JPH03112606A - Manufacturing method of ceramic multilayer wiring board - Google Patents
Manufacturing method of ceramic multilayer wiring boardInfo
- Publication number
- JPH03112606A JPH03112606A JP25018189A JP25018189A JPH03112606A JP H03112606 A JPH03112606 A JP H03112606A JP 25018189 A JP25018189 A JP 25018189A JP 25018189 A JP25018189 A JP 25018189A JP H03112606 A JPH03112606 A JP H03112606A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- green
- raw
- multilayer wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000013022 venting Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Producing Shaped Articles From Materials (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はセラミック多層配線基板の製造方法に関し、よ
り詳細には半導体素子を収容する半導体素子収納用パッ
ケージや半導体素子、抵抗、コンデンサ等が搭載接続さ
れる回路基板等に用いられるセラミック多層配線基板の
製造方法に関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a method for manufacturing a ceramic multilayer wiring board, and more specifically, the present invention relates to a method for manufacturing a ceramic multilayer wiring board, and more specifically, it relates to a semiconductor element housing package that houses a semiconductor element, a semiconductor element, a resistor, a capacitor, etc. The present invention relates to a method of manufacturing a ceramic multilayer wiring board used for a connected circuit board or the like.
（従来の技術）
従来、半導体素子収納用パンケージや回路基板等に使用
されるセラミック多層配線基板はアルミナセラミックス
等の電気絶縁材料より成る基体と該基体の表面及び内部
に埋設、焼付られているタングステン（−）、モリブデ
ン（Ｍｏ）等の高融点金属より成る配線導体とにより構
成されている。(Prior Art) Conventionally, ceramic multilayer wiring boards used for semiconductor device housing pancakes, circuit boards, etc. have a base made of an electrically insulating material such as alumina ceramics and tungsten embedded and baked into the surface and inside of the base. (-), and a wiring conductor made of a high melting point metal such as molybdenum (Mo).
かかる従来のセラミック多層配線基板は通常、以下の方
法によって製作される。Such conventional ceramic multilayer wiring boards are usually manufactured by the following method.
即ち、
まず、アルミナ＜ Ａｌｚ（ｈ ）等の電気絶縁性に優
れたセラミックス原料粉末に適当な有機溶剤、溶媒を添
加混合して泥漿状となすと共に、該泥漿物を従来周知の
ドクターブレード法を採用することによってシート状と
し、複数枚のセラミック生シートを得る。That is, first, a ceramic raw material powder with excellent electrical insulation properties such as alumina < Alz (h) is mixed with an appropriate organic solvent to form a slurry, and the slurry is processed by the conventionally well-known doctor blade method. By employing this method, it is made into a sheet and a plurality of raw ceramic sheets are obtained.
次に前記各セラミック生シートに接続配線用のスルーホ
ールを形成するとともに該スルーホール内及び上面にタ
ングステン（−）、モリブデン（Ｍｏ）等の高融点金属
から成る金属ペーストをスクリーン印刷法により印刷塗
布し所定パターンの配線用導体を被着させる。Next, through-holes for connection wiring are formed in each of the green ceramic sheets, and a metal paste made of a high-melting point metal such as tungsten (-) or molybdenum (Mo) is printed and coated inside the through-holes and on the top surface using a screen printing method. Then, a predetermined pattern of wiring conductors is applied.
そして最後に前記各セラミック生シートを上下に積層す
るとともに加圧して生積層体を得ると共に、該生積層体
を約１５００℃の温度で焼成し、各セラミック生シート
と配線用導体層とを焼結一体化させることによって製品
としてのセラミック多層配線基板となる。Finally, each of the green ceramic sheets is stacked vertically and pressurized to obtain a green laminate, and the green laminate is fired at a temperature of about 1500°C, and each ceramic green sheet and wiring conductor layer are fired. By integrating them, a ceramic multilayer wiring board is created as a product.
（発明が解決しようとする課題）
しかし乍ら、この従来のセラミック多層配線基板の製造
方法によれば複数枚のセラミック生シートを積層し、生
積層体を得る際、各セラミック生シート間に空気が抱き
込まれ、これが焼成時に膨張してセラミック多層配線基
板に大きな膨れを形成し、該膨れがセラミック多層配線
基板の配線導体を断線させたり外観不良を起こしたりす
るという欠点を有していた。(Problem to be Solved by the Invention) However, according to this conventional method for manufacturing a ceramic multilayer wiring board, when a plurality of green ceramic sheets are laminated to obtain a green laminate, air is generated between each green ceramic sheet. The ceramic multilayer wiring board has a disadvantage in that it is trapped, expands during firing, and forms a large bulge in the ceramic multilayer wiring board, and the bulge breaks the wiring conductor of the ceramic multilayer wiring board or causes poor appearance.
（発明の目的）
本発明は上記欠点に鑑み案出されたもので、その目的は
空気の抱き込みに起因する膨れの発生を極小とし、配線
導体の断線及び外観不良の発生を皆無としたセラミック
多層配線基板の製造方法を提供することにある。(Object of the Invention) The present invention was devised in view of the above-mentioned drawbacks, and its purpose is to minimize the occurrence of bulges caused by air entrapment, and to eliminate the occurrence of disconnection of wiring conductors and appearance defects. An object of the present invention is to provide a method for manufacturing a multilayer wiring board.
（課題を解決するための手段）
本発明は上面に配線用導体を有し、厚み方向に空気抜き
用の貫通孔を有するセラミ・７り生シートを複数枚、積
層して生積層体を得ると共に、該生積層体を加圧し、セ
ラミック生シート間に介在する空気を前記貫通孔を介し
て外部に導出させ、しかる後、前記生積層体を焼成し、
焼結一体化させることを特徴とするものである。(Means for Solving the Problems) The present invention obtains a raw laminate by laminating a plurality of ceramic 7 raw sheets each having a wiring conductor on the upper surface and having through holes for air vent in the thickness direction. , pressurizing the green laminate to allow air interposed between the ceramic green sheets to be led out through the through holes, and then firing the green laminate;
It is characterized by being sintered and integrated.
（実施例）
次ぎに本発明のセラミック多層配線基板の製造方法を第
１図に示す実施例に基づき詳細に説明する。(Example) Next, a method for manufacturing a ceramic multilayer wiring board according to the present invention will be described in detail based on an example shown in FIG.
まず第１図（ａ）に示す如く２枚のセラミック生シート
をｌａ、 ｌｂを製作する。First, as shown in Fig. 1(a), two ceramic raw sheets la and lb are manufactured.
前記セラミック生シートｌａ、ｌｂは、例えばアルミナ
（ＡＩｔｏ３） 、シリカ（ＳｉＯ□）等のセラミック
原料粉末に適当な有機溶剤、溶媒を添加混合して泥漿物
を作り、これを従来周知のドクターブレード法等により
シート状となすことによって形成される。The ceramic raw sheets la and lb are prepared by adding and mixing an appropriate organic solvent or solvent to ceramic raw material powder such as alumina (AIto3) or silica (SiO□) to form a slurry, which is then processed by the conventional well-known doctor blade method. It is formed by forming it into a sheet shape.
また前記セラミック生シートＩａ、 ｌｂはその夫々の
厚み方向に空気抜き用の貫通孔２ａ、２ｂが形成されて
おり、更にセラミック生シー）１ａには接続用導体を充
填するためのスルーホール３ａが形成されている。In addition, the green ceramic sheets Ia and lb have through-holes 2a and 2b formed in their respective thickness directions for venting air, and the green ceramic sheet 1a is further formed with a through-hole 3a for filling a connection conductor. has been done.
前記空気抜き用貫通孔２ａ、２ｂは後述するセラミック
生シートｌａ、 ｌｂを重ね、生積層体とする際、セラ
ミック生シートｌａ、 ｌｂ間に介在する空気を外部に
導出する作用を為し、その孔径は空気の導出が容易な大
きさ、具体的には０．５〜１ 、５ｍｍの径に形成され
る。The air venting through-holes 2a and 2b function to lead out the air interposed between the green ceramic sheets la and lb when stacking the green ceramic sheets la and lb, which will be described later, to form a green laminate. is formed to a size that allows air to be easily drawn out, specifically, a diameter of 0.5 to 1.5 mm.
また前記スルーホール３ａはその内部に接続用導体とな
る金属ペーストが充填され、その孔径は金属ペーストの
流入が容易な大きさ、具体的には０゜１５〜０．３５ｍ
ｍの大きさとなっている。Further, the through hole 3a is filled with a metal paste that becomes a connection conductor, and the hole diameter is a size that allows the metal paste to easily flow in, specifically, 0°15 to 0.35 m.
It has a size of m.
尚、前記空気抜き用貫通孔２ａ 、 ２ｂ及びスルーホ
ール３ａは従来周知の打ち抜き加工法によりセラミック
生シート１ａ、１ｂに所定孔径に形成される。The air venting through holes 2a, 2b and the through hole 3a are formed to a predetermined diameter in the green ceramic sheets 1a, 1b by a conventionally well-known punching method.
次に第１図（ｂ）に示す如く、前記各セラミック生シー
トｌａ、 ｌｂの上面に配線用の導体４ａ、４ｂを被着
する。Next, as shown in FIG. 1(b), conductors 4a and 4b for wiring are adhered to the upper surfaces of each of the green ceramic sheets la and lb.
前記配線用の導体４ａ、４ｂはタングステン（誓）、モ
リブデン（Ｍｏ）、マンガン（Ｍｎ）等の高融点金属よ
り成り、政商融点金属粉末に適当な有機溶剤、溶媒を添
加混合して得た金属ペーストをスクリーン印刷等の厚膜
手法を採用することによってセラミック生シーＨａ、ｌ
ｂ上面に印刷塗布される。The wiring conductors 4a and 4b are made of high melting point metals such as tungsten, molybdenum (Mo), and manganese (Mn), which are obtained by adding and mixing suitable organic solvents and solvents to powdered melting point metals. By applying a thick film method such as screen printing to the paste, ceramic green sheets are produced.
b Printing is applied on the top surface.
また、セラミック生シート１ａの上面に金属ペーストを
印刷塗布する際、セラミック生シート１ａに設けたスル
ーホール３ａ内にも金属ペーストが充填され、これが接
続用導体４ｃとなる。Further, when printing and applying the metal paste on the upper surface of the ceramic green sheet 1a, the metal paste is also filled into the through holes 3a provided in the ceramic green sheet 1a, and this becomes the connection conductor 4c.
次に第１図（ｃ）に示す如くセラミック生シートｌｂＯ
上にセラミック生シー）１ａを重ねて生積層体とし、こ
れによってセラミック生シートｌａの上面に設けた配線
用導体４ａとセラミック生シートｌｂの上面に設けた配
線用導体４ｂとを接続用導体４ｃを介して電気的に接続
する。Next, as shown in Fig. 1(c), the raw ceramic sheet lbO
A raw ceramic sheet 1a is stacked on top to form a green laminate, thereby connecting a wiring conductor 4a provided on the upper surface of the ceramic raw sheet la and a wiring conductor 4b provided on the upper surface of the ceramic raw sheet lb to a connecting conductor 4c. Connect electrically via.
また前記セラミック生シートｌａ、ｌｂは積層され、生
積層体となされた後、５０〜１５０Ｋｇ／ｃｍ２の圧力
で加圧され、これによってセラミック生シート１ａと１
ｂとは密着性を大として接合する。Further, the green ceramic sheets la and lb are laminated to form a green laminate, and then pressurized at a pressure of 50 to 150 kg/cm2, whereby the green ceramic sheets 1a and 1
B is bonded with high adhesion.
尚、この場合、各セラミック生シートＩａ、 ｌｂには
空気抜き用の貫通孔２ａ、２ｂが形成されているためセ
ラミック生シートｌａと１ｂの間に介在する空気は前記
貫通孔２ａ 、 ２ｂを介して外部に導出されセラミッ
ク生シートｌａ、ｌｂ間に空気を抱き込むことはない。In this case, since air venting holes 2a and 2b are formed in each of the green ceramic sheets Ia and lb, the air interposed between the green ceramic sheets la and 1b is removed through the through holes 2a and 2b. Air is not drawn out to the outside and trapped between the green ceramic sheets la and lb.
また前記生積層体を加圧する際、セラミック生シー目ａ
＋１ｂの温度を５０〜１００ ’Ｃとしておくとセラミ
ック生シーＨａ、ｌｂの密着性をより優れたものとなす
ことができ、生積層体を加圧する際にはセラミック生シ
ートｌａ、Ｉｂを５０〜１００℃の温度に加熱しておく
ことが好ましい。Also, when pressurizing the raw laminate, the ceramic raw seam a
By setting the temperature of +1b at 50 to 100'C, the adhesion of the raw ceramic sheets Ha and lb can be made even better, and when pressurizing the raw laminate, the temperature of the raw ceramic sheets la and Ib is set at 50 to 100'C. Preferably, it is heated to a temperature of 100°C.
次に、前記加圧された生積層体は還元雰囲気中、約１５
００°Ｃの温度で焼成され、セラミック生シートｌａ、
ｌｂと配線用導体４ａ、４ｂ及び接続用導体４ｃとを焼
結一体化させることによってセラミック多層配線基板が
完成する。Next, the pressurized green laminate is placed in a reducing atmosphere for about 15 min.
Fired at a temperature of 00°C, the ceramic raw sheet la,
A ceramic multilayer wiring board is completed by sintering and integrating lb, wiring conductors 4a, 4b, and connection conductor 4c.
尚、前記生積層体を焼成しセラミック多層配線基板とす
る際、生積層体を構成するセラミック生シー日ａ、 Ｉ
ｂ間には空気の抱き込みがないことがら該抱き込まれた
空気の膨張によってセラミック多層配線基板に膨れが発
生することは一切なく、これによって配線用導体４ａ、
４ｂに断線が生じたり外観不良が発生したりすることは
皆無となる。Incidentally, when firing the raw laminate to form a ceramic multilayer wiring board, the ceramic raw laminate constituting the raw laminate A, I
Since there is no air trapped between the spaces between the wiring conductors 4a and
There is no possibility that wire breakage or appearance defects will occur in 4b.
また本発明は上述の実施例に限定されるものではなく、
本発明の要旨を逸脱しない範囲であれば種々の変更は可
能であり、例えばセラミック生シートを３枚以上重ねて
セラミック多層配線基板としてもよい。この場合、セラ
ミック生シートを一枚重ねるたびに所定圧力で加圧し、
重ねたセラミック生シートとその下部にあるセラミック
生シートとの間に介在する空気を重ねたセラミック生シ
ートの貫通孔を介して導出させれば全てのセラミック生
シート間に空気を抱き込むことはない。Furthermore, the present invention is not limited to the above-mentioned embodiments,
Various modifications can be made without departing from the gist of the present invention; for example, three or more raw ceramic sheets may be stacked to form a ceramic multilayer wiring board. In this case, each time a raw ceramic sheet is stacked, a predetermined pressure is applied.
If the air interposed between the stacked ceramic raw sheets and the ceramic raw sheet below them is led out through the through holes of the stacked ceramic raw sheets, air will not be trapped between all the ceramic raw sheets. .
（発明の効果）
本発明のセラミック多層配線基板の製造方法によれば配
線用導体を有するセラミック生シートに空気抜き用の貫
通孔を設けたことから該セラミック生シートを複数枚積
層しても各セラミック生シート間に空気を抱き込むこと
は一切なく、抱き込まれた空気の膨張によってセラミッ
ク多層配線基板に膨れが発生するのを皆無となして配線
用導体の断線及び外観不良の発生を有効に防止すること
が可能となる。(Effects of the Invention) According to the method for manufacturing a ceramic multilayer wiring board of the present invention, a through hole for air venting is provided in a raw ceramic sheet having a wiring conductor, so that even if a plurality of raw ceramic sheets are laminated, each ceramic There is no air trapped between the raw sheets, and there is no bulge in the ceramic multilayer wiring board due to the expansion of the trapped air, effectively preventing disconnection of wiring conductors and appearance defects. It becomes possible to do so.
第１図（ａ） （ｂ） （ｃ）は本発明のセラミック多
層配線基板の製造方法を説明するための各工程毎の断面
図である。
ｌａ、 Ｉｂ ・・セラミック生シート２ａ・・・・
空気抜き用貫通孔
４ａ、４ｂ ・・配線用導体FIGS. 1(a), 1(b), and 1(c) are cross-sectional views of each step for explaining the method for manufacturing a ceramic multilayer wiring board of the present invention. la, Ib...Ceramic raw sheet 2a...
Air vent through holes 4a, 4b...Wiring conductor
Claims (1)
孔を有するセラミック生シートを複数枚積層して生積層
体を得ると共に、該生積層体を加圧し、セラミック生シ
ート間に介在する空気を前記貫通孔を介して外部に導出
させ、しかる後、前記生積層体を焼成し、焼結一体化さ
せることを特徴とするセラミック多層配線基板の製造方
法。A green laminate is obtained by laminating a plurality of green ceramic sheets each having a wiring conductor on the upper surface and a through hole for air vent in the thickness direction, and the green laminate is pressurized to be interposed between the green ceramic sheets. A method for manufacturing a ceramic multilayer wiring board, characterized in that air is led outside through the through hole, and then the raw laminate is fired and sintered into one piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25018189A JP2893116B2 (en) | 1989-09-26 | 1989-09-26 | Manufacturing method of ceramic multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25018189A JP2893116B2 (en) | 1989-09-26 | 1989-09-26 | Manufacturing method of ceramic multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112606A true JPH03112606A (en) | 1991-05-14 |
| JP2893116B2 JP2893116B2 (en) | 1999-05-17 |
Family
ID=17204023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25018189A Expired - Lifetime JP2893116B2 (en) | 1989-09-26 | 1989-09-26 | Manufacturing method of ceramic multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2893116B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543493A (en) * | 2021-07-12 | 2021-10-22 | 上海嘉捷通电路科技股份有限公司 | Preparation method of Z-direction interconnection printed circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818461B1 (en) * | 2006-09-19 | 2008-04-01 | 삼성전기주식회사 | Multilayer ceramic substrate and its manufacturing method |
-
1989
- 1989-09-26 JP JP25018189A patent/JP2893116B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543493A (en) * | 2021-07-12 | 2021-10-22 | 上海嘉捷通电路科技股份有限公司 | Preparation method of Z-direction interconnection printed circuit board |
| CN113543493B (en) * | 2021-07-12 | 2023-05-09 | 上海嘉捷通电路科技股份有限公司 | Preparation method of Z-direction interconnection printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2893116B2 (en) | 1999-05-17 |
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