JPH03127849A - Wafer transferring equipment - Google Patents

Abstract

PURPOSE:To facilitate the supply and positioning of a wafer before treatment to a processing part, by installing a freely reciprocating vacuum sucking plate on a moving stand reciprocating in front of each elevating stand, which sucking plate sucks a wafer before treatment on a first elevating stand and transfers it onto a second elevating stand. CONSTITUTION:A moving stand 82 reciprocates in front of a first elevating stand 15 and a second vacuum sucking type elevating stand 65 installed in a wafer processing part A. A vacuum sucking plate 92, which reciprocates in the direction perpendicular to the moving direction of the moving stand 82 and transfers a wafer 3 on the first elevating stand 15 onto the second elevating stand 65, is installed on the moving stand 82. When the sucking plate 92 retracts from a stage 17, it ascends up to a specified position, and the upper surface of the stage 17 becomes flush with the upper surface of the elevating stand 65. Then the stage 17 retains the wafer 3 and sucks it by vacuum. Thereby the supply and positioning of a wafer 3 before treatment to the processing part A are facilitated.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention involves attaching an adhesive tape to the top of a wafer of any shape, such as a circular shape, such as a silicon wafer that serves as a substrate for an integrated circuit, and applying this tape to the top of the wafer. The present invention relates to a wafer transfer device in a wafer processing device, such as a device that peels off tape other than the portion stuck on the wafer after cutting along the outer periphery.

[Prior Art] A conventional wafer-adhesive tape adhering device, for example, disclosed in Japanese Patent Application Laid-Open No. 64-43458, is a device for adhering a wide adhesive tape to a wafer. The tape is then canted along the periphery of the wafer.

The wafer transfer device in this known technology takes out a large number of unprocessed wafers stored in a cassette one by one using an endless belt for taking out wafers, transports the wafers to a processing section using a transport heald, and in this processing section, The processed wafer is subjected to processes such as pasting with adhesive tape and canting, and is transported again by the transport belt and inserted into the cassette by the endless heddle for wafer insertion.

[Problem to be solved by the invention]

As mentioned above, many of the wafer transfer devices in conventional wafer processing equipment use endless conveyor belts, so in order to prevent the heald from interfering with processing in the wafer processing section, the processing table There were problems such as the need for a complicated mechanism such as providing a groove for the heald to fit in and raising and lowering the frame to which the heddle was attached.

An object of the present invention is to provide a wafer transfer apparatus that solves the problems of the prior art as described above and minimizes the use of an endless belt or eliminates the endless belt.

[Means to solve the problem]

In order to solve the above problems, the present invention provides an endless belt for taking out wafers, which takes out wafers one by one from a cassette, and a vacuum provided on one side of the wafer processing section. An endless belt for carrying in wafers is provided to be placed on the first suction-type lifting table, and on the other side of the processing section, there is an endless belt for carrying out wafers for carrying out processed wafers, and an endless belt for carrying out wafers to carry out processed wafers. An endless heddle for inserting wafers is provided for inserting processed wafers one by one into the cassette of the unloading section.
The movable table reciprocates between the elevating table and the front of the second elevating table of the vacuum suction type provided in the processing section. The present invention provides a wafer transfer device equipped with a vacuum suction plate for transferring a wafer onto a second lifting table.

Further, a third lifting table is provided between the second lifting table and the endless belt for carrying out wafers, and a third lifting table is provided in front of the first lifting table and a second lifting table of a vacuum suction type provided in the processing section. The first moving table that reciprocates between the two stages is equipped with a vacuum suction plate that moves back and forth in a direction perpendicular to the moving direction of the moving table to transfer the wafer on the first lifting table to the second lifting table of the processing section. Further, the second moving table is also provided with a vacuum suction plate that moves back and forth in a direction perpendicular to the moving direction of the moving table to transfer the processed wafer on the second lifting table onto the third lifting table. A moving table is provided that moves between the loading section and the unloading section of the wafer transfer device and wafer processing device, and a rotating table is provided on the moving table. A reciprocating member is provided that can be freely directed toward the loading section, the processing section, and the unloading section, and this retracting member transfers the wafer taken out from the cassette of the loading section to the processing section by vacuum suction, and processes the processed wafer. The present invention also provides a wafer transfer device equipped with a vacuum suction plate for transferring a wafer from a cassette in an unloading section to a cassette in an unloading section.

[Operation] The present invention has the above-described configuration, and in the first invention, a large number of wafers stored in a cassette in a loading section are taken out one by one starting from the lowest one by an endless belt for taking out wafers. transferred onto the belt.

The wafer transferred onto the endless wafer loading belt as described above is driven by this belt to come to the lowered position of the first lifting table and is stopped there.

Then, as the first lifting table rises, the wafer on the belt is transferred onto the lifting table and fixed on the table by vacuum suction.

Next, the vacuum suction plate on the first moving table advances to the underside of the wafer on the first lifting table, and then the first lifting table lowers slightly to place the wafer on the vacuum suction plate, and at the same time vacuum Suction is released and the vacuum suction plate suctions the wafer.

The vacuum suction plate that has adsorbed the wafer remains in that position, and the moving table moves to the front of the processing section and stops, and the wafer adsorbed on the vacuum suction plate is placed on the second elevating table in the lowered position. let

Next, the second elevating table rises slightly, and after the wafer is vacuum-adsorbed onto the second elevating table, the vacuum suction plate releases the vacuum suction and returns to the initial position together with the movable table.

The wafers left in the processing section are subjected to processes such as pasting adhesive tape and canting the pasted adhesive tape.

When the processing unit finishes processing the wafer as described above, the endless heald for carrying out the wafer is driven, the processed wafer is transferred onto the endless belt for inserting the wafer and stopped, and finally the endless belt for inserting the wafer is driven. and insert the processed wafer into the cassette.

By repeating the above operations, the wafers in the cassette of the loading section are taken out one by one and processed, and then inserted one by one into the cassette of the unloading section.

In the case of the second invention, the processes such as attaching an adhesive tape to the wafer and the steps up to the processing are the same as the first invention, but the steps thereafter are different.

That is, after adhesive tape is pasted onto the wafer and canted, the vacuum suction plate on the second movable table that has been moved to the front of the processing section advances toward the processing section and vacuums the processed wafer. At the same time as the suction, the vacuum suction of the second lifting table is released, and the second moving table moves together with the vacuum suction plate that adsorbed the wafer, transfers the wafer onto the third lifting table, and the third lifting table rises. A wafer is placed on the wafer and vacuum suction is performed, and at the same time, the vacuum suction plate is released from vacuum suction and returns to its initial position together with the third moving table.

On the other hand, the third elevating table that has suctioned the processed wafer is slightly lowered, and the wafer is placed on the endless heald for carrying out the wafer, and the vacuum suction is released.

After that, the process is the same as that of the first invention device described above.

In the third invention, an endless belt for conveyance is not used at all, but a swivel table is provided on the movable table so that the vacuum suction plate can be rotated and moved forward and backward, so that the vacuum suction plate is directed toward the loading section. Move the wafer forward and backward to take out the wafer from the cassette.

Next, the wafer is supplied with the vacuum suction plate directed toward the processing section and subjected to the same processing as in the first and second aspects of the invention.

When the processing is finished, the vacuum suction plate is moved forward and backward toward the processing section to take out the processed wafer.

Next, advance and retreat the vacuum suction plate towards the unloading section,
Insert the processed wafer into the cassette 7 of the unloading section.

- By repeating the above operations, the wafers in the cassette of the loading section are taken out one by one and processed, and then inserted one by one into the cassette of the unloading section.

[Example] A device for bonding a wafer and a tape together will be described below as an example of the device of the present invention.

In the first embodiment shown in FIGS. 1 and 2, reference numeral 1 denotes a loading section, which has a stand 14 on which a cassette 2 is placed.

A large number of wafers 3 are stacked at appropriate intervals in the cassette 2 on this table 14 with the element formation side facing up, and the endless belt 4.5.6 for taking out wafers is used to remove the lowest wafer 3 in the cassette 2. is sent onto the guide stand 7. The guide stand 7 is the first
As shown in the figure, the belt 6 is divided into a plurality of parts, and
An endless belt 8.9 for carrying in wafers is arranged in a direction perpendicular to this heald 6, and a plurality of guide bars 10 are fixed.

As shown in FIG. 2, the belt 8 is bent by a plurality of pulleys to prevent it from interfering with the belt 6. The belt 6 feeds the wafer 3 onto the table 7, the belt 6 stops, and the belts 8.9 11 and a transmission belt 12 in the direction of the arrow in FIG. 2, the wafer 3 is sent to the next first lifting table 15.

The table 14 is raised and lowered by a lifting means (not shown), and each time one wafer 3 is taken out, the cassette 2 is lowered and the next wafer 3 is placed on the belt 4.

The first lifting platform 15 is an air cylinder 1 shown in FIG.
6, and a suction groove or hole is provided on the top surface.
This is communicated with a vacuum suction device to suction and fix the wafer on the table 15.

Reference numeral 19 denotes a wafer positioning plate provided beside the lifting table 15, which is semicircular and has an arcuate protrusion 20 along the outer circumference of the wafer 3, and is provided with a pair of notches 21 into which the conveying side of the belt 9 is fitted.

Furthermore, when the lifting table 15 is used as a turning table for wafer alignment, the table 15 is turned by a stamping motor, and the motor is stopped when the orientation flat of the wafer reaches a predetermined position according to a detector. .

A is a processing section, in the illustrated example, adhesive tape is pasted on the wafer 3 on the stage 17, and then the tape can)/means 18
This is used to cant the tape stuck onto the wafer 3.

In addition, 22 in Fig. 2 is a machine stand, and the machine box 2 on this machine stand 22
3 is provided with a reel 26 for feeding out the adhesive tape 25 and a take-up reel 27 for the same, and the tape 2 fed out from the reel 26 is
5 passes through a swing roller 28 and a pair of guide rollers 29, passes between upper and lower rollers 30 and 31 with the adhesive side facing down, and then passes through a guide roller 3 provided on a moving frame 34.
5 and the adhesion roller 36, passing between a pair of upper and lower peeling rollers 38 of a tape peeling means 37 (to be described later), a guide roller 39 and a guide roller 40.4 provided in the machine box 23.
1. The film is wound onto the winding wheel 27 via swing rollers 42 and 43.

Further, the separator 45 is connected to the roller 4 of the moving frame 34.
6.47, passes between rollers 31 and 48, is guided to a guide roller 49, passes through a swing roller 50, and is wound onto a separator take-up reel 51.

The tape cutting means 18 is installed in a lifting frame 55 shown in FIG. 2 which is raised and lowered by a vertical air cylinder fixed to the inner surface of the side wall of the machine box 23.

A vertical cylindrical body 56 is provided at the lower part of the elevating frame 55.

Reference numeral 57 denotes a rotary support plate provided at the lower end of the cylindrical body 56, and an adjustment plate 58 movable in the horizontal direction along a guide is provided at the bottom of the support plate 57. The adjustment plate 58 is moved horizontally and fixed at an arbitrary position to match the cut size.

A sliding body 59 that is moved by a feed screw is provided at the bottom of the adjustment plate 58, a frame 60 is provided on the side of this sliding body 59, a cutter 61 is provided at the lower end of this frame 60, and the vacuum suction type stage 17 is provided. Adhesive tape 25 attached to the upper wafer 3
is canted along the periphery of the wafer 3.

The stage 17 has a large number of suction holes or suction grooves on its upper surface and fixes the wafer 3 moved thereon by vacuum suction, and can be raised and lowered by an air cylinder 63 shown in FIG.

2 The tape peeling means 37 is connected to a guide 44 as shown in FIG.
The bealing roller 3 is mounted on a moving table 52 that moves along
8 and a guide roller 39. The moving frame 34 also moves along the guide 44.

An opening 64 is provided in the center of the stage 17, into which a second elevating table 65 is attached. This elevating table 65 is moved to the stage 1 by the air cylinder 63 and another air cylinder.
7, it can be raised and lowered freely.

This second elevating table 65 is also provided with suction grooves or holes on its upper surface, which are communicated with a vacuum suction device to suction and fix the wafer on the table 65.

66 in FIG. 1 is an unloading section, and this unloading section 66
has a function opposite to that of the load section 1. That is,
As shown in FIG. 1, it consists of a table 68 on which a cassette 67 is placed and a device for raising and lowering it, and has a guide table 69 at the rear.

The guide stand 6S is divided into a plurality of parts, and the guide bar 7
7, and a pair of left and right endless belts 70, 71 for carrying out wafers are provided between them, and a pair of left and right endless belts 72, 73, 74 for wafer insertion, which are perpendicular to the heald 71, are provided between the bell door 1 and the table 68. are arranged one after another, and the wafers 3 thereon are fed into a cassette 67 on a table 68.

The conveyance side of the heald 71 is bent by a plurality of pulleys as shown in FIG. 2 so as not to interfere with the heald 72, and a second
Drive in the direction of the arrow in the figure.

Reference numeral 88 denotes horizontal parallel grooves provided at a predetermined depth from the upper surface of the stage 17, along which the endless heald 89 for wafer transfer is run.

As shown in FIG. 2, the belt 89 is arranged so as to surround both the upper and lower sides of the stage 17 by a plurality of bools arranged above and below both sides of the stage 17, and the belt 70 side is also used as a pulley of the belt 70, and the belt 89 is Transmission belt 9
4 in the direction of the arrow in FIG.

Reference numeral 80 in FIG. 1 is a table provided extending from the first elevating table 15 to the front of the second elevating table 65, and a movable table 82 that moves along a guide bar 81 provided on this table is provided.

The moving table 82 is a feed screw 8 arranged on the table 80.
4. Advances and retreats by forward and reverse rotation.

Further, the feed screw 84 is supported by a bearing on the table 80 and is driven by a forward/reverse motor 86 via a transmission belt.

A reciprocating member SO is provided on the moving table 82 mentioned above.

This member 90 moves forward and backward in a direction perpendicular to the moving direction of the moving table 82 by means of an air cylinder or the like.

On the reciprocating member 90, there is a tip, that is, an elevating platform 15.6.
A vacuum suction plate 92 having a bifurcated end on the 5 side is fixed.

A plurality of suction holes are provided in necessary parts such as the upper or lower surfaces of the bifurcated portions of the suction plate 92, and the thin communication holes provided in the suction plate 92 are communicated with the suction holes, and the communication holes are connected to the member 90. A connected vacuum suction hose is connected, and the hose is connected to a vacuum suction device via an automatic control valve.

Next, to explain the operation of the first embodiment, as described above, the wafer 35 taken out from the cassette 2 passes through the endless belt 4, 5, 6, 8, and the belt 9 to the first belt.
The belt 8.9 is carried onto the lifting table 15 of the wafer, and the belt 8.9 stops at the same time as it hits the ridge 20 of the wafer positioning plate 19. At this time, although the elevating table 15 is below the conveying surface of the heald 9, when the wafer 3 stops directly above it, the cylinder 16 works and the elevating table 15 rises, lifting the wafer 3 from above the heald 9 and lifting the wafer 3 onto the protruding edge 20. At the same time as raising the wafer 3 higher, a vacuum suction device operates to suction and fix the wafer 3 onto the lifting table 15.

When alignment of the wafer 3 is required, the lifting table 15 rotates to align the wafer 3.

Next, the reciprocating member 9 on the movable table 82 in the position shown in FIG.
0 moves forward in the direction of the first lifting table 15 and inserts the two prongs at the tip above the conveying surface of the belt 9 and below the wafer 3 as shown by the chain line in FIG.

Then, at the same time as lowering the lifting table 15, the vacuum suction is released, the wafer 3 is vacuum suctioned by the vacuum suction plate 92, and the movable table 82 is moved to the left in FIG.
When the wafer 2 is stopped at the position indicated by line M in FIG.

At this time, the stage 17, the second lifting platform 65, the belt 8
9 is below the suction plate 92, but when the suction plate 92 is stopped, the lifting table 65 rises and contacts the wafer 3, and at the same time vacuum suctions the wafer 3, and at the same time, the vacuum suction of the suction plate 92 is released. , the reciprocating member 90 retreats, and the movable table 82 returns to the position indicated by the chain line in FIG. 1, returning to its original position in FIG.

Under the condition that the suction plate 92 is removed from the stage 17 as described above, the stage 17 rises to the position indicated by the chain line in FIG.
The stage 17 supports the wafer 3 and vacuum-chucks it.

Next, the moving frame 34 moves and the adhesive tape 25 is applied to the wafer 3 on the stage 17 by the application roller 36.

Next, the tape cutting means 18 descends, cuts the tape 25 on the wafer 3 along the outer periphery of the wafer 3 with the blade 61, and then ascends.

Thereafter, the tape peeling means 37 moves to peel off the perforated tape 25 after being cut and wind it onto the reel 27.

After affixing the tape 25 to the wafer 3 on the stage 17 and cutting it as described above, the vacuum suction of the wafer by the stage 17 is released, and the elevating table 65 and the stage 17 are both lowered and the wafer 3 is placed on the belt 89. It will be listed on .

Next, Held 8S starts running to the right toward Figure 1.

As mentioned above, when the heald 89 starts running, the belt 70.
71 also starts running and feeds the wafer 3 onto the endless belt 72 for wafer insertion at the rear of the unloading section 66.
0.71.89 will stop.

At the same time, the belts 72, 73, 74 begin to rotate forward, feeding the processed wafers 3 into the cassette 67 on the platform 68.

The stand 68 is a known one that rises each time one wafer 3 is fed into the cassette 67.

9 By repeating the above operations, the wafers in the cassette of the loading section are taken out one by one and processed, and then inserted one by one into the cassette of the unloading section.

3 and 4 show a second embodiment, in which the endless belt 89 for wafer conveyance of the first embodiment is omitted, and a third elevating table 78 is provided next to the stage 17.

This lifting platform 78 is installed between the left and right belts 70,
It is raised and lowered by an air cylinder 79, and similarly to each of the lifting tables 15 and 65, a suction groove or hole is provided on the upper surface thereof, and this is communicated with a vacuum suction device to suction and fix the wafer on the table 78. be.

The table 80 is provided extending from the first lifting table 15 to the front of the third lifting table 78, and a second moving table 83 that moves along the guide bar 81 is provided on this chiffle.

The movable table 83 also moves forward and backward by forward and reverse rotation of a feed screw 85 parallel to the feed screw 84 disposed on the table 80.

Further, the feed screw 85 is supported by a bearing on the table 80 and is driven by a forward/reverse motor 87.

A moving member 91 is also provided on the moving table 83, and this member 91 is also moved back and forth by an air cylinder or the like in a direction perpendicular to the moving direction of the moving table 83.

A vacuum suction plate 93 similar to the vacuum suction plate S2 is also fixed on the reciprocating member 91.

In the second embodiment described above, after the tape 25 is attached to the wafer 3 on the stage 17 and the wafer is cut, the operation after the vacuum suction of the wafer by the stage 17 is released is different.

In other words, the stage 17 is lowered leaving the elevator platform 65 behind.
The lifting table 65 lifts the wafer 3 to the stage 17 while vacuum suctioning it.
It will protrude upward.

Next, the second moving table 83 moves to the right toward FIG.
The vacuum suction plate 93 thereon is moved to the position indicated by the chain line a, and then the reciprocating member 91 is advanced to bring the suction plate 93 to the position indicated by the chain line a.

When the suction plate 93 is in this position, the wafer 3 is directly above the suction plate 93, so the second elevating table 65 is lowered to place the wafer 3 on the suction plate 93, and at the same time, the vacuum suction is released.
A suction plate 93 vacuum suctions the wafer 3.

As described above, under the conditions that the suction plate 93 suctions the processed wafer 3 and the second lifting table 65 and the stage 17 are lowered, the second moving table 83 moves to the left in FIG. Board S
3 at the position indicated by the solid line in Figure 3.

At this time, since the suction plate 93 is above the endless belt 70 for carrying out the wafer and the third elevating table 78, the elevating table 78 rises and contacts the lower surface of the wafer 3, and at the same time vacuum suctions the wafer 3, and at the same time, the suction plate S3 releases the vacuum suction and returns to the initial position by retreating the reciprocating member S1.

Next, the third elevating table 78 is lowered to place the wafer 3 on the endless heald 70 for carrying out the wafer, and at the same time, the vacuum suction is released and the belts 70, 71 start running. The rest is the same as in the first embodiment.

FIG. 5 shows a third embodiment, in which no endless belt is used at all.

Furthermore, although there is one moving table 82, one moving member 90, and one vacuum suction plate 92 as in the first embodiment, a rotating table S5 driven by a low reactor or the like is provided on the moving table 82, and this A reciprocating member 90 is provided on the stand 95, and the suction plate 9
2 to the right or left every 90 degrees and to move forward and backward.

In this embodiment, the suction plate S2 is first directed toward the load section 1 on the right, and then the suction plate 92 is advanced toward the load section 1, so that the two prongs at the tip thereof are placed at the top of the cassette 2 on the stand 14. Insert it under the wafer 3 at the lower end.

Next, the suction plate 92 vacuum suctions the wafer 3 and moves backward to take out one wafer 3 from the cassette 2.

The suction plate 92 which has taken out the wafer 3 in this way turns 90 degrees to the left facing FIG.
The suction plate 92 stops at the same time as the wafer 3 at its tip hits the protrusion 20 of the wafer positioning plate 19 as shown by the chain line C in the figure.

At this time, the elevating table 15 is below the suction plate 92, but when the wafer 3 stops directly above it, the cylinder 16 works and the elevating table 15 rises and comes into contact with the wafer 3, and the suction plate 92 is vacuumed. At the same time, the suction is released and the wafer 3 is lifted up from above the suction plate S2 and above the ridge 2o, and the vacuum suction device acts to suction and fix the wafer 3 onto the lifting table 15, and the suction plate 92 is returned to its original position. fall back.

When alignment of the wafer 3 is required, the lifting table 15 rotates to align the wafer 3.

Next, the reciprocating member 90 on the movable table 82 located at the position indicated by the solid line in FIG.

Then, at the same time as lowering the lifting table 15, the vacuum suction is released, the wafer 3 is vacuum suctioned by the vacuum suction plate S2, and the movable table 82 is moved to the left in FIG.
When the wafer 2 is stopped at the position indicated by the chain line a in FIG. 5, the wafer 3 is placed on the lifting table 65.

At this time, the stage 17 and the elevating table 65 are below the suction plate 92, but under condition 4 in which the suction plate 92 is stopped, the elevating table 65 rises and contacts the wafer 3, and at the same time vacuum suctions the wafer 3. The vacuum suction of the suction plate S2 is released, the reciprocating member 90 retreats, and the suction plate 92 moves to the fifth position.
Return to position b in the figure.

As described above, the stage 17 is raised under the condition that the suction plate 92 is removed from the stage 17, and the upper surface of the lifting table 65 and the upper surface of the stage 17 become the same plane, and the stage 17 supports the wafer 3 and vacuum-chucks it. The tape is pasted onto the wafer 3 and cut as in the other embodiments.

After pasting the tape 25 on the wafer 3 on the stage 17 and cutting it, the vacuum suction of the wafer by the stage 17 is released, the stage 17 descends leaving the lifting table 65, and the lifting table 65 vacuum suctions the wafer 3. It remains in a state where it protrudes above the stage 17.

Next is the chain! The suction plate 92, which was waiting at the position 'Xb, moves forward again to the position of the chain vAa.

When the suction plate 92 is in this position, the wafer 3 is directly above the suction plate 92, so the lifting table 65 is lowered to place the wafer 3 on the suction plate 92, and at the same time, the vacuum suction is released, and the suction plate 92 is placed on the wafer. 3 is vacuum-adsorbed.

As described above, under the condition that the suction plate 92 suctions the processed wafer 3 and the lifting table 65 and the stage 17 are lowered, the movable table 82 moves to the left in FIG. Stop at the position shown in Figure d.

Next, the swivel table 95 turns 90' to the left, and the advancing/retracting member 90 advances toward the unloading section 66 on the left side and moves the two prongs of the suction plate s2 to the cassette 67 on the table 68 as shown by the chain line e. After inserting the processed wafer 3 into the cassette 67, the vacuum suction is released and the suction plate S2 retreats to return to its original position.

By repeating the above operations, the wafers in the cassette of the loading section are taken out one by one and processed, and then inserted one by one into the cassette of the unloading section.

〔Effect of the invention〕

As described above, this invention provides a vacuum suction type lifting table in the wafer processing section, a vacuum suction type lifting table on one side or both sides, and a movable table that reciprocates in front of each of these lifting tables. Since it is equipped with a vacuum suction plate that can move forward and backward to adsorb the unprocessed wafer on the first lifting table and transfer it to the second lifting table, it is possible to supply and position the unprocessed wafer to the processing section. becomes easier.

In addition, in the second invention, which has three lifting tables and two moving tables, the vacuum suction plate on the first moving table takes out the wafer from the cassette in the loading section and moves it onto the first lifting table. Since the vacuum suction plate on the second movable table can take out the processed wafer on the second lifting table while the wafer is being supplied to the wafer, the work efficiency is improved.

Furthermore, in the third invention, an endless heddle for transportation or the like can be completely abolished, and since it can be configured with one moving table, two moving tables, and an elevating table, the mechanism can be significantly simplified.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a first embodiment of the device of the present invention, FIG. 2 is a front view of the same as above, FIG. 3 is a plan view of a second embodiment, and FIG. 4 is a front view of the same as above. FIG. 5 is a plan view showing the third embodiment. 1... Load section, 2.67...
・Cassette, 3... Wafer, 4.5.6... Endless heddle for taking out wafer, 8.
9...Endless bell l-115 for carrying wafers...
...First lifting platform, 25...Adhesive tape, 6
5...Second lifting platform, 70.71...Endless belt for carrying out wafers, 72
．． 73.74... Endless belt for wafer insertion, 7
8... Third lifting platform, 82... First moving platform, 83... Second moving platform, 90.91...
...Movement member, 92, S3...Vacuum suction plate, 95...Swivel table, A...Wafer processing section.

Claims (3)

[Claims] (1) In wafer processing equipment that performs processes such as attaching adhesive tape to wafers and cutting them, there is an endless belt for taking out wafers that takes out wafers one by one from a cassette in a loading section, and an endless belt for taking out wafers. An endless belt for carrying in wafers is provided to place the taken out wafers on a vacuum suction type first elevating table provided on one side of the wafer processing section, and processed wafers are carried out to the other side of the processing section. An endless belt for carrying out wafers, and an endless belt for inserting wafers that insert processed wafers carried out by the endless belt for carrying out wafers one by one into a cassette of the unloading section,
The movable table that reciprocates between the first elevating table and the front of the second elevating table of the vacuum suction type provided in the processing section has a first elevating table that moves back and forth in a direction orthogonal to the moving direction of the movable table. A wafer transfer device equipped with a vacuum suction plate for transferring a wafer on a second lifting table to a second lifting table. (2) A third elevating table is provided between the second elevating table and the endless belt for carrying out wafers, and a third elevating table is provided in front of the first elevating table and a second elevating table of a vacuum suction type provided in the processing section. A vacuum suction plate that moves back and forth in a direction perpendicular to the direction of movement of the moving table to transfer the wafer on the first lifting table to the second lifting table of the processing section. Further, the second moving table is also provided with a vacuum suction plate that moves back and forth in a direction perpendicular to the moving direction of this moving table to transfer the processed wafer on the second lifting table onto the third lifting table. The wafer transfer device according to claim 1, further comprising: (3) A moving table is provided that moves between the loading section and the unloading section of the wafer processing apparatus, a rotating table is provided on the moving table, and the loading section and the unloading section are moved on the rotating table by rotating the rotating table. A reciprocating member that can be freely directed toward the processing section and the unloading section is provided, and the retracting member transfers the wafer taken out from the cassette of the loading section to the processing section by vacuum suction.
A wafer transfer device equipped with a vacuum suction plate that transfers processed wafers from the processing section to the cassette in the unloading section.