JPH0274054A - Sealing method of semiconductor device - Google Patents
Sealing method of semiconductor deviceInfo
- Publication number
- JPH0274054A JPH0274054A JP22575888A JP22575888A JPH0274054A JP H0274054 A JPH0274054 A JP H0274054A JP 22575888 A JP22575888 A JP 22575888A JP 22575888 A JP22575888 A JP 22575888A JP H0274054 A JPH0274054 A JP H0274054A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal ring
- pulse current
- metal cap
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の封止方法に関し、特にセラミック
パッケージＩＣの金属キャップ封止方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for sealing a semiconductor device, and more particularly to a method for sealing a metal cap of a ceramic package IC.
従来、この種の半導体装置の封止方法は、第２図に示す
とおり、メタルリング３が固着されたセラミック基板４
にＩＣを装着しメタルリング３上に金属キャップ２を置
き、一対のローラを極１でメタルリング３上の金属キャ
ップ２を押え、そのローラ電極間にパルス電流を印加し
てメタルリング３と金属キャップ２を溶接し封止してい
た。Conventionally, as shown in FIG. 2, a method for sealing a semiconductor device of this type involves a ceramic substrate 4 to which a metal ring 3 is fixed.
Mount the IC on the metal ring 3, place the metal cap 2 on the metal ring 3, press the metal cap 2 on the metal ring 3 with the pole 1 of a pair of rollers, and apply a pulse current between the roller electrodes to connect the metal ring 3 and the metal cap. Cap 2 was welded and sealed.
上述した従来の半導体装置の封止方法は、パルス電流を
ローラ電極間に印加していることより、その電流経路は
一方のローラ電極から金属キャップ２とメタルリング３
を通り、再び金属キャップを通りもう一方のローラ電極
へ流れる有効電流と、一方のローラ電極から金属キャッ
プ２のみを通りもう一方のローラ電極へ流れる無効電流
とに分流されるので、無効電流による電力効率源及び封
止性の低下という欠点がある。In the conventional semiconductor device sealing method described above, a pulse current is applied between the roller electrodes, so that the current path is from one roller electrode to the metal cap 2 and the metal ring 3.
, the active current flows through the metal cap 2 again to the other roller electrode, and the reactive current flows from one roller electrode through only the metal cap 2 to the other roller electrode, so the power due to the reactive current There are disadvantages of reduced efficiency and sealing properties.
本発明は、半導体装置を装着したセラミックパッケージ
の金属キャップ封止において、金属キャップをパッケー
ジのメタルリングに電気溶接する際のパルス電流を直接
金属キャップとメタルリング間に流すことを特徴とする
。The present invention is characterized in that in sealing a ceramic package equipped with a semiconductor device with a metal cap, a pulsed current for electrically welding the metal cap to a metal ring of the package is directly passed between the metal cap and the metal ring.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す図である。メタルリン
グ３が固着されたセラミック基板４にＩＣを装着しメタ
ルリング３上に金属キャップ２をかぶせる。ローラ電極
１を金属キャップ２を押えるように設置し、パルス電流
電源５をローラ電極１とメタルリング３との間に接続し
てパルス電流を流す。このように結線すると、パルス電
流はパルス電流電源５の一方の電極からローラ電１１．
金属キャップ２．メタルリング３を通りパルス電流電源
５の他方の電極へと流れるので無効電流はなくなる。FIG. 1 is a diagram showing an embodiment of the present invention. An IC is mounted on a ceramic substrate 4 to which a metal ring 3 is fixed, and a metal cap 2 is placed over the metal ring 3. A roller electrode 1 is installed so as to press a metal cap 2, and a pulse current power source 5 is connected between the roller electrode 1 and the metal ring 3 to apply a pulse current. By connecting the wires in this manner, a pulse current is transmitted from one electrode of the pulse current power source 5 to the roller electrode 11.
Metal cap 2. Since the current flows through the metal ring 3 to the other electrode of the pulsed current power source 5, there is no reactive current.
以上説明したように本発明は、パルス電流をセラミック
パッケージの金属キャップとメタルリング間に印加する
ことにより電力効率が上がり封止性を向上できる効果が
ある。As described above, the present invention has the effect of increasing power efficiency and improving sealing performance by applying a pulsed current between the metal cap and metal ring of a ceramic package.
【図面の簡単な説明】
第１図は本発明の半導体装置の封止方法を説明する図、
第２図は従来の封止方法の説明図である。
１・・・ローラ電極、２・・・金属キャップ、３・・・
メタルリング、４・・・セラミック基板、５・・・パル
ス電流電源。[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a diagram illustrating the method for sealing a semiconductor device of the present invention;
FIG. 2 is an explanatory diagram of a conventional sealing method. 1... Roller electrode, 2... Metal cap, 3...
Metal ring, 4... Ceramic substrate, 5... Pulse current power supply.
Claims (1)
ップ封止において、金属キャップをパッケージのメタル
リングに電気溶接する際のパルス電流を直接金属キャッ
プとメタルリング間に印加することを特徴とする半導体
装置の封止方法。Sealing of a semiconductor device characterized by applying a pulsed current directly between the metal cap and the metal ring when electrically welding the metal cap to the metal ring of the package in metal cap sealing of a ceramic package equipped with a semiconductor device. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22575888A JPH0274054A (en) | 1988-09-09 | 1988-09-09 | Sealing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22575888A JPH0274054A (en) | 1988-09-09 | 1988-09-09 | Sealing method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0274054A true JPH0274054A (en) | 1990-03-14 |
Family
ID=16834355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22575888A Pending JPH0274054A (en) | 1988-09-09 | 1988-09-09 | Sealing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0274054A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102837136A (en) * | 2012-09-11 | 2012-12-26 | 陕西华经微电子股份有限公司 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421169A (en) * | 1977-07-18 | 1979-02-17 | Nec Corp | Package for semiconductor |
| JPS5474374A (en) * | 1977-11-26 | 1979-06-14 | Nec Corp | Sealing method for semiconductor container |
| JPS5477572A (en) * | 1977-12-02 | 1979-06-21 | Nec Corp | Hermetic sealing method of package for semiconductor devices |
| JPS54155767A (en) * | 1978-05-29 | 1979-12-08 | Nec Corp | Semiconductor device |
| JPS6230352A (en) * | 1985-07-31 | 1987-02-09 | Nec Corp | Package for semiconductor device |
-
1988
- 1988-09-09 JP JP22575888A patent/JPH0274054A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421169A (en) * | 1977-07-18 | 1979-02-17 | Nec Corp | Package for semiconductor |
| JPS5474374A (en) * | 1977-11-26 | 1979-06-14 | Nec Corp | Sealing method for semiconductor container |
| JPS5477572A (en) * | 1977-12-02 | 1979-06-21 | Nec Corp | Hermetic sealing method of package for semiconductor devices |
| JPS54155767A (en) * | 1978-05-29 | 1979-12-08 | Nec Corp | Semiconductor device |
| JPS6230352A (en) * | 1985-07-31 | 1987-02-09 | Nec Corp | Package for semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102837136A (en) * | 2012-09-11 | 2012-12-26 | 陕西华经微电子股份有限公司 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
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