JPH0266957A - Pickup device of semiconductor element - Google Patents

Abstract

PURPOSE:To make it possible to prevent occurrence of flaws in a semiconductor element even if the semiconductor element to be picked up is moved in the lateral direction when a push-up pin is pushed up by providing a step part in a holder. CONSTITUTION:In a holder 3a, a step part 8 is provided between a central flat part 6a and a slant part 7a which is inclined downward at the peripheral part. Before an UV tape 2 is sucked, a neighboring semiconductor element 1a is located higher than the lowest surface of a semiconductor element 1 to be picked up. After the UV tape is sucked, the UV tape 2 is conformal to the shape of the upper surface of the holder 3a. The neighboring semiconductor element 1a is lowered and located lower than the lowest surface of the semiconductor element 1 to be picked up. When the UV tape 2 is sucked through sucking holes 5, the UV tape 2 which is located on a lower flat part 9a id lowered. The UV tape 2 is peeled off from the semiconductor element 1 to be picked up. Therefore, the semiconductor element 1 can be picked up without pushing up the semiconductor element 1 with a push-up pin 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device pickup device, and more particularly to a semiconductor device pickup device using a holder having a mechanism for adsorbing an adhesive tape.

[Conventional technology]

Semiconductor elements are processed by dicing (hereinafter referred to as full-cut dicing) in which a semiconductor wafer is completely cut using an adhesive tape (hereinafter referred to as UV sheet) that has an adhesive surface on one side whose adhesive strength decreases due to ultraviolet irradiation. When picking up a UV sheet that has been irradiated with ultraviolet rays after full-cut dicing to reduce its adhesive strength without stretching the UV sheet, there is a semiconductor device pickup device that is used for this purpose.

FIG. 4 is a sectional view of an example of a conventional semiconductor device pickup device.

As shown in FIG.
The area where the material is picked up is a flat part 6, and the periphery of the flat part 6 is a downwardly inclined slope part 7.
A suction port 5 is arranged on the lower surface of the lower surface and the lower surface of the inclined part 7. When picking up the semiconductor element 1, from the suction port 5
The UV sheet 2 is adsorbed, the UV sheet 2 is made to follow the shape of the upper surface of the holder 3, the gap between the semiconductor element 1 to be picked up and the adjacent semiconductor element 1a is widened, and the flat part 6 is
The push-up bottle 4 is raised through the central suction port 5, and the semiconductor element 1 to be picked up is pushed up and picked up.

[Problem to be solved by the invention]

The conventional semiconductor device pickup device described above is U■
Since there is an adjacent semiconductor element above the bottom surface of the semiconductor element to be picked up after the tape is adsorbed, when the semiconductor element to be picked up is pushed up, the semiconductor element to be picked up may be affected by backlash of the pushing-up mechanism and when the push-up pin rises due to vibration. Due to the generated vibrations, when the semiconductor device moves laterally, it comes into contact with an adjacent semiconductor device, causing scratches on the semiconductor device and causing the semiconductor device to become defective.

[Means to solve the problem]

The semiconductor device pickup device of the present invention has an adhesive tape on the upper surface and a semiconductor wafer is pasted on the adhesive surface. a boulder having a pick-up area for a semiconductor element to be picked up in the center and an inclined area sloping downward outside the pick-up area, and adsorbing the adhesive tape in the pick-up area and the inclined area when picking up the semiconductor element; A pickup device for a semiconductor device comprising: a step provided in the pickup region such that the bottom surface of the semiconductor device on the pickup region is above the top surface of an adjacent semiconductor device when picking up the semiconductor device. .

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of a first embodiment of the invention.

As shown in FIG. , has a step 8 between a central flat portion 6a serving as a bias amplifier region of the semiconductor element 1 to be picked up and a downwardly inclined slope portion 76 around the flat portion 61. Other than having the step 8, this structure is almost the same as that of the semiconductor device pickup device shown in FIG. 4 described above, and the explanation thereof will be omitted. Before the UV tape 2 is adsorbed, an adjacent semiconductor element 1a exists above the bottom surface of the semiconductor element 1 to be picked up.

FIG. 2 is a sectional view of the first embodiment of FIG. 1 after adsorption of the UV tape.

As shown in FIG. 2, the UV tape 2 follows the top surface shape of the holder 33, and therefore the adjacent semiconductor element 1
a is pulled down so that it exists below the bottom surface of the semiconductor element 1 to be picked up.

FIG. 3 is a sectional view of a second embodiment of the invention.

As shown in FIG. 3, in the second embodiment, the first
Flat portion 6 of the first embodiment shown. An upper flat part 9 with a protruding periphery and a lower flat part 9 with a step inside the upper flat part 9. It is composed of

With this configuration, tJ V from the suction port 5
When the tape 2 is attracted, an adjacent semiconductor element 1a exists below the bottom surface of the semiconductor element 1 to be picked up, and at the same time, a lower flat portion 9. The UV tape 2 on top is pulled downward by suction, and the semiconductor element 1 to be picked up is
The UV tape 2 is peeled off.

Therefore, the semiconductor element 1 to be picked up by the push-up pin
The semiconductor element 1 can be picked up without being pushed up.

〔Effect of the invention〕

As explained above, the present invention has the effect that by providing a step in the holder, it is possible to prevent scratches from occurring on the semiconductor element even if the semiconductor element to be picked up moves laterally when the push-up bottle is pushed up. .

To give an example of an experiment, when a conventional semiconductor device pickup device was used, the incidence of scratches or chips on the semiconductor device during pickup was 3.6%, whereas in the first embodiment, the occurrence rate of scratches or chips was 3.6%. There were no occurrences of chips.

Further, according to the second embodiment, by narrowing the flat portion and providing a stepped flat portion that does not contact the semiconductor device to be picked up between the flat portions, the semiconductor device to be picked up by the push-up bin is improved. Since the UV tape can be picked up without being pushed up, there is no need for a pushing up mechanism, and since the UV tape is not pierced by the lifting bottle, the broken pieces of the UV tape will not stick to the semiconductor element being picked up. This has the effect of enabling good mounting when mounting a semiconductor element on a lead frame.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of the first embodiment of the present invention, and 214 is a sectional view of the first embodiment of the present invention.
Cross-sectional view of the first embodiment in FIG. 1 after V-tape adsorption;
4 is a cross-sectional view of a second embodiment of the present invention, and FIG. 4 is a cross-sectional view of an example of a conventional semiconductor device pickup device. 1... Semiconductor element to be picked up, 11... Semiconductor element adjacent to the semiconductor element to be picked up, 2...
・UV tape, 3,3. Boulder-14... Push-up bottle, 5... Suction port, 6.6. ...Flat part, 7°73
...Slope part, 8...Step, 9...Upper flat part, 9
゜...1; flat area. Agent Patent Attorney Susumu Uchihara Arroyosabia 4 (G) 3rd Prisoner

Claims (1)

[Claims] An adhesive tape having an adhesive surface on the upper surface and on which a semiconductor wafer is attached and divided into individual semiconductor elements; a pickup area for semiconductor elements arranged on the lower side of the adhesive tape and to be picked up in the center; and the pickup area. A pickup device for a semiconductor device, comprising: a holder which has a downwardly inclined sloped region on the outside of the semiconductor device, and a holder which attracts the adhesive tape at the pickup region and the sloped region when picking up the semiconductor device; A pickup device for a semiconductor device, characterized in that the pickup region has a step provided so that the bottom surface of the semiconductor device on the pickup region is above the top surface of an adjacent semiconductor device.