JPH0239509A - High frequency heating device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention reliably mechanically integrates relatively heavy capacitors used in the magnetron drive power supply section of a high-frequency heating device that uses a magnetron to oscillate microwaves on one circuit board. This invention relates to a high-frequency heating device that can be fixed in place.

[Prior art] In order to attach a component to a circuit board, the lead wire of the connection terminal of the component is inserted into a hole provided in the board, and then bent along the back surface of the board to mechanically attach the component to the board. Fixing it has been done for a long time (Utility Model Publication No. 61-102077)
Publication No.). In this case, soldering is performed to electrically connect the component to the wiring on the board surface, but this soldering is not expected to have a mechanical fixation effect; The intention is to have soldering share only the physical connection action. However, in general, the lead wires of component connection terminals are not very strong, so in the case of parts that are somewhat heavy, it is recommended that the mechanical surface bonding function and the electrical connection function be shared. However, in some cases, the expected effect was not always obtained.

[Problems to be Solved by the Invention] The capacitors used as filter capacitors, resonance capacitors, and high voltage capacitors in the magnetron drive power supply section of a high-frequency heating device that uses a magnetron for microwave oscillation are somewhat heavy. Conventionally, the capacitor was not attached to the circuit board, but a mounting bracket was provided on the capacitor resin case and screwed to the chassis of the heating device, or when it was attached to the board, an adhesive was used between the capacitor resin case and the board. They were glued and fixed with double-sided adhesive tape.

FIG. 2(a) shows the case of screwing, and FIG. 2(b) shows the case of adhesion. In the figure, 1 is a capacitor, 2 is a board, and 11.12 is a terminal. In this way, the fixing action is ensured mechanically, but electrical connection work must be carried out separately.

The present invention uses adhesive or adhesive tape as in the past when attaching somewhat heavy capacitors used as filter capacitors, resonance capacitors, and high voltage capacitors to a board in the magnetron drive power supply section of a high-frequency heating device. High-frequency heating that is highly reliable and suitable for mass production, using a capacitor mounting method that is mechanically fixed to the board and then electrically connected by soldering, without imparting mechanical stress to the parts. The purpose is to provide equipment.

[Means for Solving the Problems] In order to achieve the above object, in the present invention, each terminal of each capacitor used as a filter capacitor, a resonant capacitor, and a high voltage capacitor is connected to a corresponding hole in a circuit board. After inserting each capacitor, a portion is provided to fix each capacitor to the board by bending it along the back surface of the board, or twisting it so that its shoulder extends beyond the edge of the hole onto the back surface of the board. The capacitor can be easily mechanically fixed to the board. Since the terminal has a part other than the part for mechanical fixation as mentioned above, that part, along with the part for mechanical fixation, may be soldered to the wiring on the circuit board surface for electrical connection. Connecting.

[Operation] If the above-mentioned method is adopted, the capacitor can be mechanically fixed to the board by simply bending or twisting a portion of the terminal without applying force to the entire terminal of the capacitor. Unlike in the case of conventional lead wires, force is no longer applied to the attachment (base) of the lead wire to the capacitor, and reliability is no longer reduced. Also,
Since soldering does not apply mechanical stress to the parts, the reliability of the electrical connection is not threatened.

[Example 1] Figures 1 (a), (b), and (c) are explanatory diagrams of main parts of an embodiment of the present invention, in which 1 is a capacitor, 2 is a substrate, 10 is a terminal, and 20 is a circuit board. The soldering of the upper wiring is pattern 2]
is solder. Figure 1 (a) shows the state in which the terminal is inserted into the terminal insertion hole of the board, and Figure 1 (b) is an enlarged view of the terminal insertion part. The narrow portion divided by the groove is bent toward the back side of the substrate along the chain line, the capacitor is mechanically fixed to the substrate, and electrically connected by soldering as shown in FIG. 1(c).

3 to 5 are enlarged views of essential parts of different embodiments in which the shapes of the bent portions of the capacitor terminals inserted into the holes of the substrate are changed. In the embodiment shown in FIG. 43, L-shaped grooves are provided on both sides near the ends of the terminal, and the central T-shaped portion is bent toward the back side of the board at the broken line portion and mechanically fixed. In the embodiment shown in FIG. 4, grooves are provided at two locations so that a narrow portion remains in the center of the terminal, and the center narrow portion is bent toward the substrate and mechanically fixed. In the embodiment shown in FIG. 5, a narrow portion formed by providing an L-shaped groove on one side of the terminal is bent toward the substrate and fixed.

In the embodiment shown in FIG. 6, a notch is provided in the middle of the terminal from both sides, and after inserting the terminal into the hole in the board, the part beyond the notch is inserted so that the shoulder part of the terminal is in the hole. The capacitor is fixed to the board by twisting it so that it extends beyond the edge and onto the back of the board.

If you do the above, the capacitor will be mechanically fixed to the board by bending or twisting the terminal after mounting the capacitor, so it will not fall or move during the soldering process. .

Moreover, since soldering does not apply mechanical stress to the parts, soldering does not reduce the reliability of the electrical connection of the parts.

[Effects of the Invention] As explained above, according to the present invention, after the capacitor is mechanically fixed to the substrate using the terminals of the capacitor itself,
Since electrical connections are made by soldering, the capacitor's mechanical attachment and electrical connections remain stable no matter what direction the board is oriented or even if vibration is applied to the board. .

[Brief explanation of the drawing]

FIGS. 1(a), (b), and (c) are explanatory diagrams of main parts of one embodiment of the present invention, FIGS. 2(a) and (b) are diagrams showing examples of different conventional techniques, and FIG. 6 to 6 are diagrams showing other different embodiments of the present invention. 1...Capacitor, 2...Substrate, 10-16...
・Terminal, Figure 21-Zouguchi 20-Midamura Sunoy Kuhn

Claims (1)

[Claims] 1. In a high-frequency heating device that uses a magnetron for microwave oscillation, the terminal of the capacitor of the magnetron drive power supply section is inserted into the corresponding hole of the circuit board, and then bent along the back surface of the board, or inserted into the hole. 1. A high-frequency heating device comprising a portion for fixing the capacitor to a substrate by twisting the capacitor so that its shoulder protrudes beyond the edge of the substrate onto the back surface of the substrate.