JPH03173190A - Circuit and manufacture thereof - Google Patents
Circuit and manufacture thereofInfo
- Publication number
- JPH03173190A JPH03173190A JP31289689A JP31289689A JPH03173190A JP H03173190 A JPH03173190 A JP H03173190A JP 31289689 A JP31289689 A JP 31289689A JP 31289689 A JP31289689 A JP 31289689A JP H03173190 A JPH03173190 A JP H03173190A
- Authority
- JP
- Japan
- Prior art keywords
- glaze
- substrate
- printing
- board
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 claims abstract description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010931 gold Substances 0.000 claims abstract description 20
- 229910052737 gold Inorganic materials 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 31
- 238000010304 firing Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 6
- 239000012298 atmosphere Substances 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明はサーマルヘッド、ハイブリッドＩＣなどに用い
られる厚膜回路、およびその製造法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film circuit used for thermal heads, hybrid ICs, etc., and a method for manufacturing the same.
［従来の技術］
現在、プリンタなどのサーマルヘッドの発熱部分やハイ
ブリッドＩＣなどに用いられる回路の形成には、主にＡ
１ ｓｏｓ （アルミナ）などの基板上に直接、また
はグレーズ層を設けた上に（ｉ）蒸着、またはスクリー
ン印刷により金の薄膜を設けて焼成した後、これをエツ
チングして導体パターンを形成する方法、あるいは（ｉ
ｉ ）銅を蒸着あるいは貼りつけた後、エツチングして
、ついで電解金メッキを行いリード部分を剥離してパタ
ーンを形成する方法がある。[Prior Art] Currently, A is mainly used to form circuits used in the heat generating parts of thermal heads of printers, hybrid ICs, etc.
1 A method in which a thin film of gold is deposited directly on a substrate such as SOS (alumina) or on a glaze layer by (i) vapor deposition or screen printing, fired, and then etched to form a conductor pattern. , or (i
i) There is a method of depositing or pasting copper, etching it, then electrolytically plating it with gold, and peeling off the lead portion to form a pattern.
［発明が解決しようとする課題〕
しかしながら、これら従来の回路はいずれも金属の薄膜
を用いているためリード部、ハンダ部の強度が充分でな
く、導体層と基板との密着性、あるいは導体層の表面平
滑性も充分でない。さらに、金薄膜をエツチングする方
法では、ファインパターン部分以外の大部分の金がエツ
チングにより除去、廃棄されてロスとなり製造コストの
上昇を招く。また、蒸着、銅薄膜の貼りつけなどの工程
は繁雑で製品のコストアップを招く。[Problems to be Solved by the Invention] However, since all of these conventional circuits use thin metal films, the strength of the lead portion and solder portion is insufficient, and the adhesion between the conductor layer and the substrate, or the conductor layer The surface smoothness is also not sufficient. Furthermore, in the method of etching a gold thin film, most of the gold other than the fine pattern portion is removed by etching and discarded, leading to loss and an increase in manufacturing costs. In addition, the processes such as vapor deposition and pasting of the copper thin film are complicated and increase the cost of the product.
本発明は安価でかつ基板と導体層との密着性に優れた回
路およびその製造法を提供することにあ［課題を解決す
るための手段］
本発明は
基板；
該基板上に形成されたグレーズ層；
該グレーズの上に設けられた銅およびガラスフリットを
含有する導体層；並びに
該導体層を被覆するメッキ膜
からなることを特徴とする回路を提供するものである。An object of the present invention is to provide a circuit that is inexpensive and has excellent adhesion between a substrate and a conductor layer, and a method for manufacturing the same.Means for Solving the Problems The present invention provides a substrate; a glaze formed on the substrate; The present invention provides a circuit characterized by comprising: a conductor layer containing copper and glass frit provided on the glaze; and a plating film covering the conductor layer.
また、本発明はかかる回路の製造法を提供するものであ
る。The present invention also provides a method for manufacturing such a circuit.
つぎに本発明をさらに詳細に説明する。Next, the present invention will be explained in more detail.
本発明にて用いられる基板としては、アルミナ基板など
公知の基板が挙げられる。Examples of the substrate used in the present invention include known substrates such as an alumina substrate.
また、グレーズ（ｇｌａｚｅ）は、ガラス質、樹脂およ
び溶剤からなる公知のものを用いてよい。Further, as the glaze, a known glaze made of glass, resin, and solvent may be used.
本発明に用いられる銅ペーストは従来公知のペーストで
あってよい。例えば、銅４５〜９０重量％、ガラスフリ
ット２０〜５重量％、樹脂５〜２５重量％および溶剤か
らなるペーストが用いられ本発明の基板を製造するには
、まず前記基板上にスクリーン印刷等の公知手段により
グレーズをベタ印刷してガラス層を設け、乾燥を行う。The copper paste used in the present invention may be a conventionally known paste. For example, in order to manufacture the substrate of the present invention using a paste consisting of 45 to 90% by weight of copper, 20 to 5% by weight of glass frit, 5 to 25% by weight of resin, and a solvent, first, the substrate is coated with screen printing or the like. A glass layer is provided by solid printing a glaze using a known method, and then dried.
この印刷−乾燥を数回繰り返す。乾燥は１００−１５０
℃程度にて行い、脱バインダーを３５０〜４５０℃程度
で行なって、ついで１１００〜１４００℃にて焼成する
。This printing-drying process is repeated several times. Drying is 100-150
The binder is removed at a temperature of about 350 to 450°C, followed by firing at a temperature of 1100 to 1400°C.
グレーズを設けた基板に導体パターンを形成する方法と
しては、従来公知のパターン形式方法がいずれも用いら
れてよい。As a method for forming a conductor pattern on a substrate provided with a glaze, any conventional pattern-forming method may be used.
例えば、スクリーン印刷法により銅ペーストをベタ印刷
しグレーズ上に厚付けを行う。これを乾燥し、非酸素雰
囲気にて焼成した後、銅膜をエツチングする。ファイン
パターンを形成するにはこのようにエツチングによるの
が好ましい。For example, a copper paste is printed all over using a screen printing method and thickly applied on the glaze. After drying and firing in a non-oxygen atmosphere, the copper film is etched. In order to form a fine pattern, it is preferable to use etching as described above.
別法としては、特定の導体パターンを有するマスクまた
はスクリーンを基板表面に置き、その上から前記導電性
ペーストを塗布してグレーズ上に導体パターンを形成し
てもよい。Alternatively, a mask or screen having a specific conductive pattern may be placed on the surface of the substrate, and the conductive paste may be applied thereon to form the conductive pattern on the glaze.
前記導体パターン形成後の乾燥、焼成は、例えば約１０
０〜１５０℃で乾燥し、酸素濃度が数ｐｐｍ＝１００ｐ
ｐｍの非酸素の窒素雰囲気中にて８００〜１１００℃程
度、好ましくは８５０〜９５０℃で焼成する。The drying and baking process after forming the conductive pattern is performed for about 10 minutes, for example.
Dry at 0 to 150℃, oxygen concentration is several ppm = 100p
It is fired at about 800 to 1100°C, preferably at 850 to 950°C in a non-oxygen nitrogen atmosphere of 100 pm.
該基板上の回路パターンには、酸化防止のため金メッキ
を行う。該金メッキ処理は、まず無電解ニッケルメッキ
を行った後、金メッキを行うのが好ましい。すなわち、
導体パターンの形成された基板を脱脂し、表面の酸処理
および活性化処理を行った後、必要に応じ無電解ニッケ
ルメッキを行う。ついで、無電解金メッキ、無電解金厚
メッキなどの金メッキを導体パターン上に行う。ファイ
ンパターンの場合など、特に電解メッキや焼き付けによ
り生ずる膜厚のバラツキを少なくする必要がある場合に
は金無電解厚メッキが好ましい。The circuit pattern on the substrate is plated with gold to prevent oxidation. In the gold plating treatment, it is preferable to first perform electroless nickel plating and then perform gold plating. That is,
After degreasing the substrate on which the conductor pattern has been formed and subjecting the surface to acid treatment and activation treatment, electroless nickel plating is performed as required. Next, gold plating such as electroless gold plating or electroless thick gold plating is performed on the conductor pattern. Gold electroless thick plating is preferred when it is necessary to reduce variations in film thickness caused by electrolytic plating or baking, such as in the case of fine patterns.
［実施例］
つぎに本発明を実施例にもとづきさらに具体的に説明す
る。[Examples] Next, the present invention will be described in more detail based on Examples.
実施例１
アルミナ基板上にスクリーン（２００メツシユ）を用い
てグレーズをベタ印刷し、１００℃、約１０分間の乾燥
をする。この印刷−乾燥を３回繰り返した。ついでグレ
ーズが印刷されたアルミナ基板を焼成した。焼成にあた
っては、まず脱バインダーを行うため４００℃まで１時
間で昇温し１５分間保持する。ついで１２５０℃まで４
時間で昇温し１時間保持した後放冷した。Example 1 A glaze is printed solidly on an alumina substrate using a screen (200 meshes) and dried at 100° C. for about 10 minutes. This printing-drying process was repeated three times. The alumina substrate printed with the glaze was then fired. During firing, first, the temperature was raised to 400° C. over 1 hour and held for 15 minutes to remove the binder. Then up to 1250℃ 4
The temperature was raised over time, maintained for 1 hour, and then allowed to cool.
銅ペースト（大研化学工業（株）製、Ｎｏ、３８ＩＣ）
を３００メツシユのスクリーンにてベタ印刷し、１２０
’ｃで約１０分乾燥した。つぎに非酸素雰囲気下８５０
〜９５０℃にて焼成した。ただし、この時４００℃まで
１時間で昇温し、３０分間保持し次に９５０℃まで３０
分で昇温して１５分間保持し、ついで徐冷した。Copper paste (manufactured by Daiken Chemical Industry Co., Ltd., No. 38IC)
is printed solidly on a 300-mesh screen, and 120
'C for about 10 minutes. Next, under a non-oxygen atmosphere, 850
It was fired at ~950°C. However, at this time, the temperature was raised to 400℃ for 1 hour, held for 30 minutes, and then raised to 950℃ for 30 minutes.
The temperature was raised in 1 minute, held for 15 minutes, and then slowly cooled.
エツチングにあたっては、まずマスキング剤をスクリー
ン印刷する。この場合パターンに応じて４００〜５００
メツシユのスクリーンを選ぶ。マスキング剤を乾燥した
後、１０％Ｈ，ＳＯ，で銅焼成膜をエツチングし、終了
後よく洗浄した。マスキング剤を剥離し、ついで基板を
脱脂液につけて表面の汚れをよく取り、活性液に浸漬し
て、メッキ加工部分を活性化処理した。次に無電解ニッ
ケルメッキ液（大研化学工業（株）製、ＤＲ−Ｎｉ−３
５０ＯＮ）でエツチングされていない部分（導体パター
ン）にニッケルメッキを施した（７５〜８５°Ｃ１約１
５分）。無電解金メッキ液（グイゴール、大研化学工業
（株）製）でニッケル部分に金をフラシュメッキした（
８５〜９５℃、約３分）。For etching, first screen print a masking agent. In this case 400-500 depending on the pattern
Select the mesh screen. After drying the masking agent, the fired copper film was etched with 10% H, SO, and thoroughly washed after etching. After removing the masking agent, the substrate was soaked in a degreasing solution to thoroughly remove dirt from the surface, and then immersed in an activating solution to activate the plated parts. Next, electroless nickel plating solution (manufactured by Daiken Chemical Industry Co., Ltd., DR-Ni-3)
Nickel plating was applied to the non-etched parts (conductor pattern) (75-85°C1 approx.
5 minutes). The nickel part was flash-plated with gold using an electroless gold plating solution (Guigor, manufactured by Daiken Chemical Industry Co., Ltd.).
85-95°C, about 3 minutes).
この基板を無電解金厚メッキ液（大研化学工業（株）製
、ＤＲ−８１８１）に浴温６０〜７０℃にて７０分浸漬
し、均一の厚みを保ったメッキを行った。This substrate was immersed in an electroless thick gold plating solution (DR-8181, manufactured by Daiken Kagaku Kogyo Co., Ltd.) at a bath temperature of 60 to 70° C. for 70 minutes to perform plating with a uniform thickness.
得られた回路は厚みが均一で基板との密着性に優れてい
た。The obtained circuit had a uniform thickness and excellent adhesion to the substrate.
実施例２
実施例１と同様にして、アルミナ基板上にグレーズを印
刷し、これを乾燥、焼成してグレーズ層を有する基板を
得た。Example 2 A glaze was printed on an alumina substrate in the same manner as in Example 1, and this was dried and fired to obtain a substrate having a glaze layer.
銅ペーストを印刷パターンを用いてスクリーン印刷（３
００〜４００メツシユ）した後、実施例１と同様にして
乾燥、焼成を行った。徐冷した後、基板を脱脂液につけ
表面の汚れをよくとり、活性液に浸漬した後、銅ペース
トの焼成パターンに実施例１と同様にして順次ニッケル
メッキ、無電解金メッキを施し、均一の厚みを保ったメ
ッキができる。得られた回路は実施例１と同様に優れた
特性を示した。Screen printing the copper paste using a printing pattern (3
00 to 400 meshes), and then dried and fired in the same manner as in Example 1. After cooling slowly, the substrate was soaked in a degreasing liquid to remove dirt from the surface, and after being immersed in an active liquid, the fired pattern of the copper paste was sequentially plated with nickel and then electroless gold in the same manner as in Example 1 to achieve a uniform thickness. It is possible to perform plating that maintains the The obtained circuit exhibited excellent characteristics similar to Example 1.
［発明の効果］
本発明によれば、基板と導体層との密着性に優れかつ導
体層の表面平滑性にも優れた回路を低コストで製造する
ことができる。また、従来の回路に比ベリード部、ハン
ダ部の強度が高い。[Effects of the Invention] According to the present invention, a circuit having excellent adhesion between the substrate and the conductor layer and excellent surface smoothness of the conductor layer can be manufactured at low cost. Also, the strength of the buried and solder parts is higher than that of conventional circuits.
Claims (5)
する工程、 （ｉｉ）ついで該グレーズ面上に導電性ペーストをベタ
印刷し導体層を形成し、これを焼成する工程、（ｉｉｉ
）ついで該導体層をエッチングして導電性回路のパター
ンを形成する工程、 （ｉｖ）ついで該基板に金メッキする工程、からなるこ
とを特徴とする回路の製造法。(2) (i) A step of printing a glaze all over the substrate and baking it, (ii) A step of printing a conductive paste all over the glazed surface to form a conductive layer, and baking it, (iii)
A method for manufacturing a circuit, comprising the following steps: (iv) then plating the substrate with gold.
ケルメッキを行う前記請求項２記載の製造法。(3) The manufacturing method according to claim 2, wherein the substrate is subjected to electroless nickel plating before the step of gold plating.
する工程、 （ｉｉ）ついで該グレーズ面上に導電性ペーストを印刷
により厚付して導電性回路を形成し、これを焼成する工
程、 （ｉｖ）ついで該基板に金メッキする工程、からなるこ
とを特徴とする回路の製造法。(4) (i) Printing a glaze all over the substrate and firing it; (ii) Next, thickly printing a conductive paste on the glazed surface to form a conductive circuit, and firing it. (iv) Next, a step of gold plating the substrate.
ケルメッキを行う前記請求項４記載の製造法。(5) The manufacturing method according to claim 4, wherein electroless nickel plating is performed on the substrate before the step of gold plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31289689A JPH03173190A (en) | 1989-11-30 | 1989-11-30 | Circuit and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31289689A JPH03173190A (en) | 1989-11-30 | 1989-11-30 | Circuit and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03173190A true JPH03173190A (en) | 1991-07-26 |
Family
ID=18034758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31289689A Pending JPH03173190A (en) | 1989-11-30 | 1989-11-30 | Circuit and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03173190A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8268716B2 (en) | 2010-09-30 | 2012-09-18 | International Business Machines Corporation | Creation of lead-free solder joint with intermetallics |
-
1989
- 1989-11-30 JP JP31289689A patent/JPH03173190A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8268716B2 (en) | 2010-09-30 | 2012-09-18 | International Business Machines Corporation | Creation of lead-free solder joint with intermetallics |
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