JPH0273759U - - Google Patents
Info
- Publication number
- JPH0273759U JPH0273759U JP15360988U JP15360988U JPH0273759U JP H0273759 U JPH0273759 U JP H0273759U JP 15360988 U JP15360988 U JP 15360988U JP 15360988 U JP15360988 U JP 15360988U JP H0273759 U JPH0273759 U JP H0273759U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- heat dissipation
- metal plate
- dissipation metal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るプリント基板を示す斜視
図、第２図はその断面図、第３図は従来のプリン
ト基板を示す斜視図、第４図はその断面図である
。
４……電子部品、１１……プリント基板、１２
……放熱用金属板、１３……部品搭載面樹脂層、
１４……半田付け面樹脂層、１５……空洞部。
FIG. 1 is a perspective view of a printed circuit board according to the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a perspective view of a conventional printed circuit board, and FIG. 4 is a sectional view thereof. 4...Electronic components, 11...Printed circuit board, 12
... Metal plate for heat dissipation, 13 ... Component mounting surface resin layer,
14...Soldering surface resin layer, 15...Cavity part.
Claims (1)
電子部品が前記樹脂層に密接された状態で搭載さ
れるプリント基板において、前記放熱用金属板に
空洞部を多数形成したことを特徴とするプリント
基板。 It has a heat dissipation metal plate whose surface is covered with a resin layer,
1. A printed circuit board on which electronic components are mounted in close contact with the resin layer, characterized in that a number of cavities are formed in the heat dissipation metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15360988U JPH0273759U (en) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15360988U JPH0273759U (en) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273759U true JPH0273759U (en) | 1990-06-05 |
Family
ID=31429607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15360988U Pending JPH0273759U (en) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273759U (en) |
-
1988
- 1988-11-28 JP JP15360988U patent/JPH0273759U/ja active Pending
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