JPH03150133A - Heat sealing device - Google Patents

Abstract

PURPOSE:To heat a material to be sealed quickly and heat bond the same at high speed by having an electrode connected with an electromagnetic wave oscillator built in a roller for pressure bonding the material to be sealed. CONSTITUTION:A heat sealing device 20 passes a form 21 between heating and pressing roller 22, applies microwave voltage to the form 21 through a heating electrode 22B, microwave heats the form 21 by means of microwave heating method and pressure bonding the same. At that time, the heat sealing device 20 applies high currency voltage to the form 21 by means of heating electrode 22B and carry out dielectric heating. The form 21, therefore, is heated by the heat generating by dielectric loss generated when being placed in a high frequency or microwave electric field generated by the heating and pressing rollers 22 in carrying out the electromagnetic wave heating process, and simultaneously pressurized and bonded under the heated state by the heating and pressing rollers 22.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention is applicable to stacking objects to be sealed, such as multiple sheets of foam such as envelope paper and confectionery paper, or folding one object to be sealed. The present invention relates to a heat sealing device that performs heat bonding under overlapping conditions such as overlapping.

[Prior Art] In the manufacturing process of multiple-fold (bi-fold, tri-fold, etc.) envelopes, postcards, etc., a heat sealing device is used to bring the forms (paper) into contact with each other.

A conventional heat sealing device includes a heating device that heats an object to be sealed, and a rolling device that presses and bonds the heated object to be sealed.

At this time, in conventional heat sealing apparatuses, an electric heater system is used as the heating position A, and a heating zone is set by this electric heater along the conveyance direction of the object to be sealed.

[Problems to be Solved by the Invention] However, the above-mentioned conventional heat sealing device using an electric heater method requires a long heating time and is difficult to achieve high-speed processing on the line.

In addition, in order to achieve high-speed processing on the line, it was necessary to set a long heating zone, and in addition, the heating of the object to be sealed and the pressure bonding were performed in separate locations, which resulted in the equipment becoming larger. do.

The present invention provides a compact installation f in a heat sealing device.
The purpose of this method is to rapidly heat the object to be sealed and heat-bond it at high speed.

[Means for Solving the Problems] In order to achieve the above object, the present invention is characterized in that a roller that pressure-bonds the object to be sealed has a built-in electrode connected to an electromagnetic wave oscillator. According to the present invention, the object to be sealed is heated by electromagnetic waves,
The dielectric I (molecular friction loss within the dielectric) that occurs when exposed to the electric field of high frequency or microwave (more heat is generated and is heated, and under this heated state it is pressed and bonded. There are the following effects.

■Since the electromagnetic wave heating method is an internal heating method, the object to be sealed (or the adhesive if an adhesive is applied to the object to be sealed) itself is the heat source, and the heating rate is high. Furthermore, the degree of heating can be adjusted freely by adjusting the strength of the high-frequency voltage or microwave voltage passed to the heating electrode, so by applying a high voltage, heating can be achieved very rapidly.

■The electromagnetic wave heating method can selectively heat only the adhesive when it is applied to the object to be sealed.

This is because a dried object to be sealed contains less water and therefore generates less heat due to less friction between molecules, whereas an adhesive generates heat very well.

This means that the heating time of the adhesive is short and the filling can be done more reliably (convex speed! l!).

In addition, since the mechanical parts of the device are not heated, work efficiency can be improved when the device is stopped due to trouble or the like.

■In addition to the above ■ and ■, heating and pressure welding of the object to be sealed n
can be performed at the same location, the heat sealing device has a compact device configuration (the object to be sealed can be rapidly heated and heat bonded at high speed).

[Embodiment] FIG. 1 shows a side view of an embodiment of the present invention, in which a heating sealing device 2t20 includes a heating/pressing roller 22 that heats and presses a plurality of foams 21 at the same time. be done.

Note that 23 is a pair of upper and lower feed rollers that feed the foam 21 to the heating and rolling roller 22 and send it out.

However, the heating and rolling O-ra 22 is constructed by incorporating heating electrodes 22B in a pair of upper and lower roller bodies 22A. Each heating electrode 22B is connected to a separately provided microwave oscillator 24. In other words, the heat sealing device 2
0 is heated and compressed by passing the t-mu 21 between the 0-ra 22,
Applying a microwave voltage (for example, 915 to 2450 MHz) to the foam 21 via the heating electrode 22B (by
The foam 21 is heated using a microwave heating method and is bonded under pressure.

Note that the heat sealing device 20 may use a high frequency oscillator instead of the microwave oscillator 24. At this time, the heating sealing device 20 uses a dielectric heating method (thanks to the heating electrode 228k).
m to form 21 with a high frequency voltage (e.g. 6-80MHz
) will cause dielectric heating.

Therefore, according to this embodiment, the foam 21 is heated by an electromagnetic wave heating method (i.e., heat is generated by dielectric loss caused by being placed in a high frequency or microwave electric field generated by the heating/pressing roller 22). At the same time, the heating/pressing roller 22 applies pressure under the above-mentioned heating condition to bond the adhesive.

At this time, the foam 11 is made of a synthetic resin material and is in contact with its own heat, or is coated with an adhesive and bonded with the adhesive.

Therefore, according to the above embodiment, there are the following effects (1) to (4).

■Since the electromagnetic wave heating method is an internal heating method, ]t-
The foam 21 (the adhesive if adhesive is applied) itself is a heat source and has a high heating rate.
The degree of this heating can be adjusted freely by adjusting the strength of the high frequency voltage or microwave voltage passed to the heating electrode 22B, so by applying a high voltage, heating can be done very rapidly.

■The electromagnetic wave heating method can selectively heat only the adhesive when the foam 21 is coated with adhesive. This is because the dry foam 21 contains less water and therefore generates less heat due to less friction between molecules, whereas the adhesive generates heat very well.

This means that the heating time for the adhesive is short and processing can be performed more reliably (at a higher speed).

In addition, since the mechanical parts of the device are not heated, it is possible to improve workability when trouble occurs (such as when the head is stopped).

■In addition to the above ■ and ■, the heating and pressure welding 6 of the foam 21 is carried out at the same level by the heating and pressing roller 22, which allows for a compact device configuration (more rapid heating of the foam 21, Can be heated and bonded at high speed.

In carrying out the present invention, in addition to the heating device using the electromagnetic wave heating method of the present invention, a conventional heating roller with a built-in electric heater or a hot air device that blows hot air generated by the electric heater onto the object to be sealed may be used. Other heating devices may also be used in combination.

[Effects of the Invention] As described above, according to the present invention, the heat sealing device has a compact device configuration (the object to be sealed can be rapidly heated and heat bonded at high speed).

[Brief explanation of the drawing]

FIG. 1 shows a side view of an embodiment of the invention. 20...heat sealing device, 21...Form, 22... Laura, 22A...roller body 22B... heating electrode, 23...Feed roller, 24...Microwave oscillator (High frequency oscillator), 31.--Continuous form.

Claims (1)

[Scope of Claims] (1) A heat sealing device comprising a heating device for heating an object to be sealed and a pressing device for bonding the object to be sealed under pressure in a heated state, wherein the object to be sealed is A heat sealing device characterized by a roller that pressurizes and adheres materials and has a built-in electrode connected to an electromagnetic wave oscillator. (2) The heat sealing device according to claim 1, wherein the electromagnetic wave oscillator is a high frequency oscillator. (3) The heat sealing device according to claim 1, wherein the electromagnetic wave oscillator is a microwave oscillator.