JPH023954A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To cut down the period from the development to the shipment by a method wherein wiring plates provided with multilayered wiring conductors orthogonal or oblique to one another to mount a plurality of semiconductor substrates, etc., are provided on the specified positions on lead frames. CONSTITUTION:Wiring plates 4 with lower layer wiring conductors 61-6n provided in orthogonal shape to the surface wiring conductors 51-5n is mounted on the wiring plate mounting regions of lead frames 2 and then semiconductor substrates, etc., are bonded onto the specified regions on the wiring plates 4 using an insulating bonding agent. Next, the semiconductor, etc,. and the wiring plates 4, the wiring plates 4 themselves, the wiring plates 4 and the lead frames 2 are electrically connected by bonding wires through connecting electrodes 7i. Through these procedures, various integrated circuit devices are manufactured by mounting the standardized wiring plates 4 on the lead frames 2 and arranging the specified semiconductor substrates etc., on the specified positions on the wiring plates 4, thereby cutting down the period from the development to the shipment of the integrated circuit devices.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit device, and particularly to an integrated circuit device in which a plurality of components are mounted in one sealed container.

[Conventional technology]

Conventionally, this type of integrated circuit device has a single molded sealing resin 1 and a lead frame 2, as shown in FIG.
The internal structure of the cross section taken along line AA' in FIG. 1 was as shown in FIG. 4. That is, the lead frame 2 has a plurality of mutually independent die bonding regions 12i on which a single semiconductor substrate 9i (i=l=k) is to be mounted.
(121-g), electrical connection between the lead frame and the semiconductor substrate, which are separated and formed into a desired shape, is made by wire bonding, for example, with metal wires 10i (i=1-
j). (For example, JP-A-54-124690). As another conventional example, for example, as shown in FIG. m to other lead frames
It is mechanically held by adhesion to the M-shaped insulating film 14, and then the semiconductor substrate 91, the lead frame 2, and the independent piece 13i are held together by the thin gold wire 10i (i=1 to j).
etc. are electrically connected (Japanese Patent Laid-Open No. 62-2
No. 7544). Furthermore, as a third conventional example, there is an example shown in FIG.

FIG. 6 is an example of an integrated circuit device having an internal structure shown in a schematic vertical cross-sectional view taken along line BB' in FIG. That is, a region 3 in which the wiring board 4 is to be mounted is arranged in the center of the lead frame, a single-layer or multilayer wiring board 4 having individual desired wiring conductors is mounted on this region, and the wiring board A plurality of semiconductor substrates 9i (i=1 to k) or passive element substrates 11i (i=l''g) such as chip capacitors are mounted on the substrate 4.
It is equipped with.

[Problem to be solved by the invention]

The conventional integrated circuit device shown in FIGS. 4 and 5 described above is
When the number of semiconductor substrates, etc. to be mounted increases, or when the scale of the electronic circuit to be provided increases, the shape of the lead frame becomes complicated, and it becomes virtually impossible to manufacture the desired lead frame. It was something. On the other hand, the integrated circuit device shown in FIG. 6 has a single-layer or multi-layer wiring board for matching individual electronic circuits, and a semiconductor substrate, etc. is mounted on this wiring board. For this reason, although the present integrated circuit device can provide a large-scale electronic circuit, it has the disadvantage that it takes a lot of time from development to shipment of the integrated circuit device due to the intervening period of manufacturing the printed board.

[Differences between the invention and the prior art]

In contrast to the conventional integrated circuit devices described above, the present invention eliminates the need to individually manufacture complicated lead frames and wiring boards, and can shorten the period from development to shipment of integrated circuit devices. They have some differences.

[Means to solve the problem]

The integrated circuit device of the present invention has the structure shown in FIG. 6, and includes a lead frame, a standardized wiring board mounted on the lead frame, a semiconductor substrate on the wiring board, etc.
The wiring board has at least two layers of wiring conductors, and each wiring conductor is provided with at least two connection electrodes, and the semiconductor substrate is coated with an insulating adhesive (epoxy resin).

It is mounted on a wiring board using silicone resin, etc.).

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic perspective view showing an embodiment (conventional example) of the present invention, in which ▪ indicates a sealing resin and 2 indicates a lead frame.

2 and 3 are diagrams schematically showing the internal structure of the cross section taken along the line AA' in FIG. 1 in the order of manufacturing steps.

In FIG. 2, a wiring board mounting area 3 is provided in the center of the lead frame 2, and a wiring board 4 is mounted on this area. The wiring board 4 has, for example, a two-layer conductor pattern 5i (i=1
~n) is the surface wiring conductor (second layer conductor), and 6i
(i = 1 to m) are lower wiring conductors (-layer conductors) provided in a shape perpendicular to the 5i conductor, and both the 5i and 6i conductors have a number of bonding wire connection electrodes 7i indicated by black circles. (i=1 to 1) on the surface of the wiring board 4.

Moreover, if desired, electrodes 81, 8□ for mounting passive components such as chip capacitors may be provided.

After mounting the wiring board 4 on a predetermined area of the lead frame 20, a semiconductor substrate 91 (i=1 to k
) on the desired area on the wiring board using an insulating adhesive (epoxy resin, silicone resin, etc.).
figure). Next, bonding wire 10i is connected between the semiconductor substrate and the wiring board, between the wiring boards and the wiring board, and between the wiring board and the lead frame.
(i=1 to j) for electrical interconnection.

Furthermore, if desired, as shown in FIG. 3, passive components such as a chip capacitor 11 may be mounted on the wiring board by a solder reflow method or the like to realize a desired circuit function.

In this embodiment, the wiring board conductor is described as a two-layer conductor, but the number of conductor layers can be set to any value as desired. Furthermore, although the wiring conductors are provided in a shape that is orthogonal to each other, these wiring conductors can also be provided in a shape that is oblique to each other.

The wiring board 4 including these semiconductor substrates, passive components, etc. is sealed with resin in the shape shown in FIG. Although Figure 1 shows the shape of a standard IP (dual in-line package) structure, the present invention can be applied to sealing resin of any structure such as SIP (single in-line package) or QFP (quad flat package). be able to.

As is clear from FIGS. 2 and 3, the plurality of surface wiring conductors 5i (i=1 to n) extend parallel to each other in the first direction while maintaining a constant interval, and the plurality of lower layer Wiring conductor 6i
(i=1 to m) also extend parallel to each other in the second direction with a constant interval maintained between them. Here the first and second directions are orthogonal. Further, a bonding wire connection electrode 7i (i) connected to the surface conductor and formed on the surface of the wiring board
=1 to 1) are scattered in a matrix shape with constant intervals maintained in the first and second directions. Similarly, bonding wire connection electrode 7i (i=1 to 1
) are scattered in a matrix shape at constant intervals in the first and second directions. Such a wiring board has high versatility because various integrated circuit devices can be obtained by arranging predetermined elements at predetermined locations. In order to achieve the object of the present invention, it is preferable that the number of both-way electric bodies extending in parallel at a constant interval is four or more. Further, in each of the two-way electric bodies, it is preferable that the number of bonding connection electrodes connected thereto and arranged at regular intervals in a matrix is 16 or more.

〔Effect of the invention〕

As explained above, the present invention mounts a wiring board having at least two layers of wiring conductors perpendicular or oblique to each other at a predetermined position on a lead frame, and furthermore, attaches a desired semiconductor substrate or the like to the wiring board. By mounting an insulating resin at any position on the top and electrically connecting between the semiconductor substrate and the wiring board, between the wiring conductors, between the wiring conductor and the lead frame, etc. using bonding wires, This has the effect of eliminating the need to individually manufacture complicated lead frames and wiring boards. Therefore, the period from development to shipment of the integrated circuit device manufactured according to the present invention is short.

As long as the present invention exhibits the above-described effects, it is natural that the materials, manufacturing method, structure, shape, etc. used in the present invention are not particularly limited.

[Brief explanation of the drawing]

FIG. 1 shows a schematic perspective view of an integrated circuit device according to the present invention (including a conventional example). Figures 2 and 3 are taken from AA' in Figure 1.
FIG. 3 is a diagram showing the internal structure of an embodiment of the present invention in a schematic cross section of a line in the order of manufacturing steps. 4 and 5 are schematic cross-sectional views of the conventional example, and FIG. 6 is a schematic vertical cross-sectional view of the conventional example (taken along the line B-B' in FIG. 1).

Claims (1)

[Claims] A wiring board having at least two layers of wiring conductors that are perpendicular or oblique to each other is mounted at a predetermined position on a lead frame, and a plurality of semiconductor substrates are adhered and mounted on the wiring board using an insulating resin, An integrated circuit device characterized in that the plurality of semiconductor substrates are sealed together with the wiring board in a single container.