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JPH034587A - Method and device for cleaning printed board - Google Patents

Method and device for cleaning printed board

Info

Publication number
JPH034587A
JPH034587A JP13753989A JP13753989A JPH034587A JP H034587 A JPH034587 A JP H034587A JP 13753989 A JP13753989 A JP 13753989A JP 13753989 A JP13753989 A JP 13753989A JP H034587 A JPH034587 A JP H034587A
Authority
JP
Japan
Prior art keywords
printed circuit
water
circuit board
detergent
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13753989A
Other languages
Japanese (ja)
Inventor
Isamu Sato
勇 佐藤
Yuji Kawamata
勇司 川又
Kaichi Tsuruta
加一 鶴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP13753989A priority Critical patent/JPH034587A/en
Publication of JPH034587A publication Critical patent/JPH034587A/en
Pending legal-status Critical Current

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  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To realize the cleaning method and the device of a printed board without being accompanied by pollution by a method wherein the residual flux of the printed board is removed by a water soluble cleaning agent, the cleaning agent is removed with water or warm water, and the printed board is heated at a prescribed temperature and dried up in a vacuum under a specific pressure or below. CONSTITUTION:A printed board P is held on a conveyer 4, and the board P is cleaned by separating flux residue from the board P by a water-soluble cleaning agent spouted from a nozzle 5 against the board P in a cleaning agent removing device 2. The cleaning agent attached to the board P is removed with water or warm water spouted out from a nozzle 9 in rinsing devices 3' and 3'', and the board P is dried with an air nozzle 7. The board P is heated at a temperature of 50 deg.C or above in a heating device 10 and dried up in a vacuum of 200Torr or below in a vacuum dryer 11. By this setup, a cleaning method and a device free of pollution can be realized.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は松脂系フラックスではんだ付けしたプリント基
板を水溶性の洗剤で洗滌する方法および装置に間する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method and apparatus for cleaning printed circuit boards soldered with pine resin flux with a water-soluble detergent.

〔発明の背景〕[Background of the invention]

一般に、プリント基板のはんだ付けにはフラックスとし
て松脂を主成分としたものが使用される。
Generally, a flux containing pine resin as a main component is used for soldering printed circuit boards.

松脂は良好な絶縁物質であり、それ自体で電気を通すこ
とがないためテレビ、ラジオ、テープレコーダーのよう
な民生機器に使用するプリント基板では、はんだ付は後
そのままにして機器に組込んでいる。しかしながら松脂
は粘着性があるため長期間のうちに、はんだ付は後のフ
ラックス残渣にゴミや埃が付着してしまうことがあるが
、ゴミや埃は湿度が高い時に吸湿し、絶縁抵抗を悪くす
ることがある。一般の民生機器では多少の絶縁抵抗の低
下では機能にあまり影響はないが、大型コンピューター
や通信機器のような精密電子機器では少しの絶縁抵抗の
低下でもエラー発生の原因となることがある。そのため
精密電子機器に用いるプリント基板は、はんだ付は後に
フラックス残渣の除去を行わなくてはならないとされて
いる。
Pine resin is a good insulator and does not conduct electricity by itself, so for printed circuit boards used in consumer equipment such as televisions, radios, and tape recorders, it is assembled into the equipment without soldering. . However, since pine resin is sticky, over a long period of time, dirt and dust may adhere to the flux residue after soldering, but dirt and dust absorb moisture when the humidity is high, worsening insulation resistance. There are things to do. In general consumer equipment, a slight drop in insulation resistance does not have much effect on functionality, but in precision electronic equipment such as large computers and communication equipment, even a small drop in insulation resistance can cause errors. For this reason, it is said that flux residue must be removed from printed circuit boards used in precision electronic equipment after soldering.

従来、はんだ付は後のプリント基板のフラックス残渣の
除去には松脂をよく溶解するフッ素系桑、或いは塩素系
の有機溶剤が用いられていた。しかしながらフッ素系の
溶剤は地球を取り巻くオゾン層を破壊するため、この破
壊されたところから太陽の紫外線が大量に地球に到達し
て人間に皮膚ガンを起こさせる誘因となり、また塩素系
の溶剤は地下に滲透し地下水と混合してしまい、それを
飲用するとやはりガン発生の誘因となる。それ故、これ
らの溶剤の使用ができなくなることも考えられる。
Conventionally, fluorine-based mulberry or chlorine-based organic solvents, which dissolve pine resin well, have been used to remove flux residue from printed circuit boards after soldering. However, since fluorine-based solvents destroy the ozone layer surrounding the earth, a large amount of the sun's ultraviolet rays reach the earth from this destruction, causing skin cancer in humans. It seeps into the water and mixes with groundwater, and drinking it can cause cancer. Therefore, it is conceivable that these solvents cannot be used.

そこで、これらの有機溶剤の代替品の研究がさかんに行
われ、近時、松脂の洗滌除去に効果のある水溶性の洗剤
がいくつか開発されるようになってきた(例、米国ベト
ロファーム社製:商品名「バイオ・アクトEC−7J 
 )。
Therefore, research into alternatives to these organic solvents has been actively conducted, and recently several water-soluble detergents that are effective in removing pine resin have been developed (for example, the detergent manufactured by Vetropharm in the United States). :Product name "Bio-Act EC-7J"
).

しかしながら、今日までプリント基板のフラックス残渣
の洗滌には前述有機溶剤しか使用されてなく、それを用
いた洗滌方法、装置等は各種提案され実施されていたが
、新しい水溶性洗剤を用いたプリント基板の洗滌方法や
装置は存在していなかったものである。
However, until now, only the above-mentioned organic solvents have been used to clean flux residue from printed circuit boards, and various cleaning methods and devices using them have been proposed and implemented. Cleaning methods and equipment did not exist.

本発明はこの新しい洗剤を用いた全く新しいプリント基
板の洗滌方法および装置を提供することにある。
The object of the present invention is to provide a completely new method and apparatus for cleaning printed circuit boards using this new detergent.

〔発明の構成〕[Structure of the invention]

本発明は、プリント基板のフラックス残渣を水溶性洗剤
で洗滌し、プリント基板に付着した前記洗剤を水または
温水で洗滌除去した後、プリント基板を50℃以上に加
熱して200 torr以下の真空中で乾燥させること
を特徴とするプリント基板の洗滌方法であり、またプリ
ント基板の洗滌工程にはプリント基板のフラックス残渣
を水溶性洗剤で洗滌する洗剤洗滌装置と、該洗剤洗滌装
置て付着した洗剤を水または温水で洗滌する水洗装置と
、水洗後のプリント基板を50℃以上に加熱する加熱装
置と、水濡れしたプリント基板を乾燥させる真空乾燥装
置とから成り、前記洗剤洗滌装置、水洗装置、加熱装置
にはプリント基板を搬送するコンベアが走行していて、
しかも該コンベアで搬送されたプリント基板が真空乾燥
装置内へ自動供給される機構となっていることを特徴と
するプリント基板の洗滌装置である。
In the present invention, flux residue on a printed circuit board is washed with a water-soluble detergent, the detergent adhering to the printed circuit board is washed away with water or hot water, and then the printed circuit board is heated to 50° C. or higher and placed in a vacuum of 200 torr or lower. This method of cleaning printed circuit boards is characterized by drying them with water, and the cleaning process of printed circuit boards includes a detergent cleaning device that cleans the flux residue on the printed circuit boards with a water-soluble detergent, and the detergent cleaning device removes the attached detergent. It consists of a washing device that washes with water or hot water, a heating device that heats the printed circuit board after washing to 50°C or higher, and a vacuum drying device that dries the wet printed circuit board. There is a conveyor running in the equipment that transports printed circuit boards.
Moreover, the printed circuit board cleaning device is characterized in that it has a mechanism in which the printed circuit board conveyed by the conveyor is automatically fed into the vacuum drying device.

本発明の洗滌方法において、水洗後プリント基板を50
℃以上に加熱するのは、洗滌工程後の真空乾燥時、被乾
燥物の温度が高ければ高い程、乾燥時間が短くなり生産
性を向上させるからである。
In the cleaning method of the present invention, the printed circuit board is washed with water for 50 minutes.
The reason why the material is heated above .degree. C. is that during vacuum drying after the washing step, the higher the temperature of the material to be dried, the shorter the drying time, which improves productivity.

本発明者らの実験によると、真空乾燥における乾燥時間
は被乾燥物の温度に比例的に関係してくるものであり、
同一真空度でも被乾燥物の温度が少しでも高くなると乾
燥時間が急激に短くなることが分かった。例えば60 
torrの真空乾燥装置における水濡れしたプリント基
板の乾燥は、プリント基板が40℃の時には40分以上
かかるがプリント基板の温度を60℃にすると3分20
秒という短い時間になる。この様に乾燥時間を短くする
のに効果のある温度は50℃以上であるため、本発明で
は水洗後のプリント基板の温度を50℃以上とした。ま
た、真空乾燥装置における真空度は小さければ小さい程
、乾燥時間が少なくなるがプリント基板を50℃にして
乾燥時間を短くするのに効果のある真空度は200 t
orr以下である。
According to experiments conducted by the present inventors, the drying time in vacuum drying is proportionally related to the temperature of the material to be dried.
It has been found that even if the degree of vacuum is the same, if the temperature of the material to be dried increases even slightly, the drying time will be drastically shortened. For example 60
It takes more than 40 minutes to dry a water-wet printed circuit board in a TORR vacuum dryer when the temperature of the printed circuit board is 40℃, but it takes 3 minutes and 20 minutes when the temperature of the printed circuit board is 60℃.
It will be a short time of seconds. Since the effective temperature for shortening the drying time is 50° C. or higher, in the present invention, the temperature of the printed circuit board after washing with water is set to 50° C. or higher. Also, the lower the degree of vacuum in the vacuum dryer, the shorter the drying time will be, but the effective degree of vacuum to shorten the drying time by keeping the printed circuit board at 50 degrees Celsius is 200 tons.
orr or less.

〔実施例〕〔Example〕

本発明のプリント基板の洗滌方法は、先ず松脂の除去に
効果のある水溶性の洗剤でプリント基板に付着したフラ
ックス残渣の除去を行う。この時の洗滌方法としては超
音波振動、ブラッシング、或いは洗剤に圧力を掛けて吹
付ける等、物理的、機械的手段を用いると効果的に除去
が行える。
In the printed circuit board cleaning method of the present invention, first, flux residue adhering to the printed circuit board is removed using a water-soluble detergent that is effective in removing pine resin. At this time, the cleaning method can be effectively removed by using physical or mechanical means such as ultrasonic vibration, brushing, or spraying detergent under pressure.

洗剤でフラックス残渣が除去されたならば、次にフラッ
クスに付着した洗剤を除去しなければならない。洗剤は
水溶性であるため、この除去には水を使うが、この場合
も超音波、ブラッシング、圧力水の吹付は等を行えれば
水洗の効果があり、しかも−度目は循環水のようなもの
で粗洗滌を行ない、二度目に浄水で仕上洗滌を行えば水
の使用料を少なくして効果的な水洗部ができる。
Once the flux residue has been removed with detergent, the detergent adhering to the flux must be removed next. Detergents are water-soluble, so water is used to remove them, but even in this case, washing with water can be effective if ultrasonic waves, brushing, spraying with pressurized water, etc. If you do a rough wash with a cloth and then finish wash with purified water a second time, you can reduce the amount of water used and create an effective water wash area.

水洗部のプリント基板は50℃以上に加熱をする。これ
は、次の真空乾燥工程における乾燥時間短縮のために行
うものである。該加熱手段としては温水、熱風の吹付け
の他、赤外線ヒーターによる方法がある。
The printed circuit board in the water washing section is heated to 50°C or higher. This is done to shorten the drying time in the next vacuum drying step. Examples of the heating means include blowing hot water and hot air, as well as using an infrared heater.

50℃以上に加熱されたプリント基板は真空乾燥装置中
に置かれ200torr以下の真空中で乾燥させられる
The printed circuit board heated to 50° C. or more is placed in a vacuum drying device and dried in a vacuum of 200 torr or less.

説明する正面断面図である。It is a front sectional view for explanation.

洗滌槽lは、洗剤洗滌装置2、水洗装置3から構成され
ており、洗滌槽内にはプリント基板Pを爪で保持して搬
送するコンベア4が設置されている。洗剤洗滌装置2の
プリント基板走行部にはプリント基板の表裏に洗剤を吹
付ける複数のノズル5・・・が設置されている。洗剤洗
滌装置2の下部は槽となっていてノズル5から噴出され
た溶剤6を一次貯めてから図示しないポンプでノズル5
に送って再使用するようになっている。またノズル5次
に上記プリント基板の洗滌方法を実施するもう一つの発
明であるプリント基板の洗滌装置について図面を参照し
ながら説明する。
The washing tank 1 is composed of a detergent washing device 2 and a water washing device 3, and a conveyor 4 that holds and conveys the printed circuit board P with its claws is installed in the washing tank. A plurality of nozzles 5 for spraying detergent onto the front and back surfaces of the printed circuit board are installed in the printed circuit board travel section of the detergent cleaning device 2. The lower part of the detergent washing device 2 is a tank that temporarily stores the solvent 6 ejected from the nozzle 5 and then transfers it to the nozzle 5 using a pump (not shown).
It is designed to be sent to the United States for reuse. Further, the nozzle 5 Next, a printed circuit board cleaning apparatus, which is another invention that implements the above-described printed circuit board cleaning method, will be described with reference to the drawings.

第1図は本発明の洗滌装置の該略図、第2図は第1図■
−■線断面の詳細図、第3図は複数の真空乾燥装置への
プリント基板の引渡し、引き出しを説明する平面図、第
4〜6図は1基の真空乾燥装置におけるプリント基板の
引渡し、取り出しをは第1水洗装#L3′と第2水洗装
置3”から成り、下部は水8を貯める槽となっている。
Fig. 1 is a schematic diagram of the cleaning device of the present invention, and Fig. 2 is a schematic diagram of the washing device of the present invention.
- Detailed cross-sectional view of line ■, Figure 3 is a plan view illustrating the delivery and removal of printed circuit boards to multiple vacuum drying devices, and Figures 4 to 6 are delivery and removal of printed circuit boards in one vacuum drying device. It consists of a first water washing device #L3' and a second water washing device 3'', and the lower part is a tank for storing water 8.

水洗装置には走行するプリント基板の表裏に圧力水を吹
付ける複数のノズル9・・・が設置されている。第1水
洗装置3′では下部の槽に貯った水が図示しないポンプ
でノズル9に送られ再使用するようになっているが、第
2水洗装g13”のノズルからは清浄な水が噴出するよ
うになっている。第2水洗装置のノズル9の近傍には、
プリント基板に圧縮空気を吹付けるエアーノズル7が設
置されている。洗滌槽1を出たところには加熱装置10
が設置されている。実施例に示す加熱装置は電熱ヒータ
であり赤外線によりプリント基板を加熱するものである
The water washing device is equipped with a plurality of nozzles 9 that spray pressurized water onto the front and back surfaces of the running printed circuit board. In the first water washing device 3', the water stored in the lower tank is sent to the nozzle 9 by a pump (not shown) for reuse, but clean water is spouted from the nozzle of the second water washing device g13''. Near the nozzle 9 of the second water washing device, there is a
An air nozzle 7 is installed to blow compressed air onto the printed circuit board. A heating device 10 is installed at the place where the washing tank 1 exits.
is installed. The heating device shown in the embodiment is an electric heater that heats a printed circuit board using infrared rays.

コンベア4の進行方向終端近傍には真空乾燥装置11が
設置されている。真空乾燥装置11はコンベア4に向け
た部分が間口した箱体であり間口は蓋12で密閉できる
ようになっている。真空乾燥装置11の一端は軸13で
軸支されており、他端は上下動装置t 14で支えられ
ていて傾斜するようになっている。真空乾燥装置11内
には多数のコロ15・・・が設置されていてプリント基
板の出し入れが円滑に行われるようになっている。16
は図示しない真空ポンプへ通じる排気口である。真空乾
燥装置は第3図に示すように3基11A、11B、II
Cが矢[hように横方に移動可能となって設置されてい
る。
A vacuum drying device 11 is installed near the end of the conveyor 4 in the direction of travel. The vacuum drying device 11 is a box with a frontage facing the conveyor 4, and the frontage can be sealed with a lid 12. One end of the vacuum drying device 11 is supported by a shaft 13, and the other end is supported by a vertical movement device t14 so as to be tilted. A large number of rollers 15 are installed in the vacuum drying device 11 to allow printed circuit boards to be taken in and out smoothly. 16
is an exhaust port leading to a vacuum pump (not shown). There are three vacuum drying devices 11A, 11B, and II as shown in Figure 3.
C is installed so that it can be moved laterally as shown by the arrow h.

ここで、上記構成から成るプリント基板の洗滌装置での
プリント基板の洗滌について説明する。
Here, cleaning of a printed circuit board using the printed circuit board cleaning apparatus having the above-mentioned configuration will be explained.

プリント基板Pを矢印A方向に走行するコンへ74に保
持し洗滌槽l内を走行させる。プリント基板Pは先ず洗
剤洗滌装置2内でノズル5から噴出する洗剤で洗滌され
る。この時、洗剤は圧力をかけであるためその勢いでフ
ラックスを剥離しながら洗滌を行う。ノズルから噴出さ
れた溶剤6は下部の槽に貯まり、図示しないポンプで再
度ノズルに送られ再使用するようになっている。洗剤で
フラックスが除去されたプリント基板はエアーノズル7
から吹付ける圧縮空気によりプリント基板に多量に付着
した洗剤が拭い落とされ、洗剤が次の工程に持ち出され
ることがなくなる0次いでフラックス残渣が除去され、
洗剤の付着が少なくなったプリント基板は水洗装置3の
第1水洗装置3′にはいる。ここではノズル9により圧
力水が吹付けられ洗剤の除去が行われる。第1水洗装置
の水は図示しないポンプで循環させて使用するため、水
の使用料の節約となるが溶剤が少し持ち出され洗剤が混
じった水であるため完全な洗滌とはならない。しかしな
がら第2水洗装置3”ではノズル9から清浄な水を噴出
させてプリント基板の洗滌を行うため、ここで仕上洗滌
となる。仕上洗滌されたプリント基板はエアーノズル7
により表面に付着した水が吹き飛ばされる。水がほとん
ど無くなったプリント基板は加熱装置10の赤外線で5
0℃以上に加熱され、最終工程である乾燥に移る。
The printed circuit board P is held at 74 by a controller running in the direction of arrow A, and is caused to run inside the cleaning tank l. The printed circuit board P is first cleaned in the detergent cleaning device 2 with detergent jetted from the nozzle 5. At this time, since the detergent applies pressure, the force of the detergent peels off the flux while cleaning. The solvent 6 ejected from the nozzle is stored in a tank at the bottom and sent to the nozzle again by a pump (not shown) for reuse. The printed circuit board whose flux has been removed with detergent is connected to air nozzle 7.
A large amount of detergent adhering to the printed circuit board is wiped off by compressed air, which prevents the detergent from being carried over to the next process.Next, flux residue is removed.
The printed circuit board with less detergent adhesion enters the first washing device 3' of the washing device 3. Here, pressure water is sprayed by the nozzle 9 to remove the detergent. Since the water in the first washing device is circulated by a pump (not shown), the amount of water used can be saved, but a small amount of the solvent is removed and the water is mixed with detergent, so it is not a complete washing process. However, in the second water washing device 3'', clean water is ejected from the nozzle 9 to wash the printed circuit board, so this is the final cleaning.
The water adhering to the surface is blown away. The printed circuit board, which has almost no water left, is heated by the infrared rays of the heating device 10.
The material is heated to 0° C. or higher, and the final step is drying.

本発明では乾燥手段として細部の水分が除去できる真空
乾燥装置を用いる。真空乾燥装置はコンベア4の端部に
3基(IIA、IIB%IIC)並列しており3基が矢
印Yの如く横方に移動できるようになっている。
In the present invention, a vacuum drying device capable of removing moisture from fine parts is used as a drying means. Three vacuum drying devices (IIA, IIB% IIC) are arranged in parallel at the end of the conveyor 4, and the three vacuum drying devices can be moved laterally as shown by arrow Y.

ここで真空乾燥装置におけるプリント基板の受は入れ、
乾燥、取り出しについて説明する。
Insert the printed circuit board in the vacuum dryer here,
Explain drying and removal.

真空乾燥袋@11は第41!Iに示す如く、間口部の蓋
12が上方に上がっており、上下動装置は下がフで奥方
が下がった傾斜状態となっている。この状態で50℃以
上に加熱されたプリント基板Pがコンベア4で送られて
くると、プリント基板は間口から傾斜した真空乾燥装置
11内へ導入される。コンベア4から放たれたプリント
基板Pは真空乾燥装置が傾斜し、しかも内部に多数のコ
ロ15・・・が設置されているため、真空乾燥装置内へ
自動的に導入される。プリント基板が真空乾燥装置内へ
導入されると、第5図に示す如く蓋12が間口を閉め、
上下動装置が少し上昇して真空乾燥装置を水平にすると
同時に、排気口16から図示しない真空ポンプで中の空
気が抜かれる。この状態でプリント基板の真空乾燥が行
われ、水分が完全に除去されたならば真空乾燥装置内へ
外気が導入され、蓋12が上方に上がって間口を間ける
。そして、第6図の如く上昇装置14が上昇しプリント
基板Pを外方に取り出す。
Vacuum drying bag @11 is the 41st! As shown in I, the lid 12 of the frontage is raised upward, and the vertical movement device is in an inclined state with the bottom being open and the back being lowered. In this state, when the printed circuit board P heated to 50° C. or more is sent by the conveyor 4, the printed circuit board is introduced into the vacuum drying device 11 which is inclined from the frontage. The printed circuit board P released from the conveyor 4 is automatically introduced into the vacuum drying apparatus because the vacuum drying apparatus is tilted and a large number of rollers 15 are installed inside the vacuum drying apparatus. When the printed circuit board is introduced into the vacuum drying apparatus, the lid 12 closes the opening as shown in FIG.
At the same time that the vertical movement device moves up a little to level the vacuum drying device, the air inside is removed from the exhaust port 16 by a vacuum pump (not shown). In this state, the printed circuit board is vacuum-dried, and when moisture is completely removed, outside air is introduced into the vacuum drying device, and the lid 12 is raised upward to create a gap. Then, as shown in FIG. 6, the lifting device 14 rises and takes out the printed circuit board P to the outside.

3基の真空乾燥装置11A、11B、I ICの状態は
、第3図に示すようにIIBにプリント基板を導入して
いる時、IICでは真空乾燥が行われ、IIAでは真空
乾燥が終了してプリント基板を取り出しているところで
ある。モしてIIAでの取り出し、IIBでの受は入れ
、IICでの乾燥が終わったならば、IIBでは蓋がさ
れ、lICでは蓋が問いてプリント基板の取り出しが行
われた後、全ての真空乾燥装置は図面右方に移動し、1
1Aでプリント基板の受は入れが行われる。この様にし
て1基の真空乾燥装置での真空乾燥が行われるでいる閏
に他の真空乾燥装置ではプリント基板の受は入れや取り
出しが行われる。
The status of the three vacuum drying devices 11A, 11B, and IIC is as shown in Figure 3. When a printed circuit board is introduced into IIB, vacuum drying is performed in IIC, and vacuum drying is completed in IIA. The printed circuit board is being removed. After removing the printed circuit board from the IIA and receiving it from the IIB, after drying in the IIC is completed, the lid is placed on the IIB, and the lid is opened on the IC and the printed circuit board is taken out. The drying device moves to the right side of the drawing, and
The printed circuit board is received at 1A. While vacuum drying is performed in one vacuum drying apparatus in this manner, printed circuit boards are received and taken out in other vacuum drying apparatuses.

なお、実施例では真空乾燥装置内へのプリント基板の導
入を真空乾燥装置の傾斜で行うようにしたが、ブツシャ
−や他の移乗装置を使用することも可能である。
In the embodiment, the printed circuit board is introduced into the vacuum drying apparatus by tilting the vacuum drying apparatus, but it is also possible to use a pusher or other transfer device.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、従来全く考えられなかった水溶性洗剤
でのプリント基板の洗滌を実用化するとともに、洗剤洗
滌、水洗、乾燥までの全工程を自動化できるようにした
ため、従来の有機溶剤での洗滌に優るとも劣らない洗滌
ができ、しかも公害問題も全くないという優れた効果を
有している。
According to the present invention, cleaning of printed circuit boards with a water-soluble detergent, which was completely unthinkable in the past, has been made practical, and the entire process from detergent cleaning, water washing, and drying can be automated, making it possible to clean the printed circuit board with a water-soluble detergent, which was completely unthinkable in the past. It has excellent effects in that it can clean as well as it cleans, and there is no pollution problem at all.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明のプリント基板の洗滌HRの概略図、
第2図は第1図■−■線断面の詳細図、第3図は複数の
真空乾燥装置へのプリント基板の引き渡し、取り出しを
説明する平面図、第4〜6図は1基の真空乾燥装置にお
けるプリント基板の引き渡し、取り出しを説明する正面
断面図である。 4・・・コンベア 5・・・洗剤噴出用ノズル7・・・
エアーノズル 9・・・水噴出用ノズル10・・・加熱
袋@11・・・真空乾燥装置P・・・プリント基板
FIG. 1 is a schematic diagram of the printed circuit board cleaning HR of the present invention;
Figure 2 is a detailed cross-sectional view taken along the line ■-■ in Figure 1, Figure 3 is a plan view illustrating the delivery and removal of printed circuit boards to multiple vacuum drying devices, and Figures 4 to 6 are one vacuum dryer. FIG. 3 is a front sectional view illustrating delivery and removal of a printed circuit board in the apparatus. 4... Conveyor 5... Detergent spray nozzle 7...
Air nozzle 9...Water jet nozzle 10...Heating bag @11...Vacuum drying device P...Printed circuit board

Claims (2)

【特許請求の範囲】[Claims] (1) プリント基板のフラックス残渣を水溶性洗剤で
洗滌し、プリント基板に付着した前記洗剤を水または温
水で洗滌除去した後、プリント基板を50℃以上に加熱
して200torr以下の真空中で乾燥させることを特
徴とするプリント基板の洗滌方法。
(1) After washing the flux residue on the printed circuit board with a water-soluble detergent and removing the detergent adhering to the printed circuit board with water or hot water, the printed circuit board is heated to 50° C. or higher and dried in a vacuum of 200 torr or lower. A method for cleaning a printed circuit board, characterized by:
(2) プリント基板の洗滌工程には、プリント基板の
フラックス残渣を水溶性洗剤で洗滌する洗剤洗滌装置と
、該洗剤洗滌装置で付着した洗剤を水または温水で洗滌
する水洗装置と、水洗後のプリント基板を50℃以上に
加熱する加熱装置と、水濡れしたプリント基板を乾燥さ
せる真空乾燥装置とから成り、前記洗剤洗滌装置、水洗
装置、加熱装置にはプリント基板を搬送するコンベアが
走行していて、しかも該コンベアで搬送されたプリント
基板が真空乾燥装置内へ自動供給される機構となってい
ることを特徴とするプリント基板の洗滌装置。
(2) The cleaning process for printed circuit boards includes a detergent cleaning device that cleans the flux residue on the printed circuit board with a water-soluble detergent, a water cleaning device that uses water or hot water to wash off the detergent that has adhered to the printed circuit board, and a It consists of a heating device that heats the printed circuit board to 50°C or higher and a vacuum drying device that dries the wet printed circuit board, and a conveyor that transports the printed circuit board runs through the detergent washing device, water washing device, and heating device. A cleaning device for printed circuit boards, further comprising a mechanism in which the printed circuit boards conveyed by the conveyor are automatically fed into a vacuum drying device.
JP13753989A 1989-06-01 1989-06-01 Method and device for cleaning printed board Pending JPH034587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13753989A JPH034587A (en) 1989-06-01 1989-06-01 Method and device for cleaning printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13753989A JPH034587A (en) 1989-06-01 1989-06-01 Method and device for cleaning printed board

Publications (1)

Publication Number Publication Date
JPH034587A true JPH034587A (en) 1991-01-10

Family

ID=15201052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13753989A Pending JPH034587A (en) 1989-06-01 1989-06-01 Method and device for cleaning printed board

Country Status (1)

Country Link
JP (1) JPH034587A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0562070U (en) * 1992-01-24 1993-08-13 日本電気株式会社 Electronic circuit board cleaning device
US6800141B2 (en) * 2001-12-21 2004-10-05 International Business Machines Corporation Semi-aqueous solvent based method of cleaning rosin flux residue
JP2007149986A (en) * 2005-11-28 2007-06-14 Hitachi High-Technologies Corp Substrate processing apparatus, substrate processing method, and substrate manufacturing method
KR100896072B1 (en) * 2008-04-29 2009-05-07 (주)실파인 Printed Pattern Removal Device of Semiconductor Wafer
JP2009216325A (en) * 2008-03-11 2009-09-24 Shimada Phys & Chem Ind Co Ltd Dryer assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0562070U (en) * 1992-01-24 1993-08-13 日本電気株式会社 Electronic circuit board cleaning device
US6800141B2 (en) * 2001-12-21 2004-10-05 International Business Machines Corporation Semi-aqueous solvent based method of cleaning rosin flux residue
JP2007149986A (en) * 2005-11-28 2007-06-14 Hitachi High-Technologies Corp Substrate processing apparatus, substrate processing method, and substrate manufacturing method
JP4557872B2 (en) * 2005-11-28 2010-10-06 株式会社日立ハイテクノロジーズ Substrate processing apparatus, substrate processing method, and substrate manufacturing method
JP2009216325A (en) * 2008-03-11 2009-09-24 Shimada Phys & Chem Ind Co Ltd Dryer assembly
KR100896072B1 (en) * 2008-04-29 2009-05-07 (주)실파인 Printed Pattern Removal Device of Semiconductor Wafer

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