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JPH03243786A - Production of metallic mold - Google Patents

Production of metallic mold

Info

Publication number
JPH03243786A
JPH03243786A JP3828090A JP3828090A JPH03243786A JP H03243786 A JPH03243786 A JP H03243786A JP 3828090 A JP3828090 A JP 3828090A JP 3828090 A JP3828090 A JP 3828090A JP H03243786 A JPH03243786 A JP H03243786A
Authority
JP
Japan
Prior art keywords
mold
ceramic film
shell
forming
master pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3828090A
Other languages
Japanese (ja)
Inventor
Yasuhiro Masumoto
康洋 増本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sailor Pen Co Ltd
Original Assignee
Sailor Pen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sailor Pen Co Ltd filed Critical Sailor Pen Co Ltd
Priority to JP3828090A priority Critical patent/JPH03243786A/en
Publication of JPH03243786A publication Critical patent/JPH03243786A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To uniformly form a ceramic film on the deep groove, etc., of a metallic mold at the time of forming the ceramic film on the recessed forming surface of the mold by forming the ceramic film on the projecting surface of a master pattern, forming a backup shell thereon and then removing the pattern by dissolution so as to incorporate into the concave part of the mold. CONSTITUTION:A high-hardness and smooth ceramic film of TiC, TiN, etc., low in frictional force is formed on the forming surface of a metallic mold having a deep groove and a hole. In this case, a master pattern 1 having the protrusions 11 and 12 corresponding to the recessed part of the metallic mold 4 consisting of a hole 51 and a groove 52 is formed with Al. A hard ceramic film 2 of TiN, TiC, etc., is vapor-deposited on the surface by ion plating, etc., Ti and Ni are further deposited thereon, a backup shell 3 of Ni is electrocast, the Al pattern 1 is dissolved in aq. sodium hydroxide and removed, and the shell 3 is cut to a specified size and incorporated into the metallic mold main body 4.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、成形面が凹状をした金型のS遣方法に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for using a mold having a concave molding surface.

〔従来技術とその問題点〕[Prior art and its problems]

例えば合成樹脂射出成形用金型の成形面の表面に、Ti
CやTiNなどのセラミック皮膜をイオンプレーティン
グ法などのPVD (物理蒸着)処理で蒸着すると、こ
れらのセラミック皮膜がきわめて硬度が高くてその表面
が平滑であるので、摩擦力と離型力が小さくなり、離型
時の成形品の損傷率が低下し、サイクルタイムも短縮で
きる。また、金型内のメルトから遊離した付着物の発生
も少なくなり、付着物の除去作業が不要でダウンタイム
も短縮される。更には、金型内のメルトフローが長くな
るので、圧力損失、温度分布の不均一、肉厚の不揃いな
どが救済されて成形不良が減少し、熱ガスに対する耐食
性も大きく改善される利点がある。
For example, Ti is applied to the molding surface of a synthetic resin injection mold.
When ceramic coatings such as C or TiN are deposited using PVD (physical vapor deposition) treatment such as ion plating, these ceramic coatings have extremely high hardness and smooth surfaces, so frictional force and mold release force are small. This reduces the damage rate of molded products during mold release and shortens cycle time. In addition, the occurrence of deposits released from the melt in the mold is reduced, and there is no need to remove deposits, reducing downtime. Furthermore, since the melt flow within the mold becomes longer, pressure loss, uneven temperature distribution, uneven wall thickness, etc. are alleviated, reducing molding defects, and corrosion resistance against hot gas is also greatly improved. .

プレス用金型にセラミック皮膜を蒸着した場合にも、冷
間溶着が減少し、粘着摩耗も減少するので、マイクロク
ラック発生後の表面脱落が遅くなり、セラミック皮膜を
蒸着することにより初めて加工が可能になった例も多い
When a ceramic film is deposited on a press mold, cold welding and adhesive wear are also reduced, which slows down the surface shedding after microcracks occur, making it possible to process the product for the first time by depositing a ceramic film. There are many cases where this has happened.

ところで、イオンプレーティング法などのPvD処理は
、処理品の深い溝や孔内面ないしその孔底面などには磁
場が十分に形成されないので、イオンがこれらの部位に
到達しにくく、所要膜厚の確保が困難であり、密着性も
十分でない不具合がある。従って、成形面が凹状をした
金型(母型)の成形面にセラミック皮膜を蒸着するとき
、深い溝や孔内面などに十分にコーティングできず、前
記の利点を十分に得ることができない、このため。
By the way, in PvD processing such as the ion plating method, a sufficient magnetic field is not formed in the deep grooves of the processed product, the inner surfaces of the holes, or the bottom surfaces of the holes, so it is difficult for ions to reach these parts, making it difficult to secure the required film thickness. There are problems in that it is difficult to adhere and the adhesion is not sufficient. Therefore, when a ceramic film is deposited on the molding surface of a mold (matrix) with a concave molding surface, it is difficult to coat the deep grooves and inner surfaces of holes, and the above advantages cannot be fully obtained. For.

金型を割り型にし、深い溝や孔などを解消して蒸着した
り、CVD (化学蒸着)処理で蒸着しているが、割り
型にすると金型コストが高くなり、またCVD処理は処
理品を高温に加熱する必要があり、特殊な場合しか行わ
れていない。
The mold is made into a split mold to eliminate deep grooves and holes before vapor deposition, or CVD (chemical vapor deposition) is used to deposit the mold, but split molds increase the cost of the mold, and CVD processing also reduces the cost of the treated product. It requires heating to high temperatures and is only used in special cases.

〔発明の目的〕[Purpose of the invention]

そこで本発明は、成形面が凹状をした金型の深い溝や孔
内面などにもセラミック皮膜が十分にコーティングされ
た金型の製造方法を提偶することを目的とする。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing a mold in which the deep grooves and inner surfaces of holes of a mold having a concave molding surface are sufficiently coated with a ceramic film.

〔発明の構成とその作用〕[Structure of the invention and its effects]

本発明の金型の製造方法は、凸状のマスターパターンの
表面にセラミック皮膜をイオンプレーティング法などの
PVD処理で蒸着する工程と、セラミック皮膜の上に電
鋳法などでバックアップシェルを形成する工程と、バッ
クアップシェルが密着したセラミック皮膜からマスター
パターンを除去する工程と、バックアップシェルを金型
本体の凹部に組み込む工程を含むことを特徴とするもの
である。
The mold manufacturing method of the present invention includes a step of depositing a ceramic film on the surface of a convex master pattern using a PVD process such as ion plating, and forming a backup shell on the ceramic film using an electroforming method or the like. The method is characterized by comprising a step of removing the master pattern from the ceramic film to which the backup shell is adhered, and a step of incorporating the backup shell into the recess of the mold body.

すなわち、成形面が凹状をした金型用のマスターパター
ンは凸状であり、金型の深い溝や孔に対応する部位は突
条や突起になる。このため、イオンプレーティング法な
どのPVD処理でマスターパターンの全表面に均一にセ
ラミック皮膜をコーティングできる。そして、このセラ
ミック皮膜にバックアップシェルを密着させ、マスター
パターンを除去した後、バックアップシェルを金型本体
の凹部に組み込むので、完成した金型の深い溝や孔内面
などにもセラミック皮膜が均一にコーティングされてい
る。
That is, a master pattern for a mold with a concave molding surface is convex, and the portions corresponding to the deep grooves and holes of the mold become ridges and protrusions. Therefore, the entire surface of the master pattern can be uniformly coated with a ceramic film by PVD treatment such as ion plating. Then, after the backup shell is brought into close contact with this ceramic film and the master pattern is removed, the backup shell is incorporated into the recessed part of the mold body, so the ceramic film is evenly coated on the deep grooves and inner surfaces of the holes in the completed mold. has been done.

〔実施例〕〔Example〕

以下に図面に示す実施例に基いて本発明を具体的に説明
する。
The present invention will be specifically described below based on embodiments shown in the drawings.

(1)マスターパターン アルミからなるマスターパターン1は、第1図(A)に
示すように、成形面が凹状をした金型の深い孔に対応す
る突起11と金型の溝に対応する環状突起12が形成さ
れており、全体的に凸状をしている。
(1) Master pattern As shown in FIG. 1(A), the master pattern 1 made of aluminum has a protrusion 11 corresponding to the deep hole of the mold with a concave molding surface and an annular protrusion corresponding to the groove of the mold. 12 is formed and has a convex shape as a whole.

(2)セラミック皮膜の蒸着 このマスターパターンエの表面に、第1図(B)に示す
ように、アーク放電型イオンプレーティング装置を使用
して次の条件でセラミック皮膜2を蒸着した。
(2) Vapor deposition of ceramic film As shown in FIG. 1(B), ceramic film 2 was vapor-deposited on the surface of this master pattern using an arc discharge type ion plating apparatus under the following conditions.

基板電圧     50V イオン化電圧   45V イオン化電流   70A 基板温度    200℃ 真空度    5 X 10−’Torrかかる条件下
で窒素ガスを導入し、135m1n。
Substrate voltage: 50V Ionization voltage: 45V Ionization current: 70A Substrate temperature: 200°C Vacuum degree: 5 x 10-'Torr Nitrogen gas was introduced under the following conditions to 135 m1n.

処理すると、膜厚が約3μ鳳のTiN皮膜がマスターパ
ターン1の全表面に均一に蒸着される。セラミック皮膜
2はTiN に限られず、TiC,T1CNの外に、Z
r、Hf、Nb、W、Ta、Vなどの金属およびその合
金の窒化物、炭化物、酸化物などを利用することができ
る。
During the treatment, a TiN film having a thickness of about 3 μm is uniformly deposited on the entire surface of the master pattern 1. The ceramic film 2 is not limited to TiN, and in addition to TiC and T1CN, Z
Nitride, carbide, oxide, etc. of metals such as r, Hf, Nb, W, Ta, and V, and their alloys can be used.

本実施例では1次に説明するバックアップシェル3をN
iの電鋳法で形成するので、セラミック皮膜2とバック
アップシェル3の密着性を向上させるために、TiN 
の上にTiを蒸着し、さらにその上にNiを蒸着する。
In this embodiment, the backup shell 3 to be explained next is N
Since it is formed by the electroforming method of i, TiN is used to improve the adhesion between the ceramic film 2 and the backup shell 3.
Ti is vapor-deposited on top of it, and Ni is further vapor-deposited on top of it.

つまり、窒素ガスの導入量を徐々に減らして1oili
n、で零にすると、その間にTiN が減少してTiが
徐々に増加し、次の10+in、でTiのみの皮膜が形
成される。そして、次のLogin、でTiとNiを、
Tiが減少してNiが徐々に増加するように蒸着させ、
最後の10+in、でNiのみを蒸着し、最外側をNi
皮膜にする。
In other words, by gradually reducing the amount of nitrogen gas introduced,
When n is set to zero, TiN decreases and Ti gradually increases, and in the next 10+ inches, a film consisting only of Ti is formed. Then, in the next Login, Ti and Ni,
Deposited so that Ti decreases and Ni gradually increases,
Only Ni is evaporated in the last 10+ inches, and the outermost layer is covered with Ni.
Make it into a film.

なお、セラミック皮膜2を蒸着するのは、イオンプレー
ティング法に限られず、真空蒸着法、スパッタリング法
、レーザー物理蒸着法などのPvD処理にて行うことが
できる。
Note that the method for depositing the ceramic film 2 is not limited to the ion plating method, and may be performed by a PvD process such as a vacuum deposition method, a sputtering method, or a laser physical vapor deposition method.

(3)バックアップシェルの形成 次の条件で240時間電鋳すると、第1図(C)に示す
ように、膜厚が約12mmのNiからなるバックアップ
シェル3が形成され、セラミック皮膜2に密着する。
(3) Formation of backup shell After electroforming for 240 hours under the following conditions, a backup shell 3 made of Ni with a thickness of about 12 mm is formed and adheres closely to the ceramic coating 2, as shown in Figure 1 (C). .

スルファミン酸ニッケル 300 g / Q 塩酸ニッケル  30 g / Q ホウ酸    40 g / Q pH4,0 浴温度     50℃ 電流密度     8A/dボ バックアップシェル3を形成するのは、電鋳法に限られ
ず、溶射法、HIPやSIPなどのプレス法、硬質樹脂
などで行うことができる。
Nickel sulfamate 300 g / Q Nickel hydrochloride 30 g / Q Boric acid 40 g / Q pH 4,0 Bath temperature 50°C Current density 8 A/d The method for forming the back-up shell 3 is not limited to electroforming, but also thermal spraying. , a pressing method such as HIP or SIP, or a hard resin.

(4)マスターパターンの除去と組立 機に、水酸化ナトリウム(30g/R)に浸漬すると、
アルミからなるマスターパターン1が溶解して除去され
、セラミック皮11512が密着したバックアップシェ
ル3が残る。そして、その外周を所定の寸法に削除して
第1図(D)に示す状態にし。
(4) When immersing the master pattern in sodium hydroxide (30g/R) in the removal and assembly machine,
The master pattern 1 made of aluminum is melted and removed, leaving the backup shell 3 to which the ceramic skin 11512 is adhered. Then, the outer periphery is removed to a predetermined size to create the state shown in FIG. 1(D).

これを、第1図(E)に示すように、金型本体4の凹部
に組み込むと金型が完成する。なお、バックアップシェ
ル3の外周を所定の寸法に削除してからマスターパター
ン1を除去し、しかる後、金型本体4の凹部に組み込ん
でもよい。
When this is assembled into the recess of the mold body 4 as shown in FIG. 1(E), the mold is completed. Note that the outer periphery of the backup shell 3 may be removed to a predetermined size, the master pattern 1 may be removed, and then the back-up shell 3 may be incorporated into the recessed portion of the mold body 4.

このように、セラミック皮膜2がマスターパターン1上
に均一に形成されるので、完成した金型の深い孔51や
溝52の表面にも均一なセラミック皮膜2が形成され、
成形面の硬度がきわめて大きい金型にすることができる
In this way, since the ceramic film 2 is uniformly formed on the master pattern 1, a uniform ceramic film 2 is also formed on the surfaces of the deep holes 51 and grooves 52 of the completed mold.
It is possible to create a mold with an extremely hard molding surface.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明の金型の製造方法は、凸状
のマスターパターンの表面にセラミック皮膜をイオンプ
レーティング法などのPVD処理で蒸着し、このセラミ
ック皮膜にバックアップシェルを密着させ、マスターパ
ターンを除去した後、バックアップシェルを金型本体の
凹部に組み込むようにしたので、成形面が凹状をした金
型の深い溝や孔内面などにもセラミック皮膜を均一に形
成することができる。
As explained above, the mold manufacturing method of the present invention involves depositing a ceramic film on the surface of a convex master pattern using a PVD process such as ion plating, bringing a backup shell into close contact with this ceramic film, and After removing the pattern, the backup shell is incorporated into the concave part of the mold body, so it is possible to uniformly form a ceramic coating even on the deep grooves and inner surfaces of holes in the mold, which has a concave molding surface.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(A)〜(E)は本発明実施例の工程説明図であ
る。 1・・・マスターパターン  2・・・セラミック皮膜
3・・・バックアップシェル 4・・・金型本体第i図 (C)
FIGS. 1(A) to 1(E) are process explanatory diagrams of an embodiment of the present invention. 1... Master pattern 2... Ceramic film 3... Backup shell 4... Mold body Figure i (C)

Claims (1)

【特許請求の範囲】 凸状のマスターパターンの表面にセラミック皮膜をイオ
ンプレーティング法などのPVD処理で蒸着する工程と
、 セラミック皮膜の上に電鋳法などでバックアップシェル
を形成する工程と。 バックアップシェルが密着したセラミック皮膜からマス
ターパターンを除去する工程と、 バックアップシェルを金型本体の凹部に組み込む工程と
、 を含むことを特徴とする金型の製造方法。
[Claims] A step of depositing a ceramic film on the surface of a convex master pattern by a PVD process such as an ion plating method, and a step of forming a backup shell on the ceramic film by an electroforming method or the like. A method for manufacturing a mold, comprising the steps of: removing a master pattern from a ceramic film to which a backup shell is adhered; and incorporating the backup shell into a recess of a mold body.
JP3828090A 1990-02-21 1990-02-21 Production of metallic mold Pending JPH03243786A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3828090A JPH03243786A (en) 1990-02-21 1990-02-21 Production of metallic mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3828090A JPH03243786A (en) 1990-02-21 1990-02-21 Production of metallic mold

Publications (1)

Publication Number Publication Date
JPH03243786A true JPH03243786A (en) 1991-10-30

Family

ID=12520906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3828090A Pending JPH03243786A (en) 1990-02-21 1990-02-21 Production of metallic mold

Country Status (1)

Country Link
JP (1) JPH03243786A (en)

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