JPH0284760A - Lead frame for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent an island from deforming in the assembling process of a semiconductor device while the deformation and disconnection of wiring as well as the exposure of the island, wiring, etc., from a resin sealing material from occurring by a method wherein a hanging load is held by inner leads through the intermediary of an electric insulating member. CONSTITUTION:Within the title lead frame for semiconductor device provided with an island 2 for mounting semiconductor elements, a hanging leads 5 fixing the island 2 on a lead frame 4 and inner leads 3 connecting semiconductor elements to wirings, the hanging lead 5 is held by the inner leads 3 through the intermediary of an electric insulating member 9. For example, polyimide film is used as said electric insulating member 9 and the polyimide film is bonded onto the hanging lead 5 and the inner leads 3 by a bonding agent. Through these procedures, the hanging lead 5 is reinforced by the inner leads 3 through the intermediary of the electric insulating member 9 so that the hanging lead 5 may be prevented from deforming in the assembling process of the resin sealed semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame used in a resin-sealed semiconductor device.

[Prior Art] FIG. 3 is a partial plan view showing a conventional lead frame. In FIG. 3, only a part of the lead frame is shown, and the island 2 on which the semiconductor element is mounted is
It is supported by the lead frame frame 4 by hanging leads 5. A plurality of inner leads 3 are provided extending toward the island 2 for connecting wiring to semiconductor elements placed on the island 2.

FIG. 4 is a sectional view showing an example of a state after a semiconductor element is mounted on the conventional lead frame shown in FIG. 3 and sealed with resin. Place the semiconductor element 1 on the island 2 with adhesive,
Next, the wiring 8 is connected between the inner lead 3 and the semiconductor element 1 to establish electrical contact, and then the resin sealing area 6 shown in FIG. 3 is resin-sealed with a resin sealant 7. do.

[Problems to be Solved by the Invention] However, in the conventional lead frame, when mounting the semiconductor element 1 on the island 2, or when placing the semiconductor element 1 on the island 2,
There is a problem in that the island 2 is easily deformed when the wiring 8 is attached between the lead 3 and the inner lead 3 or when the wiring 8 is sealed with resin. For this reason, as shown in FIG. 4, the island 2 is sometimes installed in an inclined state.

Due to such deformation of the island 2, the wiring 8 may be deformed or disconnected. Further, if the island 2 has a significant inclination, the island 2 and the wiring 8 may be resin-sealed in a state where they are exposed from the resin sealing material 7.

This invention was made to solve such conventional problems, and prevents deformation of islands in the process of assembling semiconductor devices, prevents deformation and disconnection of wiring, and furthermore exposes islands and wiring from resin sealing material. The purpose of the present invention is to provide a lead frame for a semiconductor device that does not require any damage.

[Means for Solving the Problems] A lead frame for a semiconductor device of the present invention includes an island for mounting a semiconductor element, a suspension lead for supporting the island on a lead frame frame, and a lead frame for connecting wiring to the semiconductor element. The suspension lead is supported by the inner lead via an electrically insulating member.

As the electrically insulating member used in this invention, any material can be used as long as it has electrically insulating properties and is hard enough to reinforce the suspension lead. For example, heat-resistant resin such as polyimide can be used.

[Function] In the present invention, the suspension lead is supported by the inner lead via the electrically insulating member. Therefore, the hanging lead is reinforced by the inner lead, so even if stress is applied to the island during the assembly process of semiconductor devices,
Deformation of the hanging lead is suppressed.

[Embodiment] FIG. 1 is a partial plan view showing an embodiment of the present invention. The island 2 is supported by a lead frame frame 4 by a hanging lead 5. Inner leads 3 for connecting wiring to the semiconductor element are provided so as to extend toward the island 2. The above structure is similar to that of the conventional lead frame, but in this embodiment, an electrically insulating member 9 is further attached to the hanging lead 5 and the inner lead 3. As the electrically insulating member 9, a polyimide film is used in this embodiment. The polyimide film is bonded to the hanging lead 5 and the inner lead 3 with an adhesive.

FIG. 2 is a sectional view showing a state after a semiconductor element is mounted on the lead frame of the embodiment shown in FIG. 1 and sealed with resin. The semiconductor element 1 is placed and fixed on the island 2 with an adhesive, and then the wiring 8 is connected between the semiconductor element 1 and the inner lead 3 to establish electrical contact. Furthermore, Fig. 1 4
A resin sealing material 7 is used to seal the area up to the resin sealing range 6 shown in FIG.

In the above process, in the case of the lead frame using this embodiment, since the hanging leads 5 are supported and reinforced by the inner leads 3 by the electrically insulating member 9, the semiconductor element 1 can be mounted on the island 2. Even if stress is applied to the island 2 when wiring is provided between the semiconductor element 1 and the inner lead 3 or when the semiconductor element 1 and the inner lead 3 are sealed with resin, deformation of the hanging lead 5 is less likely to occur. For this reason,
As shown in FIG. 2, the island 2 is sealed with resin without being tilted. Therefore, the wiring 8 can be prevented from being deformed or disconnected, and furthermore, the island 2 and the wiring 8 can be prevented from being exposed from the resin sealing material 7.

In this embodiment, an electrically insulating member 9 is attached to a part of the inner lead 3 to support the hanging lead 5.
If electrical insulating members are attached to all the inner leads 3, the suspension leads 5 may be supported.

[Effects of the Invention] As explained above, if the lead frame for a semiconductor device of the present invention is used, the suspension leads are reinforced by the inner leads via the electrically insulating member, so that the assembly of the resin-sealed semiconductor device is facilitated. Deformation of the hanging lead 5 can be prevented during the process.

Therefore, deformation or disconnection of the wiring, or exposure of the island or wiring from the resin sealing material can be prevented.

Therefore, by using the lead frame of the present invention, it is possible to produce high quality semiconductor devices with excellent production efficiency.

[Brief explanation of the drawing]

FIG. 1 is a partial plan view showing an embodiment of the present invention. FIG. 2 is a sectional view showing a state after a semiconductor element is mounted on the lead frame of the embodiment shown in FIG. 1 and sealed with resin. FIG. 3 is a partial plan view showing a conventional lead frame. FIG. 4 is a sectional view showing an example of a state after a semiconductor element is mounted on a conventional lead frame and sealed with resin. In the figure, 1 is a semiconductor element, 2 is an island, 3 is an inner lead, 4 is a lead frame frame, 5 is a hanging lead,
Reference numeral 6 indicates a resin sealing range, 7 a resin sealant, 8 wiring, and 9 an electrically insulating member. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] (1) A lead frame for a semiconductor device comprising an island for mounting a semiconductor element, a hanging lead for supporting the island on a lead frame frame, and an inner lead for connecting wiring to the semiconductor element, A lead frame for a semiconductor device, characterized in that a hanging lead is supported by the inner lead via an electrically insulating member.