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JPH0315358B2 - - Google Patents

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Publication number
JPH0315358B2
JPH0315358B2 JP9546683A JP9546683A JPH0315358B2 JP H0315358 B2 JPH0315358 B2 JP H0315358B2 JP 9546683 A JP9546683 A JP 9546683A JP 9546683 A JP9546683 A JP 9546683A JP H0315358 B2 JPH0315358 B2 JP H0315358B2
Authority
JP
Japan
Prior art keywords
electromagnetic shielding
mold
case
conductive filler
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9546683A
Other languages
Japanese (ja)
Other versions
JPS59219999A (en
Inventor
Hidehiro Iwase
Yoshinobu Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP9546683A priority Critical patent/JPS59219999A/en
Publication of JPS59219999A publication Critical patent/JPS59219999A/en
Publication of JPH0315358B2 publication Critical patent/JPH0315358B2/ja
Granted legal-status Critical Current

Links

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、電磁波シールド性合成樹脂製成形品
を2個以上嵌合させて構成される電磁波シールド
ケースの製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing an electromagnetic shielding case constructed by fitting two or more electromagnetic shielding synthetic resin molded products.

〔発明の技術的背景〕[Technical background of the invention]

近年、デイジタル電子機器の発展に伴ない、こ
れらの電子機器から発生する電磁波が周辺のテレ
ビ等の他の機器へ妨害を与えたり、あるいは他の
機器からの電磁波によつて誤動作を起こしたりす
るという問題が大きくクローズアツプされてきて
いる。
In recent years, with the development of digital electronic devices, it has been reported that the electromagnetic waves generated by these electronic devices can interfere with other nearby devices such as televisions, or cause malfunctions due to electromagnetic waves from other devices. The problem is getting a lot of attention.

これらの問題は電子回路を包囲するケースに電
磁波シールド効果を持たせることにより解決する
ことができる。
These problems can be solved by providing an electromagnetic shielding effect to the case surrounding the electronic circuit.

しかしてこのようなケースとしては、量産性、
経済性、軽量性等の観点から合成樹脂製のものが
多く用いられており、また射出成形の技術上の制
約や内部機器の組立作業上の都合から2つ以上の
成形品を嵌合させて製造されている。
However, in such cases, mass production,
Products made of synthetic resin are often used due to their economic efficiency and light weight, and due to technical constraints of injection molding and convenience in assembling internal equipment, two or more molded products are often fitted together. Manufactured.

このようなケースに電磁波シールド性を付与す
る方法としては以下に記載するような種々の方法
が採られていた。
Various methods as described below have been used to provide electromagnetic shielding properties to such cases.

(イ) メツキ、塗装、溶射、箔接着等の方法で合成
樹脂製ケースの外表面あるいは内表面に金属質
の電磁波シールド層を設ける。
(b) A metallic electromagnetic shielding layer is provided on the outer or inner surface of the synthetic resin case by plating, painting, thermal spraying, foil adhesion, etc.

(ロ) 金属粉、カーボン粉、金属箔、金属繊維、カ
ーボン繊維等の導電性フイラーを混和した熱可
塑性樹脂によりケースを成形する。
(b) The case is molded from thermoplastic resin mixed with conductive filler such as metal powder, carbon powder, metal foil, metal fiber, carbon fiber, etc.

〔背景技術の問題点〕[Problems with background technology]

しかしながらこれらの方法のうち(イ)の方法
においては、落下による衝撃や熱サイクル等によ
り電磁波シールド層が剥離したり脱落したりする
おそれがあり、その剥離片が万一電子回路上に落
下した場合には、短絡や発火等の重大事故につな
がり易いという問題があつた。
However, in method (a) of these methods, there is a risk that the electromagnetic shielding layer may peel off or fall off due to impact from dropping or thermal cycling, and in the unlikely event that a peeled piece falls onto the electronic circuit. However, there was a problem in that it could easily lead to serious accidents such as short circuits and fires.

また(ロ)の方法においては、通常、外観の平
滑性、帯電防止のため、金型キヤビテイ部分の表
面温度をできるだけ高く(熱可塑性樹脂の種類に
もよるが通常60℃以上)して成形することによ
り、成形品表面への導電性フイラーの露出を防止
しているが、そのため電磁波シールドケースの嵌
合部において導電性フイラーの接触がなくなり、
この部分で電磁波が漏洩してしまうという問題が
あつた。そのため嵌合部の接触面を導電性フイラ
ーが均一に露出するまで削除しなければならず、
二次加工に手間がかかるという欠点があつた。
In addition, in the method (b), the surface temperature of the mold cavity is usually kept as high as possible (usually 60°C or higher, depending on the type of thermoplastic resin) to ensure a smooth appearance and prevent static electricity. This prevents the conductive filler from being exposed to the surface of the molded product, but as a result, there is no contact of the conductive filler at the fitting part of the electromagnetic shielding case.
There was a problem with electromagnetic waves leaking in this part. Therefore, the contact surface of the mating part must be removed until the conductive filler is uniformly exposed.
The drawback was that secondary processing was time-consuming.

〔発明の目的〕[Purpose of the invention]

本発明はこのような点に対処してなされたもの
で、上述のような二次加工を必要とすることなく
嵌合部において導電性を有する電磁波シールドケ
ースの製造方法を提供することを目的とする。
The present invention has been made in view of these points, and an object of the present invention is to provide a method for manufacturing an electromagnetic shielding case that has conductivity at the fitting portion without requiring secondary processing as described above. do.

〔発明の概要〕[Summary of the invention]

すなわち本発明の電磁波シールドケースの製造
方法は、電磁波シールド性合成樹脂からなる成形
品を2つ以上嵌合させて構成される電磁波シール
ドケースを製造するにあたり、前記成形品の嵌合
部となる部分の金型キヤビテイ内にあらかじめ−
40〜20℃に冷却された金属板を挿入し、金型の表
面温度を60℃以上に保持してキヤビテイ内に電磁
波シールド性合成樹脂を充填し固化させて、嵌合
部に金属板を露出し、ケース表面に導電性フイラ
ーが露出しない成形品を製造することを特徴とし
ている。
That is, the method for manufacturing an electromagnetic shielding case of the present invention is to manufacture an electromagnetic shielding case configured by fitting two or more molded products made of electromagnetic shielding synthetic resin, and to produce a part that becomes a fitting part of the molded product. - in the mold cavity in advance.
A metal plate cooled to 40 to 20℃ is inserted, the surface temperature of the mold is maintained at 60℃ or higher, and the cavity is filled with electromagnetic shielding synthetic resin and solidified, exposing the metal plate at the mating part. However, it is characterized by manufacturing a molded product in which the conductive filler is not exposed on the case surface.

本発明において使用される電磁波シールド性合
成樹脂は、金属粉、カーボン粉、金属箔、金属繊
維、カーボン繊維等の導電性フイラーを、ポリス
チレン、ABS樹脂等のスチレン系樹脂、ポリプ
ロピレン等のオレフイン系樹脂、ポリカーボネー
ト、ポリアミドおよびポリエステルのような熱可
塑性樹脂に混和したものである。
The electromagnetic shielding synthetic resin used in the present invention is a conductive filler such as metal powder, carbon powder, metal foil, metal fiber, or carbon fiber, and a styrene resin such as polystyrene, ABS resin, or olefin resin such as polypropylene. , blended with thermoplastic resins such as polycarbonates, polyamides and polyesters.

また本発明において使用する金属板としては、
平板状あるいはL字状の鉄、銅、アルミニウムお
よびこれらの合金や表面にめつきを施したものが
あげられる。
In addition, the metal plate used in the present invention includes:
Examples include plate-shaped or L-shaped iron, copper, aluminum, alloys thereof, and those with plated surfaces.

次に本発明方法を図面を用いて説明する。 Next, the method of the present invention will be explained using the drawings.

第1図は本発明方法に使用する金型の断面であ
る。図において符号1,2はそれぞれ金型の固定
側型板、移動側型板であつて、固定側キヤビテイ
表面3と移動側キヤビテイ表面4の温度は各々熱
媒体流路5,6内の熱媒体によつて導電性フイラ
ーが成形品表面に露出しないよう60℃以上の適温
に制御されている。符号7は本発明の特徴をなす
もので、成形品嵌合部となる、金型キヤビテイに
挿入された金属板である。この金属板7は、充填
された電磁波シールド性合成樹脂がここで急冷固
化されて導電性充填剤が露出し、この金属板7に
密接するように、予め−40〜20℃に冷却されて金
型キヤビテイ内に挿入される。
FIG. 1 is a cross section of a mold used in the method of the present invention. In the figure, reference numerals 1 and 2 are the stationary mold plate and the movable mold plate of the mold, respectively. The temperature is controlled at an appropriate temperature of 60°C or higher to prevent the conductive filler from being exposed on the surface of the molded product. Reference numeral 7 is a metal plate that is a feature of the present invention and is inserted into the mold cavity and serves as a molded product fitting part. This metal plate 7 is pre-cooled to -40 to 20°C so that the electromagnetic shielding synthetic resin filled therein is rapidly solidified and the conductive filler is exposed. Inserted into the mold cavity.

本発明においては、このような金型を使用し
て、まず射出機のシリンダー内で可塑化した電磁
波シールド性合成樹脂を金型のノズルタツチ部8
を経て、金型キヤビテイ内に充填する。このとき
導電性フイラーは熱媒体流路5,6内の熱媒体の
影響をうけ固定側キヤビテイ表面と移動側キヤビ
テイ表面には露出しないが、低温状態にある金属
板7表面には露出して、金属板7と導電性フイラ
ーが導通した状態で電磁波シールド性合成樹脂が
固化する。
In the present invention, using such a mold, first, the electromagnetic shielding synthetic resin plasticized in the cylinder of the injection machine is applied to the nozzle touch part 8 of the mold.
After that, it is filled into the mold cavity. At this time, the conductive filler is not exposed on the fixed side cavity surface and the moving side cavity surface due to the influence of the heat medium in the heat medium flow paths 5 and 6, but is exposed on the surface of the metal plate 7 which is in a low temperature state. The electromagnetic shielding synthetic resin solidifies in a state where the metal plate 7 and the conductive filler are electrically connected.

つまり、導電性フイラーと熱可塑性樹脂とを混
和した電磁波シールド性合成樹脂において、溶融
した電磁波シールド性合成樹脂を金型内に充填す
ると、60℃以上の温度に加熱されている金型の表
面部分では、樹脂が十分溶融して流動状態となる
ため、導電性フイラーよりも樹脂成分が金型表面
近傍に集中し、樹脂リツチの状態となつて固化す
る。このため、金型から取り出した成形後のシー
ルドケース表面には導電性フイラーが露出してお
らず、樹脂成分で被膜が形成されたような樹脂リ
ツチの平滑性に優れた絶縁層が形成されることに
なる。
In other words, when a mold is filled with molten electromagnetic shielding synthetic resin that is a mixture of a conductive filler and a thermoplastic resin, the surface of the mold is heated to a temperature of 60°C or higher. In this case, since the resin is sufficiently melted to be in a fluid state, the resin component is concentrated near the surface of the mold rather than the conductive filler, and solidifies in a resin-rich state. Therefore, the conductive filler is not exposed on the surface of the molded shield case when removed from the mold, and an insulating layer with excellent smoothness and rich resin is formed, as if a film was formed from the resin component. It turns out.

一方、−40〜20℃の金属板を挿入した金型の嵌
合部では、充填された電磁波シールド性合成樹脂
が冷却された金属板に接触して急冷され、そのま
ま固化するため、樹脂成分の流動状態時間が短
く、樹脂成分が寄り集まつて金属板を被膜するに
は至らない。つまり、樹脂成分と導電性フイラー
とが分散した状態で固化し、導電性フイラーが露
出した金属板と接触した状態となる。
On the other hand, at the fitting part of the mold into which a metal plate at -40 to 20°C is inserted, the filled synthetic resin with electromagnetic shielding properties comes into contact with the cooled metal plate and is rapidly cooled, solidifying as it is. The flow state time is short, and the resin components do not come together to form a coating on the metal plate. That is, the resin component and the conductive filler are solidified in a dispersed state, and the conductive filler is brought into contact with the exposed metal plate.

このようにして成型された嵌合部に金属板の露
出した成形品9,10を金属板7,7を接触させ
て嵌合してなる電磁波シールドケースの断面を第
2図aに、その嵌合部の拡大断面を第2図bに示
す。第2図bに示すように成形品9内の導電性フ
イラーfは金属板7と導通しており金属板7はも
う一方の成形品10の金属板7′と接触し、さら
に成形品10の金属板7′は成形品10内の導電
性フイラーと導通しているので、電磁波シールド
ケースの嵌合部は全体として導通状態となり、嵌
合部での電磁波の漏洩を防ぐことができる。
Figure 2a shows a cross section of an electromagnetic shielding case formed by fitting the molded products 9 and 10 with exposed metal plates into the fitting portion formed in this way with the metal plates 7 and 7 in contact. An enlarged cross-section of the joint is shown in Figure 2b. As shown in FIG. 2b, the conductive filler f in the molded product 9 is electrically connected to the metal plate 7, and the metal plate comes into contact with the metal plate 7' of the other molded product 10. Since the metal plate 7' is electrically connected to the conductive filler in the molded product 10, the entire fitting portion of the electromagnetic shielding case is in a conductive state, and leakage of electromagnetic waves at the fitting portion can be prevented.

また、シールドケース表面には導電性フイラー
が露出しておらず絶縁層tが存在するので、外観
が平滑で導電性フイラーfとの接触により帯電す
るおそれもない。
Further, since the conductive filler is not exposed on the surface of the shield case and the insulating layer t is present, the appearance is smooth and there is no fear of being charged by contact with the conductive filler f.

〔発明の実施例〕[Embodiments of the invention]

次に本発明の実施例について説明する。 Next, examples of the present invention will be described.

実施例 挿入時の温度が5℃になるように冷却したニツ
ケルメツキ鉄板を、嵌合部となる金型キヤビテイ
内に挿入した。この状態で、金型のノズルタツチ
部より射出圧力900Kg/cm2、樹脂温230℃の条件で
40重量%の真ちゆう繊維を含むABS樹脂からな
る電磁波シールド性合成樹脂を充填した。なお金
型温度は固定側キヤビテイ表面温度が75℃、移動
側キヤビテイ表面温度が70℃になるように調節し
た。また成型時間は上ケースで射出に18秒間、冷
却に60秒間、下ケースで射出に16秒間、冷却に55
秒間とした。
Example A nickel-plated iron plate cooled to a temperature of 5° C. at the time of insertion was inserted into a mold cavity serving as a fitting portion. In this state, the injection pressure was 900Kg/cm 2 from the nozzle touch part of the mold, and the resin temperature was 230℃.
Filled with electromagnetic shielding synthetic resin made of ABS resin containing 40% by weight of brass fibers. The mold temperature was adjusted so that the fixed side cavity surface temperature was 75°C and the moving side cavity surface temperature was 70°C. The molding time is 18 seconds for injection and 60 seconds for cooling in the upper case, and 16 seconds for injection and 55 seconds for cooling in the lower case.
Seconds.

このようにして巾300mm、長さ400mm、高さ200
mm、肉厚3mmの上ケースと巾300mm、長さ400mm、
高さ150mm、肉厚3mmの下ケースを製造し、これ
らの成形品に直流モータを組み込み、上ケースと
下ケースを嵌合させた。しかる後、直流モータを
回転させ、そのブラシから発生する雑音電波を、
ケース外3mmの位置でダイポールアンテナでキヤ
ツチし、スペクトルアナライザーで側定した。測
定結果は第3図aのグラフに示す通りであつた。
一方電磁波シールド性合成樹脂の成形時に金属板
を使用しない以外は実施例と同様にして電磁波シ
ールドケースを製造し、直流モーターを組み込ん
で雑音電波を測定した。その測定結果は第3図b
のグラフに示す通りであつた。
In this way, the width is 300mm, the length is 400mm, and the height is 200mm.
mm, wall thickness 3mm upper case, width 300mm, length 400mm,
A lower case with a height of 150 mm and a wall thickness of 3 mm was manufactured, a DC motor was built into these molded products, and the upper and lower cases were fitted together. After that, the DC motor is rotated, and the noise radio waves generated from the brush are
It was caught using a dipole antenna at a position 3 mm outside the case, and the side was determined using a spectrum analyzer. The measurement results were as shown in the graph of FIG. 3a.
On the other hand, an electromagnetic shielding case was manufactured in the same manner as in the example except that no metal plate was used during molding of the electromagnetic shielding synthetic resin, and a DC motor was incorporated therein to measure noise radio waves. The measurement results are shown in Figure 3b.
The results were as shown in the graph below.

このグラフからも明らかなように実施例の電磁
波シールドケースでは雑音電波が小さく、良好な
電磁波シールド効果を有することが認められた。
As is clear from this graph, the electromagnetic shielding case of the example produced small noise radio waves and was found to have a good electromagnetic shielding effect.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明方法によれば、嵌合
部で導通があり、表面は絶縁性の電磁波シールド
ケースが得られるので、成形品の二次加工が不要
となり、電磁波シールド効果の大きい電磁波シー
ルドケースが得られる。
As explained above, according to the method of the present invention, it is possible to obtain an electromagnetic shielding case that has conductivity at the mating part and has an insulating surface, which eliminates the need for secondary processing of the molded product and provides an electromagnetic shielding with a large electromagnetic shielding effect. You get a case.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明方法に使用する金型の断面図、
第2図aは本発明方法により得られた電磁波シー
ルドケースの組立て断面図、第2図bは第2図a
の嵌合部の拡大断面図、第3図a、bはそれぞれ
本発明方法により得られた電磁波シールドケース
および従来の方法により得られた電磁波シールド
ケースの電磁波シールド性能を表わすグラフであ
る。 1……固定側型板、2……移動側型板、3……
固定側キヤビテイ、4……移動側キヤビテイ、
5,6……熱媒体流路、7,7′……金属板、9,
10……成形品。
FIG. 1 is a sectional view of a mold used in the method of the present invention;
Figure 2a is an assembled sectional view of the electromagnetic shielding case obtained by the method of the present invention, Figure 2b is Figure 2a
3A and 3B are graphs showing the electromagnetic shielding performance of the electromagnetic shielding case obtained by the method of the present invention and the electromagnetic shielding case obtained by the conventional method, respectively. 1... Fixed side template, 2... Moving side template, 3...
Fixed side cavity, 4...Movable side cavity,
5, 6... Heat medium flow path, 7, 7'... Metal plate, 9,
10... Molded product.

Claims (1)

【特許請求の範囲】 1 電磁波シールド性合成樹脂からなる成形品を
2つ以上嵌合させて構成される電磁波シールドケ
ースを製造するにあたり、 前記成形品の嵌合部となる部分の金型キヤビテ
イ内にあらかじめ−40〜20℃に冷却された金属板
を挿入し、金型の表面温度を60℃以上に保持して
キヤビテイ内に電磁波シールド性合成樹脂を充填
し固化させて、嵌合部に金属板を露出し、ケース
表面に導電性フイラーが露出しない成形品を製造
することを特徴とする電磁波シールドケースの製
造方法。
[Scope of Claims] 1. In manufacturing an electromagnetic shielding case constructed by fitting two or more molded products made of electromagnetic shielding synthetic resin, the inside of the mold cavity in the part that becomes the fitting part of the molded products. A metal plate pre-cooled to -40 to 20℃ is inserted into the mold, the surface temperature of the mold is maintained at 60℃ or higher, and electromagnetic shielding synthetic resin is filled into the cavity and solidified. A method for manufacturing an electromagnetic shielding case, characterized by manufacturing a molded product in which a plate is exposed and a conductive filler is not exposed on the case surface.
JP9546683A 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case Granted JPS59219999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9546683A JPS59219999A (en) 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9546683A JPS59219999A (en) 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case

Publications (2)

Publication Number Publication Date
JPS59219999A JPS59219999A (en) 1984-12-11
JPH0315358B2 true JPH0315358B2 (en) 1991-02-28

Family

ID=14138430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9546683A Granted JPS59219999A (en) 1983-05-30 1983-05-30 Method of producing electromagnetic wave shielding case

Country Status (1)

Country Link
JP (1) JPS59219999A (en)

Also Published As

Publication number Publication date
JPS59219999A (en) 1984-12-11

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