JPH023266Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of a high-density connector used to attach an LSI module to a printed wiring board.

In order to improve the processing power of computers, semiconductor devices such as LSIs and ICs are becoming smaller and larger in capacity, and at the same time, the mounting methods are also being improved.

In other words, semiconductor devices such as LSIs had a package structure in which each semiconductor chip was covered with a hermetic sheath, and the package was mounted in a through hole on a printed wiring board.

However, in the future, multiple LSI chips will be mounted on a multilayer wiring board made of ceramic.
A mounting method is planned in which a module is created and then installed as a replacement unit on a printed wiring board via a connector.

In this case, the connector is fixed to the printed wiring board by a method such as soldering, and the LSI module is removable.

The present invention relates to the structure of a connector.

[Conventional technology]

FIG. 2 is a partial sectional view illustrating the currently planned method for mounting an LSI module on a printed wiring board.

That is, in the LSI module 1, a plurality of LSIs 2 are mounted on the upper part of a multilayer wiring board 3 made of ceramic or the like, and a large number of lead pins 4 are provided at the lower part to be circuit-connected to the upper LSI 2.

Next, the connector 5 is made of a material such as ceramic, and has a guide hole 6 in the upper part into which the lead pin 4 of the LSI module is inserted, and a connecting pin 7 is pulled out from the guide hole 6 in the lower part. A solder reservoir 8 is provided in the guide hole 6.

The connecting pins 7 of this connector 5 are configured to be inserted into through holes 10 of the printed circuit board 9.

That is, the lead pins 4 of the LSI module 1 are connected to the connector by low melting point solder in the solder reservoir 8, and insertion and removal of the LSI module is performed with the low melting point solder melted.

The present invention relates to the shape of the guide hole 6 provided in the connector 5 and the structure for taking out the connecting pin 7. Conventionally, the structure for taking out the connecting pin 7 was as shown in FIG. 3 or 4.

Here, the structure shown in FIG. 3 is the same as that shown in FIG. 2, and a guide hole 6 is provided in a heat-resistant substrate 11 such as crystallized glass by a method such as cutting or sintering. In the case of Figure 4, insert the connecting pin 7 from the top and weld it using gold/tin (Au/Sn) alloy, etc. In the case of Fig. 4, align the connecting pin 7 from the bottom and proceed as before. A structure such as welding was used.

However, in the structure shown in FIG. 3, there is a problem in aligning the connecting pin 7 and the guide hole 6, and in the structure shown in FIG. There is a problem.

[Problem that the invention attempts to solve]

The connector for inserting and removing LSI modules has an extremely large number of connection pins, several thousand, and the pitch of the connection pins, which are arranged in a matrix, is 1.25.
Since it is extremely short (about mm), it is difficult to align it with the guide hole provided in the heat-resistant substrate, and there is also the problem that the adhesive strength is low when welding to the guide hole from below.

[Means for solving problems]

The above problem is caused by the lead pins of a module equipped with multiple LSIs being inserted and fixed into the solder pools arranged in a matrix on the top of the connector board, and the contact pins provided at the bottom of the solder pools being inserted into the through holes of the printed circuit board. In a connector that is inserted into a hole and fixed, the joint part of the contact pin to the connector board and the solder reservoir provided on the top thereof are each formed with a mortar-shaped slope, and the head of the contact pin fits into this. This problem can be solved by a high-density connector characterized in that the contact pins are provided in an inclined shape, and the contact pins are inserted into the connector board and welded.

[Effect]

The present invention facilitates alignment by forming the heat-resistant substrate to which the guide hole and the connecting pin are welded with a mortar-shaped slope, and the head of the connecting pin is also formed with a mortar-shaped slope. This allows the connecting pin to fit into the heat-resistant substrate, thereby increasing adhesive strength.

〔Example〕

Figure 1 is a cross-sectional view explaining the present invention. Figure A is a partial cross-section showing the state before the connecting pin 12 is attached, and Figure B is a partial cross-section showing the state in which the lead pin of the LSI module is inserted into the connector implementing the present invention. It is a diagram.

The present invention will be described below with reference to Examples.

The connecting pin 12 is made of phosphor bronze with a diameter of 0.3 mm, the mortar-shaped head has a diameter of 0.3 mm, and the base has a diameter of 1.0 mm.
Processed with Nickel Ni and Palladium Pd
After the base plating, gold plating with a thickness of 0.1 mm was applied.

On the other hand, a crystallized glass 13 is used as the heat-resistant substrate, and is cut so that the head of the mortar-shaped connecting pin 12 fits therein.
A guide hole 14 is provided in the upper part of 3 by cutting into a symmetrical shape.

In this embodiment, the crystallized glass 13 constituting the connector has a thickness of 1 mm.

Next, in order to weld the connecting pin 12 to the crystallized glass 13, in the case of this embodiment, Au with a melting point of 280° C.
Using Sn solder, they were fitted as shown in Figure 1B.

Next, as the low melting point solder 15 to be inserted into the guide hole 14, an In.Sn alloy having a melting point of 100 to 120° C. was used.

Forming the joint between the guide hole 14 and the connecting pin 12 in a mortar shape in this way makes it easier to insert the lead pin of the LSI module, and also increases the joint strength of the connecting pins that make up the connector, making it more reliable than the conventional structure. will improve.

[Effect of idea]

As described above, by implementing the present invention, it becomes easy to insert the LSI module, and the bonding strength of the connecting pins forming the connector can be improved.

[Brief explanation of drawings]

Fig. 1 is a sectional view explaining the connector structure according to the present invention, and Fig. 1A shows the state before connecting the connecting pins;
Figure B is a state diagram with the connector connected, and Figure 2 is
FIGS. 3 and 4 are cross-sectional views illustrating the connector connection of the LSI module to the printed circuit board, and FIGS. 3 and 4 are cross-sectional views showing the welded state of conventional connection pins. In the figure, 1 is an LSI module, 3 is a multilayer wiring board, 4 is a lead pin, 5 is a connector, 6, 1
4 is a guide hole, 7 and 12 are connection pins, 8 is a solder reservoir, 9 is a printed circuit board, 10 is a through hole, 1
1 is a heat-resistant substrate, 13 is crystallized glass, and 15 is low melting point solder.

Claims (1)

[Scope of utility model registration request] The lead pins of the module equipped with multiple LSIs are inserted and fixed into the solder pools arranged in a matrix on the top of the connector board, and are inserted into the through holes of the printed circuit board using the contact pins provided at the bottom of the solder pools. In the connector to be fixed, the joint portion of the contact pin to the connector board and the solder reservoir provided on the top thereof are each formed with a mortar-like slope, and the head of the contact pin is sloped in a shape that fits into this. A high-density connector characterized in that the contact pins are inserted into the connector board and welded.