JPH031931A - Thermal seal device - Google Patents
Thermal seal deviceInfo
- Publication number
- JPH031931A JPH031931A JP1134728A JP13472889A JPH031931A JP H031931 A JPH031931 A JP H031931A JP 1134728 A JP1134728 A JP 1134728A JP 13472889 A JP13472889 A JP 13472889A JP H031931 A JPH031931 A JP H031931A
- Authority
- JP
- Japan
- Prior art keywords
- heating
- heated
- heat
- sealed
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 79
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 abstract description 6
- 230000005684 electric field Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 239000003989 dielectric material Substances 0.000 abstract 1
- 239000006260 foam Substances 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1425—Microwave radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
- B29C65/7888—Means for handling of moving sheets or webs
- B29C65/7894—Means for handling of moving sheets or webs of continuously moving sheets or webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/727—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being porous, e.g. foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
- B29C66/8341—Roller, cylinder or drum types; Band or belt types; Ball types
- B29C66/83411—Roller, cylinder or drum types
- B29C66/83413—Roller, cylinder or drum types cooperating rollers, cylinders or drums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/04—Condition, form or state of moulded material or of the material to be shaped cellular or porous
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Package Closures (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、封筒用紙、葉書用紙等の複数枚のフオーム等
の被シール物を相互に重ね合わせ、もしくは１枚の被シ
ール物を折り重ねる等の重ね合わせ状態下で加熱接着す
る加熱シール装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to stacking objects to be sealed, such as multiple sheets of foam such as envelope paper and postcard paper, or folding a single object to be sealed. This invention relates to a heat sealing device that performs heat bonding under overlapping conditions.
［従来の技術］
複数折り（２つ折り、３つ折り等）封筒、葉書等の製造
過程では、それらのフオーム（用紙）を接着する加熱シ
・−ル装置が用いられている。[Prior Art] In the manufacturing process of multi-fold (bi-fold, tri-fold, etc.) envelopes, postcards, etc., a heat sealing device is used to bond the forms.
従来の加熱シール装置は、被シール物を加熱する加熱装
置と、加熱状態にある被シール物を加圧接着する圧下装
置とを有して構成されている。A conventional heat sealing device includes a heating device that heats an object to be sealed, and a rolling device that presses and bonds the heated object to be sealed.
この時、従来の加熱シール装置にあっては、加熱装置と
して、電熱ヒータ方式を用いており、電熱ヒータを内蔵
した加熱ローラを被シール物に圧接せしめたり、電熱ヒ
ータにて生成される熱風を被シール物に吹き付ける等に
よっている。At this time, conventional heat sealing devices use an electric heater method as a heating device, in which a heating roller with a built-in electric heater is brought into pressure contact with the object to be sealed, or hot air generated by the electric heater is used. By spraying it onto the object to be sealed.
［発明が解決しようとする課題］
然しながら、上記従来の電熱ヒータ方式を用いた加熱シ
ール装置にあっては、加熱時間が長く、ラインの高速処
理化を達成するに困難かある。[Problems to be Solved by the Invention] However, in the heat sealing device using the conventional electric heater method described above, the heating time is long, making it difficult to achieve high-speed processing on the line.
又、ラインの高速処理化を実現するためには、加熱ゾー
ンを長く設定する必要があり、装置が大型化する。Furthermore, in order to achieve high-speed processing on the line, it is necessary to set a long heating zone, which increases the size of the apparatus.
本発明は、加熱シール装置において、コンパクトな装置
構成により、被シール物を急速に加熱し、高速にて加熱
接着することを目的とする。An object of the present invention is to rapidly heat an object to be sealed and heat-bond it at high speed using a compact device configuration in a heat sealing device.
［課厘を解決するための手段］
請求項１に記載の本発明は、被シール物を加熱する加熱
装置と、加熱状態にある被シール物を加圧接着する圧下
装置とを有して構成される加熱シール装置において、加
熱装置が電磁波加熱方式％式％
請求項２記載の本発明は、前記電磁波加熱方式が誘電加
熱方式であるようにしたものである。[Means for solving the problem] The present invention according to claim 1 includes a heating device that heats an object to be sealed, and a rolling device that presses and bonds the object to be sealed in a heated state. In the heating sealing apparatus, the heating device is an electromagnetic heating method.The invention according to claim 2 is characterized in that the electromagnetic heating method is a dielectric heating method.
請求項３に記載の本発明は、前記電磁波加熱方式がマイ
クロ波加熱方式であるようにしたものである。According to a third aspect of the present invention, the electromagnetic wave heating method is a microwave heating method.
［作用］
本発明によれば、被シール物は電磁波加熱方式により、
高周波或いはマイクロ波の電場に置かれることにて生ず
る誘電体損（誘電体内の分子摩擦ｔｉ ）により発熱す
ることにて加熱され、この加熱状態下て加圧されて接着
せしめられる。従って、下記■〜■の作用効果がある。[Function] According to the present invention, the object to be sealed is heated by electromagnetic waves,
When placed in a high-frequency or microwave electric field, heat is generated due to dielectric loss (molecular friction ti in the dielectric), and the material is heated, and under this heated state, it is pressed and bonded. Therefore, there are the following effects.
■電磁波加熱力式は、内部加熱方式であるから、被シー
ル物（被シール物に接着剤が塗布されている場合には接
着剤）自体が熱源であり、加熱速度が大きい。又、この
加熱の程度は、加熱電極に通じた高周波電圧、或いはマ
イクロ波電圧の強さにより自由に加減できるので、高い
電圧を与えることに°Ｃ非常に急速に加熱できるや■電
磁波加熱方式は、被シール物に接着剤か塗布されている
場合、接着剤だけを選択加熱てきる。乾燥した被シール
物は含有水分が少ないので分子間の摩擦か少なく発熱が
弱いのに対し、接着剤は非常に良く発熱するからである
。■Since the electromagnetic wave heating power type is an internal heating method, the object to be sealed (or the adhesive if adhesive is applied to the object to be sealed) itself is the heat source, and the heating rate is high. Also, the degree of this heating can be adjusted freely by the strength of the high frequency voltage or microwave voltage passed through the heating electrode, so it is possible to heat the temperature very quickly by applying a high voltage. If an adhesive is applied to the object to be sealed, only the adhesive can be selectively heated. This is because a dry object to be sealed contains less moisture and therefore generates less heat due to less friction between molecules, whereas adhesives generate heat very well.
このことは、接着剤の加熱時間が短く、より確実に高速
処理できることを意味する。This means that the heating time for the adhesive is short and high-speed processing can be performed more reliably.
又、装置の機械部品等が加熱されないので、トラブル発
生等による装置停止時の作業性を向上できる。In addition, since the mechanical parts of the device are not heated, work efficiency can be improved when the device is stopped due to trouble or the like.
■上記■、■により、加熱シール装置において、コンパ
クトな装置構成により、被シール物を急速に加熱し、高
速にて加熱接着することができる。(2) According to (2) and (2) above, in the heat sealing device, the object to be sealed can be rapidly heated and heat-bonded at high speed with a compact device configuration.
［実施例コ
第１図は本発明の第１実施例を示す側面図、第２図は第
１図の平面図、第３図は本発明の第２実施例を示す側面
図、第４図は本発明の第３実施例を示す側面図である。[Embodiment] Fig. 1 is a side view showing the first embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a side view showing the second embodiment of the invention, Fig. 4 FIG. 3 is a side view showing a third embodiment of the present invention.
（第１実施例）
第１図、及び第２図の加熱シール装置１０は、複数枚の
フオーム１１を加熱する加熱装置１２と、加熱状態にあ
るフオーム１１のシール必要部を加圧接着する上下一対
の圧下ローラ１３とを有して構成される。尚、１４はフ
オーム１１を加熱装置１２に送り込み、送り出しする上
下一対の送りローラである。尚、１１Ａは接着された帳
票である。(First Embodiment) The heating sealing device 10 shown in FIGS. 1 and 2 includes a heating device 12 that heats a plurality of foams 11, and an upper and lower end that pressure-bonds the parts of the heated foams 11 that require sealing. It is configured to include a pair of rolling down rollers 13. Note that 14 is a pair of upper and lower feed rollers that feed the foam 11 into the heating device 12 and send it out. Note that 11A is a pasted form.
然るに、加熱装置１２は、マイクロ波発振器１２Ａと、
上下一対の加熱電極１２Ｂとから構成される。この時、
加熱装置１２は、マイクロ波加熱方式によるものであり
、２個の加熱電極１２Ｂの間にフオーム１１を通し、フ
オーム１１にマイクロ波電圧（例えば９１５〜２４５０
ＭＩＩＺ）を加えることにてマイクロ波加熱するもので
ある。However, the heating device 12 includes a microwave oscillator 12A,
It is composed of a pair of upper and lower heating electrodes 12B. At this time,
The heating device 12 uses a microwave heating method, and the foam 11 is passed between two heating electrodes 12B, and a microwave voltage (for example, 915 to 2450) is applied to the foam 11.
Microwave heating is performed by adding MIIZ).
尚、加熱装置１２は、高周波発振器（１２Ａ）と、上下
一対の加熱型１（１２Ｂ）とから構成されても良い。こ
の時、加熱装置１２は、誘電加熱方式により、加熱電極
（１２Ｂ）にてフオーム１１に高周波電圧（例えば６〜
８０ Ｍ Ｉｔ ｚ ）を加えることにて誘電加熱する
ことになる。Note that the heating device 12 may include a high-frequency oscillator (12A) and a pair of upper and lower heating molds 1 (12B). At this time, the heating device 12 uses a dielectric heating method to apply a high frequency voltage (e.g.
By adding 80 M It z ), dielectric heating is performed.
次に、上記実施例の作用について説明する。Next, the operation of the above embodiment will be explained.
フオーム１１は、電磁波加熱方式により、加熱装置１２
の加熱型５１２Ｂが生成する高周波或いはマイクロ波の
電場に置かれることにて生ずる誘電体損（誘電体内の分
子摩擦損）により発熱することにて加熱され、続いて圧
下ローラ１３に送り込まれ、上記加熱状態下で加圧され
て接着せしめられる。The foam 11 is heated by a heating device 12 using an electromagnetic wave heating method.
The heating mold 512B generates heat due to dielectric loss (molecular friction loss in the dielectric) caused by being placed in a generated high frequency or microwave electric field, and is heated, and then sent to the rolling down roller 13, and then heated. Pressure is applied under heated conditions to form a bond.
この時、フオーム１１は、■合成樹脂材料からなり自ら
の熱融着にて接着し、或いは■接着剤を塗布されていて
この接着剤にて接着される。At this time, the foam 11 is (1) made of a synthetic resin material and adhered by its own heat fusion, or (2) is coated with an adhesive and is adhered with this adhesive.
従って、上記実施例によれば下記■〜■の作用効果かあ
る。Therefore, according to the above embodiment, the following effects (1) to (4) are achieved.
■電磁波加熱方式は、内部加熱方式であるから、フオー
ム１１（フオーム１１に接着剤が塗布されている場合に
は接着剤）自体が熱源であり、加熱速度が大きい。又、
この加熱の程度は、加熱電極１２ Ｂに通じた高周波電
圧、或いはマイクロ波電圧の強さにより自由に加減てき
るので、高い電圧を与えることにて非常に急速に加熱で
きる。(2) Since the electromagnetic wave heating method is an internal heating method, the foam 11 (or the adhesive if adhesive is applied to the foam 11) itself is the heat source, and the heating rate is high. or,
The degree of this heating can be adjusted freely depending on the strength of the high frequency voltage or microwave voltage passed to the heating electrode 12B, so by applying a high voltage, heating can be done very rapidly.
■電磁波加熱方式は、フオーム１１に接着剤が塗布され
ている場合、接着剤だけを選択加熱できる。乾燥したフ
オーム１１は含有水分か少ないので分子間の摩擦か少な
く発熱が弱いのに対し、接着剤は非常に良く発熱するか
らである。(2) The electromagnetic wave heating method can selectively heat only the adhesive when the foam 11 is coated with adhesive. This is because the dried foam 11 contains less water and therefore generates less heat due to less friction between molecules, whereas the adhesive generates heat very well.
このことは、接着剤の加熱時間が短く、より確実に高速
処理できることを意味する。This means that the heating time for the adhesive is short and high-speed processing can be performed more reliably.
又、装置の機械部品等が加熱されないので、トラブル発
生等による装置停止時の作業性を向上できる。In addition, since the mechanical parts of the device are not heated, work efficiency can be improved when the device is stopped due to trouble or the like.
■上記■、■により、コンパクトな装置構成により、フ
オーム１１を急速に加熱し、高速にて加熱接着すること
ができる。(2) According to (2) and (2) above, the foam 11 can be rapidly heated and bonded by heat at high speed with a compact device configuration.
（第２実施例）
第３図の加熱シール装置２０は、複数枚のフオーム２１
を加熱と同時に加圧接着する加熱兼圧下ローラ２２を有
して構成される。尚、２３はフオーム２１を加熱兼圧下
ローラ２２に送り込み、送り出しする上下一対の送りロ
ーラである。(Second Embodiment) The heat sealing device 20 shown in FIG.
It has a heating/pressing roller 22 that simultaneously heats and pressurizes and adheres. Note that 23 is a pair of upper and lower feed rollers that feed the foam 21 to the heating/pressing roller 22 and send it out.
然るに、加熱兼圧下ローラ２２は、マイクロ波発振器２
２Ａを上下一対の加熱電極を構成するローラ本体２２Ｂ
に内蔵することにて構成される。However, the heating and rolling roller 22 is powered by the microwave oscillator 2.
2A is a roller body 22B that constitutes a pair of upper and lower heating electrodes.
It is configured by incorporating it into.
即ち、加熱兼圧下ローラ２２は、マイクロ波加熱方式に
てフオーム２１をマイクロ波加熱する。That is, the heating/pressing roller 22 microwave-heats the foam 21 using a microwave heating method.
尚、加熱兼圧下ローラ２２は、高周波発振器（２２Ａ）
を上下一対の加熱電極を構成するローラ本体（２２Ｂ）
に内蔵するものであっても良い。この時、加熱兼圧下ロ
ーラ２２は、誘電加熱方式にてフオーム２１を誘電加熱
する。In addition, the heating and rolling roller 22 is a high frequency oscillator (22A).
The roller body (22B) that constitutes a pair of upper and lower heating electrodes
It may also be something that is built into the. At this time, the heating/pressing roller 22 dielectrically heats the foam 21 using a dielectric heating method.
従って、この第２実施例によれば、フオーム２１は、電
磁波加熱方式により、加熱兼圧下ローラ２２が生成する
高周波或いはマイクロ波の電場に置かれることにて生ず
る誘電体損により発熱することにて加熱されると同時に
、該加熱兼圧下ローラ２２により上記加熱状態下で加圧
されて接着せしめられる。従って、コンパクトな装置構
成により、フォτム１１を急速に加熱し、高速にて加熱
接着することかできる。Therefore, according to the second embodiment, the foam 21 generates heat due to dielectric loss caused by being placed in the high frequency or microwave electric field generated by the heating and rolling down roller 22 using the electromagnetic wave heating method. At the same time as it is heated, it is pressed by the heating/pressing roller 22 in the heated state to be bonded. Therefore, with a compact device configuration, the foam 11 can be rapidly heated and thermally bonded at high speed.
（第３実施例）
第４図は、構成の主要部に第１図、及び第２図に示した
加熱シール装置１０を採用したものであり、１枚の連続
フオーム３１を２つ折り、又は３つ折りした後、上記加
熱シール装置１０にてそのシール必要部を加圧接着する
ものである。(Third Embodiment) FIG. 4 shows an example in which the heat sealing device 10 shown in FIGS. After folding, the portions requiring sealing are bonded under pressure using the heat sealing device 10 described above.
第４図において、３２はビントラクタ送り装置、３３は
裁断部、３１Ａは接着され、裁断された帳票である。In FIG. 4, 32 is a bin tractor feeding device, 33 is a cutting section, and 31A is a bonded and cut form.
尚、本発明の実施においては、本発明の電磁波加熱方式
による加熱装置に加えて、従来の電熱ヒータを内蔵した
加熱ローラ、又は電熱ヒータにて生成される熱風を被シ
ール物に吹き付ける熱風装置等の他の加熱装置を併用す
るものてあっても良い。In carrying out the present invention, in addition to the heating device using the electromagnetic wave heating method of the present invention, a conventional heating roller with a built-in electric heater or a hot air device that blows hot air generated by the electric heater onto the object to be sealed may be used. It is also possible to use other heating devices in combination.
［発明の効果］
以上のように本発明によれば、加熱シール装置において
、コンパクトな装置構成により、被シール物を急速に加
熱し、高速にて加熱接着することができる。[Effects of the Invention] As described above, according to the present invention, in the heat sealing device, the object to be sealed can be rapidly heated and heat bonded at high speed with a compact device configuration.
第１図は本発明の第１実施例を示す側面図、第２図は第
１図の平面図、第３図は本発明の第２実施例を示す側面
図、第４図は本発明の第３実施例を示す側面図である。
１０．２０・・・加熱シール装置、
１１．２１・・・フオーム、
１２・・・加熱装置、
１３・・・圧下ローラ、
２２・・・加熱兼圧下ローラ、
１２Ａ、２２Ａ・・・マイクロ波発振器（高周波発振器
）、
２Ｂ。
２Ｂ・・・加熱電極、
１・・・連続フオーム。FIG. 1 is a side view showing a first embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a side view showing a second embodiment of the present invention, and FIG. FIG. 7 is a side view showing a third embodiment. 10.20... Heat sealing device, 11.21... Form, 12... Heating device, 13... Rolling down roller, 22... Heating and rolling down roller, 12A, 22A... Microwave oscillator (High frequency oscillator), 2B. 2B... Heating electrode, 1... Continuous form.
Claims (3)
る被シール物を加圧接着する圧下装置とを有して構成さ
れる加熱シール装置において、加熱装置が電磁波加熱方
式によるものであることを特徴とする加熱シール装置。(1) In a heat sealing device that includes a heating device that heats the object to be sealed and a rolling device that presses and bonds the heated object to be sealed, the heating device uses an electromagnetic wave heating method. A heat sealing device characterized by:
１記載の加熱シール装置。(2) The heat sealing device according to claim 1, wherein the electromagnetic wave heating method is a dielectric heating method.
請求項１記載の加熱シール装置。(3) The heat sealing device according to claim 1, wherein the electromagnetic wave heating method is a microwave heating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134728A JPH031931A (en) | 1989-05-30 | 1989-05-30 | Thermal seal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134728A JPH031931A (en) | 1989-05-30 | 1989-05-30 | Thermal seal device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22924590A Division JPH03150133A (en) | 1990-08-30 | 1990-08-30 | Heat sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031931A true JPH031931A (en) | 1991-01-08 |
Family
ID=15135211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1134728A Pending JPH031931A (en) | 1989-05-30 | 1989-05-30 | Thermal seal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031931A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111129614A (en) * | 2020-01-19 | 2020-05-08 | 超威电源集团有限公司 | Method for manufacturing lead-acid storage battery |
| KR20230127997A (en) | 2020-12-28 | 2023-09-01 | 모찌다 세이야쿠 가부시끼가이샤 | Novel multi-layer polymer-coated cross-linked alginate gel fibers |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62292424A (en) * | 1986-06-12 | 1987-12-19 | 本州製紙株式会社 | Manufacture of corrugated board sheet |
| JPS63239164A (en) * | 1987-03-27 | 1988-10-05 | 工業技術院長 | Method of joining ceramics |
| JPS6351718B2 (en) * | 1982-09-21 | 1988-10-14 | Brother Ind Ltd |
-
1989
- 1989-05-30 JP JP1134728A patent/JPH031931A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6351718B2 (en) * | 1982-09-21 | 1988-10-14 | Brother Ind Ltd | |
| JPS62292424A (en) * | 1986-06-12 | 1987-12-19 | 本州製紙株式会社 | Manufacture of corrugated board sheet |
| JPS63239164A (en) * | 1987-03-27 | 1988-10-05 | 工業技術院長 | Method of joining ceramics |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111129614A (en) * | 2020-01-19 | 2020-05-08 | 超威电源集团有限公司 | Method for manufacturing lead-acid storage battery |
| KR20230127997A (en) | 2020-12-28 | 2023-09-01 | 모찌다 세이야쿠 가부시끼가이샤 | Novel multi-layer polymer-coated cross-linked alginate gel fibers |
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