manufactured by applying pressure to harden the epoxy prepreg 20 and integrating it, then drilling holes in the resulting laminate, plating the through-hole portions, and etching the surface.
このようにして多層プリント回路基板を製造するに際し
ては、外装板１１の樹脂層１１ｂは、エポキシプリプレ
グ２０が硬化して得られるエポキシ硬化層１２との接着
性を高めるため、その表面が粗面化されていることが望
ましい。When manufacturing a multilayer printed circuit board in this way, the surface of the resin layer 11b of the exterior board 11 is roughened in order to improve adhesion to the epoxy cured layer 12 obtained by curing the epoxy prepreg 20. It is desirable that the
このため、従来より、樹脂層１１ｂを形成するための外
装板樹脂層形成用プリプレグの表面に、加熱状態におい
ても粗面状態を保ち得るフィルムなどを押当てて加熱し
、樹脂層１１ｂの表面を粗面化していた。For this reason, conventionally, the surface of the resin layer 11b is heated by pressing a film or the like that can maintain a rough surface state even in a heated state onto the surface of the prepreg for forming the resin layer of the exterior plate for forming the resin layer 11b. The surface had become rough.
ところで、従来、このようにして樹脂層１１ｂの表面を
粗面化するためのフィルムとして、テトラ（Ｔｅ＋Ｉｌ
ａ＋）の商品名で知られる米国デュポン社製の二軸延伸
ｌ−フッ化ビニルポリマーフィルム（以下、テドラフィ
ルムと呼ぶ：ＣａＣｏ３を５％含有）、あるいはトリア
セチルセルロースフィルムの表面をサンドブラストで粗
化したマットフィルムなどが知られ、外装板の樹脂層表
面を粗面化するために使用されている。By the way, conventionally, as a film for roughening the surface of the resin layer 11b in this way, tetra (Te+Il) has been used.
The surface of a biaxially oriented l-fluorinated vinyl polymer film (hereinafter referred to as Tedra film, containing 5% CaCo3) manufactured by DuPont, USA, known under the trade name of a+), or a triacetyl cellulose film was roughened by sandblasting. Matte films are known and are used to roughen the surface of the resin layer of exterior panels.
しかし、これら従来のマットフィルムを外装板樹脂層形
成用プリプレグと接して加圧加熱し、表面が粗面化され
た樹脂層を有する外装板を製造しようとすると、フィル
ムに含まれるＣ ａ ＣＯｓなどの充填剤、あるいは充
填剤の分散剤成分がフィルムと接触していた樹脂層、銅
板に移行し、この外装板を用いて製造された多層プリン
ト回路基板の性能を低下させることがある。However, when these conventional matte films are pressed and heated in contact with a prepreg for forming an exterior plate resin layer to produce an exterior plate having a resin layer with a roughened surface, C a COs etc. contained in the film are removed. The filler or the dispersant component of the filler may migrate to the resin layer or copper plate that was in contact with the film, reducing the performance of the multilayer printed circuit board manufactured using this exterior plate.
そこで本発明者らは、特開昭６２−３２０３１号公報に
おいて、上記のような問題点を解決するマット−フィル
ムとして、表面が粗面化されたポリ４−メチル−１−ペ
ンテンフィルムを提案した。Therefore, the present inventors proposed a poly-4-methyl-1-pentene film with a roughened surface as a matte film to solve the above-mentioned problems in JP-A No. 62-32031. .
しかしながら、このポリ４−メチル−１−ペンテンフィ
ルム製マットフィルムを外装板樹脂層形成用プリプレグ
と圧接加熱して外装板１１の樹脂層１１ｂの表面を粗面
化すると、圧接加熱中に膨張して皺が形成されたり、あ
るいはポリ４−メチル−１−ペンテンフィルムの軟化に
よりエンボス目が潰れたりして、外装板１１の樹脂層１
１ｂの表面を粗面化することができなくなる場合がある
。However, when this matte film made of poly-4-methyl-1-pentene film is pressed and heated with the prepreg for forming the resin layer of the exterior plate to roughen the surface of the resin layer 11b of the exterior plate 11, it expands during the pressure and heating. The resin layer 1 of the exterior plate 11 may be wrinkled or the embossed eyes may be crushed due to the softening of the poly-4-methyl-1-pentene film.
It may become impossible to roughen the surface of 1b.
従って、上述したような圧接加熱中に皺が形成されたり
、あるいはエンボス目が潰れたりすることがなく、離型
性に優れた硬質粗面を有するマットフィルムが望まれて
いる。Therefore, there is a demand for a matte film that does not form wrinkles or collapse the embossed lines during pressure heating as described above, and has a hard rough surface with excellent mold releasability.
発明の目的
本発明は、上記事情に鑑みなされたもので、離型性が良
好であって、外装板樹脂層形成用プリプレグと加圧加熱
状態で接触させてプリプレグを硬化させることにより、
表面が粗面化された外装板の樹脂層を形成することがで
き、しがも、このような粗面を形成する際にエンボス目
が潰れたり、あるいは皺が形成されたりすることがない
ような離型フィルムを提供することを目的としている。Purpose of the Invention The present invention has been made in view of the above circumstances, and has good mold releasability, and by bringing the prepreg into contact with a prepreg for forming an exterior plate resin layer under pressure and heating to cure the prepreg,
It is possible to form the resin layer of the exterior plate with a roughened surface, but it is possible to prevent the embossed eyes from being crushed or wrinkles to form when forming such a rough surface. The purpose is to provide a release film that is
発明の概要
本発明のマットフィルムは、平均表面粗さＲ２が２〜２
０μｍの粗面である紙シートの上に、厚さ１０〜５０）
μｍのポリ−４−メチル−１−ペンテンフィルムが積層
されてなることを特徴としている。Summary of the invention The matte film of the present invention has an average surface roughness R2 of 2 to 2.
10 to 50 mm thick on a paper sheet with a rough surface of 0 μm)
It is characterized by being laminated with poly-4-methyl-1-pentene films of μm.
発明の詳細な説明
以下、本発明に係る離型フィルムについて具体的に説明
する。Detailed Description of the Invention The release film according to the present invention will be specifically described below.
本発明に係る離型フィルムは、平均表面粗さＲ８が２〜
２０μｍである紙シート上に、厚さ１０〜５０μｍのポ
リ−４−メチル−１−ペンテンフィルムが積層されてい
る。The release film according to the present invention has an average surface roughness R8 of 2 to
A poly-4-methyl-1-pentene film having a thickness of 10 to 50 μm is laminated on a paper sheet having a thickness of 20 μm.
このような離型フィルムは、第１図に示すように紙シー
ト１の片面にポリ−４−メチル用−ペンテンフィルム２
が積層されているが、あるいは第２図に示すように紙シ
ート１の両面にポリ−４−メチル−１−ペンテンフィル
ム２が積層されている。As shown in FIG. 1, such a release film includes a poly-4-methyl-pentene film 2 on one side of a paper sheet 1.
Alternatively, as shown in FIG. 2, poly-4-methyl-1-pentene films 2 are laminated on both sides of the paper sheet 1.
ここで紙シート１のポリ−４−メチル−１−ペンテンフ
ィルムが積層される面は、その平均表面粗さＲ８が２〜
２０μｍ１好ましくは３〜１０μｍである。Here, the surface of the paper sheet 1 on which the poly-4-methyl-1-pentene film is laminated has an average surface roughness R8 of 2 to
20 μm, preferably 3 to 10 μm.
本発明においては、どのような紙シートでも使用するこ
とができ、たとえば紙シート１中にフレ、カオリンなど
の充填剤、サイズ剤などが含有されていてもよい。In the present invention, any paper sheet can be used, and for example, the paper sheet 1 may contain fillers such as fillers, kaolin, and sizing agents.
本発明において使用されるポリ−４−メチル−ｌ−ペン
テンフィルムは、４−メチル−１−ペンテンの単独重合
体からなっていてもよく、また、４−メチル−１−ペン
テンと他のα−オレフィン、好ましくは炭素数２〜２０
を有するα−オレフィン、例えばエチレン、プロピレン
、１−ブテン、１−ヘキセン、１−オクテン、１−デセ
ン、１−テトラデセン、１−オクタデセンなどとの共重
合体からなっていてもよく、この場合には４−メチル−
１−ペンテンから導かれる構成単位が８５モル％以上の
量で存在していることが望ましい。The poly-4-methyl-1-pentene film used in the present invention may be composed of a homopolymer of 4-methyl-1-pentene, or may be composed of a homopolymer of 4-methyl-1-pentene and other α- Olefin, preferably carbon number 2-20
It may also consist of a copolymer with an α-olefin having a is 4-methyl-
It is desirable that the structural unit derived from 1-pentene be present in an amount of 85 mol% or more.
このようなポリ−４−メチル−１−ペンテンでは、荷重
５ｋｇ、温度２６０℃の条件下で測定されるメルトフロ
ーレートが０．５〜２５０ｇ／１０分の範囲にあること
が好ましく、メルトフローレートがこのような範囲にあ
ると、フィルム成形性および得られたフィルムの機械的
強度が優れている。For such poly-4-methyl-1-pentene, it is preferable that the melt flow rate measured under the conditions of a load of 5 kg and a temperature of 260°C is in the range of 0.5 to 250 g/10 minutes. When it is within this range, film formability and mechanical strength of the obtained film are excellent.
また、ポリ−４−メチル−１−ペンテンフィルム２は、
ポリ−４−メチル−１−ペンテンのみから形成すること
ができるが、ポリ−４−メチル−１−ペンテン中に引張
り強度を低下させない程度に少量のＣａ ＣＯ、Ｂ ａ
Ｓ Ｏｓ シリカ、マイカ、タルりなどの充填剤、シ
リコンオイルなどの離型剤あるいは耐熱安定化剤、耐候
安定化剤、防錆剤、帯電防止剤などの１種または２種以
上の添加剤が配合されていてもよい。なお、上記充填剤
、離型剤がポリ−４−メチル−１−ペンテン中に配合さ
れている場合には、充填剤の配合量は３０重量％以下、
離型剤の配合量は約６重量％以下であることが好ましい
。Moreover, the poly-4-methyl-1-pentene film 2 is
Although it can be formed only from poly-4-methyl-1-pentene, a small amount of Ca CO, B a is added to the poly-4-methyl-1-pentene to the extent that the tensile strength is not reduced.
S Os Fillers such as silica, mica, and tar, mold release agents such as silicone oil, and one or more additives such as heat stabilizers, weather stabilizers, rust preventives, and antistatic agents. It may be blended. In addition, when the above-mentioned filler and mold release agent are blended into poly-4-methyl-1-pentene, the blending amount of the filler is 30% by weight or less,
The amount of mold release agent blended is preferably about 6% by weight or less.
さらに、ポリ−４−メチル−１−ペンテンフィルム２は
、延伸、好ましくは一軸延伸されていることが望ましい
。この際の延伸倍率は、２〜６倍、好ましくは３〜５倍
程度であることが望ましい。Furthermore, it is desirable that the poly-4-methyl-1-pentene film 2 be stretched, preferably uniaxially stretched. The stretching ratio at this time is desirably about 2 to 6 times, preferably about 3 to 5 times.
また、このポリ−４−メチル−１−ペンテンフィルム２
の厚さは、１０〜５０μｍ１好ましくは２０〜４０μｍ
であることが望ましい。In addition, this poly-4-methyl-1-pentene film 2
The thickness is 10 to 50 μm, preferably 20 to 40 μm
It is desirable that
上述した第１図および第２図に示される離型フィルムは
、例えば以下に示す方法によって製造することができる
。The release film shown in FIGS. 1 and 2 described above can be manufactured, for example, by the method shown below.
第３図に示すように、まず、ローラー３．３などの搬送
手段でロール状の紙シート１をその長手方向に走行させ
る。As shown in FIG. 3, first, the roll-shaped paper sheet 1 is run in its longitudinal direction by means of conveying means such as rollers 3.3.
次いで、紙シート１の上部に配設されたラミネーター４
のスリット状の開口部４ａから溶融したポリ−４−メチ
ル−１−ペンテン５を紙シート１上に押出して、紙シー
ト１上にポリ−４−メチル−１−ペンテンフィルム２を
積層する。Next, a laminator 4 placed on top of the paper sheet 1
The molten poly-4-methyl-1-pentene 5 is extruded onto the paper sheet 1 through the slit-shaped opening 4a, and the poly-4-methyl-1-pentene film 2 is laminated on the paper sheet 1.
離型フィルムの製造方法２
第４図に示すように、ローラー３．３などの搬送手段で
ロール状の紙シート１をその長手方向に走行させる。Method 2 for producing a release film As shown in FIG. 4, a roll-shaped paper sheet 1 is run in its longitudinal direction by a conveying means such as a roller 3.3.
次いで、紙シート１の片面に接着剤７を塗布し、この紙
シート１の片面にポリ−４−メチル−１−ペンテンフィ
ルム２を圧接する。Next, an adhesive 7 is applied to one side of the paper sheet 1, and a poly-4-methyl-1-pentene film 2 is pressed onto one side of the paper sheet 1.
発明の効果
本発明に係る離型フィルムにおけるポリ−４−メチル−
１−ペンテンフィルムをプリプレグに接して加圧加熱す
ると、このポリ−４−メチル−１−ペンテンフィルムを
通して紙シートの粗面がプリプレグに転写され、プリプ
レグが硬化して形成された樹脂層表面に良好なエンボス
が形成される。Effects of the invention Poly-4-methyl- in the release film according to the invention
When the 1-pentene film is pressed and heated in contact with the prepreg, the rough surface of the paper sheet is transferred to the prepreg through the poly-4-methyl-1-pentene film, and the prepreg hardens and forms a good layer on the surface of the resin layer. An embossment is formed.
そしてこの紙シートの粗面は、このような加圧加熱によ
って型部れしない。The rough surface of this paper sheet does not deviate from the mold due to such pressurization and heating.
しかも、本発明に係る離型フィルムは、紙シートによっ
てポリ−４−メチル−１−ペンテンフィルムの変形が防
止され、ポリ−４−メチル−１−ペンテンフィルムに皺
が形成されることもない。Moreover, in the release film according to the present invention, deformation of the poly-4-methyl-1-pentene film is prevented by the paper sheet, and wrinkles are not formed in the poly-4-methyl-1-pentene film.
従って、本発明に係る離型フィルムは、プリプレグに圧
接して加熱することにより所望の粗面を有する樹脂層を
形成することができ、このような樹脂層を有する多層プ
リント回路基板の外装板などを製造する際に好適に使用
することができる。Therefore, the release film according to the present invention can form a resin layer having a desired rough surface by press-contacting it to a prepreg and heating it. It can be suitably used when manufacturing.
以下、本発明を実施例によりさらに具体的に説明するが
、本発明はこれらの実施例に何ら制限されるものではな
い。EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples in any way.
［実施例］
実施例１
ポリ−４−メチル−１−ペンテンフィルム（三井石油化
学工業（株）社製Ｍ２１０）を紙シートの両面に接着剤
により接着し、離型フィルムを製造した。[Examples] Example 1 Poly-4-methyl-1-pentene film (M210 manufactured by Mitsui Petrochemical Industries, Ltd.) was adhered to both sides of a paper sheet with an adhesive to produce a release film.
なお、紙シートの平均表面粗さＲおよび最大表暑
面粗さＲは表１に示す通りであり、用いたボｆｆ１ｌ！
ジ−４−メチル−１−ペンテンフィルムは、５倍に一軸
延伸された厚さ５０μｍの延伸フィルムであり、その表
面は特に粗面化処理されていなかった。Note that the average surface roughness R and maximum surface roughness R of the paper sheet are as shown in Table 1, and the used boff1l! The di-4-methyl-1-pentene film was a stretched film with a thickness of 50 μm that had been uniaxially stretched five times, and its surface was not particularly roughened.
このようにして製造された離型フィルムの両面に、エポ
キシプリプレグ（三菱瓦斯化学（株）社製ボンディング
用プリプレグ）および銅箔を順次積層した。Epoxy prepreg (bonding prepreg manufactured by Mitsubishi Gas Chemical Co., Ltd.) and copper foil were sequentially laminated on both sides of the release film thus produced.
得られた積層体を２０ｋｇ／ａｌの圧力で加圧しながら
１３０℃の温度で３０分間加熱し、次いで４０ｋｇ／ｃ
ａｒの圧力で加圧しながら１８０℃の温度で６０分間加
熱してエポキシプリプレグを硬化させ、エポキシ樹脂硬
化層を形成した。The obtained laminate was heated at a temperature of 130°C for 30 minutes while applying a pressure of 20 kg/al, then 40 kg/c
The epoxy prepreg was cured by heating at a temperature of 180° C. for 60 minutes while applying a pressure of ar to form a cured epoxy resin layer.
このようにして形成されたエポキシ樹脂硬化層から離型
フィルムを剥離し、エポキシ樹脂硬化層の平均表面粗さ
Ｒおよび最大表面粗さＲをａ
ｍａｗ測定したと
ころ、表１に示す結果が得られた。The release film was peeled off from the epoxy resin cured layer thus formed, and the average surface roughness R and maximum surface roughness R of the epoxy resin cured layer were determined by a
When maw was measured, the results shown in Table 1 were obtained.
実施例２
ポリ−４−メチル−１−ペンテンフィルム（三井石油化
学工業（株）社製Ｘ−２２）を紙シートの両面に接着剤
により接着し、離型フィルムを製造した。Example 2 Poly-4-methyl-1-pentene film (X-22 manufactured by Mitsui Petrochemical Industries, Ltd.) was adhered to both sides of a paper sheet with an adhesive to produce a release film.
ここで用いたポリ−４〜メチル−１−ペンテンフィルム
はＴダイ成形機により押出し成形された以外は実施例１
と同様のフィルムである。Example 1 except that the poly-4-methyl-1-pentene film used here was extruded using a T-die molding machine.
It is a similar film.
このようにして製造された離型フィルムを用いて実施例
１と同様にしてエポキシ樹脂硬化層を形成し、エポキシ
樹脂硬化層の平均表面粗さＲお♂
よび最大表面粗さＲを測定したところ、表１ｌ１ａＸ
に示す結果が得られた。A cured epoxy resin layer was formed using the release film thus produced in the same manner as in Example 1, and the average surface roughness R and maximum surface roughness R of the cured epoxy resin layer were measured. , the results shown in Table 1l1aX were obtained.
比較例１
離型フィルムとしてポリ−４−メチル−１−ペンテン製
マットフィルム（三井石油化学工業（株）社製Ｘ−２２
ＭＴ４）を使用した。このマットフィルムの平均表面粗
さＲおよび最大表面粗さＲ１，１１８畠
は、それぞれ０．５．３．８であった。Comparative Example 1 A poly-4-methyl-1-pentene matte film (X-22 manufactured by Mitsui Petrochemical Industries, Ltd.) was used as a release film.
MT4) was used. The average surface roughness R and maximum surface roughness R1,118 of this matte film were 0.5.3.8, respectively.
この比較例１のマットフィルムの片面にエポキシプリプ
レグおよび銅箔を順次積層し、他面に綱板を積層した以
外は実施例１と同様にしてエポキシ樹脂硬化層を形成し
、エポキシ樹脂硬化層の平均表面粗さＲおよび最大表面
粗さＲを測定ａ
ｍａｒしたところ、表１に示す
結果が得られた。An epoxy resin cured layer was formed in the same manner as in Example 1, except that epoxy prepreg and copper foil were sequentially laminated on one side of the matte film of Comparative Example 1, and a steel plate was laminated on the other side. Measure the average surface roughness R and maximum surface roughness Ra
As a result, the results shown in Table 1 were obtained.
表１の結果から明らかなように、実施例の離型フィルム
を用いれば、エポキシ樹脂硬化層表面に、充分な大きさ
のの平均表面粗さＲおよび最大表面粗さＲを有する粗面
が形成される。これに鵬ｌｘ
対し、比較例１のマットフィルムを用いても、エポキシ
樹脂硬化層表面にこのような平均表面粗さＲおよび最大
表面粗さＲを有する粗面は形１
ｍｌｌ成され
ない。As is clear from the results in Table 1, when the release film of the example is used, a rough surface having a sufficiently large average surface roughness R and maximum surface roughness R is formed on the surface of the epoxy resin cured layer. be done. In contrast, even if the matte film of Comparative Example 1 is used, the rough surface having such average surface roughness R and maximum surface roughness R on the surface of the epoxy resin cured layer is
ml is not created.
第１．２図は、それぞれ本発明に係るマットフィルムの
一例を示す断面図、第３．４図は、それぞれ本発明に係
るマットフィルムの製造方法を説明するための図面、第
５図は、多層プリント回路基板を示す断面図、第６図は
、第５図の多層プリント回路基板の製造方法を説明する
ための図面である。
１・・・紙シート、２・・・ポリ−４−メチル−１−ペ
ンテンフィルム。
第
図
第
スFig. 1.2 is a cross-sectional view showing an example of the matte film according to the present invention, Fig. 3.4 is a drawing for explaining the method of manufacturing the matte film according to the present invention, and Fig. 5 is a cross-sectional view showing an example of the matte film according to the present invention. FIG. 6, a cross-sectional view showing the multilayer printed circuit board, is a drawing for explaining a method of manufacturing the multilayer printed circuit board of FIG. 5. 1...Paper sheet, 2...Poly-4-methyl-1-pentene film. Figure No.
Claims (1)
ト上に、厚さ１０〜５０μｍのポリ−４−メチル−１−
ペンテンフィルムが積層されてなることを特徴とする離
型フィルム。(1) Poly-4-methyl-1-
A release film characterized by being made by laminating pentene films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22068390A JP2959818B2 (en) | 1990-08-22 | 1990-08-22 | Release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22068390A JP2959818B2 (en) | 1990-08-22 | 1990-08-22 | Release film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04101841A true JPH04101841A (en) | 1992-04-03 |
| JP2959818B2 JP2959818B2 (en) | 1999-10-06 |
Family
ID=16754839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22068390A Expired - Lifetime JP2959818B2 (en) | 1990-08-22 | 1990-08-22 | Release film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2959818B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995025987A1 (en) * | 1994-03-18 | 1995-09-28 | Iso Developments Limited | Transfer materials |
| CN109219275A (en) * | 2018-10-23 | 2019-01-15 | 珠海杰赛科技有限公司 | High-level, the thick thin core layer of copper of one kind covers type method and pcb board |
-
1990
- 1990-08-22 JP JP22068390A patent/JP2959818B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995025987A1 (en) * | 1994-03-18 | 1995-09-28 | Iso Developments Limited | Transfer materials |
| US6746811B2 (en) | 1994-03-18 | 2004-06-08 | Xyron Uk Limited | Transfer materials |
| US6929847B2 (en) | 1994-03-18 | 2005-08-16 | Xyron Uk Limited | Transfer materials |
| CN109219275A (en) * | 2018-10-23 | 2019-01-15 | 珠海杰赛科技有限公司 | High-level, the thick thin core layer of copper of one kind covers type method and pcb board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2959818B2 (en) | 1999-10-06 |
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