JPH01207961A - Semiconductor device - Google Patents

Abstract

PURPOSE:To fix a semiconductor device on a printed board simultaneously, by providing protrusions at an external lead of a package and inserting the semiconductor device into a hole on the printed board. CONSTITUTION:A lead frame 2 is connected electrically with an external circuit by Cu plating 3. A printed board 4 serves to fix the semiconductor device or to perform wiring for the external circuit and protrusions 6 serve to fix the semiconductor device onto the printed board 4. For example, wedge-shaped protrusions 6 having a maximum height 125mum are provided at both side faces of the lead frame 2 having the size 0.25mm and the lead frame is inserted into a hole having a diameter 0.5mm on the printed board 4. The protruding 6 allow this device to be inserted into the printed board 4 but it is unable for the device to be disconnected from the printed board. Thus, this device is fixed on the printed board 4 without performing a solenoid process.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly to a semiconductor device in which external terminals of the semiconductor device are provided with protrusions for fixing.

[Conventional technology]

Conventionally, this type of semiconductor device has had a lead frame with a constant thickness as shown in FIG. For this reason, the fixing of the semiconductor device to the printed circuit board and the electrical connection to the circuit on the printed circuit board have been performed by the following method. First, an insertion hole for passing the lead frame through the printed circuit board is opened, and Cu plating is applied inside and around the insertion hole. After that, the semiconductor device is inserted into a predetermined location. Next, in order to fix the inserted semiconductor device to the printed circuit board and electrically connect it to the circuit on the printed circuit board, melted solder at high temperature is applied to the Cu plating part and the lead frame, and then cooled and Cu plating is performed. Alloy the parts, lead frame, and solder.

[Problem that the invention seeks to solve]

With the conventional lead frame that has a constant thickness as described above, there is a risk that the semiconductor device will fall out of the printed circuit board just by inserting it into the printed circuit board, so the process of soldering the lead frame and the circuit on the printed circuit board is necessary. It is essential. However, in the soldering process, solder is melted at high temperatures and the melted solder is attached to the Cu plating and lead frame, so if it is exposed to high temperatures for a long time or is too high, the Cu plating may peel off or the printed circuit board may peel off. part of
.

Problems arise such as burning of the aluminum electrodes of the semiconductor elements and melting of the aluminum electrodes of the semiconductor elements due to heat conduction from the lead frame.

[Means for solving problems]

The semiconductor device of the present invention is characterized in that an external terminal of the semiconductor device has a protrusion formed integrally with the external terminal.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view of a first embodiment of the invention. The mold resin 1 is used to protect the semiconductor chip from the outside, the lead frame 2 is used to transmit signals from the semiconductor chip to the outside, and the Cu plating 3 is used to electrically connect the lead frame 2 and an external circuit. for printed circuit board 4
1 is a substrate for fixing a semiconductor device or for wiring an external circuit, and a protrusion 6 is for fixing the semiconductor device and the printed circuit board 4. Thickness 0.25mm as shown in Figure 1
A wedge-shaped protrusion 6 with a maximum height of 125 μm is provided on both sides of the lead frame 2, and a printed circuit board 4 with a diameter of 0.5 mm is provided.
Insert into the upper hole. Although the semiconductor device can be inserted into the printed circuit board 4 due to the protrusion 6, it is impossible to pull it out, and the semiconductor device can be fixed onto the printed circuit board 4 without any soldering process. . The diameter of the lead frame 20 and the diameter of the opening to which the Cu plating 3 of the printed circuit board 4 is attached are such that the thickness of the Cu plating 4 is sufficiently thick in order to reduce the contact resistance between the lead frame 2 and the Cu plating 4. It is desirable to make the diameter smaller than 4.

FIG. 2 is a longitudinal sectional view of a second embodiment of the invention.

The difference from the first embodiment is that a wedge-shaped protrusion 6 is provided in the opposite direction at a portion 2 to 3 mm above the protrusion 6 of the first embodiment. That is, the printed circuit board 4 is sandwiched from both sides of the printed circuit board 4. This allows the first
In this embodiment, it is possible to minimize failures caused by the vibration of the semiconductor when vibration is applied to the printed circuit board 4 into which the semiconductor is inserted. Note that the distance between the protrusion 6 and the printed circuit board 4 varies depending on the thickness of the protrusion 6, and the distance between the protrusion 6 and the printed circuit board 4 is 2 to 3 mm.
Needless to say, it is not limited to this.

FIG. 3 is a longitudinal sectional view of a third embodiment of the invention. Third
This embodiment is an embodiment in which a protrusion 6 is provided on a ceramic pin grid array package (hereinafter simply referred to as PGA). Since a PGA lead pin generally has a circular cross-sectional shape, the protrusion 6 needs to be conical.

A semiconductor device of the present invention includes a mold resin, a lead frame, and a wedge-shaped protrusion on a portion of the lead frame. A semiconductor device using a lead frame having this shape is inserted into a printed circuit board. Since the side of the lead frame is wedge-shaped, it can be inserted relatively easily, but it is not easy to pull out a semiconductor device that has been inserted from the printed circuit board unless the insertion opening is made larger. cannot be pulled out. Therefore, even if the circuit on the printed circuit board is in operation, there is no need to remove or drop the semiconductor device.

〔Effect of the invention〕

As described above, the present invention has the advantage that by providing a protrusion on the external lead of a semiconductor device package, the semiconductor device can be fixed at the same time by simply inserting it. It goes without saying that the present invention is very effective when used to improve fixation even when soldering is performed after mounting on a printed circuit board and before soldering the printed circuit board and semiconductor device. .

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a second embodiment of the invention, and FIG. 3 is a longitudinal sectional view of a third embodiment of the invention.
FIG. 4 is a vertical cross-sectional view of a conventional semiconductor device. 1...Mold resin, 2...Lead frame, 3...Cu plating, 4...Printed circuit board, End...Solder, 6... ····protrusion,
7...Ceramic package, 8...
lead pin. Agent: Susumu Uchihara, Patent Attorney / 7-rule Y massi otsu 1 illustration / Morph stone is ■ 3 otsumutsu ηshi) ゛state η blind erasure 41

Claims (1)

[Claims] A semiconductor device characterized in that an external terminal of the semiconductor device has a protrusion formed integrally with the external terminal.