JPH03190265A - Semiconductor chip carrier - Google Patents

Abstract

PURPOSE:To make it possible to cope with the generation of heat ever increasing as a result of higher integration, more enhanced functions and higher-speed operation of semiconductor chips by extending the size of a metal sheet inserted into an insulation layer up to a region of the metal sheet where thermal pins are installed. CONSTITUTION:The size of a metal sheet 2 inserted into an insulation layer 1 is extended up to a region of the metal sheet 2 where thermal pins 3 are installed in order to improve its heat dissipation performance. In order that the metal sheet 2 must be extended up to the region where the terminal pins 3 are installed, a hole 8 larger than the terminal pins 3 are bored on the metal sheet 2 in positions equivalent to the installation position of the terminal pins 3 so that the terminal pins 3 may not come off from the metal plate 2. Therefore, the portion of the metal sheet 2 which is engaged with an outside heat radiation body 6 is enlarged, it is possible to relieve the restrictions imposed to the shape of the outside heat radiation body 6 and to mount the outside heat radiation body 6 with ease. This construction makes it possible to cope with higher integration, more enhanced functions and higher-speed operation of semiconductor chips.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor chip carrier used for mounting a semiconductor chip.

[Conventional technology]

Printed wiring boards such as epoxy resin laminates based on glass cloth have recently come to be used as insulating layers constituting semiconductor chip carriers. However, such printed wiring boards have poor thermal conductivity and cannot dissipate heat well. Previously, the present inventors published Japanese Patent Application Laid-Open No. 62
-52992, a fourth structure is constructed of a resin laminated printed wiring board in which a metal plate is inserted into an insulating layer and a part of the metal plate is exposed to the outside to improve heat dissipation.
The semiconductor chip carrier shown in the figure was provided.

In this device, an insulating layer 1 covers a metal plate 2 from the peripheral edge to the center, and a recess without an insulating layer is formed around the center of the metal plate 2, and the bottom of this recess is covered with the metal plate 2. 2 is exposed, one first recess 4 is provided for heat dissipation, and the other second recess 5 is provided for mounting a semiconductor chip 7. The insulating layer 1 of the printed wiring board has good heat dissipation properties because the insulating layer 2 is exposed to the outside through the recess, and the insulating layer 1 covers the metal plate 2 from the periphery to the center.
This semiconductor chip carrier has improved moisture resistance by blocking the movement of the metal plate 2 inserted inside the area of the terminal pins 3 arranged in the area, and further sealing the gap between the insulating layer 1 and the metal plate 2. There was something special about it.

However, with the increase in the amount of heat generated by semiconductor chips as they become faster, more highly integrated, and more highly functional, there are increasing expectations for the creation of semiconductor chip carriers with even better heat dissipation properties. The expansion of the metal plate inserted into the layer was limited by contact with terminal pins disposed in the same insulating layer. In addition, when attaching the external heat sink to the semiconductor chip carrier, since the metal plate 2 is recessed from the surface of the insulating layer 1, there are restrictions on the shape of the external heat sink 6. External heat sink smaller than 4 6
The degree of freedom in the shape of the external heat radiator 6, which aims to increase the amount of heat dissipated, was small.

[Problem to be solved by the invention]

In order to further improve heat dissipation, the size of the metal plate inserted into the insulating layer has been expanded to include the area where the terminal pins are arranged, and the size of the metal plate inserted into the insulating layer has been expanded to include the area where the terminal pins are arranged. It is an object of the present invention to provide a semiconductor chimp carrier having a structure in which an external heat dissipation body can be easily attached while also eliminating the above restrictions.

[Means to solve the problem]

In order to solve the above problems, the present invention provides a metal plate embedded in an insulating layer, an insulating layer left on both surfaces of the metal plate from the periphery to the center, and recesses formed on both sides of the insulating layer. The metal plate exposed at the bottom of the recess, a plurality of holes formed in this metal plate that are larger than the outer diameter of the terminal pin, and an insulator formed at the same position as the holes with a smaller diameter than the plurality of holes. The present invention provides a semiconductor chip carrier characterized in that it has terminal pins disposed in through-holes in the layers.

〔Example〕

The present invention will be explained in detail below based on the drawings. 1st
The figure is a perspective view of one embodiment of the present invention, and FIG. 2 is an XY cross-sectional view of FIG. 1 with an external heat sink attached. The semiconductor chip carrier shown in FIG. 2 includes a metal plate 2 embedded in an insulating layer 1. This metal plate has recesses formed on both sides of the insulating layer 1, leaving the insulating layer 1 from the periphery to the center of both surfaces. The first recess 4, which is one of the recesses, is for attaching an external heat sink 6, and the insulating layer 1 remains from the periphery of the metal plate 2 toward the center to the extent that the metal plate 2 does not come off the insulating layer 1. In order to improve heat dissipation, it is desirable to have a shape that ensures as wide an exposed area of the metal plate 2 as possible. The second recess 5, which is the other recess, is for mounting the semiconductor chip 7. When the semiconductor chip 7 is mounted on the metal plate 2 exposed on the bottom surface of the second recess 5, the semiconductor chip 7 generates dust. The heat is absorbed by the metal plate 2 and further transferred to the external heat radiator 6 having fins on the side surface attached to the bottom of the first recess 4 on the opposite side of the metal plate 2 having excellent thermal conductivity, Since the heat is not trapped in the metal plate 2 (it is radiated into the air), it becomes possible to support higher integration, higher functionality, and higher speed of the semiconductor chip 7.

The semiconductor chip 7 mounted on the metal plate 2 on the bottom of the second recess 5 and the conductor circuit 11 formed on the surface of the insulating layer 1 are connected via a metal wire 12. It is connected to a through hole plating layer of a through hole 9 formed in the insulating layer 1 into which a terminal pin 3 serving as a terminal is inserted.

As is well known, the shapes of the first recess 4 and the second recess 5 are generally rectangular prisms, but there is no particular limitation and they may be cylindrical or the like.

In the semiconductor chip carrier having the above configuration, in order to expand the metal plate 2 to the area where the terminal pins 3 are arranged,
The terminal pin 3 is placed at a position on the metal plate 2 corresponding to the position where the terminal pin 3 is arranged so that the terminal pin 3 does not come into contact with the metal plate 2.
68 with a larger diameter is provided. This hole may be a through hole shown in FIG. 2, or may be a non-through hole 10 shown in an enlarged view showing another embodiment in FIG. 3, and its shape may be a cylinder or a square prism, and is not particularly limited. It is sufficient if the size is such that it does not come into contact with the terminal pin 3.

As for the form of the semiconductor chip carrier, one in which the terminal pins 3 are disposed in through holes 9 formed in the insulating layer 1 opposite to the surface to which the external heat radiator 6 is attached is preferable in order to improve heat radiation.

Further, the shape of the external heat radiator 6 may be a prism with side fins, or a cylinder with top fins, which are generally used as a heat radiator or heat radiator fin.

Next, regarding the materials used, the insulating layer 1 constituting the semiconductor chip carrier shown in FIG. 2 is made of an insulating material obtained by curing the resin of a prepreg obtained by impregnating a base material with a resin and drying it. Here, the resin for the insulating layer 1 is preferably one that has excellent heat resistance and moisture resistance, and has high resin purity, particularly low ionic impurities. Specifically, epoxy resin, polyimide resin, Funso resin, phenol resin, unsaturated polyester resin, PPO resin, etc. are suitable. Note that insulating layer 1
As the base material, an inorganic material such as glass fiber is preferable to paper because of its superior heat resistance and moisture resistance.

Examples of the metal plate 2 inserted into the insulating layer 1 and the external heat sink 6 attached to the metal plate 2 include copper plates, copper alloy plates, copper-invar-copper alloy plates, iron-nickel alloy plates, other control plates, and iron plates. , aluminum plate, etc. can be used.

〔Effect of the invention〕

As described above, in the semiconductor chip carrier according to the present invention, the size of the metal plate inserted into the insulating layer can be enlarged to the area where the terminal pins are arranged, and the metal plate is exposed to dissipate heat from the outside. Since the part of the metal plate that joins with the body becomes larger, it is possible to remove the restrictions placed on the shape of the external heat sink, and it becomes a semiconductor chip carrier with a structure that allows the external heat sink to be easily attached, making it possible to improve the structure of the semiconductor chip. This is a semiconductor chip carrier that can cope with increased heat generation due to higher integration, higher functionality, and faster speeds.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2 is an X-Y sectional view of the same with an external heat sink attached, and Fig. 3 is a partially enlarged sectional view showing another embodiment. , and FIG. 4 respectively show cross-sectional views of a conventional example. 1... Insulating layer 2... Metal plate 3... Terminal pin 4... First recess 5... Second recess 6
...External heat sink 7...Semiconductor chimp 8...Hole 9...Through hole 1st W1 11!2 Fig.

Claims (1)

[Claims] (1) A metal plate embedded in an insulating layer, recesses formed on both sides of the insulating layer with the insulating layer left from the periphery to the center on both surfaces of the metal plate, and the metal exposed at the bottom of these recesses. A plate, a plurality of holes larger than the outer diameter of the terminal pin formed in this metal plate, and a through hole in an insulating layer formed at the same position as the hole with a smaller diameter than the plurality of holes. A semiconductor chip carrier characterized by having terminal pins.