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JPH01276911A - Filter device - Google Patents

Filter device

Info

Publication number
JPH01276911A
JPH01276911A JP10636188A JP10636188A JPH01276911A JP H01276911 A JPH01276911 A JP H01276911A JP 10636188 A JP10636188 A JP 10636188A JP 10636188 A JP10636188 A JP 10636188A JP H01276911 A JPH01276911 A JP H01276911A
Authority
JP
Japan
Prior art keywords
case
shield case
filter
saw filter
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10636188A
Other languages
Japanese (ja)
Inventor
Kazuhiko Kubo
一彦 久保
Michirou Yamashita
山下 路郎
Akira Mishima
三島 昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10636188A priority Critical patent/JPH01276911A/en
Publication of JPH01276911A publication Critical patent/JPH01276911A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To prevent the production of signal-through between the input and output and the mismatching at an input/output terminal from being caused by providing a metallic piece for earthing through the use of a shield case and soldering the piece with the metallic case of an SAW filter. CONSTITUTION:A metallic plate 2 utilizing part of a shield case 1 and a metallic case of an SAW filter 4 are soldered. That is, the metallic plate 2 is formed incorporatedly with the shield case 1 in the same direction as the part of leg inserted to a printed circuit board 5, folded further by 90 deg., the end of the earth metallic plate 2 is arranged so as to nearly in contact with a guard of the metallic case of the SAW filter 4 when each terminal of the SAW filter 4 and the leg of the shield case 1 are inserted respectively to the printed circuit board 5 and the contact part is soldered from the upper part. Thus, excellent grounding is obtained by a simple method.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、テレビジョン受像機の映像中間周波増幅回路
(以下VIP回路と略す)や、衛星放送受信機の第2中
間周波増幅回路等に使用される弾性表面波フィルタ(以
下SAWフィルタと略す)を用いたフィルタ装置に関す
るものである。
[Detailed Description of the Invention] Industrial Application Field The present invention is used in a video intermediate frequency amplification circuit (hereinafter abbreviated as VIP circuit) of a television receiver, a second intermediate frequency amplification circuit of a satellite broadcasting receiver, etc. The present invention relates to a filter device using a surface acoustic wave filter (hereinafter abbreviated as SAW filter).

従来の技術 近年、SAWフィルタが電極形成技術の進歩により高い
周波数領域まで歩留りよく廉価に量産されるようになり
、LCフィルタに代って、手軽に利用できるようになっ
てきた。中でも、金属ケースに封入されたタイプのSA
Wフィルタは広く使用されており、−収約には、基板孔
に挿入して、裏面側のプリント箔で、デイツプハンダ付
は等により、回路が形成される。
BACKGROUND OF THE INVENTION In recent years, advances in electrode formation technology have enabled SAW filters to be mass-produced at high yields and at low cost up to high frequency ranges, and have become easy to use in place of LC filters. Among them, the type of SA enclosed in a metal case
W filters are widely used, and a circuit is formed by inserting them into a hole in a board, printing foil on the back side, dip soldering, etc.

以下、図面を参照しながら、上述したような従  。Hereinafter, with reference to the drawings, the following will be described.

来のフィルタ装置について説明を行なう。第2図は従来
のフィルタ装置の実装状態を示したもので、基板の裏面
側よりみたものである。第2図において、1はVIF回
路を囲むシールドケース、2はアース用のプリント箔、
3は表側より挿入されたSAWフィルタ、4はVIP回
路のIC,5は7’リント基板である。
A conventional filter device will be explained below. FIG. 2 shows the mounting state of a conventional filter device, as seen from the back side of the board. In Figure 2, 1 is a shield case surrounding the VIF circuit, 2 is a printed foil for grounding,
3 is a SAW filter inserted from the front side, 4 is a VIP circuit IC, and 5 is a 7' lint board.

以上のように構成されたフィルタ装置において、SAW
フィルタ3には例えば4つの端子があり、図中、Aは入
力、B、Cは出力、Dはアース端子である。B、Cの出
力はVIF用IC4の平衡入力端子に接続される。又、
Dの端子はアース箔2に接続され、シールドケース1の
足等に接続されていく。このような構成により、Aの端
子に接続された入力信号は、SAWフィルタ3を経てI
C4に入力される。
In the filter device configured as described above, the SAW
The filter 3 has, for example, four terminals; in the figure, A is an input, B and C are outputs, and D is a ground terminal. The outputs of B and C are connected to the balanced input terminal of the VIF IC4. or,
The terminal D is connected to the ground foil 2, and then to the legs of the shield case 1, etc. With such a configuration, the input signal connected to the terminal of A passes through the SAW filter 3 and is sent to I.
It is input to C4.

発明が解決しようとする課題 しかしながら、上記のような構成では、フィルタ特性が
十分に得られないという問題点を有していた。
Problems to be Solved by the Invention However, the above configuration has a problem in that sufficient filter characteristics cannot be obtained.

第3図にフィルタの特性図を示すが、実線(()はSA
Wフィルタ単体の本来の特性図で、破線(ロ)は第2図
の構成法による特性図を示している。(ロ)の場合には
、帯域内においては反射によるリップルを生じ、帯域外
においては減衰度が十分でなく、本来より約1odB位
悪化することになり、妨害性能が著しく劣化する。
Figure 3 shows the characteristic diagram of the filter, where the solid line (() indicates SA
This is the original characteristic diagram of the W filter alone, and the broken line (b) shows the characteristic diagram obtained by the configuration method shown in FIG. In the case of (b), ripples occur within the band due to reflection, and outside the band, the attenuation is insufficient, making the signal about 1 odB worse than it should be, resulting in a significant deterioration of the jamming performance.

このような現象が生じる原因は、フィルタ自体の接地が
十分でないことから入出力間の信号スルーを生じたり、
入出力端子でのミスマツチングを生じるためである。
The reason for this phenomenon is that the filter itself is not sufficiently grounded, resulting in signal through between the input and output.
This is because mismatching occurs at the input/output terminals.

第2図において、SAWのアース端子りはアース箔2を
通じてシールドケース5に接続されているが、箔が細く
て長いためその導体インピーダンスが高くなり、十分な
接地特性が得られなくなる。
In FIG. 2, the ground terminal of the SAW is connected to the shield case 5 through the ground foil 2, but since the foil is thin and long, its conductor impedance becomes high, making it impossible to obtain sufficient grounding characteristics.

又、プリント基板上には、多くの回路部品がつめて配置
されるため、太いアース箔を何本も形成することは不可
能であり、上記のような問題は避けられない。
Furthermore, since many circuit components are arranged close together on a printed circuit board, it is impossible to form many thick ground foils, and the above-mentioned problems are unavoidable.

本発明は、上記問題点に鑑み、本来のフィルタ特性を発
揮できるフィルタ装置を提供することを目的とするもの
である。
SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a filter device that can exhibit its original filter characteristics.

課題を解決するための手段 この目的を達成するために、本発明のフィルタ装置は、
シールドケースの一部を利用した金属板と、SAWフィ
ルタの金属ケースをハンダ付けにより接続した構造で構
成されている。
Means for Solving the Problems To achieve this object, the filter device of the invention comprises:
It consists of a metal plate using a part of the shield case and the metal case of the SAW filter connected by soldering.

作  用 このような構成によって、良好な接地状態が得られるた
め1本来のフィルタ特性が得られることとなる。
Function: With such a configuration, a good grounding condition can be obtained, so that the original filter characteristics can be obtained.

実施例 以下、本発明の一実施例について、図面を参照しながら
説明する。第1図は本発明の一実施例におけるフィルタ
装置を示すものである。
EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 shows a filter device in one embodiment of the present invention.

第1図において、1はシールドケース、2はシールドケ
ース1に一体に形成したアース強化用の金属板、3はハ
ンダ、4はアース端子となる金属ケースをもつSAWフ
ィルタ、6はプリント基板である。
In Fig. 1, 1 is a shield case, 2 is a metal plate for strengthening the ground formed integrally with the shield case 1, 3 is solder, 4 is a SAW filter with a metal case that serves as a ground terminal, and 6 is a printed circuit board. .

以上のように構成されたフィルタ装置について、以下そ
の動作について説明する。第1図において、(6)は構
成の断面図、(Fりは平面図、(Qはシールドケースの
展開図を示す。第1図(qにおいて、プリント基板6に
挿入する足の部分と同一方向に、金属板2をシールドケ
ース1と一体に形成してさらに90度折り曲げ、第1図
(ト)に示すように、プリント基板6にSAWフィルタ
4の各端子とシールドケース10足をそれぞれ挿入した
時、アース用金属板2の端がSAWフィルタ4の金属ケ
ースのツバの部分とほぼ接触するように配置し、上から
接触部分を第1図(B)で示すようにノ・ンダ付けする
The operation of the filter device configured as described above will be explained below. In Figure 1, (6) is a cross-sectional view of the configuration, (F is a plan view, and (Q is a developed view of the shield case. Form the metal plate 2 integrally with the shield case 1, bend it further 90 degrees, and insert each terminal of the SAW filter 4 and 10 pairs of the shield cases into the printed circuit board 6, as shown in FIG. 1 (G). When this happens, the end of the grounding metal plate 2 is placed so that it is almost in contact with the brim of the metal case of the SAW filter 4, and the contact part is soldered from above as shown in Figure 1 (B). .

以上のような実施例によれば、良好な接地が簡単な方法
で得られるため、本来の帯域内及び帯域外での特性が得
られる。
According to the embodiments described above, good grounding can be obtained in a simple manner, so that the original in-band and out-of-band characteristics can be obtained.

発明の効果 以上のように、本発明によれば、シールドケースを利用
してアース用の金属片を設け、SAWフィルタの金属ケ
ースとノ−ンダ付けすることにより、本来の良好なフィ
ルタ特性を得ることができ、その実用的効果は大なるも
のがある。
Effects of the Invention As described above, according to the present invention, original good filter characteristics can be obtained by providing a metal piece for grounding using the shield case and bonding it to the metal case of the SAW filter. It can be done, and its practical effects are great.

本発明の場合、金属片はシールドケースの足の部分と同
方向に設けるので、材料的なロスも少なく、又、側面か
らの切起しの時に生じるようなケース自体に孔があくこ
ともない。
In the case of the present invention, the metal pieces are provided in the same direction as the legs of the shield case, so there is less material loss, and there is no hole in the case itself, which occurs when cutting and raising from the side. .

又、ハンダ付けはSAWフィルタの頭の部分で行なうこ
とも考えられるが、SAWのチップ、およびアース用の
端子等が、金属ケースの下部に位置している為、ツバの
部分で接地する方が効果が大きく、その意味でも、本装
置は効果的である。
Also, it is possible to solder at the head of the SAW filter, but since the SAW chip and grounding terminal are located at the bottom of the metal case, it is better to ground at the brim. The effect is large, and in that sense, the present device is effective.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例におけるフィルタ装置の側面
図と平面図及びシールドケースの展開図、第2図は従来
例のフィルタ装置の基板裏面側よりみた裏面図、第3図
はSAWフィルタの特性図である。 1・・・・・・シールドケース、2・・・・・・アース
強化用金属板%3・・・・・・ハンダ、4・・・・・・
SAWフィルタ、5・・・・・・プリント基板。 代理人の氏名、弁理士 中 尾 敏 男 ほか1名f−
−シールy7−ス 4−−−.5AW74Aグ 5・・−アシンに基仮
Fig. 1 is a side view, a plan view, and a developed view of a shield case of a filter device according to an embodiment of the present invention, Fig. 2 is a rear view of a conventional filter device as seen from the back side of the substrate, and Fig. 3 is a SAW filter. FIG. 1...Shield case, 2...Metal plate for ground reinforcement %3...Solder, 4...
SAW filter, 5... Printed circuit board. Name of agent, patent attorney Toshio Nakao and 1 other person f-
-Seal y7-s4---. 5AW74Ag5...-Based on Asin

Claims (1)

【特許請求の範囲】[Claims] 金属ケースを有する弾性表面波フィルタと、シールドケ
ースと、プリント基板とで構成され、上記シールドケー
スにはプリント基板への挿入足と同方向に接地用の金属
板が一体に設けられ、この金属板が水平に折曲げられ、
上記フィルタの端子とシールドケースの挿入足が上記基
板に挿入され、接地用金属板が基板表面側にくるように
配置され、上記接地用金属板の先端部分と上記フィルタ
の金属ケースの底部とがほぼ接触するようになされ、こ
の接触部分がハンダ付けされてなるフィルタ装置。
It is composed of a surface acoustic wave filter having a metal case, a shield case, and a printed circuit board, and the shield case is integrally provided with a metal plate for grounding in the same direction as the foot inserted into the printed circuit board. is bent horizontally,
The terminal of the filter and the insertion foot of the shield case are inserted into the board, the grounding metal plate is placed on the front side of the board, and the tip of the grounding metal plate is connected to the bottom of the filter's metal case. A filter device in which the contact portions are soldered.
JP10636188A 1988-04-28 1988-04-28 Filter device Pending JPH01276911A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10636188A JPH01276911A (en) 1988-04-28 1988-04-28 Filter device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10636188A JPH01276911A (en) 1988-04-28 1988-04-28 Filter device

Publications (1)

Publication Number Publication Date
JPH01276911A true JPH01276911A (en) 1989-11-07

Family

ID=14431601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10636188A Pending JPH01276911A (en) 1988-04-28 1988-04-28 Filter device

Country Status (1)

Country Link
JP (1) JPH01276911A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113391U (en) * 1989-02-23 1990-09-11
JPH03241894A (en) * 1990-02-20 1991-10-29 Nec Corp Electronic component module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113391U (en) * 1989-02-23 1990-09-11
JPH03241894A (en) * 1990-02-20 1991-10-29 Nec Corp Electronic component module

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