JPH03141506A - Anisotropic conductive material and its manufacture - Google Patents
Anisotropic conductive material and its manufactureInfo
- Publication number
- JPH03141506A JPH03141506A JP27935189A JP27935189A JPH03141506A JP H03141506 A JPH03141506 A JP H03141506A JP 27935189 A JP27935189 A JP 27935189A JP 27935189 A JP27935189 A JP 27935189A JP H03141506 A JPH03141506 A JP H03141506A
- Authority
- JP
- Japan
- Prior art keywords
- needle
- conductive material
- crystals
- adhesive
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000013078 crystal Substances 0.000 claims abstract description 22
- 230000005291 magnetic effect Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000005294 ferromagnetic effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 3
- 239000003302 ferromagnetic material Substances 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- -1 for instance Substances 0.000 abstract 1
- 238000005304 joining Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011295 pitch Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、異方導電性材及びその製造方法に間するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an anisotropically conductive material and a method for manufacturing the same.
従来の技術
従来、異方導電性材、例えは異方導電性接着剤、あるい
は異方導電性シートは、電子回路基板の製造において、
非常にピッチ間隔の細かいリードないしはＩＣの接合に
利用されている。特に、この異方導電性シートは、近年
小型、軽量化する電子機器にあって多用されるようにな
ったエフピーシ−（ＦＰＣ）と基板の接合、あるいは液
晶デイスプレィのリード接合によく用いられている。こ
の異方導電性シート中には導電性を付与するため微細な
金属粒子が混入されている。例えば、ニッケルやカーボ
ンの粉末を用いることが多い。BACKGROUND ART Conventionally, anisotropically conductive materials, such as anisotropically conductive adhesives or anisotropically conductive sheets, have been used in the manufacture of electronic circuit boards.
It is used for joining leads or ICs with very fine pitch intervals. In particular, this anisotropic conductive sheet is often used for bonding FPCs and substrates, which have become popular in electronic devices that have become smaller and lighter in recent years, or for lead bonding of liquid crystal displays. . Fine metal particles are mixed into this anisotropic conductive sheet to impart conductivity. For example, nickel or carbon powder is often used.
これらの導電性シートを利用した接合法としては、その
シートに、接合部の大きさに対応した治具で圧力をかけ
ると同時に、治具自身を加熱してこれを熱源としてその
接合部を加熱するという方法が一般的である。圧力がか
かったところだけに導電性が生じるようになっている。A joining method using these conductive sheets involves applying pressure to the sheets using a jig that corresponds to the size of the joint, and at the same time heating the jig itself and using this as a heat source to heat the joint. A common method is to do so. Conductivity occurs only where pressure is applied.
このような異方導電性シートを用いた接合は、半田付け
に比較して低温での接合が可能になることから、耐熱性
の低い電子部品を使用する場合には好適である。Bonding using such an anisotropic conductive sheet enables bonding at a lower temperature than soldering, and is therefore suitable when using electronic components with low heat resistance.
発明が解決しようとする課題
しかし、従来の異方導電性材に用いられている導電性粒
子の形状は、第２図に示すように球形であるため、基板
２及びリード３との接触面積が限られており、接合抵抗
にバラツキが出やすいという課題がある。即ち同図にお
いて、基板２の上に母材料としての接着剤層４が形成さ
れ、その接着剤層４の中に球状金属粒子δが分散されて
いる。Problems to be Solved by the Invention However, since the shape of the conductive particles used in the conventional anisotropic conductive material is spherical as shown in FIG. 2, the contact area with the substrate 2 and the leads 3 is small. However, there is a problem in that the bonding resistance tends to vary. That is, in the figure, an adhesive layer 4 as a base material is formed on a substrate 2, and spherical metal particles δ are dispersed in the adhesive layer 4.
この接着剤層４の上にリード３が接着されている。Leads 3 are bonded onto this adhesive layer 4.
本発明は、このような従来技術の課題を解決することを
目的とする。The present invention aims to solve the problems of the prior art.
課題を解決するための手段
請求項１記載の本発明は、母材料の中に針状の導電性材
料が分散された異方導電性材である。Means for Solving the Problems The present invention as set forth in claim 1 is an anisotropically conductive material in which acicular conductive material is dispersed in a base material.
請求項２０本発明は、請求項１記載の導電性材料として
強磁性体の針状結晶を用い、その針状結晶に磁界をかけ
ることによって、磁界をかけた部分の針状結晶に配向性
を与え、その磁界をかけた部分にだけ導電性を与える異
方導電性材の製造方法である。Claim 20 The present invention uses needle-like crystals of ferromagnetic material as the conductive material according to claim 1, and by applying a magnetic field to the needle-like crystals, the orientation of the needle-like crystals is imparted to the portion where the magnetic field is applied. This is a method of manufacturing an anisotropically conductive material that gives conductivity only to the area where the magnetic field is applied.
作用
本発明においては、導電性を付与する材料の形状が針状
であるので、接合抵抗にバラツキが少なくなり、配向性
が高くなる。その結果微小ピッチの接合が可能となる。Function: In the present invention, since the shape of the material imparting conductivity is acicular, variations in bonding resistance are reduced and orientation is enhanced. As a result, fine pitch bonding becomes possible.
また、強磁性体の針状結晶に磁界をかけることによって
そのかけた部分の針状結晶に集中的に配向性を与えて、
導電性を与えることができる。In addition, by applying a magnetic field to needle-like crystals of ferromagnetic material, the needle-like crystals in the area where the magnetic field is applied are intensively given orientation.
Can provide conductivity.
実施例
以下本発明の一実施例について図面を参照しながら説明
する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第１図は、本発明にかかる異方導電性材の一実施例を示
す断面図である。FIG. 1 is a sectional view showing an embodiment of the anisotropically conductive material according to the present invention.
基板２の上には、母材料としての一液性エボキシ接着剤
４の層が形成され、その中に、針状の強磁性体結晶、例
えばニッケルの結晶が分散されている。A layer of one-component epoxy adhesive 4 as a base material is formed on the substrate 2, and needle-shaped ferromagnetic crystals, such as nickel crystals, are dispersed therein.
基板２とリード３との接合の方法を以下に示す。A method for joining the substrate 2 and the leads 3 will be described below.
基板２上に針状結晶を分散した接着剤４を塗布し、その
上からＦＰＣのリード３をかぶせる。接着剤４が硬化す
る前に、リード３のある部分にだけ磁界を与えることに
より、その部分、即ち導電性が必要な部分にある針状結
晶ｌだけ配向させる。この状態で接着剤４を硬化させる
ことにより、接合が完成する。このように、配向性が高
い状態に針状結晶１を形成することができるので、微小
ピッチの接合が可能となる。また、銀粒子を用いたとき
の拡散によって生じるマイグレーションの発生を防止で
きる。このようにして通常用いられるスクリーン印刷工
程を経ずに微少なピッチを持つ電子回路上の接合が可能
となる。An adhesive 4 in which needle crystals are dispersed is applied onto the substrate 2, and an FPC lead 3 is placed over it. By applying a magnetic field only to a certain part of the lead 3 before the adhesive 4 hardens, only the acicular crystals 1 in that part, that is, the part where conductivity is required, are oriented. By curing the adhesive 4 in this state, the bonding is completed. In this way, since the needle-like crystals 1 can be formed in a highly oriented state, bonding at a minute pitch is possible. Furthermore, it is possible to prevent migration caused by diffusion when silver particles are used. In this way, it is possible to bond electronic circuits with minute pitches without going through the commonly used screen printing process.
なお、強磁性体結晶１としてはニッケルのほかに鉄、銀
、コバルト、及びその合金等が使用可能である。In addition to nickel, iron, silver, cobalt, alloys thereof, and the like can be used as the ferromagnetic crystal 1.
また、母材料としては、エポキシ接着剤に限らず他の材
料でも構わない。Further, the base material is not limited to epoxy adhesive, and other materials may be used.
発明の詳細
な説明したように本発明によれば、導電性材料として針
状の結晶を用いることにより従来よりも配向性が強くな
り、微少なピッチを持つ電子回路上の接合に適する。DETAILED DESCRIPTION OF THE INVENTION As described in detail, according to the present invention, by using needle-like crystals as the conductive material, the orientation is stronger than in the past, and it is suitable for bonding on electronic circuits with minute pitches.
また、導電性材料として強磁性体の針状結晶を用い、磁
界をかけることによって、必要な場所に自由に導電性を
付与できる長所を有する。In addition, it has the advantage that conductivity can be freely imparted to required locations by using needle-shaped ferromagnetic crystals as the conductive material and applying a magnetic field.
第１図は本発明の一実施例における異方導電性材の接合
の断面図、第２図は従来の異方導電性材の接合の断面図
である。
１・・・針状結晶、２・・・基板、３・・・リード、４
・・・接着剤、５・・・球状金属粒子。FIG. 1 is a sectional view of joining anisotropically conductive materials according to an embodiment of the present invention, and FIG. 2 is a sectional view of conventional joining of anisotropically conductive materials. DESCRIPTION OF SYMBOLS 1... Acicular crystal, 2... Substrate, 3... Lead, 4
... Adhesive, 5... Spherical metal particles.
Claims (2)
を特徴とする異方導電性材。(1) An anisotropically conductive material characterized by having acicular conductive material dispersed in a base material.
結晶を用い、その針状結晶に磁界をかけることによって
、磁界をかけた部分の針状結晶に配向性を与え、その磁
界をかけた部分にだけ導電性を与えることを特徴とする
異方導電性材の製造方法。(2) A ferromagnetic acicular crystal is used as the conductive material according to claim 1, and by applying a magnetic field to the acicular crystal, orientation is imparted to the acicular crystal in the area where the magnetic field is applied, and the magnetic field A method for producing an anisotropically conductive material characterized by imparting conductivity only to the portion where it is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27935189A JPH03141506A (en) | 1989-10-26 | 1989-10-26 | Anisotropic conductive material and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27935189A JPH03141506A (en) | 1989-10-26 | 1989-10-26 | Anisotropic conductive material and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03141506A true JPH03141506A (en) | 1991-06-17 |
Family
ID=17609961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27935189A Pending JPH03141506A (en) | 1989-10-26 | 1989-10-26 | Anisotropic conductive material and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03141506A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004088056A (en) * | 2002-07-02 | 2004-03-18 | Sumitomo Electric Ind Ltd | Piezoelectric vibrator, method of mounting the same, mounting device, ultrasonic probe using the same, and three-dimensional ultrasonic diagnostic apparatus using the same |
| JP2007317563A (en) * | 2006-05-26 | 2007-12-06 | Sumitomo Electric Ind Ltd | Adhesive for circuit connection |
| JP2008084545A (en) * | 2006-09-25 | 2008-04-10 | Sumitomo Electric Ind Ltd | Adhesive for electrode connection |
| US8230786B2 (en) | 2002-06-05 | 2012-07-31 | Kba-Giori S.A. | Method of manufacturing an engraved plate |
-
1989
- 1989-10-26 JP JP27935189A patent/JPH03141506A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8230786B2 (en) | 2002-06-05 | 2012-07-31 | Kba-Giori S.A. | Method of manufacturing an engraved plate |
| US8574714B2 (en) | 2002-06-05 | 2013-11-05 | Kba-Giori S.A. | Method of manufacturing an engraved plate |
| JP2004088056A (en) * | 2002-07-02 | 2004-03-18 | Sumitomo Electric Ind Ltd | Piezoelectric vibrator, method of mounting the same, mounting device, ultrasonic probe using the same, and three-dimensional ultrasonic diagnostic apparatus using the same |
| JP2007317563A (en) * | 2006-05-26 | 2007-12-06 | Sumitomo Electric Ind Ltd | Adhesive for circuit connection |
| JP2008084545A (en) * | 2006-09-25 | 2008-04-10 | Sumitomo Electric Ind Ltd | Adhesive for electrode connection |
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