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JPH0260147A - Pellet pickup mechanism - Google Patents

Pellet pickup mechanism

Info

Publication number
JPH0260147A
JPH0260147A JP63211665A JP21166588A JPH0260147A JP H0260147 A JPH0260147 A JP H0260147A JP 63211665 A JP63211665 A JP 63211665A JP 21166588 A JP21166588 A JP 21166588A JP H0260147 A JPH0260147 A JP H0260147A
Authority
JP
Japan
Prior art keywords
pellet
tape
pellets
adhesive force
caused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63211665A
Other languages
Japanese (ja)
Inventor
Yutaka Endo
裕 遠藤
Motohisa Mori
森 元久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63211665A priority Critical patent/JPH0260147A/en
Publication of JPH0260147A publication Critical patent/JPH0260147A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To prevent the peeling-off of a multiplicity of pellets owing to vibration and to prevent pellets other than those desired from being sucked up by a method wherein a light beam capable of reducing adhesive force is concentrated on one pellet region only. CONSTITUTION:A ring moving section 8 is caused to horizontally move for a desired pellet 2 to travel to a location over the ultraviolet rays projecting port 5 of a fiber cable 4, and the pellet 2 is exposed to an ultraviolet beam originating in a light source 3. As the result, a UV tape 1 is hardened only in the region mounted with the pellet 2 for reduction in adhesive force, whereby adhesion force is reduced between the pellet 2 and the UV tape 1. Under the conditions, a vacuum adsorption collet 7 is caused to descend toward the pellet 2 with its adhesive force reduced, to suck it up. After this, the vacuum adsorption collet 7 is lifted and caused to move horizontally to a specified pellet accommodating section and the pellet 2 is released of vacuum suction, which completes the pickup and movement.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はテープに張付けた半導体ウェハーを個々のペレ
ットに分離した後に、前記テープに光線を照射してその
粘着力を小さくし、ペレットをピックアップするペレッ
トピックアップmusに関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention involves separating a semiconductor wafer attached to a tape into individual pellets, then irradiating the tape with light to reduce its adhesive strength, and picking up the pellets. Regarding pellet pickup mus.

〔従来の技術〕[Conventional technology]

従来、ペレット外観選別、或いはダイボンダ等に使用す
るこの種のベレットピックアップ機構では例えばUVテ
ープに張付けた半導体ウェハーを個々のペレットに分離
した後に、半導体ウェハーの領域の全てに相当するUV
テープに紫外線を照射し、全てのペレットとテープとの
粘着力を小さくした後、ペレットピックアップ機構に取
付け、個々のペレットをピックアップするようにしてい
た。
Conventionally, in this type of pellet pickup mechanism used for pellet appearance sorting or die bonding, for example, after separating a semiconductor wafer attached to a UV tape into individual pellets, UV light covering the entire area of the semiconductor wafer is used.
After the tape was irradiated with ultraviolet light to reduce the adhesive strength between all pellets and the tape, it was attached to a pellet pickup mechanism to pick up individual pellets.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のペレットピックアップ機構では全てのペ
レットとテープとの粘着力を小さくしているため、粘着
力を極端に小さくした場合、テープをベレットピックア
ップ機構に取付ける際の振動、あるいはペレットピック
アップIl椙の動作時の振動等により多数のペレットが
剥れてしまったり、あるいは真空吸着コレットでテープ
上からペレットを吸着する際、望むペレット以外の他の
ペレットを吸着してしまうという問題があった。また、
前記問題が発生しないように粘着力をある程度大きくし
ておくと、真空吸着のみではベレットを吸着できず、例
えば第2図のように、ベレット2を張付けたUVテープ
1を固定リング6に固定し、リング移動部8にて固定リ
ング6を横方向に移動させつつ、テープ1の下部裏側か
ら突上機構13によりテープ1を貫通して針12を上昇
させ、ベレット2を真空吸着コレット7側に突き上げる
補助手段が必要であるという欠点があった。
In the conventional pellet pickup mechanism described above, the adhesive force between all the pellets and the tape is reduced, so if the adhesive force is extremely reduced, it may cause vibrations when attaching the tape to the pellet pickup mechanism, or vibrations in the pellet pickup mechanism. There have been problems in that a large number of pellets come off due to vibrations during operation, or that when a vacuum suction collet adsorbs pellets from above the tape, other pellets than the desired pellets are adsorbed. Also,
If the adhesive force is increased to a certain extent to prevent the above problem from occurring, the pellet cannot be adsorbed by vacuum suction alone, and for example, as shown in FIG. While moving the fixing ring 6 in the lateral direction using the ring moving unit 8, the needle 12 is raised from the lower back side of the tape 1 by penetrating the tape 1 by the lifting mechanism 13, and the pellet 2 is moved to the vacuum suction collet 7 side. The drawback was that an auxiliary means for pushing up was required.

本発明の目的は前記課題を解決したベレットピックアッ
プ1JI4を提供することにある。
An object of the present invention is to provide a pellet pickup 1JI4 that solves the above problems.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来のベレットピックアップ機構に対して、本
発明はテープに張付けたベレットのうち、単一のベレッ
ト領域部のみにテープ粘着力を小さくする光線を照射す
るという相違点を有する。
The present invention differs from the conventional bullet pickup mechanism described above in that it irradiates only a single bullet area of the bullet attached to the tape with a light beam that reduces the adhesive strength of the tape.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明はテープに張付けた半
導体ウェハーを個々のベレットに分能した後に前記テー
プに光線を照射してその粘着力を小さくし、ベレットを
テープ上からピックアップするベレットピックアップ機
構において、単一のベレット領域部のみにテープ粘着力
を小さくする光線を集中させて照射する@横を有するも
のである。
In order to achieve the above object, the present invention provides a pellet pickup mechanism that divides a semiconductor wafer attached to a tape into individual pellets, irradiates the tape with a light beam to reduce its adhesive strength, and picks up the pellets from above the tape. In the present invention, a beam of light that reduces the adhesive force of the tape is concentrated and irradiated only on a single pellet region.

〔実施例〕〔Example〕

次に、本発明について図面にもとづき説明する。 Next, the present invention will be explained based on the drawings.

(実方拒例1) 第1図は本発明の実施例1を示す断面図である。(Actual refusal case 1) FIG. 1 is a sectional view showing a first embodiment of the present invention.

1はベレット2を張付けたUVテープ、3はベレット2
を張付けたUVテープ1を硬化させて粘着力を小さくす
る紫外線光源、4は紫外線光a3からの紫外光をベレッ
ト2を張付けたUVチー11の裏側から単一ベレット2
の張付は面の領域部にのみ導き集中的に照射する照射口
5を有するファイバーケーブル、6はUVテープ1を固
定する固定リング、7はその下部端面に真空吸着口を持
ちUVテープ1上のベレット2に対して上下及び水平運
動し所定のベレット収容部とUVテープ1上のベレット
2位置とを移動するように取付けた真空吸着コレット、
8はUVテープ1を水平方向に移動させるよう取付けた
リング移動部、9は固定リング6をリング移動部8に取
付ける取付治具である。
1 is UV tape with Beret 2 attached, 3 is Beret 2
An ultraviolet light source 4 is used to harden the UV tape 1 pasted with UV tape 1 to reduce its adhesive strength, and 4 is a UV light source that applies ultraviolet light from UV light a3 to the single pellet 2 from the back side of the UV tape 11 with the pellet 2 pasted on it.
is attached to a fiber cable having an irradiation port 5 that guides and intensively irradiates only the area of the surface, 6 is a fixing ring that fixes the UV tape 1, and 7 is a fiber cable with a vacuum suction port on the lower end surface of the UV tape 1. a vacuum suction collet attached to move vertically and horizontally relative to the pellet 2 to move between a predetermined pellet accommodating portion and the position of the pellet 2 on the UV tape 1;
Reference numeral 8 denotes a ring moving section attached to move the UV tape 1 in the horizontal direction, and 9 is a mounting jig for attaching the fixed ring 6 to the ring moving section 8.

次に動作について説明する。まず、リング移動部8を水
平移動して望みのベレット2をファイノく−ケーブル4
の紫外線照射口5の上方に位置させ、紫外光を光源3よ
り照射すると、UVテープ1は単一のベレット2の領域
部のみ硬化して粘着力が小さくなりベレット2との接着
力が小さくなる。
Next, the operation will be explained. First, move the ring moving part 8 horizontally to move the desired pellet 2 to the cable 4.
When the UV tape 1 is placed above the ultraviolet irradiation port 5 and irradiated with ultraviolet light from the light source 3, the UV tape 1 hardens only in the area of a single pellet 2, and the adhesive force with the pellet 2 decreases. .

この状態で真空吸着コレット7を、テープの接着力が小
さくなった特定のベレット2に対して降下させて真空吸
着する。その後、真空吸着コレ・ント7を−L昇させ、
水平移動し所定のベレ・ット収容部へ運び、真空吸着を
解除してベレット2のピ・ツクアップ、移送を完了する
In this state, the vacuum suction collet 7 is lowered and vacuum suctioned onto a specific pellet 2 where the adhesive strength of the tape has become low. After that, the vacuum suction collector 7 is raised by -L,
The pellet 2 is moved horizontally and carried to a predetermined pellet storage area, and the vacuum suction is released to complete the pick-up and transfer of the pellet 2.

(実施例2) 第2図は本発明の実施例2を示す断面図である。(Example 2) FIG. 2 is a sectional view showing a second embodiment of the present invention.

10は単一のベレット2の領域部のみに当るように窓の
あいたマスクを設けた紫外線光源3に対する光学系、1
1は光学系10からの紫外光をベレ・ント2の裏側から
UVテープ1に照射するように光路を直角に曲げるプリ
ズムである。この実施例ではマスクの変更によりベレッ
トサイズの変更に容易に対処できるという利点がある。
10 is an optical system for the ultraviolet light source 3 provided with a mask with a window so as to hit only the region of a single pellet 2;
1 is a prism that bends the optical path at right angles so that the ultraviolet light from the optical system 10 is irradiated onto the UV tape 1 from the back side of the beam lens 2. This embodiment has the advantage that the pellet size can be easily changed by changing the mask.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は単一のベレット領域部にの
みベレットとテープとの粘着力を小さくする光線を照射
した後、該ベレットをピ・ンクツ・yプするようにした
ため、ピックアップ機構の振動等により多数のベレット
が剥れてしまったり、あるいは望みのベレット以外のベ
レットを吸着してしまうという恐れがなく、しかも真空
吸着コレットへの吸着のためベレットをテープから引き
はがす他の補助手段を取付ける必要がなく、構造か簡単
になるという効果がある。
As explained above, the present invention irradiates only a single bullet region with a beam of light that reduces the adhesive force between the bullet and the tape, and then pinpoints the bullet, which causes vibrations in the pickup mechanism. There is no fear that a large number of pellets will come off due to such factors, or that pellets other than the desired pellets will be attracted, and other auxiliary means can be installed to separate the pellets from the tape in order to attract them to the vacuum suction collet. It is unnecessary and has the effect of simplifying the structure.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例1を示す断面図、第2図は本発
明の実施例2を示す断面図、第3図は従来例を示ず断面
図である。 1・・・UVテープ    2・・・ベレット3・・・
紫外線光源 4・・・ファイバーケーブル 5・・・照射口 ア・・・真空吸着コレット 9・・・取付治具 11・・・プリズム 13・・・突上機構 6・・・固定リング 8・・・リング移動部 10・・・光学系 12・・・針 特 許出願人  日本電気株式会社 第 図
FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a second embodiment of the present invention, and FIG. 3 is a sectional view not showing a conventional example. 1...UV tape 2...Bellet 3...
Ultraviolet light source 4...Fiber cable 5...Irradiation port a...Vacuum suction collet 9...Mounting jig 11...Prism 13...Uplifting mechanism 6...Fixing ring 8... Ring moving unit 10...Optical system 12...Needle patent applicant NEC Corporation Figure

Claims (1)

【特許請求の範囲】[Claims] (1)テープに張付けた半導体ウェハーを個々のペレッ
トに分離した後に前記テープに光線を照射してその粘着
力を小さくし、ペレットをテープ上からピックアップす
るペレットピックアップ機構において、単一のペレット
領域部のみにテープ粘着力を小さくする光線を集中させ
て照射する機構を有することを特徴とするペレットピッ
クアップ機構。
(1) In a pellet pickup mechanism that separates a semiconductor wafer attached to a tape into individual pellets, irradiates the tape with light to reduce its adhesive strength, and then picks up the pellets from above the tape. A pellet pickup mechanism characterized by having a mechanism that concentrates and irradiates a light beam that reduces tape adhesive strength.
JP63211665A 1988-08-26 1988-08-26 Pellet pickup mechanism Pending JPH0260147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63211665A JPH0260147A (en) 1988-08-26 1988-08-26 Pellet pickup mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63211665A JPH0260147A (en) 1988-08-26 1988-08-26 Pellet pickup mechanism

Publications (1)

Publication Number Publication Date
JPH0260147A true JPH0260147A (en) 1990-02-28

Family

ID=16609567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63211665A Pending JPH0260147A (en) 1988-08-26 1988-08-26 Pellet pickup mechanism

Country Status (1)

Country Link
JP (1) JPH0260147A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827394A (en) * 1996-07-15 1998-10-27 Vanguard International Semiconductor Corporation Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing
EP1592058A3 (en) * 2004-04-21 2006-04-12 Nitto Denko Corporation Method of selective thermal release from a heat peelable sheet and corresponding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827394A (en) * 1996-07-15 1998-10-27 Vanguard International Semiconductor Corporation Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing
EP1592058A3 (en) * 2004-04-21 2006-04-12 Nitto Denko Corporation Method of selective thermal release from a heat peelable sheet and corresponding apparatus

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