JP2658451B2 - Semiconductor chip carrier - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor chip carrier used for mounting a semiconductor chip.

[Conventional technology]

A printed wiring board such as an epoxy resin laminate using a glass cloth as a base material has recently been used for an insulating layer constituting a semiconductor chip carrier. However, such a printed wiring board has poor heat conductivity and cannot radiate heat well. First, the present inventors disclosed in
At -52992, a metal plate is inserted and arranged in the insulating layer,
A part of this metal plate was exposed to the outside to provide a semiconductor chip carrier shown in FIG. 4 composed of a printed wiring board of a resin laminate having good heat dissipation.

In this device, the insulating layer 1 covers the metal plate 2 from the periphery to the center, and a concave portion without the insulating layer is formed around the central portion of the metal plate 2. 2 is exposed, and the first concave portion 4 is used for heat dissipation.
The other second recesses 5 are provided for mounting the semiconductor chip 7, respectively, and are semiconductor chip carriers. Since the metal plate 2 is exposed to the outside in the recesses, good heat dissipation and an insulating layer are provided. 1 covers the metal plate 2 from the peripheral edge to the center of the metal plate 2 to prevent the metal plate 2 inserted inside the region of the terminal pins 3 arranged on the insulating layer 1 of the printed wiring board from moving. Further, there is a feature in that a gap formed between the insulating layer 1 and the metal plate 2 is sealed to provide a semiconductor chip carrier having improved moisture resistance.

However, with the increasing heat generation of semiconductor chips due to the speeding up, higher integration, and higher functionality of semiconductor chips, the creation of semiconductor chip carriers with even better heat dissipation is expected to grow more and more. The enlargement of a metal plate inserted in a layer has a limitation of contact with a terminal pin provided on the same insulating layer. In addition, when the external heat radiator is attached to the semiconductor chip carrier, the shape of the external heat radiator 6 is limited because the metal plate 2 is recessed from the surface of the insulating layer 1, and the mounting portion is formed by the heat radiating recess 4. The external heat radiator 6 is limited to a small external heat radiator 6, and has a small degree of freedom in the shape of the external heat radiator 6 for increasing the heat radiation amount.

[Problems to be solved by the invention]

In order to further enhance the heat dissipation, the size of the metal plate inserted into the insulating layer can be increased to the area where the terminal pins are provided. It is another object of the present invention to provide a semiconductor chip carrier having a structure in which the restriction can be released and an external radiator can be easily attached.

[Means for solving the problem]

The present invention, in order to solve the above problems, a metal plate embedded in the insulating layer, leaving the insulating layer from the center from the peripheral edge of both surfaces of the metal plate, concave portions formed on both sides of the insulating layer, The metal plate exposed on the bottom surface of the concave portion, a plurality of holes larger than the outer diameter of the terminal pin formed in the metal plate, and an insulation formed at the same position as the hole with a smaller diameter than the plurality of holes provided. A semiconductor chip carrier having a terminal pin disposed in a through hole of a layer.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is an XY cross-sectional view of FIG. 1 to which an external heat radiator is attached. The semiconductor chip carrier shown in FIG. 2 has a metal plate 2 embedded in an insulating layer 1 and concave portions formed on both sides of the insulating layer 1, leaving the insulating layer 1 from the peripheral edges of both surfaces of the metal plate to the center. Having. The first concave portion 4, which is one concave portion, is for mounting the external heat radiator 6, and the insulating layer 1 is left from the peripheral edge of the metal plate 2 to the center to the extent that the metal plate 2 does not separate from the insulating layer 1. In order to improve the heat dissipation, it is desirable that the shape of the metal plate 2 be as large as possible so that the exposed area of the metal plate 2 is ensured. The second concave portion 5 serving as the other concave portion is for mounting the semiconductor chip 7, and is generated from the semiconductor chip 7 when the semiconductor chip 7 is mounted on the metal plate 2 exposed on the bottom surface of the second concave portion 5. The heat is absorbed by the metal plate 2 and further moves to the external radiator 6 having fins on the side surface attached to the bottom surface of the first concave portion 4 on the opposite side of the metal plate 2 having excellent heat conductivity. The heat is radiated into the air without remaining in the metal plate 2, so that the semiconductor chip 7 can cope with high integration, high functionality, and high speed.

The semiconductor chip 7 mounted on the metal plate 2 on the bottom surface of the second recess 5 and the conductor circuit 11 formed on the surface of the insulating layer 1 are connected via a metal wire 12, and the conductor circuit 11 is connected to an external terminal. It is connected to a through-hole plating layer of a through hole 9 formed in the insulating layer 1 for inserting the terminal pin 3 serving as a terminal.

The shape of the first concave portion 4 and the second concave portion 5 is generally a quadrangular prism shape as is well known, but may be a cylindrical column without any particular limitation.

In the semiconductor chip carrier having the above structure, the metal plate 2
In order to extend the terminal pin 3 to the area where the terminal pin 3 is provided, the terminal pin 3 A larger diameter hole 8 is provided. This hole may be the through hole shown in FIG. 2 or the non-through hole 10 in an enlarged view showing another embodiment of FIG. 3, and the shape may be a column or a square column. However, it is sufficient if the size does not contact the terminal pins 3.

As the form of the semiconductor chip carrier, the one in which the terminal pins 3 are provided in the through holes 9 formed in the insulating layer 1 opposite to the surface to which the external heat radiator 6 is attached is preferable for improving heat radiation.

In addition, the shape of the external heat radiator 6 that is generally used as a heat radiator or heat radiator, such as a prism having a side surface fin or a column having a top fin, can be used.

Next, the materials used will be described. For the insulating layer 1 constituting the semiconductor chip carrier of FIG. 2, an insulating material obtained by curing a prepreg resin obtained by impregnating and drying a base material with a resin is used. Here, the resin of the insulating layer 1 has heat resistance,
Those having excellent moisture resistance and a low resin purity, particularly low ionic impurities, are preferred. Specifically, epoxy resin, polyimide resin, fluorine resin, phenol resin, unsaturated polyester resin, PPO resin and the like are suitable. Insulating layer 1
As a base material, an inorganic material such as glass fiber is more preferable than paper in terms of heat resistance and moisture resistance.

Examples of the metal plate 2 inserted into the insulating layer 1 and the external radiator 6 attached to the metal plate 2 include a copper plate, a copper alloy plate,
Copper-invar-copper alloy plates, iron-nickel alloy plates, other steel plates, iron plates, aluminum plates, and the like can be used.

〔The invention's effect〕

As described above, the semiconductor chip carrier according to the present invention can be a metal plate in which the size of the metal plate inserted into the insulating layer is enlarged to the area where the terminal pins are provided, and the metal plate is exposed to external heat radiation. Since the size of the metal plate that joins the body becomes larger, the restriction imposed on the shape of the external heat radiator can be released, and the semiconductor chip carrier has a structure that allows the external heat radiator to be easily attached. It is a semiconductor chip carrier that can cope with heat generated by high integration, high functionality, and high speed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is an XY cross-sectional view in which an external heat radiator is attached, FIG. 3 is a partially enlarged cross-sectional view showing another embodiment, FIG. 4 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1 ... Insulating layer, 2 ... Metal plate 3 ... Terminal pin 4, 4 ... First concave part 5 ... Second concave part, 6 ... External radiator 7 ... Semiconductor chip, 8 ... Hole 9 ... … Through hole

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Takeshi Kano 1048 Odakadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Works, Ltd. (72) Inventor Toru Higuchi 1048 Odaka, Kadoma, Osaka Prefecture

Claims (1)

(57) [Claims] 1. A metal plate embedded in an insulating layer, concave portions formed on both surfaces of the insulating layer, leaving the insulating layer from the peripheral edge of both surfaces of the metal plate toward the center, and exposed on the bottom surfaces of these concave portions. The metal plate, a plurality of holes larger than the outer diameter of the terminal pins formed in the metal plate, and a through hole of the insulating layer formed at the same position as the hole with a smaller diameter than the plurality of holes. A semiconductor chip carrier having provided terminal pins.