JPH036358A - Method for controlling deposition amount of molten metal plating - Google Patents
Method for controlling deposition amount of molten metal platingInfo
- Publication number
- JPH036358A JPH036358A JP13920989A JP13920989A JPH036358A JP H036358 A JPH036358 A JP H036358A JP 13920989 A JP13920989 A JP 13920989A JP 13920989 A JP13920989 A JP 13920989A JP H036358 A JPH036358 A JP H036358A
- Authority
- JP
- Japan
- Prior art keywords
- molten metal
- steel strip
- plating
- bath
- hot dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000007747 plating Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims description 8
- 230000008021 deposition Effects 0.000 title 1
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 36
- 239000010959 steel Substances 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 230000001276 controlling effect Effects 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc.Also Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、溶融金属メッキの付着量制御方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for controlling the amount of molten metal plating deposited.
従来の技術
溶融金属メッキの付着量制御方法としては、鋼帯等金属
帯をメッキ浴中へ導き、上方へ引き上げメッキ金属が未
凝固のときにガスワイプにより、付着量制御を施すこと
がよく知られている。Conventional technology A well-known method for controlling the amount of adhesion in molten metal plating is to introduce a metal strip such as a steel strip into a plating bath, pull it upwards, and use a gas wipe to control the amount of adhesion when the plated metal is not solidified. ing.
このような制御法においては、鋼帯金山に亙りガス吐出
圧を均一にすることが困難であり、メッキ金属のワイプ
も不均一になり、品質を損なうことになり、又ガスのメ
ッキ付着面への衝突によりメッキ金属が飛散(スプラシ
ュ)し、これが付着制御後のメッキ鋼帯表面に付着した
り、飛散したメッキ金属が硬化し、浴表面へ落下し、浮
遊ドロスとなって、浴を汚染することにより鋼帯のメッ
キ表面が劣化する。In this type of control method, it is difficult to make the gas discharge pressure uniform across the steel strip gold mine, which results in uneven wiping of the plated metal, which impairs quality, and also prevents the gas from reaching the plated surface. The plated metal is scattered due to the collision, and this may adhere to the surface of the plated steel strip after adhesion control, or the scattered plated metal may harden and fall to the bath surface, becoming floating dross and contaminating the bath. This deteriorates the plated surface of the steel strip.
更にガス噴射音が高く作業環境を悪化させることになる
等の欠点をともなうものである。Further, there are drawbacks such as high gas injection noise, which worsens the working environment.
このようなことから、リニアーモーターの電磁力により
メッキ金属付着量を制御することが開示されている(特
開昭81−227158号等)が、払拭力が弱く、かつ
電力消費量が多くコスト高になる等の欠点がある。For this reason, it has been disclosed that the amount of plating metal deposited is controlled by the electromagnetic force of a linear motor (Japanese Patent Laid-Open No. 81-227158, etc.), but the wiping power is weak, the power consumption is large, and the cost is high. There are disadvantages such as becoming
発明が解決しようとする課題
本発明は、このような欠点を有利に解決するためなされ
たものである。Problems to be Solved by the Invention The present invention has been made to advantageously solve these drawbacks.
課題を解決するための手段
本発明は、溶融金属メッキ浴表面の鋼帯出側両面全「I
Jに亙り、メッキ金属付着量制御板と鋼帯間隙を該制御
板の移動により調整することを特徴とする、溶融金属メ
ッキの付着量制御方法。Means for Solving the Problems The present invention provides a means for solving the problems by applying an I
1. A method for controlling the coating amount of molten metal plating, comprising adjusting the gap between the plated metal coating amount control plate and the steel strip by moving the control plate.
及び溶融金属メッキ浴表面の鋼帯出側両面金山に亙り、
メッキ金属付着量制御板の高さを調整することを特徴と
する、溶融金属メッキの付着量制御方法に関するもので
ある。and over the gold mine on both sides of the steel strip exit side on the surface of the molten metal plating bath,
The present invention relates to a method for controlling the amount of deposited metal plating, which is characterized by adjusting the height of a plated metal deposit amount control plate.
即ち、木発明における溶融金属メッキとしては亜鉛、ア
ルミニウム、錫、ターンメタル等があり、又これらの金
属に少量の他の金属を添加した合金メッキを施すことが
でき、更にメッキ後、必要に応じて加熱処理し合金化処
理をすることもできる。In other words, hot-dip metal plating in wood invention includes zinc, aluminum, tin, turn metal, etc.Also, alloy plating can be performed by adding small amounts of other metals to these metals, and after plating, if necessary, It is also possible to perform alloying treatment by heat treatment.
次に木発明によるメッキ付着量制御のメカニズムについ
て、図面により説明する。Next, the mechanism of controlling the coating amount of plating according to the invention will be explained with reference to the drawings.
第1図において、鋼帯1は、溶融金属メッキ浴2内に浸
漬し、メッキ後上方へ移動し、メッキ浴2表面上へ引き
上げる。このとき、鋼帯1の両面にメッキ金属2が随伴
される。そこでメッキ浴2表面の鋼帯1出側両面にメッ
キ金属付着量制御板3.3a (例えば、セラミック
ス等耐熱、耐食性を具備するものを用いることができる
。)を配置し、この制御板3.3aと鋼帯1の間隙を調
整し、鋼帯1へのメッキ金属の付着量を制御する。In FIG. 1, a steel strip 1 is immersed in a molten metal plating bath 2, moves upward after plating, and is pulled up onto the surface of the plating bath 2. At this time, the plated metal 2 is attached to both sides of the steel strip 1. Therefore, a plating metal adhesion control plate 3.3a (for example, a material having heat resistance and corrosion resistance such as ceramics can be used) is arranged on both sides of the steel strip 1 exit side of the surface of the plating bath 2. The amount of plating metal deposited on the steel strip 1 is controlled by adjusting the gap between the steel strip 3a and the steel strip 1.
即ち、鋼帯1は、制御板3.3&間(面間)を通過する
際に、随伴メッキ金属2aにょる反力を受ける、いわゆ
る一種のハイドロプレーニング現象により、制御板3.
3&間の中央に保持されながら移動するため、鋼帯1両
面のメッキ付着量はほぼ均一に制御できる。That is, when the steel strip 1 passes between the control plates 3.3 and 3.3, it receives a reaction force from the accompanying plated metal 2a, which is a so-called hydroplaning phenomenon, causing the control plates 3.3 and 3.
Since it moves while being held in the center between 3&, the amount of plating deposited on both sides of the steel strip 1 can be controlled to be almost uniform.
従って、制御板3.3aの移動yJ整により、鋼帯1と
の間隙を調整することにより、鋼帯1のメッキ付着量を
正確に制御することができる。Therefore, by adjusting the gap between the control plate 3.3a and the steel strip 1 by adjusting the movement yJ, the amount of plating deposited on the steel strip 1 can be accurately controlled.
即ち、20〜90g/fl12の広範囲の付着量制御が
確実にでき、しかも付着量制御によるメッキ金属の飛散
もなく通板速度を上げることができ、生産性を著しく向
上することができる。In other words, it is possible to reliably control the coating amount over a wide range of 20 to 90 g/fl12, and the sheet passing speed can be increased without scattering of the plated metal due to the coating amount control, thereby significantly improving productivity.
又、鋼帯1の表裏面でメッキ付着量を変化させる、いわ
ゆる差厚メッキを施す場合は、第2図に示すごとく、メ
ッキ金属付着量制御板3.3&の一方の制御板3より、
他方の制御板3aを図示のごとく、制御板3.3aと鋼
帯1との間隙を均間隙で、高くすることにより、制御板
3a側の鋼帯1面を制御板3側の鋼帯1面より厚付着量
にすることができる。In addition, when performing so-called differential thickness plating, which changes the amount of plating on the front and back surfaces of the steel strip 1, as shown in FIG.
As shown in the figure, the other control plate 3a is made high with a uniform gap between the control plate 3.3a and the steel strip 1, so that the steel strip 1 surface on the control plate 3a side is connected to the steel strip 1 on the control plate 3 side. The amount of coating can be made thicker than the surface.
その理由は、鋼帯1−制御板3.3&間のメッキ金属(
浴)粘性流の成長度合により、ワイピングゾーンから鋼
帯1表面に随伴して吐出するメッキ層内の速度分布が異
なることにより、粘性流は、制御板が長い程面内で保持
される時間が長く充分成長する。The reason is that the plated metal between the steel strip 1 and the control plate 3.
(Bath) Depending on the growth rate of the viscous flow, the velocity distribution within the plating layer discharged from the wiping zone along with the surface of the steel strip 1 differs.The longer the control plate is, the longer the viscous flow is held in the plane Grows long and full.
そのため第5図に示すごとく、速度分布が直線分布に近
ずくことにより鋼帯から離れた点でも高い線速度をもつ
ようになり、制御板エツジ部との表面張力に勝る範囲が
広がる。Therefore, as shown in FIG. 5, as the velocity distribution approaches a linear distribution, even points far away from the steel strip have a high linear velocity, and the range where the surface tension with the control plate edge portion can be overcome is expanded.
従って鋼帯にも多くの溶融金属が残り厚目付とすること
ができる。Therefore, a large amount of molten metal remains in the steel strip so that it can be made thicker.
実施例 次に本発明の実施例を挙げる。Example Next, examples of the present invention will be described.
実施例1 連続溶融亜鉛メッキにおいて次記のごと〈実施した。Example 1 Continuous hot-dip galvanizing was carried out as follows.
(1)メッキ浴組成:通常のメッキ浴
(2)メッキ浴温:480℃
(3)被メッキ材:鋼帯(Q、8mm厚、 800m+
wlll)(4)通板速度: Loom/分
(5)メッキ金属付着量制御板:第3図参照a、a
: 30mm、 b、b’ : 20mm、
R,R’ : 5mm(6)メッキ金属付着量制
御板と鋼帯の間隙=1.0層脂(m帯両面共同間隙)
このようにして連続的に亜鉛メッキを施したところ、両
面に均一にBog/m2(片面)の付着量に制御できた
。(1) Plating bath composition: Normal plating bath (2) Plating bath temperature: 480℃ (3) Plating material: Steel strip (Q, 8mm thick, 800m+
(4) Sheet threading speed: Loom/min (5) Plating metal adhesion amount control board: See Figure 3 a, a
: 30mm, b, b' : 20mm,
R, R': 5mm (6) Gap between plated metal coating amount control plate and steel strip = 1.0 layer resin (common gap on both sides of m band) When zinc plating was applied continuously in this way, both sides were uniformly coated. The amount of adhesion could be controlled to Bog/m2 (one side).
実施例2
実施例1同条件で実施し、メッキ金属付着量制御板を下
記のごとく、高さを変えて、差厚メッキを施した。Example 2 It was carried out under the same conditions as Example 1, and the height of the plated metal adhesion control plate was changed as shown below to perform differential plating.
メッキ金属付着量制御板:第4図参照
a : 30mm、a’ : 40mm、 b
: 20mm、b’ : 30+a+m。Plating metal adhesion amount control plate: See Figure 4 a: 30mm, a': 40mm, b
: 20mm, b': 30+a+m.
R,R:5mm
このようにしてメッキを施したところ、制御板3a側の
鋼帯面Bog/r12.制御板3側の鋼帯面50g/m
2の差厚メッキを施すことができた。R, R: 5mm When plating was applied in this way, the steel strip surface on the control plate 3a side Bog/r12. Steel strip surface on control plate 3 side 50g/m
It was possible to perform plating with a difference in thickness of 2.
発明の効果
本発明により、付着量制御によるスプラシュ発生等がな
く、高速通板ができ、生産性が向上するとともに被メッ
キ材全山に亙り、均一な付着量制御が確実に行うことが
でき、品質も向上することができる。Effects of the Invention The present invention enables high-speed threading without the occurrence of splash due to coating amount control, improving productivity, and ensuring uniform coating amount control over the entire plated material. Quality can also be improved.
又ガスワイプ等に比べ付着量制御のためのエネルギーを
必要とせず、コストを低下させることができる。Furthermore, compared to gas wipes and the like, it does not require energy to control the amount of adhesion, reducing costs.
更に付着量制御板配置のための空間部がほとんど不要に
なり、浴底部のジンクロールと上方のロールによる支承
距離が短かくでき、メッキ鋼帯の巾方向反り(0反)を
ほとんど無くすることができ、メッキ後の合金化処理炉
での合金化処理が均一にできる等の多くの優れた効果が
得られる。Furthermore, almost no space is required for arranging the coating amount control plate, the supporting distance between the zinc roll at the bottom of the bath and the upper roll can be shortened, and warping in the width direction (zero warping) of the plated steel strip can be almost eliminated. Many excellent effects can be obtained, such as uniform alloying treatment in the alloying treatment furnace after plating.
第1図及び第2図は、本発明を示す説明図、第3図及び
第4図は、本発明の実施例を示す制御板の説明図、第5
図は溶融金属の粘性流と溶融金属線速度分布の関係を示
す説明図である。
1拳・金鋼帯、2・・拳メッキ浴、2a ・・・随伴メ
ッキ金属、3.3a ・・・付着量制御板。1 and 2 are explanatory views showing the present invention, FIGS. 3 and 4 are explanatory views of a control board showing an embodiment of the present invention, and FIG.
The figure is an explanatory diagram showing the relationship between the viscous flow of molten metal and the molten metal linear velocity distribution. 1. Gold steel belt, 2.. Fist plating bath, 2a... Accompanied plating metal, 3.3a... Adhesion amount control plate.
Claims (2)
、メッキ金属付着量制御板と鋼帯間隙を該制御板の移動
により調整することを特徴とする溶融金属メッキの付着
量制御方法。(1) A method for controlling the coating amount of molten metal plating, which comprises adjusting the gap between the plated metal coating amount control plate and the steel strip by moving the control plate over the entire width of both sides of the steel strip exit side of the surface of the molten metal plating bath. .
、メッキ金属付着量制御板の高さを調整することを特徴
とする溶融金属メッキの付着量制御方法。(2) A method for controlling the amount of deposited metal plating, which comprises adjusting the height of a plated metal deposit control plate over the entire width of both sides of the steel strip exit side of the surface of the molten metal plating bath.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13920989A JPH036358A (en) | 1989-06-02 | 1989-06-02 | Method for controlling deposition amount of molten metal plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13920989A JPH036358A (en) | 1989-06-02 | 1989-06-02 | Method for controlling deposition amount of molten metal plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH036358A true JPH036358A (en) | 1991-01-11 |
Family
ID=15240076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13920989A Pending JPH036358A (en) | 1989-06-02 | 1989-06-02 | Method for controlling deposition amount of molten metal plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH036358A (en) |
-
1989
- 1989-06-02 JP JP13920989A patent/JPH036358A/en active Pending
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