JPH03241894A - Electronic component module - Google Patents
Electronic component moduleInfo
- Publication number
- JPH03241894A JPH03241894A JP4011090A JP4011090A JPH03241894A JP H03241894 A JPH03241894 A JP H03241894A JP 4011090 A JP4011090 A JP 4011090A JP 4011090 A JP4011090 A JP 4011090A JP H03241894 A JPH03241894 A JP H03241894A
- Authority
- JP
- Japan
- Prior art keywords
- metal case
- hole
- electronic component
- component module
- saw filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品モジュールに関し、特に５ＡＷ（弾性
表面波素子）フィルターを有し、金属ケースでシールド
する必要のある電子部品モジュールに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component module, and particularly to an electronic component module that has a 5AW (surface acoustic wave element) filter and needs to be shielded with a metal case.
第３図は従来の電子部品モジュールの一例を示す断面図
である。従来、この種の電子部品モジュールは、ＳＡＷ
フィルター１１の実装されたプリント基板１２のグラウ
ンドとプリント基板１２を囲う金属ケース１３とを半田
付は後、金属カバー１４を金属ケース１３に半田付けす
ることによりシールドしていた。FIG. 3 is a sectional view showing an example of a conventional electronic component module. Conventionally, this type of electronic component module is SAW
After the ground of the printed circuit board 12 on which the filter 11 is mounted and the metal case 13 surrounding the printed circuit board 12 are soldered, a metal cover 14 is soldered to the metal case 13 for shielding.
上述した従来の電子部品モジュールは、小型化を計るた
めにプリント基板を小さくすると、ＳＡＷフィルターに
つながるプリント基板のグラウンドパターンが細くなり
インダクタンスを持ってしまうため、ＳＡＷフィルター
のグラウンドが不十分となり、ＳＡＷフィルターの特性
が劣化してしまう可能性があるという欠点がある。In the conventional electronic component module described above, when the printed circuit board is made smaller in order to achieve miniaturization, the ground pattern of the printed circuit board connected to the SAW filter becomes thinner and has inductance, resulting in insufficient grounding for the SAW filter and The drawback is that the characteristics of the filter may deteriorate.
本発明の電子部品モジュールは、穴を有した金属ケース
と、前記金属ケースに囲まれ且つ前記穴から上部をのぞ
かせた弾性表面波素子フィルターを実装したプリント基
板と、前記金属ケースと前記弾性表面波素子フィルター
とを導通させる半田とを備えている。The electronic component module of the present invention includes a metal case having a hole, a printed circuit board mounted with a surface acoustic wave element filter surrounded by the metal case and whose upper part is peeked through the hole, and the metal case and the surface acoustic wave element filter. The element filter is provided with solder for electrical conduction with the element filter.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図及び第２図は本発明の一実施例の平面図及び断面
図である。1 and 2 are a plan view and a sectional view of an embodiment of the present invention.
ＳＡＷフィルター１は円柱形の本体と入出力リード端子
を有した小型のフィルターであり、プリント基板２はＳ
ＡＷフィルター１及び抵抗、トランジスタ、コンデンサ
等の部品を実装して回路を構成するものであり、また金
属ケース３と金属カバー４は内部と外部を遮断して各々
の影響を受けないようにするためのものである。金属ケ
ース３の上面に明けられた穴５はＳＡＷフィルター１の
上部をのぞかせるためのものであり、この穴５の部分に
おいて゛半田６により金属ケース３とＳＡＷフィルター
１を半田付けし、両者を導通させる。The SAW filter 1 is a small filter with a cylindrical body and input/output lead terminals, and the printed circuit board 2 is an SAW filter.
The AW filter 1 and components such as resistors, transistors, and capacitors are mounted to form a circuit, and the metal case 3 and metal cover 4 are used to isolate the inside and outside so that they are not influenced by each other. belongs to. A hole 5 made on the top surface of the metal case 3 is for peeking through the top of the SAW filter 1, and in this hole 5, the metal case 3 and the SAW filter 1 are soldered with solder 6, and the two are electrically connected. let
以上説明したように本発明は、金属ケースに穴をあけて
、その穴から上部をのぞかせたＳＡＷフィルターを金属
ケースと半田付けすることにより、金属ケースに半田付
けされたプリント基板のグラウンドパターンと、ＳＡＷ
フィルターのグラウンドとを金属ケースを介して広く導
通させることが出来るために、プリント基板のグラウン
ドパターンとＳＡＷフィルターのグラウンド間のインダ
クタンスが小さくなり、ＳＡＷフィルターの本来の特性
が得られる効果がある。また金属ケースに穴をあけ、そ
の穴からＳＡＷフィルターをのぞかせているため、従来
の電子部品モジュールよりも金属ケースの厚さ分だけ全
体の厚さを薄くすることが出来、高密度に電子部品モジ
ュールを実装する際に有効である。As explained above, the present invention makes a hole in a metal case, and by soldering the SAW filter whose upper part is peeked through the hole to the metal case, the ground pattern of the printed circuit board soldered to the metal case, SAW
Since the ground of the filter can be widely electrically connected through the metal case, the inductance between the ground pattern of the printed circuit board and the ground of the SAW filter is reduced, and the original characteristics of the SAW filter can be obtained. In addition, since a hole is made in the metal case and the SAW filter is peeked through the hole, the overall thickness can be reduced by the thickness of the metal case compared to conventional electronic component modules, allowing for a high-density electronic component module. It is effective when implementing.
第１図及び第２図は本発明の一実施例の平面図及び断面
図、第３図は従来の電子部品モジュールの一例を示す断
面図である。
１．１１・・・ＳＡＷフィルター ２，１２・・・プリ
ント基板、３，１３・・・金属ケース、４，１４・・・
金属カバー ５・・・穴、６・・・半田。1 and 2 are a plan view and a sectional view of an embodiment of the present invention, and FIG. 3 is a sectional view showing an example of a conventional electronic component module. 1.11...SAW filter 2,12...Printed circuit board, 3,13...Metal case, 4,14...
Metal cover 5...hole, 6...solder.
Claims (1)
前記穴から上部をのぞかせた弾性表面波素子フィルター
を実装したプリント基板と、前記金属ケースと前記弾性
表面波素子フィルターとを導通させる半田とを備えるこ
とを特徴とする電子部品モジュール。A metal case having a hole, a printed circuit board mounted with a surface acoustic wave element filter surrounded by the metal case and whose upper part is peeked through the hole, and solder for electrically connecting the metal case and the surface acoustic wave element filter. An electronic component module comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4011090A JPH03241894A (en) | 1990-02-20 | 1990-02-20 | Electronic component module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4011090A JPH03241894A (en) | 1990-02-20 | 1990-02-20 | Electronic component module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03241894A true JPH03241894A (en) | 1991-10-29 |
Family
ID=12571720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4011090A Pending JPH03241894A (en) | 1990-02-20 | 1990-02-20 | Electronic component module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03241894A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01276911A (en) * | 1988-04-28 | 1989-11-07 | Matsushita Electric Ind Co Ltd | Filter device |
-
1990
- 1990-02-20 JP JP4011090A patent/JPH03241894A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01276911A (en) * | 1988-04-28 | 1989-11-07 | Matsushita Electric Ind Co Ltd | Filter device |
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