JPH03261565A - Base plate for thermal head - Google Patents
Base plate for thermal headInfo
- Publication number
- JPH03261565A JPH03261565A JP6066290A JP6066290A JPH03261565A JP H03261565 A JPH03261565 A JP H03261565A JP 6066290 A JP6066290 A JP 6066290A JP 6066290 A JP6066290 A JP 6066290A JP H03261565 A JPH03261565 A JP H03261565A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- base plate
- crystallized glass
- thermal head
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000011521 glass Substances 0.000 claims abstract description 22
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 238000005498 polishing Methods 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000007723 die pressing method Methods 0.000 abstract 1
- 229910001679 gibbsite Inorganic materials 0.000 abstract 1
- 239000001095 magnesium carbonate Substances 0.000 abstract 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 abstract 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 abstract 1
- 235000014380 magnesium carbonate Nutrition 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 235000011007 phosphoric acid Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 238000004017 vitrification Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 238000005338 heat storage Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- 241001475178 Dira Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- LXMSZDCAJNLERA-ZHYRCANASA-N spironolactone Chemical compound C([C@@H]1[C@]2(C)CC[C@@H]3[C@@]4(C)CCC(=O)C=C4C[C@H]([C@@H]13)SC(=O)C)C[C@@]21CCC(=O)O1 LXMSZDCAJNLERA-ZHYRCANASA-N 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、ファクシミリやサーマρグリンター等に用い
られるサーマルヘッド用として好適な基板に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a substrate suitable for a thermal head used in a facsimile machine, a thermal ρ-grinder, or the like.
「従来の技術」
アμミナ等セフミック基板表面に、蓄熱層となる低熱伝
導率で、かつ表面の平滑性に優れるガラ７、をグレージ
ングしたグレーズ基板を用いていた。``Prior Art'' A glazed substrate was used in which the surface of a cefmic substrate such as AμMina was glazed with glass 7, which served as a heat storage layer and had low thermal conductivity and excellent surface smoothness.
筐た、最近では蓄熱層としてポリイミド樹脂を用いたサ
ーマルヘッド用エポキシ糸ｔＭ脂基板が、セラミックレ
スサーマルヘッド周基板として開発されている。Recently, an epoxy thread tM resin substrate for thermal heads using polyimide resin as a heat storage layer has been developed as a ceramic-less thermal head peripheral substrate.
「発明が解決しようとする課題」
グレーズ基板は、耐熱性・平滑性には冨むが、熱効率は
セラミックレスサーマルヘッド用基板程良くはない。こ
れは、グレーズ基板の熱伝導率が、樹脂よシも高くなる
ためである。``Problems to be Solved by the Invention'' Glazed substrates have good heat resistance and smoothness, but their thermal efficiency is not as good as that of ceramic-less thermal head substrates. This is because the thermal conductivity of the glazed substrate is higher than that of the resin.
４ｆｃ、、（ｃフミックレスサーマルヘッド用基板は、
熱効率が高く省電力化が可能ではあるが、ポリイミド系
でも耐熱限界は７００℃程度であること、コスト高であ
ること等の問題を残している。4fc, (c humicless thermal head board is
Although it has high thermal efficiency and can save power, even polyimide-based materials still have problems such as a heat resistance limit of about 700° C. and high cost.
「課題を達成するための手段」
グレーズ基板の熱伝導率を考えると、ガラスからなるグ
レーズ舖は、０．００１５〜０．００８０ｃａｌ／’Ｃ
・秒・０と低いｉ！ヲ有するが、アルミナ基板は０．０
５ ｃａｌ ／”Ｃ・秒・■程度で、１０倍以上の熱伝
導率を有し、全体での熱伝導率を引き上げ熱効率を低下
させてし筐う。"Means for achieving the objective" Considering the thermal conductivity of the glaze substrate, the glaze made of glass is 0.0015 to 0.0080 cal/'C.
・Second・0 and low i! However, the alumina substrate has 0.0
It has a thermal conductivity of 10 times or more at about 5 cal/"C・sec・■, which increases the overall thermal conductivity and reduces the thermal efficiency.
そこで、表面がピンホールが少なく平滑性を有し、かつ
アルミナ基板工υも、遥かに熱伝導率の低い基板材料を
検討し、結晶化ガラスを用いることによう、グレージン
グすることなしに表面平滑性を有し、かつ低熱伝導率で
ある所澁の基板が得られることを見い出した。Therefore, we considered a substrate material with a smooth surface with few pinholes and a much lower thermal conductivity than alumina substrates, and decided to use crystallized glass, which has a smooth surface without glazing. It has been found that a certain substrate can be obtained which has high properties and low thermal conductivity.
表面平滑性をグレーズ基板兼みにするには、結晶化ガラ
スの表面を鏡面研磨することによう得られる。その表面
平滑性としては、表面粗度でＲａ＝０．１μｍ以下、望
筐しくはＲａ＝０．０１μｍ以下が良い。Surface smoothness can be obtained by mirror-polishing the surface of crystallized glass so that it can also be used as a glaze substrate. As for the surface smoothness, the surface roughness is preferably Ra=0.1 μm or less, preferably Ra=0.01 μm or less.
「作用」
結晶化ガラスは、グレーズよ夕低い熱伝導率を有するも
のではないが、アルミナよりは低熱伝導率であるため、
グレーズドアルミナ基板と比較すると結晶化ガラス基板
は、同等以上の低熱伝導率となυ、グレーズ基板以上の
高熱効率を発揮する。"Function" Although crystallized glass does not have a low thermal conductivity as a glaze, it has a lower thermal conductivity than alumina, so
Compared to a glazed alumina substrate, a crystallized glass substrate has a lower thermal conductivity that is equal to or higher than that of a glazed alumina substrate, and exhibits higher thermal efficiency than a glazed substrate.
また、結晶化ガラス基板の表面は、グレーズに相当する
平滑性を有し、アルミナをはじめとした他のセラミック
基板で問題となっているビンホー〃もない。In addition, the surface of the crystallized glass substrate has smoothness equivalent to a glaze, and there is no "binho" which is a problem with other ceramic substrates including alumina.
更に、結晶化ガラス基板は、それ自体で蓄熱層となυ、
グレーズ塗布不要であるから、工程が簡略化されるメリ
ットもある。Furthermore, the crystallized glass substrate itself acts as a heat storage layer υ,
Since glaze application is not required, there is also the advantage of simplifying the process.
「実施例」
５ｉｆｔ ５８ｗｔ５５ＡｈＯｓ ２８ｗｔ％ 、 Ｍ
ｇ０１８ｖｒｔ％ 、ＺｎＯ４ｗｔ％ 、Ｂ富Ｏｓ １
ｗｔ％、ｈｏｓ １ｗｔ％組成となるよう□、Ｓ ｌｏ
ｚ 、 Ａｌ（ＯＨ）ｓ 、 ＭｇＣ（ｈ 。"Example" 5ift 58wt55AhOs 28wt%, M
g018vrt%, ZnO4wt%, B wealth Os 1
wt%, hos □, S lo so that the composition is 1 wt%
z, Al(OH)s, MgC(h.
ＺｎＯ、ＨａＢＯｓ 、 Ｈ３ＰＯ４ｔ’秤量し、ブイ
カイ機にて混合し、白金ルツボにて１４５０°Ｃで熔融
し、融液を水中へ投入し急冷してガラス化し、とのガラ
スをアルミナ製ボーρミ〃で粉砕してガラスフリットと
した。ZnO, HaBOs, H3PO4t' were weighed, mixed in a bubble machine, melted at 1450°C in a platinum crucible, the melt was poured into water and rapidly cooled to vitrify, and the glass was poured into an alumina bow mold. It was crushed into glass frit.
このフリットを、常法のグリーンシート法あるいは金型
デレヌ等によシ、成形体を得たのち９６０℃・２時間焼
成して結晶化ガラス基板を得た。This frit was molded by a conventional green sheet method or a mold derenu to obtain a molded body, which was then fired at 960° C. for 2 hours to obtain a crystallized glass substrate.
なか、結晶化ガラスの組成は、本実施例に限定されず、
例えば特開昭５９−９２９４８．特開昭５９−８８９５
、特開昭５９−１８７８４１で開示されているものが好
筐しいが、一般の結晶化ガラスでも適用可能である。一
般のガラス基板は熱伝導は低いが、機械的強度が弱く、
ヘッドとしては使用しにくい。Among them, the composition of the crystallized glass is not limited to this example,
For example, JP-A-59-92948. Japanese Patent Publication No. 59-8895
The one disclosed in JP-A-59-187841 is preferable, but general crystallized glass can also be used. General glass substrates have low thermal conductivity but low mechanical strength.
Difficult to use as a head.
こうして得られた結晶化ガラス基板は、研削、研磨、切
断等の加工が可能で、グレーズ基板では困難な複雑形状
のサーマルヘッド用基板とすることが出来る。The crystallized glass substrate thus obtained can be processed by grinding, polishing, cutting, etc., and can be made into a substrate for a thermal head having a complicated shape, which is difficult to do with a glazed substrate.
また、基板表面にはビンホーμ等も少なく、サーマルヘ
ッド用基板に要求される表面平滑性を有し、かつ熱伝導
率が０．００６ ｃａｌ ／”Ｃ・秒・０とアルミナ基
板よシも遥かに低くグレーズドアルミナ基板と比較して
も、同等以上の熱効率を示す。In addition, the substrate surface has less Binho μ etc., has the surface smoothness required for a thermal head substrate, and has a thermal conductivity of 0.006 cal/”C・sec・0, which is far superior to alumina substrates. Even when compared to glazed alumina substrates, which have a lower thermal efficiency, they show equivalent or higher thermal efficiency.
なか、この結晶化ガラス基板の表面粗度は、焼き肌で０
．２μ’（−Ｒａ）、鏡面研磨を行うことによジＲａ＝
０．００２μｍとなう、サーマルヘッド用として要求さ
れる平滑性を満足するものであった。Among these, the surface roughness of this crystallized glass substrate is 0 after baking.
．． 2μ'(-Ra), diRa= by mirror polishing
The smoothness was 0.002 μm, which is required for thermal heads.
「発明の効果」
グレーズドアルミナ基板の代わシとして、低熱伝導率の
結晶化ガラスを用いることによシ、熱効率が良くなシ、
サーマルヘッドの省電力化を可能とできる。"Effects of the Invention" By using crystallized glass with low thermal conductivity as a substitute for glazed alumina substrates, it has been possible to achieve good thermal efficiency.
It is possible to save power for the thermal head.
グレーズ基板では困難であった基板端面や段付き基板の
エツジ部の平滑性及び形状保持が良好となシ、これらエ
ツジ部をサーマルヘッドトして用いることによシ、サー
マルヘッドの小型化に貢献できる。The smoothness and shape retention of the substrate end faces and the edges of stepped substrates, which are difficult to achieve with glazed substrates, are good, and by using these edges as thermal heads, it contributes to the miniaturization of thermal heads. can.
Claims (1)
、その表面粗度Ｒａが０．３μｍ以下であることを特徴
とする基板。A thermal head substrate made of crystallized glass, characterized in that its surface roughness Ra is 0.3 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6066290A JPH03261565A (en) | 1990-03-12 | 1990-03-12 | Base plate for thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6066290A JPH03261565A (en) | 1990-03-12 | 1990-03-12 | Base plate for thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03261565A true JPH03261565A (en) | 1991-11-21 |
Family
ID=13148777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6066290A Pending JPH03261565A (en) | 1990-03-12 | 1990-03-12 | Base plate for thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03261565A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940109A (en) * | 1994-05-31 | 1999-08-17 | Rohm Co. Ltd. | Thermal printhead, substrate for the same and method for making the substrate |
| EP0858894A3 (en) * | 1997-01-31 | 1999-10-13 | Kyocera Corporation | Member having ultrafine groove, member for passage, method of manufacturing the same, ink jet printer head using the same, and ink jet printer head |
-
1990
- 1990-03-12 JP JP6066290A patent/JPH03261565A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5940109A (en) * | 1994-05-31 | 1999-08-17 | Rohm Co. Ltd. | Thermal printhead, substrate for the same and method for making the substrate |
| EP0858894A3 (en) * | 1997-01-31 | 1999-10-13 | Kyocera Corporation | Member having ultrafine groove, member for passage, method of manufacturing the same, ink jet printer head using the same, and ink jet printer head |
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