JPH023538B2 - - Google Patents
Info
- Publication number
- JPH023538B2 JPH023538B2 JP19894682A JP19894682A JPH023538B2 JP H023538 B2 JPH023538 B2 JP H023538B2 JP 19894682 A JP19894682 A JP 19894682A JP 19894682 A JP19894682 A JP 19894682A JP H023538 B2 JPH023538 B2 JP H023538B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- target
- flat plate
- substrate
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19894682A JPS5989413A (ja) | 1982-11-15 | 1982-11-15 | Icの配線パタ−ン形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19894682A JPS5989413A (ja) | 1982-11-15 | 1982-11-15 | Icの配線パタ−ン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5989413A JPS5989413A (ja) | 1984-05-23 |
JPH023538B2 true JPH023538B2 (de) | 1990-01-24 |
Family
ID=16399584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19894682A Granted JPS5989413A (ja) | 1982-11-15 | 1982-11-15 | Icの配線パタ−ン形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5989413A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4610774A (en) * | 1984-11-14 | 1986-09-09 | Hitachi, Ltd. | Target for sputtering |
JPS63202040A (ja) * | 1987-02-17 | 1988-08-22 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
-
1982
- 1982-11-15 JP JP19894682A patent/JPS5989413A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5989413A (ja) | 1984-05-23 |
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