JPH05335709A - Printed wiring substrate - Google Patents
Printed wiring substrateInfo
- Publication number
- JPH05335709A JPH05335709A JP29537991A JP29537991A JPH05335709A JP H05335709 A JPH05335709 A JP H05335709A JP 29537991 A JP29537991 A JP 29537991A JP 29537991 A JP29537991 A JP 29537991A JP H05335709 A JPH05335709 A JP H05335709A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- printed wiring
- wiring substrate
- bent
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は印刷配線基板に関し、特
に高放熱性が要求される金属板を使用した印刷配線基板
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board using a metal plate which requires high heat dissipation.
【0002】[0002]
【従来の技術】従来の金属板を使用した印刷配線基板の
構造の代表例は、図3に示す様に、平坦な金属板21の
上に絶縁層2と絶縁層2上に導体層3を形成していた。
そして、例えば、混成集積回路装置にこの印刷配線基板
を使用する場合は、導体層3上にパワートランジスタな
どのペレットや種々の部品を搭載していた。さらに、こ
の混成集積回路装置を他の配線基板などと電気的に導通
させる為に、リード端子5の様な先端が平坦な構造のも
のをはんだ4を使用し熱圧着などの方法で導体層3に取
り付けていた。2. Description of the Related Art A typical example of the structure of a conventional printed wiring board using a metal plate is, as shown in FIG. 3, an insulating layer 2 on a flat metal plate 21 and a conductor layer 3 on the insulating layer 2. Had formed.
Then, for example, when this printed wiring board is used in a hybrid integrated circuit device, pellets such as power transistors and various parts are mounted on the conductor layer 3. Further, in order to electrically connect the hybrid integrated circuit device to another wiring board or the like, a conductor layer 3 having a structure with a flat tip such as a lead terminal 5 is used by a method such as thermocompression bonding using solder 4. Was attached to.
【0003】[0003]
【発明が解決しようとする課題】上述した従来の金属板
を使用した印刷配線基板は、混成集積回路装置などに使
用する場合、他の配線基板などと導通させる為にリード
端子を取り付ける。このリード端子は、先端が平坦な
為、取り付け工程において熱圧着などの方法を使用する
ので、作業工数が非常にかかるという問題点があった。When the above-mentioned conventional printed wiring board using a metal plate is used in a hybrid integrated circuit device or the like, lead terminals are attached so as to be electrically connected to another wiring board or the like. Since the tip of this lead terminal is flat, a method such as thermocompression bonding is used in the mounting process, which causes a problem that the number of working steps is very large.
【0004】また、先端が平坦なリード端子は、接着強
度が震動に対して弱いという問題点があった。Further, the lead terminal having a flat tip has a problem that the bonding strength is weak against vibration.
【0005】本発明の目的は、リード端子の取り付けが
不要で、他の配線基板との接着強度の優れた印刷配線基
板を提供することにある。It is an object of the present invention to provide a printed wiring board which does not require attachment of lead terminals and has excellent adhesive strength with other wiring boards.
【0006】[0006]
【課題を解決するための手段】本発明の印刷配線基板
は、両端が板面に対して同一方向にほぼ直角に折り曲げ
られ、さらに外側と内側のいずれか一方の方向にL字型
に折り曲げられた金属板と、該金属板の表面に形成され
た絶縁層と、該絶縁層上に配置された導体層とを有し、
前記金属板の両端のL字型の先端部が前記絶縁層で被覆
されている。In the printed wiring board of the present invention, both ends are bent substantially at right angles in the same direction with respect to the plate surface, and are further bent in an L shape in either one of the outside direction and the inside direction. A metal plate, an insulating layer formed on the surface of the metal plate, and a conductor layer arranged on the insulating layer,
The L-shaped tip portions of both ends of the metal plate are covered with the insulating layer.
【0007】[0007]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【0008】図1(a),(b)は本発明の第1の実施
例の断面図およびその斜視図である。FIGS. 1A and 1B are a sectional view and a perspective view of a first embodiment of the present invention.
【0009】第1の実施例は、図1(a),(b)に示
す様に、両端が板面に対してほぼ直角に、さらに、外側
に向かってL字型に折り曲げられた金属板1の上に絶縁
層2とその上に導体層3を形成する。In the first embodiment, as shown in FIGS. 1 (a) and 1 (b), both ends of the metal plate are bent substantially at right angles to the plate surface and further bent outward in an L-shape. An insulating layer 2 and a conductor layer 3 are formed on the insulating layer 2.
【0010】このL字型に曲がっている部分が、他の配
線基板などと導通をとる端子の役割りをするのである。
したがって、初めから、L字型に曲げてある印刷配線基
板を使用するので、端子取り付け工数が不要になる。ま
た、印刷配線基板と端子は接着したものではない為、従
来のリード端子をはんだで取り付けたものに比べ、端子
接着強度が非常に優れているという効果を有する。The L-shaped bent portion functions as a terminal for establishing electrical connection with another wiring board or the like.
Therefore, since the printed wiring board bent in an L-shape is used from the beginning, the number of man-hours for mounting the terminal becomes unnecessary. Further, since the printed wiring board and the terminal are not bonded to each other, there is an effect that the terminal bonding strength is very excellent as compared with the conventional lead terminal mounted by soldering.
【0011】ここで、この印刷配線基板を他の配線基板
などに搭載する場合、L字型に曲がっている底部の導体
層3にはんだを塗布するが、この時、印刷配線基板の端
面に金属板1が露出していると短絡してしまう恐れがあ
る。その為、このL字型に曲がっている金属板1の端面
を絶縁層2で完全に被覆する様に形成する。Here, when this printed wiring board is mounted on another wiring board or the like, solder is applied to the conductor layer 3 at the bottom that is bent in an L shape, but at this time, metal is applied to the end surface of the printed wiring board. If the plate 1 is exposed, it may cause a short circuit. Therefore, the end face of the metal plate 1 bent in the L shape is formed so as to be completely covered with the insulating layer 2.
【0012】図2は本発明の第2の実施例の断面図であ
る。FIG. 2 is a sectional view of the second embodiment of the present invention.
【0013】第2の実施例は、図2に示す様に、両端が
内側に向かってL字型に曲がっている金属板11を使用
することにより、図1に示す第1の実施例と比べて、他
の配線基板などに搭載した場合、その実装面積を小さく
できる効果がある。The second embodiment is different from the first embodiment shown in FIG. 1 by using a metal plate 11 whose both ends are bent inward in an L shape as shown in FIG. When mounted on another wiring board or the like, the mounting area can be reduced.
【0014】[0014]
【発明の効果】以上説明した様に本発明は、両端がL字
型に曲がっている金属板を使用しているので、そのL字
型に曲がっている部分が端子の役割りをする。したがっ
て、従来の様にリード端子を熱圧着などの方法で取り付
ける必要がないので、端子取り付け作業工数が不要にな
るという効果がある。As described above, according to the present invention, since the metal plate whose both ends are bent in the L shape is used, the part bent in the L shape serves as a terminal. Therefore, it is not necessary to attach the lead terminal by a method such as thermocompression bonding as in the conventional case, and there is an effect that the number of man-hours for attaching the terminal becomes unnecessary.
【図1】本発明の第1の実施例の断面図およびその斜視
図である。FIG. 1 is a sectional view and a perspective view of a first embodiment of the present invention.
【図2】本発明の第2の実施例の断面図である。FIG. 2 is a sectional view of a second embodiment of the present invention.
【図3】従来の印刷配線基板の一例の断面図である。FIG. 3 is a cross-sectional view of an example of a conventional printed wiring board.
1,11,21 金属板 2 絶縁層 3 導体層 4 はんだ 5 リード端子 1,11,21 Metal plate 2 Insulation layer 3 Conductor layer 4 Solder 5 Lead terminal
Claims (1)
に折り曲げられ、さらに外側と内側のいずれか一方の方
向にL字型に折り曲げられた金属板と、該金属板の表面
に形成された絶縁層と、該絶縁層上に配置された導体層
とを有し、前記金属板の両端のL字型の先端部が前記絶
縁層で被覆されていることを特徴とする印刷配線基板。1. A metal plate having both ends bent substantially at right angles to the plate surface in the same direction and further bent in an L-shape in either the outer or inner direction, and formed on the surface of the metal plate. Printed wiring board having an insulating layer formed on the insulating layer and a conductor layer disposed on the insulating layer, and L-shaped tip portions of both ends of the metal plate are covered with the insulating layer. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29537991A JPH05335709A (en) | 1991-11-12 | 1991-11-12 | Printed wiring substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29537991A JPH05335709A (en) | 1991-11-12 | 1991-11-12 | Printed wiring substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05335709A true JPH05335709A (en) | 1993-12-17 |
Family
ID=17819869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29537991A Withdrawn JPH05335709A (en) | 1991-11-12 | 1991-11-12 | Printed wiring substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05335709A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
KR101154790B1 (en) * | 2010-09-02 | 2012-06-18 | 엘지이노텍 주식회사 | The radiant heat circuit board unified blanket and the chassis structure having the same |
JP2016507870A (en) * | 2013-04-12 | 2016-03-10 | ティー・イー・エス カンパニー リミテッドTes Co., Ltd | Battery protection device manufacturing method and battery protection device |
-
1991
- 1991-11-12 JP JP29537991A patent/JPH05335709A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007005839A (en) * | 2006-10-13 | 2007-01-11 | Mitsubishi Electric Corp | Surface mounting package and semiconductor device |
JP4563980B2 (en) * | 2006-10-13 | 2010-10-20 | 三菱電機株式会社 | Surface mount type package and semiconductor device |
KR101154790B1 (en) * | 2010-09-02 | 2012-06-18 | 엘지이노텍 주식회사 | The radiant heat circuit board unified blanket and the chassis structure having the same |
JP2016507870A (en) * | 2013-04-12 | 2016-03-10 | ティー・イー・エス カンパニー リミテッドTes Co., Ltd | Battery protection device manufacturing method and battery protection device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990204 |