JPH0241447U - - Google Patents
Info
- Publication number
- JPH0241447U JPH0241447U JP11865688U JP11865688U JPH0241447U JP H0241447 U JPH0241447 U JP H0241447U JP 11865688 U JP11865688 U JP 11865688U JP 11865688 U JP11865688 U JP 11865688U JP H0241447 U JPH0241447 U JP H0241447U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- lead
- out terminals
- resin part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す集積回路パツ
ケージの斜視図、第２図は裏側の斜視図、第３図
は実装状態を示すプリント基板要部の断面図、第
４図は他の実施例による集積回路パツケージの裏
側斜視図、第５図は従来の集積回路パツケージの
斜視図、第６図は実装状態を示すプリント基板要
部の断面図である。
１…樹脂部、２…導出端子、１ａ…厚み部、３
…プリント基板、４…端子配線、５…配線。
Fig. 1 is a perspective view of an integrated circuit package showing an embodiment of the present invention, Fig. 2 is a perspective view of the back side, Fig. 3 is a sectional view of the main parts of a printed circuit board showing the mounted state, and Fig. 4 is a perspective view of an integrated circuit package showing an embodiment of the present invention. FIG. 5 is a perspective view of the back side of the integrated circuit package according to the embodiment, FIG. 5 is a perspective view of the conventional integrated circuit package, and FIG. 6 is a sectional view of the main parts of the printed circuit board showing the mounted state. DESCRIPTION OF SYMBOLS 1...Resin part, 2...Leading-out terminal, 1a...Thickness part, 3
...Printed circuit board, 4...terminal wiring, 5...wiring.
Claims (1)
路パツケージにおいて、前記樹脂部の一辺側に導
出端子が集中して設けられ、導出端子と反対の辺
側に、導出端子の高さに対応した厚み部が樹脂部
と一体的に設けられていることを特徴とする集積
回路パツケージ。 In an integrated circuit package formed by wrapping a semiconductor chip in a resin part, lead-out terminals are concentrated on one side of the resin part, and a thickness part corresponding to the height of the lead-out terminals is provided on the side opposite to the lead-out terminals. An integrated circuit package characterized in that the integrated circuit package is provided integrally with a resin part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11865688U JPH0241447U (en) | 1988-09-09 | 1988-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11865688U JPH0241447U (en) | 1988-09-09 | 1988-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241447U true JPH0241447U (en) | 1990-03-22 |
Family
ID=31363192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11865688U Pending JPH0241447U (en) | 1988-09-09 | 1988-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241447U (en) |
-
1988
- 1988-09-09 JP JP11865688U patent/JPH0241447U/ja active Pending