JPH03106046A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPH03106046A JPH03106046A JP24591589A JP24591589A JPH03106046A JP H03106046 A JPH03106046 A JP H03106046A JP 24591589 A JP24591589 A JP 24591589A JP 24591589 A JP24591589 A JP 24591589A JP H03106046 A JPH03106046 A JP H03106046A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- parts
- tape
- resin
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 20
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 30
- 229920005989 resin Polymers 0.000 abstract description 30
- 238000000034 method Methods 0.000 abstract description 9
- 238000002347 injection Methods 0.000 abstract description 7
- 239000007924 injection Substances 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000004132 cross linking Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 239000012050 conventional carrier Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体装置の製造工程で多故の半導体素子
を実装するのに使用するキャリアテーデに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a carrier board used to mount defective semiconductor elements in the manufacturing process of semiconductor devices.
近早、集積回路素子など半導体素子の電極接合技術とし
て、従来から広く使用されているワイヤポンデイング方
法に代って、テープキャリアを用いた、いわゆるＴＡＢ
（Ｔａｐｅ Ａｕｔｅｍａｔｅｄ Ｂｏｎｄｉｎｇ）方
法が採用されてきた。In recent years, the so-called TAB method using a tape carrier will replace the conventionally widely used wire bonding method as an electrode bonding technology for semiconductor devices such as integrated circuit devices.
(Tape Automated Bonding) method has been adopted.
この種の’［’ＡＢ方法に用いる従来のキャリアテープ
は、Ｍ５図（ａ） ， （ｂ）に示すように構或されて
いた。図はテープキャリアを示し、１はキャリアテープ
で、帯状のテープ本体２と、このテープ本体ｚ上に形成
された多数のリード３とからなる。テープ本体２は、ポ
リイミド樹脂などたわみ性をもち、絶縁性の合成樹脂か
らなう１幅方向の中央部には半導体素子が配置される複
数の中央孔２ａが間隔をあけて設けられ、中央孔２ａの
四周にはリ−ド支持部２ｂを介し、外部リード用孔２ｃ
が設けられ、各外部リード用孔２ｃ相互間は架橋部２ｄ
が設けられ、リード支持部２ｂをつないでいる。テープ
本体２０両側縁には長手方向に所定の間隔で多数の位置
決め送シ孔２ｅが設けられている。３は鋼材など導ｔ性
金属材からなシ、テープ本体２面に付着形成された多数
のリードで、内部リード支持部２ｂから先端が中央孔２
ａに至る内部リード部３ａと、外部リード用孔２ｃを筐
たぐ外部リード部３ｂと、テープ本体２に付着するテス
トパッド部３ｃとから形成されている。A conventional carrier tape used in this type of '['AB method was constructed as shown in Figs. M5 (a) and (b). The figure shows a tape carrier, and 1 is a carrier tape, which is composed of a band-shaped tape body 2 and a large number of leads 3 formed on this tape body z. The tape body 2 is made of a flexible and insulating synthetic resin such as polyimide resin, and a plurality of central holes 2a in which semiconductor elements are placed are provided at intervals in the widthwise center of the tape body 2. External lead holes 2c are provided on the four circumferences of 2a through lead support portions 2b.
A bridging portion 2d is provided between each external lead hole 2c.
is provided to connect the lead support portions 2b. A large number of positioning holes 2e are provided on both side edges of the tape body 20 at predetermined intervals in the longitudinal direction. Reference numeral 3 denotes a large number of leads made of a conductive metal material such as steel, which are attached to two surfaces of the tape body, and whose tips extend from the internal lead support part 2b to the central hole 2.
It is formed of an internal lead part 3a that extends to the tape body 2a, an external lead part 3b that encases the external lead hole 2c, and a test pad part 3c that is attached to the tape body 2.
上記架橋部２ｄは、内部リード部３ａの位置精度を高め
るためのリード支持部２ｂを一体につなぐものである。The bridging portion 2d serves to integrally connect the lead support portions 2b to improve the positional accuracy of the internal lead portions 3a.
このように構或されたキャリアテープ１に、半導体素子
６を中央孔２ａ内にし、半導体素子５の各バンプ６が対
応する各内部リード部３ａの所定位置に対向するように
位置決めし、パンブ６と内部リード部３ａを熱圧着法で
接合する。鎖線で示す１４は、後工程で或形される樹脂
封止体の側周を表す。The semiconductor element 6 is placed in the center hole 2a on the carrier tape 1 constructed in this way, and positioned so that each bump 6 of the semiconductor element 5 faces a predetermined position of each corresponding internal lead part 3a. and the internal lead portion 3a are joined by thermocompression bonding. The chain line 14 represents the side periphery of the resin-sealed body that will be shaped in a later step.
こうして構或されたテープキャリアを、第６図（ａ）に
示すように、下金型８上に載せ半導体素子５部をキャビ
テイ１０に位置し、上金型７とで型締めする。上金型７
にはキャビティ９，ランナ１１，グート１２が設けられ
ている。この状態で、低圧トランス７ア或形方法によシ
、例えばエポキシ樹脂など注入用樹脂をヲンナエユから
各キャビティ９．１０内に注入して硬化させる。Ａ（ｍ
５図参照）はゲート部における樹脂の注入方向を示す。As shown in FIG. 6(a), the tape carrier thus constructed is placed on the lower mold 8, the semiconductor element 5 is positioned in the cavity 10, and the mold is clamped with the upper mold 7. Upper mold 7
A cavity 9, a runner 11, and a groove 12 are provided. In this state, the low voltage transformer 7a injects an injection resin such as epoxy resin into each cavity 9, 10 from the inside and hardens it by a certain method. A(m
5) indicates the injection direction of the resin at the gate portion.
こうして、第６図（ｂ）のように、或形された樹脂封止
体工３によシ半導体素子５部が封止される。この状態か
ら不要の樹脂部（鎖線で示す）を除去し、テープ本体２
を各単位ごとに分割し、不要部を除去すると、複数の樹
脂封止半導体装置が得られる。In this way, as shown in FIG. 6(b), the semiconductor element 5 is sealed by the shaped resin sealing body 3. From this state, remove the unnecessary resin part (indicated by the chain line) and remove the tape body 2.
By dividing into units and removing unnecessary parts, a plurality of resin-sealed semiconductor devices can be obtained.
ところが、上記第６図のキャリアテープ２では、注入樹
脂が充てん不要なリード用孔２ｃに入υ、後で面倒な除
去作業を要していた。However, in the carrier tape 2 shown in FIG. 6, the injected resin enters the lead hole 2c which does not need to be filled, necessitating a troublesome removal operation later.
これに対処し、従来の他の例として第７図に示すよう（
（、キャリアテーグ２の架橋部２ｄにｊＪ一ド支持部２
ｂに至るゲート対応孔１３を設けたものがある。To deal with this, as shown in Fig. 7 as another conventional example (
(JJ-do support part 2 is attached to the bridge part 2d of carrier tag 2.
Some are provided with a gate corresponding hole 13 extending to point b.
ａ１！７図のようｒｃ＃ｌｌ或されたテープキャリアを
、第８図（＆）に示すように、下金ｆＭ８に載せ半導体
素子５部をキャビテイｌＯに位置し、上金ＩＭ’７で型
締めする。つづいて、エボキシ樹脂など注入用樹脂を、
フンナ１ユから矢印Ｂ方向（第７図参照）にゲート１２
のゲート対応孔１５を経てキャビデイ９ ． １０内に
注入し硬化させる。こうして、第８図（ｂ）のように、
或形された樹脂封止体１３によう半導体素子５部が封止
される。この状態から不要の樹脂部（鎖線で示す）を除
去し、デー１本体２ｔ−各単位に分割し、不要部を除去
すると、複数の樹脂封止半導体装置が得られる。The tape carrier with rc#ll as shown in Fig. a1!7 is placed on the lower metal fM8 as shown in Fig. 8 (&), and the 5th part of the semiconductor element is placed in the cavity lO, and then molded with the upper metal IM'7. Tighten. Next, injection resin such as epoxy resin,
Gate 12 from Funna 1yu in the direction of arrow B (see Figure 7)
The cavity 9. 10 and harden it. In this way, as shown in FIG. 8(b),
A portion of the semiconductor element 5 is sealed in the shaped resin sealing body 13. From this state, unnecessary resin parts (indicated by chain lines) are removed, the data 1 body 2t is divided into units, and unnecessary parts are removed to obtain a plurality of resin-sealed semiconductor devices.
上記のような従来のキャリアテープでは、金型内Ｋ樹ｍ
を注入すると、流入樹脂の圧力にようリード支持郁２ｂ
が曲＃）変形した多、半導体素子５側へ変位してしまう
という問題点が合った。With the conventional carrier tape as described above, the K tree inside the mold is
When injecting, the pressure of the inflowing resin causes the lead support Iku 2b to
However, the problem of the deformed portion being displaced toward the semiconductor element 5 side has been solved.
このため、内部リード部３ａが切断したシ、内部リード
部３ａとバング６との接合が離れたうし、特に、リード
３数の少ないキャリアテープでは、これによる不良が多
くなっていた。As a result, the inner lead portion 3a is cut and the bond between the inner lead portion 3a and the bang 6 becomes separated, and this causes many defects, especially in carrier tapes having a small number of leads.
この発明は、このような問題点を解決するためになされ
たもので、樹脂封止工程における内部リード部３ａの切
断やバング６との離れなどの不良をなくするキャリアテ
ープを得ることを目的としている。This invention was made to solve these problems, and aims to provide a carrier tape that eliminates defects such as cutting of the internal lead part 3a and separation from the bang 6 during the resin sealing process. There is.
この発明にかかるキャリアテーグは、テープ本体の外部
リード用孔間の架橋部又は外部リード用孔に設けた連結
部に、ゲート対応流路部を設け中央孔に連通させたもの
である。In the carrier tag according to the present invention, a gate-corresponding channel is provided in the bridge between the external lead holes of the tape body or in the connection part provided in the external lead holes, and communicates with the central hole.
〔作用〕
この発明に訃いては、キャリアテープを入れた金型内に
樹脂を注入すると、上金型のゲート部において、樹脂は
テープ本体に設けられた架橋部又は中央連結部に形成さ
れたゲート対応流路部を通シ中央孔部に至シキャビティ
内に圧入され、樹脂の注入圧力がテープ本体のリード支
持部には、作用せず変形，変位が防止される。[Function] According to the present invention, when resin is injected into the mold containing the carrier tape, at the gate part of the upper mold, the resin is formed at the bridge part or central connecting part provided in the tape body. The resin is press-fitted into the cavity through the gate-corresponding channel portion and into the central hole portion, and the injection pressure of the resin does not act on the lead support portion of the tape body, thereby preventing deformation and displacement.
第１図（ａ）及び（ｂ）はこの発明の一実施例によるキ
ャリアテープを用いたテープキャリアの平面図及び断面
図であシ、２ａ＝２ｅ，３．３ａＮ３ｃ，５ ， ６
， １４ぱ上記従来装置と同一のものである０キャリア
テーグ２１のテープ本体２２には、架橋部２ｄから中央
孔２ａに至るゲート対応流路部２３が切欠き形成され、
先端側の幅が広げられ、流路断面積が次第に大きくされ
、樹脂が円滑に注入されるようにし、注入圧力がリード
支持部２ｂに影響を及ぼさないようにしてある。FIGS. 1(a) and 1(b) are a plan view and a sectional view of a tape carrier using a carrier tape according to an embodiment of the present invention, 2a=2e, 3.3aN3c, 5, 6
, 14 The tape body 22 of the zero carrier tag 21, which is the same as the conventional device described above, has a notch formed therein with a gate corresponding channel portion 23 extending from the bridge portion 2d to the central hole 2a.
The width at the tip side is widened, and the cross-sectional area of the flow path is gradually increased, so that the resin is injected smoothly and the injection pressure does not affect the lead support portion 2b.
第１図（．）のゲート対応流路部２３をｊｇｌ図（ｃ）
に拡大図で示す。JGL diagram (c) of the flow path section 23 corresponding to the gate in Figure 1 (.)
Shown in enlarged view.
第１ ｔＮ （ｂ）のテーデキャリアを金型に入れた状
態を第２図（．）に断面図で示す。第１図（．）の［ｂ
−Ｊｉｂ線にかける断面図を第２図（ｂ）に、［［ｃ−
■ＱＪＩにおける断面図を＠２図（Ｑ）に示し、いづれ
もテープキャリアが金型に型締めされている状態を図示
している。FIG. 2(.) shows a cross-sectional view of the state in which the TED carrier of the first tN (b) is placed in the mold. Figure 1 (.) [b
-Jib line is shown in Fig. 2(b).
■A cross-sectional view of QJI is shown in Figure 2 (Q), and both diagrams show the state in which the tape carrier is clamped to the mold.
第１図のように構成されたテープキャリアを、第２図（
ａ）のように、下金型８に載せ、上金型７とで型締めす
る。このとき、上金型７のヲンナ１１，ゲート１２の周
囲の部分によシ、テープ本体２２の架橋部２ｄの外部リ
ード用孔２ｃ側、及びリード支持部２ｂの外部リード用
孔２ｃ側付近は閉じられている。ゲート対応流路部２３
の周囲の架橋剖２ｄのうち、外部リード用孔２ｃ側は上
，下金型７，８の挾付けによｂ１樹脂の外部リード用孔
２ｃへの流出を防ぐとともに、ゲート対応流路部２３の
上，下も、上，下金型７，８０面が壁となう、他への流
出を防いでいる（第２図ｂ）。The tape carrier configured as shown in Fig. 1 is shown in Fig. 2 (
As shown in a), it is placed on the lower mold 8 and clamped with the upper mold 7. At this time, the area around the inner die 11 and gate 12 of the upper mold 7, the external lead hole 2c side of the bridging portion 2d of the tape body 22, and the vicinity of the external lead hole 2c side of the lead support portion 2b are Closed. Gate compatible channel section 23
Of the cross-linking section 2d around the external lead hole 2c side, the upper and lower molds 7 and 8 are clamped to prevent the b1 resin from flowing into the external lead hole 2c, and the gate corresponding channel section 23 The upper and lower surfaces of the upper and lower molds 7 and 80 serve as walls to prevent leakage to other areas (Fig. 2b).
この状態で、第２図（ａ）のように、低圧トランスファ
或形法によシ、エポキシ樹脂などの樹脂を矢印Ｃのよう
に注入し、硯化させる。こうして、樹脂封正体１３によ
う半導体素子５部が封止されたテープキャリアを金型か
ら取出した状態を第２図（ｄ）に示す。この状態から不
要の樹脂部（＠線で示す）を除去し、テープ本体２２を
各単位ごとに分割し、不要部を除去すると、″４Ｉ数の
樹，ｌｌｉｒ封止半導体装置が得られる。In this state, as shown in FIG. 2(a), a resin such as epoxy resin is injected in the direction of arrow C using a low-pressure transfer method to form an inkstone. The state in which the tape carrier with the semiconductor element 5 sealed in the resin sealing body 13 is taken out from the mold is shown in FIG. 2(d). From this state, unnecessary resin parts (indicated by @ lines) are removed, the tape body 22 is divided into units, and unnecessary parts are removed to obtain a ``4I'' sealed semiconductor device.
第３図（ａ）はこの発明の他の実施例によるキャリアテ
ープを用いたテープキャリアの平面図である。FIG. 3(a) is a plan view of a tape carrier using a carrier tape according to another embodiment of the present invention.
テープ本体２２の外部リード用孔２ｃに、リード支持部
２ｂを連結する連結部２４を投け、この連結部２４に中
央孔２ａに至るゲート対応流路部２５を設け、先端側の
幅が広げられている。上記連結部２４の外部リード用孔
２ｃに対する位置は、区では幅方向の中央にしたが他の
位置にしてもよい。上金型７のゲートは連結部２４に対
応する位置にしている。A connecting part 24 that connects the lead support part 2b is inserted into the external lead hole 2c of the tape body 22, and a gate corresponding channel part 25 leading to the central hole 2a is provided in this connecting part 24, so that the width of the tip side is increased. It is being Although the position of the connecting portion 24 relative to the external lead hole 2c was set at the center in the width direction in the case, it may be set at another position. The gate of the upper mold 7 is located at a position corresponding to the connecting portion 24.
なか、上記ゲート対応流路部２３．２５は、テープ本体
２２を貫通する切欠き状に形成したが、底を〔発明の効
果〕
以上のように、この発明によれば、キャリアテープのテ
ープ本体の外部リード用孔間の架橋部、又は外部リード
用孔に設けられリード支持部へ至る連結部に、ゲート対
応流路部を設け中央孔に連通させ、このゲート対応流路
部上に上金型のゲートを位置させたので、テープキャリ
アを入れた金型内に樹脂を注入すると、樹脂がゲート対
応流路部を通ジ中央孔に至シキャビテイ内に圧入され、
樹脂の注入圧力がテープ本体のリード支持部には作用せ
ず、変形，変位が防止され、内部リードの切断や内部リ
ード部とバンプの接合が離れたシすることがなくされる
。The gate-corresponding flow path portions 23 and 25 are formed in the shape of a cutout penetrating the tape body 22, but the bottom of the gate-corresponding channel portions 23 and 25 is formed in the tape body of the carrier tape. A gate-compatible flow path is provided in the bridge between the external lead holes, or a connecting portion provided in the external lead holes and connected to the lead support part, and communicates with the center hole, and an upper metal plate is placed on the gate-compatible flow path. With the gate of the mold in place, when resin is injected into the mold containing the tape carrier, the resin passes through the flow path corresponding to the gate and is press-fitted into the center hole into the cavity.
The injection pressure of the resin does not act on the lead support portion of the tape body, preventing deformation and displacement, and preventing cutting of the internal lead and separation of the bond between the internal lead portion and the bump.
第１図（ａ）ぱこの発明の一実施例によるキャリアテー
プを用いたテープキャリアの平面図、第１図（ｂ）は第
１図（ａ）のＩ−Ｉ線にかける断面図、第１図（Ｑ）は
第１図（ａ）のゲート対応流路部の拡大図、第２図｛ａ
）はＷｃｌ図（ｂ）のテープキャリアを金型に型締めし
た断面図、第２図（ｂ）及び（Ｃ）は第１図（ｃ）のｌ
ｂ−■ｂ線及びＩｌｃ−Ｉｎｃ線に分ける断面図で、金
型に型締めされている状態を示す。第２図（ｄ）は第２
図（ａ）の状態から樹脂封止され取出された分割前の半
導体装置の断面図、第３図（ａ）はこの発明の第２の実
施例によるキャリアテーデを用いたテーデキャリアの平
面図、第３図（ｂ）は第３図（ａ）のＩＩＩ−ＩＩＩ線
における断面図で、金型に型締めされた状態を示す。
第４図（ａ）及び（ｂ）はこの発明の第３の実施例によ
るキャリアテーブを示すゲート対応流路部の平面図及び
断面図、第５図（．）は従来のキャリアテーブを用いた
テーフ゛キャリアの平面図、＠５図（ｂ）は第５図（ａ
）のＶ一▼線における断面図、第６図（ａ）は第５図の
テープキャリアを金型で型締めした状態の断面図、第６
図（ｂ）は第６図（ａ）の状態から樹脂封止され取出さ
れた分割前の半導体装置の断面図、第７図は従来の他の
キャリアテーグを用いたテープキャリアの平面図、第８
図（ａ）は第７図の■一■線における断面図で金型に型
締めされた状態を示す。
第８図（ｂ）は第８図（ａ）の状態から樹脂封止され取
出された分割前の半導体装置の断面図である。
２ａ・・・中央孔、２ｂ・・・リード支持部、２ｃ・・
・外部リード用孔、２ｄ・・・架橋部、３・・・リード
、３ａ・・・内部リード、３ｂ・・・外部リード、５・
・・半導体素子、６・・・バンプ、グ・・・上金型、８
・・・下金型、９．１０・・・キャビテイ、１２・・・
ゲート、１３・・・樹脂封止体、２１・・・キャリアテ
ープ、２２・・・デープ本体、２３ｊ尖
２５，・・・ゲート対応流路部、２４・・・連結部なか
、図中同一符号は同一又は相当部分を示す。FIG. 1(a) is a plan view of a tape carrier using a carrier tape according to an embodiment of Paco's invention, FIG. 1(b) is a sectional view taken along the line I--I of FIG. 1(a), Figure (Q) is an enlarged view of the flow path corresponding to the gate in Figure 1 (a), and Figure 2 {a
) is a cross-sectional view of the tape carrier shown in Wcl figure (b) clamped into a mold, and Figures 2 (b) and (C) are sectional views of the tape carrier shown in Figure 1 (c).
A cross-sectional view taken along line b--b and line Ilc-Inc, showing a state in which the mold is clamped. Figure 2(d) shows the second
3(a) is a cross-sectional view of the semiconductor device sealed with resin and taken out from the state shown in FIG. 3(a) before division. FIG. 3(b) is a cross-sectional view taken along the line III--III in FIG. 3(a), showing the state clamped in the mold. FIGS. 4(a) and (b) are a plan view and a cross-sectional view of a gate-corresponding channel section showing a carrier table according to a third embodiment of the present invention, and FIG. 5(.) is a diagram showing a carrier table according to a third embodiment of the invention. The plan view of the tape carrier, @Figure 5 (b) is the same as Figure 5 (a).
), Figure 6(a) is a cross-sectional view of the tape carrier shown in Figure 5 clamped with a mold, Figure 6(a) is a cross-sectional view of
Figure (b) is a sectional view of a semiconductor device sealed with resin and taken out from the state of Figure 6 (a) before division, Figure 7 is a plan view of a tape carrier using another conventional carrier tape, and Figure 8.
Figure (a) is a sectional view taken along line 1-2 in Figure 7, and shows the state in which the mold is clamped. FIG. 8(b) is a sectional view of the semiconductor device sealed with resin and taken out from the state of FIG. 8(a) before division. 2a...Central hole, 2b...Lead support part, 2c...
- External lead hole, 2d...Bridging portion, 3...Lead, 3a...Internal lead, 3b...External lead, 5.
...Semiconductor element, 6...Bump, groove...Upper mold, 8
...Lower mold, 9.10...Cavity, 12...
Gate, 13...Resin sealing body, 21...Carrier tape, 22...Deep body, 23j tip 25,...Gate corresponding channel section, 24...Connection part, same reference numerals in the figure indicates the same or equivalent part.
Claims (1)
央部に長手方向に間隔をあけ配された複数の中央孔と、
この中央孔の四周をリード支持部を介して配された複数
の外部リード用孔と、これら外部リード用孔の相互間に
残され上記リード支持部につながる架橋部とが形成され
たテープ本体、このテープ本体の上面に付着形成され、
内部リード部が上記リード支持部から上記中央孔に至り
、外部リード部が上記外部リード用孔をまたいだ複数の
リードを備え、上記各内部リード部の先端下面にバンプ
を介し半導体素子が接合されるようにされており、上記
架橋部又は上記外部リード用孔に長手方向に形成されリ
ード支持部につながる連結部に、上記中央孔に通じるゲ
ート対応流路部を形成し、上金型のゲート下に対応する
ようにしたことを特徴とするキャリアテープ。It is made of a flexible band-shaped synthetic resin material, and has a plurality of central holes arranged at intervals in the longitudinal direction at the center in the width direction.
A tape body having a plurality of external lead holes arranged around the central hole via a lead support part, and a bridge part left between the external lead holes and connected to the lead support part; This tape is attached to the top surface of the main body,
An internal lead portion extends from the lead support portion to the central hole, an external lead portion includes a plurality of leads spanning the external lead hole, and a semiconductor element is bonded to the lower surface of the tip of each internal lead portion via a bump. A gate-corresponding channel portion communicating with the central hole is formed in the bridge portion or the connection portion formed in the longitudinal direction of the external lead hole and connected to the lead support portion, and the gate of the upper mold is connected to the connecting portion. A carrier tape characterized by being compatible with the bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24591589A JPH0680707B2 (en) | 1989-09-20 | 1989-09-20 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24591589A JPH0680707B2 (en) | 1989-09-20 | 1989-09-20 | Carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03106046A true JPH03106046A (en) | 1991-05-02 |
| JPH0680707B2 JPH0680707B2 (en) | 1994-10-12 |
Family
ID=17140730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24591589A Expired - Fee Related JPH0680707B2 (en) | 1989-09-20 | 1989-09-20 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680707B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG115569A1 (en) * | 2003-09-09 | 2005-10-28 | Micron Technology Inc | Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods |
-
1989
- 1989-09-20 JP JP24591589A patent/JPH0680707B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG115569A1 (en) * | 2003-09-09 | 2005-10-28 | Micron Technology Inc | Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0680707B2 (en) | 1994-10-12 |
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