JPH03263348A - IC carrier and suction transport device - Google Patents

Abstract

PURPOSE:To easily and effectively suck and chuck an IC and to improve productivity by so composing a carrier that a removing groove formed at the carrier can be used also as a sucking area, and forming a suction pad for sucking the carrier inserted fixedly with the IC of a flat plate made of conductive rubber. CONSTITUTION:An IC 1 to be inspected is secured to a groove 15b formed at the surface 15a side of a square-shaped carrier 15. A removing area 15d is formed at the inside of periphery on rear surface 15c, and other dot area CD is used as a sucking surface. On the other hand, vacuum pincers 18 are formed of a sucking head 16 having a flange 16a of size covering the entire area of the surface 15c, and a sucking pad 17 of an elastic plate state attached to the end face. A recess step surface 16d is formed except a peripheral area E at the end of the flange 16a, a through-hole 16e of a shaft 16d is opened, and a plurality of through-holes 17a are formed in the positions corresponding to the area 15d at the pad 17. When the pad 17 is brought into contact with the surface 15c, the area 15d communicates with the hole 16e to suck the IC 1 together with the carrier 15 by the pincers 18 to convey it.

Description

[Detailed Description of the Invention] [Summary] An object of the present invention is to improve productivity by easily and reliably suctioning and chucking ICs, regarding an IC suction and transportation device that transports completed semiconductor ICs to a predetermined testing device. An IC suction/conveyance device for suctioning an IC housed in a carrier together with the carrier on a surface opposite to the lead wire bending direction and conveying it to a predetermined position, the device having a size sufficient to cover the carrier. The vacuum tweezers have an elastic plate as a suction pad, and a carrier has a suction surface that is suctioned by the vacuum tweezers, and the suction pad of the vacuum tweezers is attached to the suction surface of the carrier. A thinning area is provided so that a closed space is formed by the suction pad when pressed near a predetermined position of the vacuum tweezers, and the suction pad of the vacuum tweezers is provided at a position corresponding to the closed space to suck the closed space. It is configured by providing a through hole.

[Industrial application field]

The present invention relates to a transport device for transporting completed semiconductor ICs (hereinafter simply referred to as ICs) to a testing device, and in particular, the present invention relates to a transport device for transporting completed semiconductor ICs (hereinafter simply referred to as ICs) to a test device, and in particular, the present invention relates to a transport device for transporting completed semiconductor ICs (hereinafter referred to simply as ICs), and in particular, the IC suction transport system aims to improve productivity by easily and reliably suctioning and chucking the ICs. Regarding equipment.

For example, in order to mount a completed IC on a test device, etc., the IC is housed in a carrier to prevent lead wires from bending or deforming, and the IC is transported by suction with vacuum tweezers along with the carrier. Since the carrier differs depending on the size and shape of the IC, the suction pad of the vacuum tweezers described above must also be changed, and depending on the configuration of the carrier, it may not be possible to secure a sufficient suction area. In other words, chuck errors may occur, and
A solution to this problem is desired since the surface must be directly adsorbed.

[Prior Art] Fig. 2 is a diagram illustrating a conventional IC suction transport method.
(1) is a diagram showing the IC and carrier, (2) is a diagram showing the IC stored in a tray as a stocker, (3)
is a diagram showing attachment to a test device.

FIG. 3 is a diagram illustrating another IC suction and conveyance device.

In FIG. 2 (1), each of the plurality of lead wires 1a protruding outside from each periphery of a required ICL to be tested is connected to the ICL after coming out from the peripheral surface.
The CI is bent to one side (top in the figure) and its tip 1
b is bent outward to form a bottom shape.

Normally, in such an IC, each lead wire often deforms or adjacent lead wires often come into contact with each other.

Therefore, normally, the IC is stored, transported between processes, or mounted on a test device while being accommodated in a carrier that prevents deformation of the lead wire and protects the IC itself.

2 in the figure shows the above I while preventing the deformation of each lead wire 1a.
A carrier 3 made of a #A resin molded product, etc. that protects the CI is shown, but in particular, the carrier 2, which has a "mouth" shape in plan view, has the above-mentioned IC from one side (the top side in the figure).
A recess is formed that follows the outer shape of the ICI so that the ICI can be fitted without play when the ICI is inserted in the state shown in the figure above, and the tip 1b of each lead wire 1a of the ICI is positioned. A groove 2a is formed at a position corresponding to each tip 1b.

It should be noted that the carrier 2 needs to have the thickness of each part as equal as possible in order to avoid warping and deformation after molding caused by internal strain during molding, and for this reason, a lightening area 2b is provided on the back side as shown in the figure. I am trying to set it up.

Therefore, when the above-mentioned ICI is inserted into the carrier 2 as indicated by the 3 mark R1, the tips 1b of each lead wire 1a of the ICI will be located separately in the corresponding groove 2a, and as a result, each Deformation of the lead wires and contact between adjacent lead wires can be suppressed.

Therefore, when the ICI is fixed to the carrier 2 using a locking mechanism (not shown) with the ICI inserted, (
The state shown in 1-a) can be achieved.

In this case, the back surface (lower side in the drawing) lc of the ICI is exposed except for its periphery.

Showing the state accommodated in a tray as a stocker (2)
The plurality of ICIs individually housed in the carrier 2 described in (1) are housed one by one in each partition frame of the tray 3 so that the back surface 1c is exposed to the front surface.

The vacuum tweezers 4 are composed of a shaft 4a having a through hole along the central axis and a funnel-shaped suction pad 4b made of conductive rubber attached to the tip of the shaft 4a.
A vibrator 5 connected to the other end of the shaft 4a is connected to a vacuum pump (not shown).

The vacuum tweezers 4 are held by a holder 6 that holds the vacuum tweezers 4 movably in the longitudinal direction at the shaft 4a, and a holder 6 is inserted between the holder 6 and the suction pad 4b. The coil spring 7 buffers the contact pressure between the suction pad 4b and the object to be sucked.

Furthermore, 8 shown in (3) indicates an input/output terminal section of the test device 9, and in particular, each of the plurality of connection terminals 8a of the input/output terminal section 8.
The end portion 8b of the ICI is disposed at a corresponding position near the bent portion of each lead wire 1a of the ICI, and
When the carrier 2 into which the CI is inserted and fixed is positioned and joined to the input/output terminal section 8, each lead wire 1a of the ICI and each connection terminal 8a come into contact with each other while maintaining their respective correspondence. ing.

Therefore, as shown in (2), the suction pad 4b of the vacuum tweezers 4 is attached to the exposed surface 1c of the ICI on the tray 3.
When the vacuum tweezers 4 are lowered to the illustrated area A in the direction of arrow a and a vacuum pump (not shown) is operated, the vacuum tweezers 4
adsorbs ICI.

Incidentally, since the static electricity charged on the surface of the ICI is discharged by the suction pad 4b made of conductive rubber, the characteristics of the ICI are not impaired.

Next, the ICI adsorbed to the vacuum tweezers 4
The IC 1 can be connected to the test equipment W9 by transporting the carrier 2 together with the carrier 2 to the position shown by the broken line C as shown by the arrow, and setting the carrier 2 at a predetermined position of the input/output terminal section 8.

In the case of such an ICI transport method, since the suction area by the vacuum tweezers 4 can be increased, there is an advantage that reliable suction, that is, chuck can be performed.

However, since the surface 1c of the ICI is directly attracted, there is a drawback that the pressing force of the vacuum tweezers 4 is applied directly to the lead wire 1a of the ICI.

FIG. 3 shows an apparatus for avoiding such drawbacks, in which a test ICI similar to that shown in FIG. 2 is inserted into the carrier 2 described in FIG. 2 and housed in a tray 3 in a fixed state.

12 in the figure shows four vacuum tweezers 1 having the same configuration as the vacuum tweezers 4 explained in FIG.
1 represents a holder mounted so as to be movable in the longitudinal direction, similar to the vacuum tweezers 4,
Further, 13 indicates a coil spring 7- inserted between the holder 12 and the suction pad lla attached to the tip of each of the vacuum tweezers 11.

In particular, the arrangement position of each vacuum tweezers 11 in this case corresponds to the illustrated region B corresponding to the four corners of the flat surface 2c formed around the ICI on the upper surface of the carrier 2.

The other end of each vacuum tweezers 11 is connected to the pipe 1.
4 is connected to a vacuum pump (not shown).

Therefore, as in the case of FIG. 2, the holder 12 is lowered to bring the suction pads 11a of each of the tweezers 11 into contact with the area B of the carrier 2 on the tray 3, and then the vacuum pump (not shown) is operated. Then, each vacuum tweezers 11 attracts the carrier 2.

Note that, as in the case of FIG. 2, the static electricity charged on the surface of the ICI is discharged by the suction pad lla made of conductive rubber.

Thereafter, by transporting and setting the carrier 2 attracted to the four vacuum tweezers 11 together with the ICI to the test equipment shown in Fig. 2, the ICI can be connected to the test equipment as in the case shown in Fig. 2. It is.

Particularly in this case, since the carrier 2 is attracted, the pressing force of the vacuum tweezers 11 is not applied to the lead wire of the ICI.

However, if the structure or shape of the carrier is such that the flat part is narrow or complicated, it may be difficult to secure a sufficient suction area to obtain the required suction force using the circular suction pad as described above. It is necessary to prepare suitable suction pads, and it is also necessary to accurately position each vacuum tweezers 11 in the suction area B of the carrier.

[Problem to be solved by the invention]

Conventional IC suction and conveyance devices have the problem that when directly suctioning the surface of an IC, the IC may be damaged.
Further, when suctioning a flat portion on a carrier, there is a problem in that a suction pad suitable for the carrier must be prepared and each vacuum tweezers must be aligned with the suction area of the carrier.

[Means to solve the problem]

The above-mentioned problem is an IC suction and conveyance device that suctions an IC housed in a carrier together with the carrier on the side opposite to the lead wire bending direction and conveys it to a predetermined position. It is composed of vacuum tweezers using an elastic plate as a suction pad, and a carrier equipped with a suction surface to be suctioned by the vacuum tweezers,
The suction surface of the carrier is provided with a white area such that a closed space is formed by the suction pad when the suction pad of the vacuum tweezers is pressed near a predetermined position on the suction surface of the carrier. This problem is solved by an IC suction and conveyance device in which a through hole for suctioning the closed space is provided at a position of the suction pad corresponding to the closed space.

[For production]

If a funnel-shaped suction pad with a limited suction area is replaced with a flat suction pad, positional restrictions on the suction area can be eliminated.

In the present invention, the carrier is configured so that the white groove formed in the carrier can be used as an adsorption area, and
A suction pad that suctions the carrier into which the IC is inserted and fixed is composed of a flat plate made of conductive rubber.

Therefore, a sufficient adsorption area can be obtained regardless of the size and shape of the IC and even the carrier.
It is possible to reliably transport ICs without damaging them.

〔Example〕

FIG. 1 is a diagram illustrating an IC suction and transportation device according to the present invention, and FIG. 1A is a diagram showing an example of the configuration of the device.

(B) is a diagram illustrating the suction and transportation state of the IC.

Note that the figure shows the main parts related to the present invention.

In Fig. 2(A), the surface (lower surface in the drawing) 15a side 1 of the carrier 15, which has the same shape as in Fig. 2(1), has a plurality of grooves 15b as explained in Fig. 2(1). As in the case of FIG. 2 (1-a), the ICI to be tested inserted from the surface 15a side corresponding to the groove 15b is fixed by a locking mechanism (not shown).

In this case, as in the case of FIG. 2, the back surface (upper side in the drawing) lc of the ICI is exposed except for its periphery.

Further, on the back surface (top surface in the figure) 15C of the carrier 15, the bottomed white area 15d described in FIG. 2(1) is provided in a circular manner inside along the periphery. The entire back surface 15c of the carrier 15 except for the white area 15d, that is, in the case of the figure, the dot area C along the periphery of the back surface 15c and the dot area along the inside of the white area 15d are on the same surface. It is used as an adsorption surface for eggplants.

Therefore, when a flat plate large enough to cover at least the entire back surface (hereinafter referred to as suction surface) 15c of the carrier 15 is brought into contact with the suction surface 15c of the carrier 15, the white area 15d forms a closed space. Intimidate 12.

On the other hand, the suction head 16 includes a flange 16a large enough to cover at least the entire area of the suction surface 15c of the carrier 15, and an elastic body such as conductive rubber attached to the end surface of the flange 16a by means of adhesive or the like. The vacuum tweezers 18, which are composed of a plate-shaped suction pad 17, have a second shaft that holds the vacuum tweezers 18 movably in the longitudinal direction of the shaft 16b at a shaft 16b portion that is perpendicular to the flange 16a. Holder 6 explained in the figure
Furthermore, a coil spring 7 inserted between the holder 6 and a recessed stepped portion 16c provided on the flange 16a side of the shaft 16b buffers the contact pressure between the suction pad 17 and the object. This is the same as in the case of FIG.

Among these, a stepped surface 16d is formed on the end surface of the flange 16a of the suction head 16, leaving a circumferential region E along the periphery, and is concave from the end surface.
A through hole 16e that passes through 6b in the axial direction is opened.

The suction head 16 is connected to a vacuum pump (not shown) through a pipe 5 connected to the other end of the shaft 16b.

In addition, at least a plurality of through holes 17a are formed in the suction pad 17 at positions corresponding to the hollow areas 15d of the carrier 15 described above.

Therefore, while positionally corresponding to the carrier 15 to which the ICI in the tray 3 is fixed as explained in FIG. When brought into contact with the suction surface 15c, the state shown in (B) is obtained.

At this time, the hollow area 15d of the carrier 15 and the through hole 16e of the suction head 16 are connected to the through hole 1 of the suction band 17.
We are communicating via 7a.

Therefore, by operating a vacuum pump (not shown) in this state, the ICI and eventually the carrier 15 can be attracted by the vacuum tweezers 18.

Therefore, by transporting the vacuum tweezers 18 as explained in FIG. 2, the ICI can be attached to a predetermined test device.

Note that, as in the case of FIG. 2, the static electricity charged on the surface of the ICI is discharged by the suction pad F made of conductive rubber.

In the case of an IC suction conveyance device having such a configuration, since the ICI is not directly suctioned, the ICI is not damaged.
Furthermore, by forming the plurality of through holes 17a in the suction pad 17 to correspond to the hollow area +Ax5d of the carrier 15, there is an advantage that it can be applied to carriers of any size and structure, and the entire hollow area 15d can be used for suction. Because of the area, the vacuum tweezers 18 and the carrier I5 cannot be precisely aligned.
It is possible to easily obtain a suction area sufficient to simultaneously adsorb and transport the

(Effects of the Invention) As described above, according to the present invention, it is possible to provide an IC suction and conveyance device that easily and reliably suctions and chucks ICs, thereby improving productivity.

5. In the description of the present invention, the lightening area provided in the carrier is formed in a continuous circumferential shape, but the same applies even if the lightening area is arranged discontinuously and dispersed. It has been experimentally confirmed that this effect can be obtained.

6 16a is a flange, 16b is a shaft, 16c is a stepped portion, 16d is a stepped surface, 16e is a through hole, 17 is a suction pad, 17a is a through hole, and 18 is a vacuum tweezers.

[Brief explanation of drawings]

FIG. 1 is a diagram illustrating an IC suction transport device according to the present invention, FIG. 2 is a diagram explaining a conventional RC suction transport method, and FIG. 3 is a diagram explaining another IC suction transport device. . In the figure, 1 is a semiconductor IC, la is a lead wire, lc is a back surface, 3 is a tray 5 is a pipe, 6 is a holder, 7 is a coil spring, 15 is a carrier, 15a is a front surface,
15b is the groove, 15c is the suction surface (back side), 15d is the thinning area, 16 is the suction head, 4I:L-32[

Claims (1)

[Claims] An IC suction and conveyance device that suctions an IC housed in a carrier together with the carrier on a surface opposite to the lead wire bending direction and conveys it to a predetermined position, the IC having an elastic plate large enough to cover the carrier. It consists of a vacuum tweezers (18) serving as a suction pad (17), and a carrier (15) equipped with a suction surface (15c) that is suctioned by the vacuum tweezers (18), and the suction surface (15c) of the carrier (15) is 15c), vacuum tweezers (18
) A hollow area (15d) in which a closed space is formed by the suction pad (17) when the suction pad (17) of the carrier (15) is pressed near a predetermined position on the suction surface (15c) of the carrier (15). vacuum tweezers (18)
An IC suction and conveyance device characterized in that a through hole (17a) for sucking the closed space is provided at a position of the suction pad (17) corresponding to the closed space.