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JPH0238750U - - Google Patents

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Publication number
JPH0238750U
JPH0238750U JP11727488U JP11727488U JPH0238750U JP H0238750 U JPH0238750 U JP H0238750U JP 11727488 U JP11727488 U JP 11727488U JP 11727488 U JP11727488 U JP 11727488U JP H0238750 U JPH0238750 U JP H0238750U
Authority
JP
Japan
Prior art keywords
cooled
refrigerant
heat sink
cooling chamber
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11727488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11727488U priority Critical patent/JPH0238750U/ja
Publication of JPH0238750U publication Critical patent/JPH0238750U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案に係るヒートシンクの一実施
例の断面図である。 １……基板、２……半導体チツプ、３……コー
ルドプレート、４……ヒートシンク、５……ノズ
ル、６……冷媒注入口、７……冷媒排出口、８…
…チヤンバ、９……コンパウンド。 FIG. 1 is a sectional view of an embodiment of a heat sink according to the present invention. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Semiconductor chip, 3...Cold plate, 4...Heat sink, 5...Nozzle, 6...Refrigerant inlet, 7...Refrigerant outlet, 8...
...Chiyamba, 9...Compound.

Claims (1)

【実用新案登録請求の範囲】 被冷却物に熱的に接触し、冷媒が循環して供給
される冷却室を有する冷却装置の前記冷却室内に
設けられる冷媒の噴流により冷却されるヒートシ
ンクであつて、 被冷却体に接する側に配置された底面と、そし
て、 冷媒が噴出される噴出口と対向する位置に配置
された頂点と、 を有することを特徴とする錐体形状のヒートシ
ンク。[Claims for Utility Model Registration] A heat sink that is cooled by a jet of refrigerant provided in the cooling chamber of a cooling device having a cooling chamber that is in thermal contact with an object to be cooled and to which a refrigerant is circulated and supplied. A cone-shaped heat sink characterized by having the following: a bottom surface disposed on a side in contact with an object to be cooled; and an apex disposed at a position facing a spout from which refrigerant is spouted.
JP11727488U 1988-09-06 1988-09-06 Pending JPH0238750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11727488U JPH0238750U (en) 1988-09-06 1988-09-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11727488U JPH0238750U (en) 1988-09-06 1988-09-06

Publications (1)

Publication Number Publication Date
JPH0238750U true JPH0238750U (en) 1990-03-15

Family

ID=31360591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11727488U Pending JPH0238750U (en) 1988-09-06 1988-09-06

Country Status (1)

Country Link
JP (1) JPH0238750U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320053A (en) * 1991-04-18 1992-11-10 Nec Corp Cooling mechanism for integrated circuit
WO2010137138A1 (en) * 2009-05-27 2010-12-02 株式会社アドバンテスト Piping joint and test head with the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320053A (en) * 1991-04-18 1992-11-10 Nec Corp Cooling mechanism for integrated circuit
WO2010137138A1 (en) * 2009-05-27 2010-12-02 株式会社アドバンテスト Piping joint and test head with the same

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