JPH0274587U - - Google Patents
Info
- Publication number
- JPH0274587U JPH0274587U JP15382688U JP15382688U JPH0274587U JP H0274587 U JPH0274587 U JP H0274587U JP 15382688 U JP15382688 U JP 15382688U JP 15382688 U JP15382688 U JP 15382688U JP H0274587 U JPH0274587 U JP H0274587U
- Authority
- JP
- Japan
- Prior art keywords
- eccentric
- eccentric portion
- maximum
- outer peripheral
- rotary compressor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 4
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Description
第1図は本考案にかかるロータリー圧縮機の要
部を示す概略斜視図、第2図は同圧縮機の平断面
図、第3図は他の実施例を示す平断面図、第4図
はロータリー圧縮機の全体構造を示す縦断面図、
第5図は従来例を示す図面である。
31……シリンダ室、35……ローラ、4……
駆動軸、5……偏心部、51……貫通孔、52…
…円形外周面、53……円形外周面、54……最
大偏心部、55……円弧形外周面、56……カツ
ト部、56′……第1カツト部、57……第2カ
ツト部。
FIG. 1 is a schematic perspective view showing the main parts of a rotary compressor according to the present invention, FIG. 2 is a plan sectional view of the same compressor, FIG. 3 is a plan sectional view showing another embodiment, and FIG. A vertical cross-sectional view showing the overall structure of a rotary compressor.
FIG. 5 is a drawing showing a conventional example. 31...Cylinder chamber, 35...Roller, 4...
Drive shaft, 5... Eccentric part, 51... Through hole, 52...
...Circular outer circumferential surface, 53...Circular outer circumferential surface, 54...Maximum eccentricity, 55...Circular outer circumferential surface, 56...Cut portion, 56'...First cut portion, 57...Second cut portion .
Claims (1)
、該偏心部5の外周に挿嵌されるローラ35とを
内装したロータリー圧縮機において、前記偏心部
5の偏心側に、軸方向に貫通する貫通孔51を形
成すると共に、前記偏心部5の軸方向中間部に、
軸方向両端部の円形外周面52,53と、最大偏
心部54を含む円弧形外周面55とを残して、前
記最大偏心部54の近くから回転方向後方側の吸
入域に延びるカツト部56を形成したことを特徴
とするロータリー圧縮機。 (2) シリンダ室31に、駆動軸4の偏心部5と
、該偏心部5の外周に挿嵌されるローラ35とを
内装したロータリー圧縮機において、前記偏心部
5の偏心側に、軸方向に貫通する貫通孔51を形
成すると共に、前記偏心部5の軸方向中間部に、
軸方向両端部の円形外周面52,53と、最大偏
心部54を含む円弧形外周面55とを残して、前
記最大偏心部54の近くから回転方向後方側の吸
入域に延びる第1カツト部56′と、前記最大偏
心部54の近くから回転方向前方側の圧縮域に延
びる第2カツト部57とを形成したことを特徴と
するロータリー圧縮機。[Claims for Utility Model Registration] (1) In a rotary compressor in which an eccentric portion 5 of a drive shaft 4 and a roller 35 inserted into the outer periphery of the eccentric portion 5 are installed in a cylinder chamber 31, the eccentric portion A through hole 51 that penetrates in the axial direction is formed on the eccentric side of the eccentric part 5, and an axially intermediate part of the eccentric part 5,
A cut portion 56 extends from near the maximum eccentric portion 54 to the suction area on the rear side in the rotational direction, leaving the circular outer peripheral surfaces 52 and 53 at both ends in the axial direction and the arcuate outer peripheral surface 55 including the maximum eccentric portion 54. A rotary compressor characterized by forming. (2) In a rotary compressor in which the eccentric part 5 of the drive shaft 4 and the roller 35 inserted into the outer periphery of the eccentric part 5 are installed in the cylinder chamber 31, the A through hole 51 penetrating through the eccentric portion 5 is formed in the axially intermediate portion of the eccentric portion 5.
A first cut extending from near the maximum eccentricity 54 to the suction area on the rear side in the rotational direction, leaving circular outer peripheral surfaces 52 and 53 at both ends in the axial direction and an arcuate outer peripheral surface 55 including the maximum eccentricity 54. 56', and a second cut portion 57 extending from near the maximum eccentric portion 54 to the compression region on the forward side in the rotational direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15382688U JPH078865Y2 (en) | 1988-11-25 | 1988-11-25 | Rotary compressor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15382688U JPH078865Y2 (en) | 1988-11-25 | 1988-11-25 | Rotary compressor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0274587U true JPH0274587U (en) | 1990-06-07 |
JPH078865Y2 JPH078865Y2 (en) | 1995-03-06 |
Family
ID=31430009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15382688U Expired - Lifetime JPH078865Y2 (en) | 1988-11-25 | 1988-11-25 | Rotary compressor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH078865Y2 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US7033922B2 (en) | 2000-06-28 | 2006-04-25 | Applied Materials. Inc. | Method and system for controlling the presence of fluorine in refractory metal layers |
US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US7115499B2 (en) | 2002-02-26 | 2006-10-03 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7208413B2 (en) | 2000-06-27 | 2007-04-24 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
US7352048B2 (en) | 2001-09-26 | 2008-04-01 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7538473B2 (en) | 2004-02-03 | 2009-05-26 | S.C. Johnson & Son, Inc. | Drive circuits and methods for ultrasonic piezoelectric actuators |
KR101878670B1 (en) * | 2012-01-06 | 2018-07-16 | 엘지전자 주식회사 | Rotary compressor |
-
1988
- 1988-11-25 JP JP15382688U patent/JPH078865Y2/en not_active Expired - Lifetime
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7501343B2 (en) | 2000-06-27 | 2009-03-10 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7208413B2 (en) | 2000-06-27 | 2007-04-24 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7033922B2 (en) | 2000-06-28 | 2006-04-25 | Applied Materials. Inc. | Method and system for controlling the presence of fluorine in refractory metal layers |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US7352048B2 (en) | 2001-09-26 | 2008-04-01 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US7094685B2 (en) | 2002-01-26 | 2006-08-22 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US7473638B2 (en) | 2002-01-26 | 2009-01-06 | Applied Materials, Inc. | Plasma-enhanced cyclic layer deposition process for barrier layers |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US7115499B2 (en) | 2002-02-26 | 2006-10-03 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
Also Published As
Publication number | Publication date |
---|---|
JPH078865Y2 (en) | 1995-03-06 |