JPH0238744U - - Google Patents
Info
- Publication number
- JPH0238744U JPH0238744U JP5236788U JP5236788U JPH0238744U JP H0238744 U JPH0238744 U JP H0238744U JP 5236788 U JP5236788 U JP 5236788U JP 5236788 U JP5236788 U JP 5236788U JP H0238744 U JPH0238744 U JP H0238744U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- boards
- case material
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000010396 two-hybrid screening Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案を示す平面図、第２図はその
−断面図、第３図は従来例である。
１，２……混成集積回路基板、３……絶縁フイ
ルム、４……ケース材、５……封止樹脂。
FIG. 1 is a plan view showing the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a conventional example. 1, 2... Hybrid integrated circuit board, 3... Insulating film, 4... Case material, 5... Sealing resin.
Claims (1)
の混成集積回路基板と、前記二枚の基板を収納す
るケース材とを備え、前記ケース材内に前記基板
を収納させ前記ケース材内に注入する封止樹脂で
前記ケース材と前記二枚の基板とを一体化するこ
とを特徴とする混成集積回路装置。 (2) 前記二枚の混成集積回路基板は絶縁フイル
ムによつて連続して離間され、前記基板間の前記
フイルムを折曲げ配置させ、前記ケース材内に収
納させることを特徴とする請求項１記載の混成集
積回路装置。 (3) 前記二枚の混成集積回路基板上に固着され
た回路素子が対向する様に前記絶縁フイルムを折
曲げることを特徴とする請求項２記載の混成集積
回路装置。 (4) 前記ケース材から前記二枚の混成集積回路
基板に固着された外部リードを導出させたことを
特徴とする請求項１記載の混成集積回路装置。 (5) 前記二枚の混成集積回路基板は絶縁処理さ
れた金属基板であることを特徴とする混成集積回
路装置。[Claims for Utility Model Registration] (1) A hybrid integrated circuit board comprising two hybrid integrated circuit boards successively arranged at a predetermined interval and a case material housing the two boards; A hybrid integrated circuit device, wherein the substrate is housed and the case material and the two substrates are integrated with a sealing resin injected into the case material. (2) The two hybrid integrated circuit boards are successively separated by an insulating film, and the film between the boards is bent and arranged to be housed in the case material. The hybrid integrated circuit device described. (3) The hybrid integrated circuit device according to claim 2, wherein the insulating film is bent so that the circuit elements fixed on the two hybrid integrated circuit boards face each other. (4) The hybrid integrated circuit device according to claim 1, wherein external leads fixed to the two hybrid integrated circuit boards are led out from the case material. (5) A hybrid integrated circuit device, wherein the two hybrid integrated circuit boards are insulated metal substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5236788U JPH0238744U (en) | 1988-04-19 | 1988-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5236788U JPH0238744U (en) | 1988-04-19 | 1988-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238744U true JPH0238744U (en) | 1990-03-15 |
Family
ID=31278368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5236788U Pending JPH0238744U (en) | 1988-04-19 | 1988-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238744U (en) |
-
1988
- 1988-04-19 JP JP5236788U patent/JPH0238744U/ja active Pending
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