JPH0332432U - - Google Patents
Info
- Publication number
- JPH0332432U JPH0332432U JP1989091910U JP9191089U JPH0332432U JP H0332432 U JPH0332432 U JP H0332432U JP 1989091910 U JP1989091910 U JP 1989091910U JP 9191089 U JP9191089 U JP 9191089U JP H0332432 U JPH0332432 U JP H0332432U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor device
- view
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図は本考案の一実施例の取付機構を利用し
て半導体装置に放熱フインを取り付けた状態を示
す断面図、第２図は同じくその正面図、第３図は
同じくその平面図、第４図は同じくその側面図、
第５図は同じく放熱フインの斜視図、第６図は同
じく封止樹脂の硬化収縮特性による反りの状態を
示す図である。第７図は従来のねじ締めにより半
導体装置に放熱フインを取り付けた例を示す正面
図、第８図は同じくその側面図、第９図は同じく
その平面図、第１０図は同じくその断面図、第１
１図は同じくその半導体装置の正面図、第１２図
は同じくその放熱フインの斜視図である。
１１……外枠、１２……半導体内部素子、１３
……熱硬化封止樹脂、１４……半導体装置、１５
……放熱フイン、１７……凹部。
FIG. 1 is a sectional view showing a state in which a heat dissipation fin is attached to a semiconductor device using an attachment mechanism according to an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a plan view thereof. Figure 4 is the same side view.
FIG. 5 is a perspective view of the heat dissipation fin, and FIG. 6 is a diagram showing the state of warpage due to the curing and shrinkage characteristics of the sealing resin. FIG. 7 is a front view showing an example of a heat dissipation fin attached to a semiconductor device by conventional screw tightening, FIG. 8 is a side view thereof, FIG. 9 is a plan view thereof, and FIG. 10 is a sectional view thereof. 1st
1 is a front view of the semiconductor device, and FIG. 12 is a perspective view of the heat dissipation fin. 11...Outer frame, 12...Semiconductor internal element, 13
... Thermosetting sealing resin, 14 ... Semiconductor device, 15
...radiating fin, 17...recess.
Claims (1)
に挿入載置され、かつ挿入載置された状態で外枠
内の半導体素子が熱硬化封止樹脂により樹脂封止
される半導体装置とからなる半導体装置の放熱フ
イン取付機構。 A semiconductor device comprising a heat dissipation fin and a semiconductor device that is inserted and placed in a recess formed in the heat dissipation fin, and in which a semiconductor element within an outer frame is resin-sealed with a thermosetting sealing resin while being inserted and placed. Equipment's heat dissipation fin attachment mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091910U JPH0648865Y2 (en) | 1989-08-03 | 1989-08-03 | Heat sink fin mounting mechanism for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091910U JPH0648865Y2 (en) | 1989-08-03 | 1989-08-03 | Heat sink fin mounting mechanism for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332432U true JPH0332432U (en) | 1991-03-29 |
| JPH0648865Y2 JPH0648865Y2 (en) | 1994-12-12 |
Family
ID=31641369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989091910U Expired - Fee Related JPH0648865Y2 (en) | 1989-08-03 | 1989-08-03 | Heat sink fin mounting mechanism for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648865Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043369B1 (en) * | 2009-03-06 | 2011-06-21 | 현대로템 주식회사 | Fire Extinguisher Condition Detection System |
-
1989
- 1989-08-03 JP JP1989091910U patent/JPH0648865Y2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043369B1 (en) * | 2009-03-06 | 2011-06-21 | 현대로템 주식회사 | Fire Extinguisher Condition Detection System |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648865Y2 (en) | 1994-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |