JPH0112648B2 - - Google Patents
Info
- Publication number
- JPH0112648B2 JPH0112648B2 JP58241741A JP24174183A JPH0112648B2 JP H0112648 B2 JPH0112648 B2 JP H0112648B2 JP 58241741 A JP58241741 A JP 58241741A JP 24174183 A JP24174183 A JP 24174183A JP H0112648 B2 JPH0112648 B2 JP H0112648B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- electromagnetic shielding
- thermoplastic composition
- layer
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1615—The materials being injected at different moulding stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
- B29C45/0416—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement co-operating with fixed mould halves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は射出成型による電磁波シールドケース
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of manufacturing an electromagnetic shielding case by injection molding.
[発明の技術的背景]
近年、デイジタル電子機器の発展に伴ない、こ
れらの電子機器から発生する電磁波が周辺のテレ
ビ等の他の機器へ妨害を与えたり、あるいは他の
機器からの電磁波によつて誤動作を起こしたりす
るという問題が大きくクローズアツプされてきて
いる。[Technical Background of the Invention] In recent years, with the development of digital electronic devices, electromagnetic waves generated by these electronic devices may interfere with other devices such as nearby televisions, or may be caused by electromagnetic waves from other devices. The problem of erroneous operation caused by overloading has become a major focus of attention.
これらの問題は電子回路を包囲するケースに電
磁波シールド効果を持たせることにより解決する
ことができる。 These problems can be solved by providing an electromagnetic shielding effect to the case surrounding the electronic circuit.
しかして、このようなケースとしては、量産
性、経済性、軽量性等の観点から合成樹脂製のも
のが多く用いられている。 However, from the viewpoints of mass production, economy, lightness, etc., cases made of synthetic resin are often used.
このようなケースに電磁波シールド性を付与す
る方法としては、以下に記載するような種々の方
法がとられていた。 Various methods as described below have been used to provide electromagnetic shielding properties to such cases.
(イ) めつき、塗装、溶射、箔接着等の方法で合成
樹脂製ケースの外表面あるいは内表面に金属質
の電磁波シールド層を設ける。(b) A metallic electromagnetic shielding layer is provided on the outer or inner surface of the synthetic resin case by plating, painting, thermal spraying, foil adhesion, etc.
(ロ) 金属粉、カーボン粉、金属箔、金属繊維、カ
ーボン繊維等の導電性フイラーを混和した熱可
塑性樹脂によりケースを成型する。(b) The case is molded from thermoplastic resin mixed with conductive filler such as metal powder, carbon powder, metal foil, metal fiber, carbon fiber, etc.
[背景技術の問題点]
しかしながら、これらの方法のうち(イ)の方法に
おいては、落下による衝撃や熱サイクル等により
電磁波シールド層が剥離したり脱落したりするお
それがあり、その剥離片が万一電子回路上に落下
した場合には、短絡や発火等の重大事故につなが
り易いという問題があつた。[Problems in the background art] However, in method (a) of these methods, there is a risk that the electromagnetic shielding layer may peel or fall off due to impact from falling or thermal cycles, and the peeled pieces may There is a problem in that if it falls onto an electronic circuit, it can easily lead to serious accidents such as short circuits and fires.
また(ロ)の方法においては、多量の導電性フイラ
ーの配合による外観の平滑性の喪失や、露出した
導電性フイラーから電荷が供給されてケースが帯
電するのを防止するため、金型のキヤビテイ側の
表面温度をできるだけ高く(熱可塑性樹脂の種類
にもよるが、通常60℃以上)し導電性フイラーが
表面から露出しないようにして成型が行なわれて
いるが、この方法では蓋と本体からなる電磁波シ
ールドケースの嵌合部や、ケースを金属シヤーシ
に当接させて接地をとる場合の当接部等における
導電性フイラー相互間あるいは導電性フイラーと
金属シヤーシ間の接触が失われて導電性がなくな
り、電磁波シールド効果が低下するという問題が
あつた。したがつてこの方法でシールドケースを
製造した場合には、嵌合部や当接部の表面を導電
性フイラーが均一に露出するまで削除しなければ
ならず、2次加工に手間がかかるという欠点があ
つた。 In addition, in method (b), the cavity of the mold is Molding is carried out by keeping the surface temperature of the side as high as possible (usually 60°C or higher, depending on the type of thermoplastic resin) so that the conductive filler is not exposed from the surface. Electromagnetic shielding occurs due to loss of contact between the conductive fillers or between the conductive filler and the metal chassis at the fitting part of the case or the contact part when the case is brought into contact with the metal chassis to establish grounding. There was a problem that the electromagnetic shielding effect was reduced. Therefore, when a shield case is manufactured using this method, the surface of the fitting part or contact part must be removed until the conductive filler is uniformly exposed, which has the disadvantage that secondary processing is time-consuming. It was hot.
[発明の目的]
本発明はこのような点に対処してなされたもの
で、上述のような二次加工を必要とすることな
く、優れた電磁波シールド効果を有する電磁波シ
ールドケースの製造方法を提供することを目的と
する。[Objective of the Invention] The present invention has been made to address the above-mentioned problems, and provides a method for manufacturing an electromagnetic shielding case that has an excellent electromagnetic shielding effect without requiring secondary processing as described above. The purpose is to
[発明の概要]
すなわち本発明の電磁波シールドケースの製造
方法は、導電性フイラーを含有する導電性熱可塑
性組成物からなる電磁波シールド層の外側表面に
非導電性熱可塑性組成物からなる非導電層を設け
るとともに、前記電磁波シールド層の一部にのみ
前記導電性フイラーを露出させて導電面を形成
し、この導電面を他の導電体に当接させて電気的
に導通させる電磁波シールドケースを製造するに
あたり、前記電磁波シールド層に対応する金型キ
ヤビテイの導電面を形成すべき部分が他の部分を
形成すべき部分よりも低温になるよう冷却しなが
ら、加熱可塑化させた前記導電性熱可塑性組成物
を充填して導電面を有する電磁波シールド層を成
型し、次いでこの電磁波シールド層を、非導電層
に対応する金型内に装填し、この金型内へ加熱可
塑化させた前記非導電性熱可塑性組成物を充填し
て非導電層を成型することを特徴としている。[Summary of the Invention] That is, the method for manufacturing an electromagnetic shielding case of the present invention includes forming a non-conductive layer made of a non-conductive thermoplastic composition on the outer surface of an electromagnetic shielding layer made of a conductive thermoplastic composition containing a conductive filler. manufacturing an electromagnetic shielding case in which the conductive filler is exposed only in a part of the electromagnetic shielding layer to form a conductive surface, and the conductive surface is brought into contact with another conductor for electrical continuity. In doing so, the conductive thermoplastic is heated and plasticized while being cooled so that the part where the conductive surface of the mold cavity corresponding to the electromagnetic shielding layer is to be formed is at a lower temperature than the part where the other parts are to be formed. An electromagnetic shielding layer having a conductive surface is filled with the composition, and then this electromagnetic shielding layer is loaded into a mold corresponding to the nonconductive layer, and the nonconductive layer is heated and plasticized into the mold. It is characterized in that it is filled with a thermoplastic composition and molded into a non-conductive layer.
本発明において、非導電層の形成に使用される
熱可塑性組成物としては、熱可塑性エラストマー
やポリスチレン、ABS樹脂、ポリプロピレン、
変性ポリフエニレンオキサイド等の熱可塑性樹脂
があげられる。 In the present invention, the thermoplastic composition used for forming the non-conductive layer includes thermoplastic elastomer, polystyrene, ABS resin, polypropylene,
Examples include thermoplastic resins such as modified polyphenylene oxide.
また、電磁波シールド層を形成する導電性熱可
塑性組成物としては、上述の組成物からなるベー
スポリマーに粉末状、繊維状あるいはフレーク状
のカーボン、鉄、銅、銅合金、アルミニウム、ニ
ツケル等の導電性フイラーを混和したものがあげ
られる。特にこの導電性熱可塑性組成物のベース
ポリマーとしては、熱可塑性エラストマーが好適
している。 In addition, the conductive thermoplastic composition forming the electromagnetic shielding layer may be a base polymer made of the above-mentioned composition and a conductive material such as powdered, fibrous or flaky carbon, iron, copper, copper alloy, aluminum, nickel, etc. Examples include those mixed with sex fillers. In particular, a thermoplastic elastomer is suitable as the base polymer for this conductive thermoplastic composition.
熱可塑性エラストマーを用いた場合には、例え
ば成型品を2つ以上嵌合させて電磁波シールドケ
ースを構成する際に、互いに当接する電磁波シー
ルド層表面がゴム弾性により完全に圧接され、嵌
合部において優れた導通を得ることができる。 When thermoplastic elastomer is used, for example, when two or more molded products are fitted together to construct an electromagnetic shielding case, the surfaces of the electromagnetic shielding layers that come into contact with each other are completely pressed together by rubber elasticity, and the Excellent conductivity can be obtained.
[発明の実施例] 次に本発明方法を図面を用いて説明する。[Embodiments of the invention] Next, the method of the present invention will be explained using the drawings.
第1図は本発明方法の一実施例に使用する射出
成型機の金型および射出シリンダの縦断面図を示
している。 FIG. 1 shows a vertical sectional view of a mold and an injection cylinder of an injection molding machine used in an embodiment of the method of the present invention.
同図において、符号1は、移動側型板2、この
移動側型板2と組合わされて成型すべき電磁波シ
ールドケースの内層の電磁波シールド層の形状に
対応するキヤビテイ3aを形成する電磁波シール
ド層成型用固定側型板4a、および移動側型板2
上に成型嵌合された電磁波シールド層5と組合わ
されて、この上に成型すべき電磁波シールドケー
スの非導電層に対応するキヤビテイ3bを成型す
る非導電層成型用固定側型板4bとから成る二色
成型用割り金型を示している。 In the figure, reference numeral 1 denotes a movable side template 2, and an electromagnetic shielding layer molding which forms a cavity 3a corresponding to the shape of the electromagnetic shielding layer of the inner layer of the electromagnetic shielding case to be molded in combination with the movable side template 2. Fixed side template 4a and moving side template 2
It consists of a fixed side mold plate 4b for molding a non-conductive layer, which is combined with the electromagnetic shielding layer 5 molded and fitted thereon to mold a cavity 3b corresponding to the non-conductive layer of the electromagnetic shielding case to be molded thereon. It shows a split mold for two-color molding.
この二色成型用割り金型1の各固定側型板4
a,4bには、射出シリンダ6a,6bの各ノズ
ル7a,7bが当接するノズルタツチ部8a,8
bが設けられている。二色成型用金型1の各キヤ
ビテイ3a,3b内には、これらのノズル7a,
7bおよびノズルタツチ部8a,8bを介して、
射出シリンダ6a,6b内で回転するスクリユー
9a,9bの推進力によりそれぞれ可塑化した導
電性熱可塑性組成物あるいは非導電性熱可塑性組
成物が充填される。 Each fixed side template 4 of this split mold 1 for two-color molding
a, 4b have nozzle touch portions 8a, 8 which are in contact with the nozzles 7a, 7b of the injection cylinders 6a, 6b.
b is provided. In each cavity 3a, 3b of the two-color molding die 1, these nozzles 7a,
7b and nozzle touch parts 8a, 8b,
The injection cylinders 6a, 6b are filled with a plasticized conductive thermoplastic composition or non-conductive thermoplastic composition by the propulsion force of the screws 9a, 9b rotating, respectively.
また、電磁波シールド層成型用固定側型板4a
の電磁波シールド層端部に対応する位置には冷媒
通路10が周設されており、この冷媒通路10に
冷媒、例えば水を通すことにより、冷媒通路10
に近接したキヤビテイ側の金型表面の温度を常温
近傍、例えば30℃以下にまで冷却できるようにな
つている。 In addition, the fixed side mold plate 4a for molding the electromagnetic shield layer
A refrigerant passage 10 is provided around the position corresponding to the end of the electromagnetic shield layer, and by passing a refrigerant such as water through the refrigerant passage 10, the refrigerant passage 10
The temperature of the mold surface on the cavity side adjacent to the mold can be cooled to around room temperature, for example, below 30°C.
第2図は第1図の−線に沿う断面図であ
り、電磁波シールド層成型用固定側型板4aの冷
媒通路10の配設状況を示している。この実施例
では、電磁波シールド成型用固定側型板4aの接
合部内側寄りに、4条の独立した冷媒通路10を
設け、これらの冷媒通路にそれぞれ水を通すこと
により、各冷媒通路に近接したキヤビテイ3a側
の金型表面を効率よく冷却できるようにしてい
る。 FIG. 2 is a sectional view taken along the - line in FIG. 1, and shows the arrangement of the refrigerant passages 10 of the fixed side mold plate 4a for molding the electromagnetic shielding layer. In this embodiment, four independent refrigerant passages 10 are provided on the inner side of the joint of the fixed side mold plate 4a for electromagnetic shield molding, and by passing water through each of these refrigerant passages, a The mold surface on the side of the cavity 3a can be efficiently cooled.
次にこの割り金型を使用して、嵌合構造の電磁
波シールドケースを製造する実施例について説明
する。 Next, an example of manufacturing an electromagnetic shielding case with a fitting structure using this split mold will be described.
すなわち、まず第1図に示すように、移動側型
板2と電磁波シールド層成型用固定側型板4aと
を組合わせた状態で射出シリンダ6aのノズル7
aが電磁波シールド層成型用固定側型板4aのノ
ズルタツチ部8aに当接され電磁波シールド層成
型用固定型板4aの冷媒通路10に通水して同図
で左端の電磁波シールド層の導電面を形成すべき
部分の近傍が30℃以下(他の部分は60℃以上)に
なるよう冷却しながら、キヤビテイ3a内に可塑
化した導電性熱可塑性組成物、例えばアルミニウ
ム繊維を含むABS樹脂が圧入されて電磁波シー
ルド層が成型される。このとき冷媒通路10近傍
の金型温度が30℃以下の部分に圧入された導電性
熱可塑性組成物は急冷され、ベースポリマーが急
速に収縮し導電性フイラーを表面から露出させた
状態で固化し、一方、他の60℃以上の金型部分に
圧入された導電性熱可塑性組成物は、導電性フイ
ラーが表面下に埋入されて熱可塑性組成物が平滑
で非導電性の面を形成する。 That is, first, as shown in FIG. 1, the nozzle 7 of the injection cylinder 6a is opened in a state in which the movable mold plate 2 and the fixed mold plate 4a for forming the electromagnetic shielding layer are combined.
a is brought into contact with the nozzle touch part 8a of the fixed side template 4a for forming the electromagnetic shielding layer, and water is passed through the coolant passage 10 of the fixed template 4a for forming the electromagnetic shielding layer to clean the conductive surface of the electromagnetic shielding layer at the left end in the figure. A plasticized conductive thermoplastic composition, such as ABS resin containing aluminum fibers, is press-fitted into the cavity 3a while cooling the area near the part to be formed to 30°C or lower (other parts to 60°C or higher). Then, an electromagnetic shielding layer is formed. At this time, the conductive thermoplastic composition press-fitted into the part of the mold near the refrigerant passage 10 where the temperature is below 30°C is rapidly cooled, the base polymer rapidly shrinks, and the conductive filler is solidified with the conductive filler exposed from the surface. , while the conductive thermoplastic composition press-fitted into the other mold part above 60℃, the conductive filler is embedded under the surface and the thermoplastic composition forms a smooth, non-conductive surface. .
次いで移動側型板2が電磁波シールド層成型用
固定側型板4aから抜き取られ、成型された電磁
波シールド層5を嵌合させたまま、矢印で示すよ
うに移動され、点線で示すようにキヤビテイ3b
にセツトされる。 Next, the movable side template 2 is extracted from the fixed side template 4a for molding the electromagnetic shielding layer, and is moved as shown by the arrow while keeping the molded electromagnetic shielding layer 5 fitted, and the cavity 3b is removed as shown by the dotted line.
is set to
しかる後、射出シリンダ6b内で可塑化された
非導電性の熱可塑性組成物、例えばABS樹脂が、
ノズル7b、ノズルタツチ部8bを介してキヤビ
テイ3b内に圧入され、先に形成された電磁波シ
ールド層5と一体化して固化される。 Thereafter, the non-conductive thermoplastic composition, such as ABS resin, is plasticized in the injection cylinder 6b.
It is press-fitted into the cavity 3b via the nozzle 7b and the nozzle touch part 8b, and is solidified by being integrated with the electromagnetic shielding layer 5 formed previously.
第3図は、このようにして成型された、嵌合構
造の電磁波シールドケース11を示しており、こ
の電磁波シールドケース11は、本体部12と蓋
部13とから構成されている。 FIG. 3 shows the electromagnetic shielding case 11 having a fitting structure formed in this way, and this electromagnetic shielding case 11 is composed of a main body part 12 and a lid part 13.
しかして本体部12および蓋部13は、それぞ
れ内層の電磁波シールド層12a,13aとこれ
らの上に一体に成形された非導電層12b,13
bとからなつている。また各電磁波シールド層1
2a,13aと非導電層12b,13bとは嵌合
部において段違いとされ、かつ電磁波シールド層
12a,13aの突出部aのほうが非導電層12
b,13bの突出部bよりやや長くされている。 Thus, the main body part 12 and the lid part 13 each have inner electromagnetic shielding layers 12a, 13a and non-conductive layers 12b, 13 integrally formed thereon.
It consists of b. In addition, each electromagnetic shield layer 1
2a, 13a and the non-conductive layers 12b, 13b are different in level at the fitting portion, and the protrusion a of the electromagnetic shielding layers 12a, 13a is higher than the non-conductive layer 12.
It is slightly longer than the protrusion b of b, 13b.
第4図は本体部12と蓋部13とを嵌合した状
態を示す断面図である。 FIG. 4 is a sectional view showing a state in which the main body part 12 and the lid part 13 are fitted together.
この図に示すように、この実施例の電磁波シー
ルドケースでは、嵌合部において電磁波シールド
層12a,13aの導電性フイラーの露出した面
がゴム状弾性により互いに圧接されるので接触部
の完全な導通が得られる。なお図においてfは導
電性フイラー、cは電磁波シールド層の縁部が弾
性変形した膨出部を示している。 As shown in this figure, in the electromagnetic shielding case of this embodiment, the exposed surfaces of the conductive fillers of the electromagnetic shielding layers 12a and 13a are pressed against each other by rubber-like elasticity at the fitting part, so that complete conduction of the contact part is achieved. is obtained. In the figure, f indicates a conductive filler, and c indicates a bulge formed by elastically deforming the edge of the electromagnetic shielding layer.
さらに、電磁波シールド層12a,13a上に
は熱可塑性組成物からなる非導電層12b,13
bが設けられているので、外観不良や外部から電
荷が供給されて帯電するおそれもなく、かつ電磁
波シールド層を熱可塑性エラストマーで形成して
も非導電層の熱可塑性組成物の種類、配合等を適
当に選択することにより強度を向上させ、さらに
任意の色彩を有する電磁波シールドケースを得る
ことができる。 Furthermore, non-conductive layers 12b and 13 made of a thermoplastic composition are provided on the electromagnetic shielding layers 12a and 13a.
b is provided, there is no risk of poor appearance or charging due to electric charge being supplied from the outside, and even if the electromagnetic shielding layer is made of a thermoplastic elastomer, the type and composition of the thermoplastic composition of the non-conductive layer, etc. By appropriately selecting the material, it is possible to improve the strength and obtain an electromagnetic shielding case having an arbitrary color.
[発明の効果]
以上説明したように本発明方法によれば、二色
射出成型機による電磁波シールド層と非導電層の
連続成型としたので、二次加工を要することなく
極めて容易に電磁波シールド効果に優れた電磁波
シールドケースが得られる。[Effects of the Invention] As explained above, according to the method of the present invention, the electromagnetic shielding layer and the non-conductive layer are continuously molded using a two-color injection molding machine, so the electromagnetic shielding effect can be achieved extremely easily without the need for secondary processing. A case with excellent electromagnetic shielding can be obtained.
第1図は本発明方法に使用する射出成型機の縦
断面図、第2図は第1図の−線に沿う断面
図、第3図は本発明方法により得られた電磁波シ
ールドケースの断面図、第4図はその組立状態を
示す断面図である。
1……二色成型用割り金型、2……移動側型
板、3a,3b……キヤビテイ、4a……電磁波
シールド層成型用固定側型板、4b……電磁波シ
ールドケース成型用固定側型板、5……電磁波シ
ールド層、6a,6b……射出シリンダ、7a,
7b……ノズル、8a,8b……ノズルタツチ
部、10……冷媒通路、11……電磁波シールド
ケース、12a,13a……電磁波シールド層、
12b,13b……非導電層、f……導電性フイ
ラー。
Figure 1 is a longitudinal sectional view of an injection molding machine used in the method of the present invention, Figure 2 is a sectional view taken along the - line in Figure 1, and Figure 3 is a sectional view of an electromagnetic shielding case obtained by the method of the present invention. , FIG. 4 is a sectional view showing the assembled state. 1...Split mold for two-color molding, 2...Moving side mold plate, 3a, 3b...Cavity, 4a...Fixed side mold plate for electromagnetic shielding layer molding, 4b...Fixed side mold for electromagnetic shielding case molding Plate, 5... Electromagnetic shielding layer, 6a, 6b... Injection cylinder, 7a,
7b... Nozzle, 8a, 8b... Nozzle touch part, 10... Refrigerant passage, 11... Electromagnetic wave shielding case, 12a, 13a... Electromagnetic wave shielding layer,
12b, 13b...non-conductive layer, f...conductive filler.
Claims (1)
成物からなる電磁波シールド層の外側表面に非導
電性熱可塑性組成物からなる非導電層を設けると
ともに、前記電磁波シールド層の一部にのみ前記
導電性フイラーを露出させて導電面を形成し、こ
の導電面を他の導電体に当接させて電気的に導通
させる電磁波シールドケースを製造するにあた
り、前記電磁波シールド層に対応する金型キヤビ
テイの導電面を形成すべき部分が他の部分を形成
すべき部分よりも低温になるよう冷却しながら、
加熱可塑化させた前記導電性熱可塑性組成物を充
填して導電面を有する電磁波シールド層を成型
し、次いでこの電磁波シールド層を、非導電層に
対応する金型内に装填し、この金型内へ加熱可塑
化させた前記非導電性熱可塑性組成物を充填して
非導電層を成型することを特徴とする電磁波シー
ルドケースの製造方法。 2 電磁波シールド層の成型工程において、金型
の導電面を形成すべき部分の温度を30℃以下に保
持しつつ金型内へ加熱溶融された導電性熱可塑性
組成物を充填する特許請求の範囲第1項記載の電
磁波シールドケースの製造方法。 3 導電性熱可塑性組成物は、熱可塑性エラスト
マーをベースとする特許請求の範囲第1項または
第2項記載の電磁波シールドケースの製造方法。[Scope of Claims] 1. A non-conductive layer made of a non-conductive thermoplastic composition is provided on the outer surface of an electromagnetic shielding layer made of a conductive thermoplastic composition containing a conductive filler, and one of the electromagnetic shielding layers is provided with a non-conductive layer made of a non-conductive thermoplastic composition. In manufacturing an electromagnetic wave shielding case in which the conductive filler is exposed only in a portion to form a conductive surface, and this conductive surface is brought into contact with another conductor to provide electrical continuity, the electromagnetic wave shielding case corresponds to the electromagnetic wave shielding layer. While cooling the mold cavity so that the part where the conductive surface is to be formed is at a lower temperature than the part where the other parts are to be formed,
The conductive thermoplastic composition that has been heat-plasticized is filled to form an electromagnetic shielding layer having a conductive surface, and then this electromagnetic shielding layer is loaded into a mold corresponding to the non-conductive layer. 1. A method for manufacturing an electromagnetic shielding case, comprising filling the non-conductive thermoplastic composition heated and plasticized to form a non-conductive layer. 2. Claims that, in the molding process of the electromagnetic shielding layer, the heated and melted conductive thermoplastic composition is filled into the mold while maintaining the temperature of the part of the mold where the conductive surface is to be formed at 30°C or less. A method for manufacturing an electromagnetic shielding case according to item 1. 3. The method for manufacturing an electromagnetic shielding case according to claim 1 or 2, wherein the conductive thermoplastic composition is based on a thermoplastic elastomer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58241741A JPS60132717A (en) | 1983-12-21 | 1983-12-21 | Preparation of electromagnetic wave shielding case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58241741A JPS60132717A (en) | 1983-12-21 | 1983-12-21 | Preparation of electromagnetic wave shielding case |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60132717A JPS60132717A (en) | 1985-07-15 |
JPH0112648B2 true JPH0112648B2 (en) | 1989-03-01 |
Family
ID=17078849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58241741A Granted JPS60132717A (en) | 1983-12-21 | 1983-12-21 | Preparation of electromagnetic wave shielding case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60132717A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0180383A3 (en) * | 1984-10-26 | 1987-06-03 | Aronkasei Co., Limited | A manufacturing method for housings with a two-layer structure |
DE3712959A1 (en) * | 1987-04-02 | 1988-10-20 | Schock & Co Gmbh | TOWEL-PLASTIC PLASTIC SANITATION OBJECT, IN PARTICULAR BATHTUB |
GB2318758A (en) * | 1996-10-31 | 1998-05-06 | Motorola Inc | Metod for applying conductive shielding to a non-conductive part |
FR3076975B1 (en) * | 2018-01-16 | 2020-02-07 | Amphenol - Air Lb | PROCESS FOR ISOLATING AN ELECTRICAL CONNECTION DEVICE HOUSING FROM ELECTROMAGNETIC WAVES AND HOUSING OBTAINED BY IMPLEMENTING THIS METHOD |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS541534U (en) * | 1977-06-03 | 1979-01-08 | ||
JPS55146724A (en) * | 1980-04-21 | 1980-11-15 | Yoshida Kogyo Kk <Ykk> | Double molding device using different kinds of materials |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5257502U (en) * | 1975-09-29 | 1977-04-26 | ||
JPH0225280Y2 (en) * | 1980-10-01 | 1990-07-11 |
-
1983
- 1983-12-21 JP JP58241741A patent/JPS60132717A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS541534U (en) * | 1977-06-03 | 1979-01-08 | ||
JPS55146724A (en) * | 1980-04-21 | 1980-11-15 | Yoshida Kogyo Kk <Ykk> | Double molding device using different kinds of materials |
Also Published As
Publication number | Publication date |
---|---|
JPS60132717A (en) | 1985-07-15 |
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