JPH03104262A - Vibration-proof heat transfer structure - Google Patents

Abstract

PURPOSE:To make it possible to improve vibration protection characteristic without damaging cooling characteristic by curving a heat transfer laminated material which is L-shaped on the surface so that both ends of the laminated material may cross each other and fixing respectively both ends which are broken into two elements to be thermally coupled. CONSTITUTION:A heat transfer laminated material 30 comprises 10 and more L-shaped oxygen free copper foils piled up. Parts 30a and 30b on the both ends are pasted together by soldering. The part 30a on one end is vertically fixed with the side of a mounting rib 3b vertically installed to the part 30b on a cooling end 3 while the part 30b on the opposite end is horizontally fixed with a lower surface of a support base 10. The end parts 30a and 30b are positioned so that they may cross each other. An arm section 30d is curved as for Z axis while an arm section 30e is also curved as for X axis. When a cooling end is subjected to displacement in X direction, the arm section 30e is freely bent in the direction of thickness. When subjected to displacement in Y1 direction, the arm section 30e is freely bent in the direction of thickness, thereby absorbing the displacement simultaneously. When subjected to displacement in Z1 direction, the arm section 30e is freely bent in the direction of thickness, thereby absorbing the displacement. It is, therefore, possible to improve vibration protection characteristic without damaging cooling characteristic.

Description

[Detailed Description of the Invention] [Summary] Regarding a vibration-proof heat transfer structure in which a semiconductor element such as an infrared detection element is cooled by a cooler via a heat-transfer laminate material, improvement of vibration-proof characteristics without impairing the cooling property. A heat transfer laminate material having an L-shaped planar shape is curved so that its ends are perpendicular to each other, and each end of the heat transfer laminate material is connected to two elements to be thermally connected. Connect and configure each.

[Industrial application field]

The present invention relates to a vibration-proof transmission structure in which a semiconductor element such as an infrared detection element is cooled by a cooler via a heat-transfer laminate material.

FIG. 6 shows the general structure of this type of semiconductor device cooling device.

Reference numeral 1 denotes a circulation cooler, which is provided on a base 2.

3 is a cooling end, which extends upward from the cooler 1.

Reference numeral 4 designates an inner cylinder portion, and reference numeral 5 represents an outer cylinder portion, each of which has a flange portion 6 fixed to an optical portion 7.

Reference numeral 8 denotes a bellows, which prevents the vibrations of the cold water heater 1 from propagating to the inner cylinder part 4 and the like, and keeps the inside of the inner cylinder part 4 airtight in a vacuum state.

The cooling end portion 3 projects into the inner cylinder portion 4 .

Reference numeral 9 denotes an optical window, which closes the upper end of the outer cylinder portion 5.

Reference numeral 10 denotes a support stand, which is fixed to the upper end of the inner cylinder part 4.

Reference numeral 11 denotes an infrared detection element, which is fixed on the support base 10.

This infrared detection element 11 exhibits high detection characteristics by cooling it to a very low temperature of about -200°C.

12 is a heat transfer laminate, which includes a support base 10 and a cooling end portion 3;
It is placed between.

The cooled end portion 3 is kept at a low temperature of about -200°C by the cooler 1, and the infrared detection element 11 is heated to a low temperature of about -200°C by the cooler 1.
2 to about -200°C.

The cooler 1 is, for example, a helium % ring type refrigerator based on a reverse Stirling cycle, and has a vibration source consisting of a motor and a crank piston mechanism inside the cooler, and vibrates during operation. When the cooler 1 vibrates, the cold end portion 3 also vibrates.

The heat transfer laminate 12 needs to be configured such that: (1) it has low thermal resistance; (2) it has flexibility and does not transmit vibrations of the cooling end portion 3 to the element 11;

[Conventional technology]

FIG. 7 shows the main part of the conventional example.

The heat transfer laminate 20 has a width W1 of 6 to 7 aw. length L1
It has a rectangular shape with a diameter of about 30 am+, and is made by stacking more than 10 very cheap oxygen-free copper foils and fixing them by soldering only on both ends.
is fixed to the upper surface 3a of the cooling end 3, and the other end 20a is fixed to the lower surface of the support base 10.

Both fixed parts are in a parallel position.

The cold end portion 3 is indicated by the arrow x. It vibrates in the y and z directions.

(Problems to be Solved by the Invention) The heat transfer laminate 20 flexibly bends in the thickness direction in response to vibrations of the cold end portion 3 in the direction of the arrow Y and in the direction of the arrow Z.

However, since the arrow X direction is the width direction of the heat transfer laminate 20, the heat transfer laminate 20 is difficult to bend.

Therefore, a part of the vibration component in the direction of arrow X is unnecessarily transmitted to the infrared detection element 11, and the image reproduced through the element 11 is deteriorated.

Furthermore, stress repeatedly acts on the fixed portion of the heat transfer laminate 20, causing this portion to break earlier than expected, which also poses a problem in terms of service life.

Note that by narrowing the width and increasing the length of the heat transfer laminate 20, the degree of freedom of movement of the heat transfer laminate in the direction of the arrow X increases and the above problem is improved; It gets worse.

SUMMARY OF THE INVENTION An object of the present invention is to provide a vibration-isolating heat transfer structure that can improve vibration-isolating characteristics without impairing cooling characteristics.

(Means for Solving the Problems) The present invention curves a heat transfer laminate material having an L-shaped planar shape so that its ends are perpendicular to each other, and thermally connects each end of the heat transfer laminate material. This is a configuration in which the two elements are connected and fixed to each other.

[Effect]

By fixing the L-shaped heat transfer laminate material with an 8% tension at substantially orthogonal positions at both ends, the heat transfer laminate material is
It becomes possible to bend the cooling end in the thickness direction in response to vibrations in all three orthogonal directions.

〔Example〕

FIG. 1 shows a main part of an embodiment of the present invention.

30 is a heat transfer laminate material, as shown in Figs. 2 (A) and (B).
As shown,! Ten or more L-shaped oxygen-free copper @31 with Wz of 6 to 7 eta, length L2 of 30 m, and thickness t+ of about 0.05 min are stacked, and the end portions 30a. 3
It has a structure in which 0b is bonded together with solder.

The heat transfer laminate material 30, as shown in FIG. 2(A),
Both end portions 30a. 30b and L-shaped central part 30c.
and an arm portion 30d between this central portion 30c and end portions 30a, 30b. 30e and more.

As shown in FIG. 1, this heat transfer laminate material 30 has one end 30a cooled! ] It is fixed perpendicularly to the vertical side surface of the mounting rib 3b vertically provided on the end 3, and the opposite end 30b is fixed horizontally to the lower surface of the support base 10.

The end portions 30a and 30b are in a perpendicular positional relationship.

The arm portion 30d is curved with respect to the Z axis, and the arm portion 30e
is curved about the X axis.

Next, the cooling characteristics and vibration damping characteristics of the infrared detection element cooling device incorporating the heat transfer laminate 030 as described above will be explained.

First, the cooling characteristics will be explained.

The heat transfer laminate material 30 has the same width w2 and length L2 as the heat transfer laminate 12 shown in FIG. 2, except that it has an L-shape, and the cooling device has excellent cooling characteristics comparable to the conventional one. have

Next, the anti-vibration characteristics will be explained.

When the cooling end portion 3 is displaced in the x1 direction of the arrow in FIG. 1, the arm portion 30d freely bends in the thickness direction to absorb the displacement, as shown in FIG.

When the cooling end portion 3 is displaced in the direction of arrow Y1 in FIG. 1, the arm portion 30d bends freely in the thickness direction, and at the same time the arm portion 30e bends in the thickness direction, as shown in FIG. absorbs the displacement of

When the cold fastening end portion 3 is displaced in the direction of arrow z1 in FIG. 1, the arm portion 30e is freely bent in the thickness direction to absorb the above displacement, as shown in FIG.

Therefore, the heat transfer laminate material 30 is
Y. It bends freely against vibrations in all directions of Z, the vibrations of the cooled end 3 are not transmitted to the element 11, and the properties of vibration isolation of the element j'11 against the cooled end 3 are superior to conventional ones. There is.

As a result, the image reproduced through the element 11 becomes a high-quality image with less image deterioration than in the past.

In addition, the heat transfer laminate 30 bends freely in the thickness direction in response to vibrations of the cooling end 3 in three mutually orthogonal directions.
Unnecessary stress is not applied to the fixed end portions 30a, 30b, and the heat transfer laminate 30 does not break at an early stage and its life is unduly shortened.

Note that the cooling device of the present invention is not limited to infrared detection elements.
It can also be applied to other parts that require cooling.

Moreover, it is applicable not only to cooling but also to heat conduction between two other elements.

[Effects of the Invention] As explained above, according to the present invention, the heat transfer laminate material can be bent in the thickness direction in response to vibrations in three directions perpendicular to each other, and the cooling properties are not affected in any way. It is possible to improve the anti-vibration characteristics without sacrificing image quality, and especially when the cooled element is an element that reproduces images, such as an infrared detection element, it is possible to obtain high-quality images with less image deterioration than before. I can do it. Moreover, stress does not act on a part of the heat transfer laminate material, and early breakage of the heat transfer laminate material can be prevented and a long life can be obtained.

[Brief explanation of drawings]

Fig. 1 is a diagram showing the main parts of an embodiment of the vibration-proof heat transfer structure of the present invention, Fig. 2 is an expanded view of the heat transfer laminate material in Fig. 1, and Fig. 3 is a cooling end. Figure 4 is a diagram showing the deformation state of the heat transfer laminate material when the cooling end is displaced in the direction of arrow Y1. Figure 5 is a diagram showing the deformation state of the heat transfer laminate material when the cooling end is displaced in the direction of arrow Y1. FIG. 6 is a diagram showing a general configuration of an infrared detection element cooling structure, and FIG. 7 is a diagram showing a conventional example. In the figure, 1 is a circulation cooler, 3 is a cooling end, 3b is a mounting rib, 4 is an inner part, 10 is a support base, 11 is an infrared detection element, 30 is a heat transfer laminate material, 30a. 30b is an end portion, 30c is a central portion, 30d. 30e indicates an arm.

Claims (1)

[Claims] A heat transfer laminate material with an L-shaped planar shape is placed at both ends (3
0a, 30b) are curved so as to be orthogonal to each other, and each end (30a, 30b) of the heat transfer laminate material is connected and fixed to two elements to be thermally coupled. Type heat transfer structure.